JPH0522919Y2 - - Google Patents
Info
- Publication number
- JPH0522919Y2 JPH0522919Y2 JP1986097187U JP9718786U JPH0522919Y2 JP H0522919 Y2 JPH0522919 Y2 JP H0522919Y2 JP 1986097187 U JP1986097187 U JP 1986097187U JP 9718786 U JP9718786 U JP 9718786U JP H0522919 Y2 JPH0522919 Y2 JP H0522919Y2
- Authority
- JP
- Japan
- Prior art keywords
- clip
- layer
- ecd
- electrode
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000011810 insulating material Substances 0.000 claims description 6
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 206010063836 Atrioventricular septal defect Diseases 0.000 description 34
- 238000001211 electron capture detection Methods 0.000 description 34
- 239000000758 substrate Substances 0.000 description 25
- 238000000605 extraction Methods 0.000 description 20
- 238000004040 coloring Methods 0.000 description 12
- 150000002500 ions Chemical class 0.000 description 11
- 238000007789 sealing Methods 0.000 description 10
- 239000003566 sealing material Substances 0.000 description 10
- 239000010409 thin film Substances 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000012634 fragment Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 230000002441 reversible effect Effects 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- ZNOKGRXACCSDPY-UHFFFAOYSA-N tungsten trioxide Chemical compound O=[W](=O)=O ZNOKGRXACCSDPY-UHFFFAOYSA-N 0.000 description 7
- 239000003973 paint Substances 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 238000006722 reduction reaction Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910006404 SnO 2 Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000010974 bronze Substances 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 description 3
- 229910000457 iridium oxide Inorganic materials 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 230000004043 responsiveness Effects 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 239000005394 sealing glass Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910001936 tantalum oxide Inorganic materials 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910001423 beryllium ion Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006056 electrooxidation reaction Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- -1 hydroxy ions Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000007334 memory performance Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、エレクトロクロミツク素子の改良に
関する。以下、エレクトロクロミツクを「EC」
と略称し、EC素子を「ECD」と略称する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to improvement of electrochromic devices. Hereinafter, Electrochromic is referred to as "EC"
The EC element is abbreviated as "ECD".
電圧を印加すると可逆的に電解酸化または還元
反応が起こり可逆的に着色する現象をエレクトロ
クロミズムと言う。このような現象を示すエレク
トロクロミツク（以下、ECと略称する）物質を
用いて、電圧操作により着消色するEC素子（以
下、ECDと略す）を作り、このECDを光量制御
素子（例えば、防眩ミラー）や７セグメントを利
用した数字表示素子に利用しようとする試みは、
20年以上前から行われている。例えば、ガラス、
基板の上に透明電極膜（陰極）、三酸化タングス
テン薄膜、二酸化ケイ素のような絶縁膜、電極膜
（陽極）を順次積層してなるECD（特公昭52−
46098参照）が全固体型ECDとして知られてい
る。このECDに電圧を印加すると三酸化タング
ステン（WO3）薄膜が青色に着色する。その後、
このECDに逆の電圧を印加すると、WO3薄膜の
青色が消えて無色になる。この着色・消色する機
構は詳しくは解明されていないが、WO3薄膜お
よび絶縁膜（イオン導電層）中に含まれれる少量
の水分がWO3の着色・消色を支配していると理
解されている。着色の反応式は下記のように推定
されている。
The phenomenon in which a reversible electrochemical oxidation or reduction reaction occurs when a voltage is applied, resulting in a reversible coloration, is called electrochromism. Attempts to use electrochromic (hereinafter abbreviated as EC) materials that exhibit this phenomenon to create EC devices (hereinafter abbreviated as ECDs) that turn on or off when a voltage is applied, and to use these ECDs in light quantity control devices (e.g. anti-glare mirrors) and number display devices using seven segments, include:
This has been going on for over 20 years. For example, glass,
An ECD (Japanese Patent Publication 1977-1989) is a type of photodiode (electrochemical diode) that is made by sequentially laminating a transparent electrode film (cathode), a thin film of tungsten trioxide, an insulating film such as silicon dioxide, and an electrode film (anode) on a substrate.
The tungsten trioxide (WO 3 ) thin film is colored blue when a voltage is applied to the ECD.
When a reverse voltage is applied to this ECD, the blue color of the WO3 thin film disappears and it becomes colorless. The mechanism of this coloring and decoloring has not been fully elucidated, but it is understood that the small amount of water contained in the WO3 thin film and the insulating film (ion conductive layer) controls the coloring and decoloring of WO3 . The coloring reaction is assumed to be as follows:
陰極側：
H2Ｏ→H+OH-
WO3＋nH+＋ne-→HoWO3
（無色透明） （青色）
陽極側：
OH-→１／2H2Ｏ＋１／4O2↑＋１／2e-
ところで、EC層を直接又は間接的に挟む一対
の電極層は、EC層の着消色を外部に見せるため
に少なくとも一方は透明でなければならない。特
に透過型のECDの場合には両方とも透明でなけ
ればならない。透明な電極材料としては、現在の
ところSnO2，In2O3，ITO（SnO2とIn2O3との混
合物）、ZnOなどが知られているが、これらの材
料は比較的透明度が悪いために薄くせねばなら
ず、この理由及びその他の理由からECDは基板
例えばガラス板やプラスチツク板の上に形成する
のが普通であり、このようなECDの構造の一例
を第４図に示す。Cathode side: H 2 O→H + OH - WO 3 +nH + +ne - →H o WO 3 (colorless and transparent) (blue) Anode side: OH - →1/2H 2 O+1/4O 2 ↑+1/2e -By the way, At least one of the pair of electrode layers that directly or indirectly sandwich the EC layer must be transparent in order to show the coloring and fading of the EC layer to the outside. Especially in the case of a transmissive ECD, both must be transparent. Currently known transparent electrode materials include SnO 2 , In 2 O 3 , ITO (a mixture of SnO 2 and In 2 O 3 ), and ZnO, but these materials have relatively poor transparency. For this and other reasons, ECDs are typically formed on a substrate, such as a glass plate or a plastic plate, and an example of the structure of such an ECD is shown in FIG.
第４図に於いて、Ａは上部透明電極、Ｂは下部
透明電極、Ｅは還元着色性EC層（例えばWO3）、
Ｄはイオン導電層、Ｃは可逆的電解酸化層又は酸
化着色性EC層（例えば酸化又は水酸化イリジウ
ム）をそれぞれ示し、基本的にはこのＡ〜Ｂの積
層構造だけでECDが構成されるが、前述のとお
り、これらのECDは基板Ｓ上に形成される。 In FIG. 4, A is an upper transparent electrode, B is a lower transparent electrode, E is a reduction coloring EC layer (for example, WO 3 ),
D represents an ion conductive layer, and C represents a reversible electrolytic oxidation layer or an oxidative coloring EC layer (e.g. iridium oxide or hydroxide), and basically an ECD is composed of only the laminated structure of A to B. , these ECDs are formed on the substrate S, as described above.
ＲはECDの封止材例えばエポキシ樹脂であり、
Ｇは保護用の封止基板である。 R is an ECD sealing material such as epoxy resin;
G is a protective sealing substrate.
このようなECDの電極Ａ，Ｂに外部電源を供
給するために、各々、取出し（電極）部が必要で
あり、ここに外部配線LA，LBが、ハンダ付けに
より接続されていた。 In order to supply external power to electrodes A and B of such an ECD, a lead-out (electrode) part is required, and external wiring L A and L B are connected to these parts by soldering.
従来、取出し部は、上部電極及び下部電極と同
種の材料及び製法で形成され、そのため真空蒸
着、イオンプレーテイング、スパツタリングなど
の真空薄膜形成技術により形成された(イ)ITOその
他の酸化物薄膜、又は(ロ)Alその他の金属薄膜が
使用されていた。 Conventionally, the extraction part has been formed using the same material and manufacturing method as the upper and lower electrodes, and therefore (a) ITO and other oxide thin films formed by vacuum thin film forming techniques such as vacuum evaporation, ion plating, and sputtering. Or (b) Al or other metal thin film was used.
しかしながら、(イ)，(ロ)いずれの場合にも取出し
部が非常に薄いので、ハンダ付けの作業効率が悪
いという問題点があるほか、(イ)の場合には、特に
電気抵抗が比較的高いので、外部配線を直接ハン
ダ付けすると、抵抗の低い外部配線と抵抗の高い
取出し部とが一点において接触しているため、外
部配線から取出し部を通じて電極全体に供給され
る電荷の供給速度が遅くなり、応答性が悪いとか
着色・消色ムラが生じるという問題点があり、更
に温水浸漬試験に供すると、外部配線が取出し部
から剥離するという問題点があつた。 However, in both cases (a) and (b), the extraction part is very thin, so there is a problem that the soldering work efficiency is poor, and in the case of (a), the electrical resistance is relatively low. If you solder the external wiring directly, the low-resistance external wiring and the high-resistance lead-out part are in contact at one point, so the supply speed of charge from the external wiring to the entire electrode through the lead-out part is slow. However, there were problems such as poor responsiveness and uneven coloring and decoloring, and furthermore, when subjected to a hot water immersion test, the external wiring peeled off from the lead-out part.
(ロ)の場合には、温水浸漬試験に供すると、取出
し部が基板から剥離するという問題点があつた。 In the case of (b), there was a problem in that the take-out portion peeled off from the substrate when subjected to a hot water immersion test.
そこで、本考案者らは、先に、これらの問題点
を解決し、温水浸漬試験に供しても剥離を生ぜ
ず、しかも外部配線から取出し部を通じて電極全
体に供給される電荷の供給速度が遅くなく、その
ため応答性がよく、着色・消色ムラの生じない
ECDを作成することを目的として、電極取出し
部に低抵抗の導電性クリツプを取り付け、これに
外部配線を接続する発明を成し、特許出願した。
この出願は、現在まだ公開されていないので、以
下「先願」と引用する。 Therefore, the inventors of the present invention first solved these problems and did not cause peeling even when subjected to a hot water immersion test, and the supply speed of charge that is supplied from the external wiring to the entire electrode through the extraction part is slow. Therefore, the responsiveness is good and there is no uneven coloring or decoloring.
For the purpose of creating an ECD, he created an invention for attaching a low-resistance conductive clip to the electrode extraction part and connecting external wiring to this, and filed a patent application for this invention.
Since this application has not yet been published, it will be referred to as the "prior application" hereinafter.
一般にECDは、一旦着色させた後、電圧印加
を止めても着色状態が維持される「メモリ−性」
を有する。先願発明のECDでは、導電性クリツ
プの外面はほとんど露出しており、そのため水な
どでぬれたとき(1)放電し易くメモリー性が低下す
るという問題点、(2)近くの別の物品と接触したと
き短絡するという問題点、(3)サビなどが発生する
問題点があつた。
In general, ECDs have "memory properties," meaning that once they are colored, the colored state remains even after the voltage is stopped.
has. In the ECD of the earlier invention, most of the outer surface of the conductive clip is exposed, so when it gets wet with water, etc., there are problems (1) that it easily discharges and reduces memory performance, and (2) that it cannot be easily connected to other objects nearby. There were problems such as short circuits when they came in contact with each other, and (3) problems such as rust.
従つて、本考案の目的は、このような問題点の
解決にある。 Therefore, the purpose of the present invention is to solve these problems.
そのため、本考案は、導電性クリツプの露出面
全部を絶縁材料例えば各種絶縁塗料で被覆したこ
とを特徴とする。
Therefore, the present invention is characterized in that the entire exposed surface of the conductive clip is coated with an insulating material, such as various insulating paints.
第５図は、本考案で使用される導電性クリツプ
の一例を示す斜視図であり、このクリツプは第６
図に示すように断面が略「コ」の字形を有する略
樋状のものである。
FIG. 5 is a perspective view showing an example of the conductive clip used in the present invention;
As shown in the figure, it is approximately gutter-shaped with a substantially U-shaped cross section.
このクリツプは、取出し部と接触する断片H1
と、基板を押さえる断片H2と、両者を接続する
連結板部H3とからなる。そして断片H1と断片H2
で、周辺部表面に取出し部が形成された基板周辺
部を挟み込む。従つて、挟み込んだ後、クリツプ
が基板から外れないように、断片H1と断片H2が
しつかりと基板にかみついていることが好まし
い。そのため、クリツプは、第６図に示すように
断片H1と断片H2との間が入口付近は狭く、連結
板部H3に近づくにつれ広くなる形状を有し、か
つバネ性を有する金属でできていることが好まし
い。金属はハンダ付けも良好に実施できるので好
ましい。好ましいバネ性を有する金属としては、
リン青銅が挙げられるが、その外ハガネなども使
用される。金属クリツプは、少なくとも取出し部
との接触面に、比較的軟らかい金属例えばスズ、
インジウム、ハンダ、それらの混合物、その他の
導電性材料で被覆されていてもよい。そのような
クリツプは、取出し部との接触が最高となろう。
なぜならば、一般には金属表面は顕微鏡で見た場
合微妙な凹凸があり、単に圧接しただけでは取出
し部との良好な接触が最高とはならないからであ
る。またリン青銅のクリツプにスズめつきする
と、耐蝕性が向上する利点もある。 This clip is connected to the piece H 1 in contact with the extraction part.
, a piece H2 that holds the board, and a connecting plate part H3 that connects the two. and fragment H 1 and fragment H 2
Then, the peripheral portion of the substrate having the extraction portion formed on the surface of the peripheral portion is sandwiched. Therefore, after being sandwiched, it is preferable that the pieces H1 and H2 firmly grip the substrate so that the clips do not come off the substrate. Therefore, as shown in Fig. 6, the clip has a shape in which the area between the fragment H1 and the fragment H2 is narrow near the entrance and widens as it approaches the connecting plate portion H3 , and is made of a metal having spring properties. Preferably. Metal is preferred because it can be soldered well. Metals with preferable spring properties include:
One example is phosphor bronze, but other materials such as steel are also used. The metal clip is made of a relatively soft metal, such as tin, at least on the contact surface with the extraction part.
It may be coated with indium, solder, mixtures thereof, or other conductive materials. Such a clip would have the best contact with the outlet.
This is because metal surfaces generally have subtle irregularities when viewed under a microscope, and mere pressure contact does not provide the best possible contact with the extraction portion. Also, tin plating on phosphor bronze clips has the advantage of improving corrosion resistance.
クリツプは、長さに制限はないので、帯状の取
出し部に合わせて必要な長さのものを用いる。そ
うすれば、取出し部とクリツプとの接触面積は、
非常に大きなものとなり、両者の間の電気抵抗は
少なくなり、またクリツプは低抵抗材料で作られ
るので、外部配線と一点で接続させられても、外
部配線から取出し部を通じて電極への電荷の供給
はスムーズであり、応答性がよくなり、かつ着
色・消色ムラがなくなる。 There is no limit to the length of the clip, so use one that has the length necessary to match the strip-shaped extraction section. Then, the contact area between the extraction part and the clip will be
The electrical resistance between the two is very large, and since the clip is made of a low-resistance material, even if it is connected to the external wiring at one point, the charge cannot be supplied from the external wiring to the electrode through the lead-out part. The process is smooth, has good responsiveness, and eliminates uneven coloring and decoloring.
またクリツプは、取出し部を基板に対し常に押
さえつけているので、仮に温水浸漬試験に供して
も取出し部が基板から剥がれる危険もない。た
だ、クリツプを取りつけるときに、取出し部を破
損する恐れがあるので、取出し部はそれ自身強靱
なITOその他の酸化物系電極材料でできているこ
とが好ましい。もつとも、取り付け作業に細心の
注意を払えば、破損の恐れは解消される。 Furthermore, since the clip always presses the ejecting portion against the substrate, there is no risk that the ejecting portion will peel off from the substrate even if subjected to a hot water immersion test. However, since there is a risk of damaging the take-out part when attaching the clip, it is preferable that the take-out part itself be made of a strong ITO or other oxide-based electrode material. However, if you pay close attention to the installation process, the risk of damage can be eliminated.
クリツプをECDに取りつける時期は、封止前
でも後でもよいが、封止前に取り付け、封止用ガ
ラスに封止材を塗布したものをECDと張り合わ
せ、その上で封止材を硬化させると、封止材が取
出し部と断片H1との間の目に見えない微小な隙
間を通じて進入し、基板端面とクリツプとの間の
比較的大きな隙間を埋める（第７図参照）。そう
すると、封止後にクリツプを取りつけたため封止
材が隙間を埋めないときに比べ、外部の水分の取
出し部への進入が封止材のために困難になるの
で、取出し部が腐食されにくくなる。また、隙間
に進入した封止材が基板とクリツプを接着するこ
とになるのでクリツプが基板から外れにくくなる
利点も得られる。 The clip can be attached to the ECD before or after sealing, but if it is attached before sealing, the sealing material is applied to the glass for sealing, the ECD is pasted, and then the sealing material is cured. The encapsulant enters through the invisible minute gap between the take-out portion and the piece H1 and fills the relatively large gap between the substrate edge and the clip (see FIG. 7). In this case, compared to when the clip is attached after sealing and the sealing material does not fill the gap, the sealing material makes it difficult for external moisture to enter the extraction part, making the extraction part less susceptible to corrosion. Furthermore, since the sealing material that has entered the gap adheres the substrate and the clip, there is an advantage that the clip is difficult to separate from the substrate.
クリツプがハンダ付け可能な材料でできている
場合には、外部配線をクリツプに接続するとき、
ハンダ付けすればよいが、クリツプが金属ででき
ている場合には、ハンダ付けに変えて圧着又は圧
締により接続してもよい。 If the clip is made of solderable material, when connecting external wiring to the clip,
Soldering is sufficient, but if the clip is made of metal, the connection may be made by crimping or clamping instead of soldering.
圧着又は圧締の方法としては、金属製のクリツ
プを使用した場合には、例えば(1)単にクリツプ末
端（特に断片H3）と基板との間に剥き出しにし
た外部配線を挟み込む方法、その変形例としてク
リツプの長さ方向の途中に穴又は溝又はスリツト
（割り）を開け、この穴又は溝を通じて剥き出し
にした外部配線の先端を差入れて、クリツプ（特
に断片H3）と基板との間に挟み込む方法、その
変形例としてクリツプの長さ方向の途中に２カ所
の穴又は溝又はスリツト（割り）を開け、第１の
穴又は溝はスリツト（割り）から剥き出しにした
外部配線の先端を差入れて第２の穴又は溝又はス
リツト（割り）から差し出し、剥き出しにした外
部配線をクリツプ（特に断片H3）と基板との間
に挟み込む方法、(2)長めのクリツプを用い、
ECDからはみ出したクリツプに、剥き出しにし
た外部配線の先端を差入れた後、クリツプを押し
つぶす方法、(3)クリツプの長さ方向の途中又は末
端に第８図に示すように例えば断面がほぼ逆
「Ｊ」の字形の圧着片H5を設け、これの間に剥き
出しにした外部配線LAの先端を圧着する方法な
どが挙げられる。尚、圧着片H5は、断片H1の一
部を折り曲げて作成してもよい。 When using metal clips, crimping or clamping methods include (1) simply sandwiching the exposed external wiring between the end of the clip (particularly fragment H 3 ) and the board, and variations thereof; For example, a hole, a groove, or a slit is made in the middle of the clip in the length direction, and the exposed end of the external wiring is inserted through this hole or groove to create a gap between the clip (particularly fragment H 3 ) and the board. As a modification of the pinching method, two holes or grooves or slits are made in the middle of the clip in the length direction, and the exposed end of the external wiring is inserted into the first hole or groove through the slits. (2) using a longer clip, inserting it through the second hole, groove or slit, and sandwiching the exposed external wiring between the clip (particularly the fragment H 3 ) and the board;
A method of inserting the tip of the exposed external wiring into the clip protruding from the ECD and then crushing the clip. An example of this method is to provide a "J"-shaped crimp piece H5 and crimp the exposed tip of the external wiring L A between these pieces. Note that the crimp piece H5 may be created by bending a part of the piece H1 .
外部配線のクリツプへの接続時期は、接続がハ
ンダ付けの場合、ECDに取りつける前に行なう
ことが好ましい。そうすれば、ECDがハンダ付
けの熱を受けず、熱による損傷の危険がなくな
る。 When connecting the external wiring to the clip, if the connection is made by soldering, it is preferable to connect it before attaching it to the ECD. This way the ECD will not be exposed to the heat of soldering and there will be no risk of heat damage.
外部配線とクリツプとの接続部は、物理的、化
学的に弱いので、封止することが好ましい。この
封止は、ECDの封止と同時に行なうと、別の封
止工程が不要になるので特に好ましい。 Since the connection between the external wiring and the clip is physically and chemically weak, it is preferable to seal it. It is particularly preferable to perform this sealing simultaneously with the sealing of the ECD, since this eliminates the need for a separate sealing step.
この後、クリツプの露出面全部を本考案に従い
絶縁材料で被覆する。絶縁材料としては、エポキ
シ樹脂塗料、ウレタン樹脂塗料、アクリル樹脂塗
料などの絶縁塗料、或いはプラスチツクで成形さ
れたカバー、熱収縮性プラスチツクによるカバー
などが挙げられる。 Thereafter, all exposed surfaces of the clip are coated with an insulating material in accordance with the present invention. Examples of the insulating material include insulating paints such as epoxy resin paints, urethane resin paints, and acrylic resin paints, covers made of plastic, and covers made of heat-shrinkable plastic.
一方、本考案に於けるECDの積層構造は、特
にどれと限定されるものではないが、固体型
ECDの構造としては、例えば電極層／EC層／
イオン導電層／電極層のような４層構造、電極
層／還元着色型ECD層／イオン導電層／可逆的
電解酸化層ないし酸化着色型EC層／電極層のよ
うな５層構造があげられる。 On the other hand, although the laminated structure of the ECD in the present invention is not particularly limited, it is a solid type.
The structure of ECD is, for example, electrode layer/EC layer/
Examples include a four-layer structure such as an ion-conductive layer/electrode layer, and a five-layer structure such as an electrode layer/reduction colored ECD layer/ion conductive layer/reversible electrolytic oxidation layer or oxidation colored EC layer/electrode layer.
透明電極の材料としては、例えばSnO2，In2
O3，ITOなどが使用される。このような電極層
は、一般には真空蒸着、イオンプレーテイング、
スパツタリングなどの真空薄膜形成技術で形成さ
れる。（還元着色性）EC層としては一般にWO3，
MoO3などが使用される。 Examples of materials for the transparent electrode include SnO 2 , In 2
O 3 , ITO, etc. are used. Such electrode layers are generally formed by vacuum evaporation, ion plating,
It is formed using vacuum thin film forming techniques such as sputtering. (Reduction colorability) The EC layer is generally WO 3 ,
MoO 3 etc. are used.
イオン導電層としては、例えば酸化ケイ素、酸
化タンタル、酸化チタン、酸化アルミニウム、酸
化ニオブ、酸化ジルコニウム、酸化ハフニウム、
酸化ランタン、フツ化マグネシウムなどが使用さ
れる。これらの物質薄膜は製造方法により電子に
対して絶縁体であるが、プロトン（H+）および
ヒドロキシイオン（OH-）に対しては良導体と
なる。EC層の着色消色反応にはカチオンが必要
とされ、H+イオンやLi+イオンをEC層その他に
含有させる必要がある。H+イオンは初めからイ
オンである必要はなく、電圧が印加されたときに
H+イオンが生じればよく、従つてH+イオンの代
わりに水を含有させてもよい。この水は非常に少
なくて十分であり、しばしば、大気中から自然に
侵入する水分でも着消色する。 Examples of the ion conductive layer include silicon oxide, tantalum oxide, titanium oxide, aluminum oxide, niobium oxide, zirconium oxide, hafnium oxide,
Lanthanum oxide, magnesium fluoride, etc. are used. Although thin films of these materials are insulators for electrons due to the manufacturing method, they are good conductors for protons (H + ) and hydroxy ions (OH − ). Cations are required for the coloring and decoloring reaction of the EC layer, and it is necessary to contain H + ions and Li + ions in the EC layer and other parts. H + ions do not need to be ions to begin with, and when a voltage is applied,
It is sufficient that H + ions are generated, and therefore water may be contained instead of H + ions. Very little of this water is sufficient, and often even moisture that naturally enters from the atmosphere will discolor.
EC層とイオン導電層とは、どちらを上にして
も下にしてもよい。さらにEC層に対して間にイ
オン導電層を挟んで可逆的電解酸化層（ないし酸
化着色型EC層）又は触媒層を配設してもよい。
このような層としては、例えば酸化ないし水酸化
イリジウム、同じくニツケル、同じくクロム、同
じくバナジウム、同じくルテニウム、同じくロジ
ウムなどがあげられる。これらの物質は、イオン
導電層又は透明電極中に分散されていても良い
し、それらを分散していてもよい。不透明な電極
層は、反射層と兼用していてもよく、例えば金、
銀、アルミニウム、クロム、スズ、亜鉛、ニツケ
ル、ルテニウム、ロジウム、ステンレスなどの金
属が使用される。 The EC layer and the ion conductive layer may be placed either on top or on the bottom. Furthermore, a reversible electrolytic oxidation layer (or oxidation-colored EC layer) or a catalyst layer may be provided to the EC layer with an ion conductive layer interposed therebetween.
Such layers include, for example, iridium oxide or hydroxide, nickel, chromium, vanadium, ruthenium, rhodium, and the like. These substances may be dispersed in the ion conductive layer or the transparent electrode, or may be dispersed therein. The opaque electrode layer may also serve as a reflective layer, for example, gold,
Metals such as silver, aluminum, chromium, tin, zinc, nickel, ruthenium, rhodium, and stainless steel are used.
以下、第１〜３図を引用して本考案を実施例に
より詳細に説明する。 Hereinafter, the present invention will be explained in detail by way of examples with reference to FIGS. 1 to 3.
矩形のガラス基板Ｓの表面全体にITO電極層を
形成し、次にフオトエツチングまたはレーザーカ
ツテイングにより上部電極Ａ用の取出し部Ｆと、
下部電極Ｂとの間に溝を形成した。取出し部Ｆと
それより隔離した矩形の下部電極Ｂとそれに連続
して続く下部電極の取出し部B1を形成した（第
２〜３図参照）。尚、ITOをマスク蒸着すること
により直接にこれらのパターンを形成してもよ
い。
An ITO electrode layer is formed on the entire surface of a rectangular glass substrate S, and then an extraction part F for the upper electrode A is formed by photo etching or laser cutting.
A groove was formed between the lower electrode B and the lower electrode B. A lead-out part F, a rectangular lower electrode B separated from the lead-out part F, and a lower electrode lead-out part B1 continuously following the lead-out part F were formed (see FIGS. 2 and 3). Note that these patterns may be directly formed by mask vapor deposition of ITO.
次に酸化イリジウムと酸化スズとの混合物から
なる可逆的電解酸化層Ｃ、酸化タンタル層Ｄ及び
酸化タングステン層Ｅを順に形成した。次に上部
電極ＡとしてAlを蒸着し、この時Alは既に基板
Ｓ上に形成された取出し部Ｆと一端が接触するよ
うに形成した。 Next, a reversible electrolytic oxidation layer C made of a mixture of iridium oxide and tin oxide, a tantalum oxide layer D, and a tungsten oxide layer E were formed in this order. Next, Al was deposited as the upper electrode A, and at this time, Al was formed so that one end was in contact with the extraction portion F already formed on the substrate S.
予めリン青銅性の導電製クリツプＨを２本用意
し、これにそれぞれ外部配線LA又はLBをハンダ
付け又は導電性接着剤にて接続した。 Two phosphor bronze conductive clips H were prepared in advance, and external wiring L A or L B was connected to each of them by soldering or conductive adhesive.
このクリツプＨを基板の短辺側にそれぞれ装着
し、これによりクリツプの断片H1が取出し部Ｆ，
B1を圧着するようにした。 The clips H are attached to the short sides of the board, so that the clip fragments H1 can be attached to the extraction parts F,
B 1 was crimped.
尚、この導電性クリツプＨの形状及び寸法は、
封止用ガラス板Ｇの位置決めとECD周辺の非表
示部のマスキングができるように設定してある。 The shape and dimensions of this conductive clip H are as follows:
It is set to allow positioning of the sealing glass plate G and masking of non-display areas around the ECD.
そしてエポキシ樹脂封止材Ｒを多めに塗布した
封止用ガラス板ＧをECDの上に重ね合わせ、対
向する２本のクリツプの間にガラス板Ｇを納め
た。２本のクリツプの間隔とガラス板Ｇの長さを
ほぼ一致させてあるので、クリツプの間にガラス
板Ｇを納めることでガラス板Ｇの位置決めは、容
易にかつ素早くできた。 Then, a sealing glass plate G coated with a large amount of epoxy resin sealant R was placed on top of the ECD, and the glass plate G was placed between two opposing clips. Since the distance between the two clips and the length of the glass plate G are approximately the same, the glass plate G can be positioned easily and quickly by being placed between the clips.
封止材Ｒが硬化するまで放置すると、余分の封
止材Ｒが取出し部、クリツプの一部、外部配線接
続部を覆い、かつ基板Ｓとクリツプとの隙間を埋
め、それらを封止した。これによりクリツプは基
板に確固として接着され、外すことができなかつ
た。 When the sealing material R was left to harden, the excess sealing material R covered the take-out portion, a portion of the clip, and the external wiring connection portion, and filled the gap between the substrate S and the clip, thereby sealing them. This made the clip firmly adhered to the substrate and could not be removed.
最後にクリツプＨの外面にエポキシ樹脂塗料を
塗布して硬化させることにより、露出個所をなく
した。 Finally, an epoxy resin paint was applied to the outer surface of the clip H and cured to eliminate exposed areas.
こうして、本実施例のECDを作製した。この
ECDの垂直断面を第１図に示す。この図は、一
部をデホルメしてあり、正確な寸法比を有しな
い。 In this way, the ECD of this example was produced. this
A vertical section of the ECD is shown in Figure 1. This figure is partially deformed and does not have accurate dimensional ratios.
このECDに駆動電源Suから着色電圧（＋
1.35V）を印加すると、基板Ｓ側から入射させた
波長633nmの光Ｌに対し、反射率が15％に減少し
（10秒後）、この反射率は電圧印加を止めても、し
ばらく保たれた。今度は消色電圧（−1.35V）を
印加すると、同じく反射率は65％に回復した（10
秒後）。 Coloring voltage (+) is applied to this ECD from the drive power supply Su.
When a voltage of 1.35V) is applied, the reflectance decreases to 15% (after 10 seconds) for light L with a wavelength of 633 nm incident from the substrate S side, and this reflectance is maintained for a while even after the voltage application is stopped. Ta. When a decoloring voltage (-1.35V) was applied this time, the reflectance recovered to 65% (10
seconds later).
従つて、本実施例のECDは、自動車その他の
防眩ミラーとして有用で、後ろから接近する自動
車の強いライトがミラーに当たつたとき、電圧を
印加して反射率を落とせば、ドライバーは眩しく
なくなる。 Therefore, the ECD of this embodiment is useful as an anti-glare mirror for automobiles and other vehicles.When the strong light of a car approaching from behind hits the mirror, applying a voltage to reduce the reflectance will prevent the driver from being dazzled. It disappears.
尚、この実施例では、上部電極、下部電極とも
取出し部は基板の短辺側にそれぞれ１カ所設けた
が、端末側にも取出し部を設け、両方から電荷を
供給してもよい。この場合には、一方の電極の取
出し部を基板の両短辺側に設け、他方の電極の取
出し部を基板の両長辺側に設け、クリツプは基板
の４辺全部に設けることになる。 In this embodiment, the upper electrode and the lower electrode each have one extraction section on the short side of the substrate, but an extraction section may also be provided on the terminal side and charges may be supplied from both. In this case, the lead-out portions of one electrode are provided on both short sides of the substrate, the lead-out portions of the other electrode are provided on both long sides of the substrate, and the clips are provided on all four sides of the substrate.
以上の通り、本考案によれば、ECDの電極の
取出し部に予め導電性クリツプを取りつけ、これ
を介して外部配線を接続する場合、クリツプの露
出面全部を絶縁材料で被覆するので、(1)水などに
ぬれたとき、放電して着色濃度が低下することが
極端に少なくなり、(2)近くの別の物品と接触した
とき短絡する(3)サビ等の発生により表示部がよご
れ信頼性がなくなるという問題点が解決される。
As described above, according to the present invention, when a conductive clip is attached to the electrode extraction part of the ECD in advance and external wiring is connected through this, the entire exposed surface of the clip is covered with an insulating material. ) When it gets wet with water, it is extremely unlikely that the color density will decrease due to discharge, (2) it will short circuit when it comes into contact with another nearby item, and (3) it will cause the display to become dirty due to rust etc. The problem of loss of gender is solved.
第１図は、本考案の実施例１にかかるECDの
概略垂直断面図である。第２図は、前記実施例１
にかかる電極の形成された基板Ｓの概略平面図で
ある。第３図は、第２図の矢視断面図である。第
４図は、従来のECDの概略垂直断面図である。
第５図は、導電性クリツプの一例を示す斜視図で
ある。第６図は、第５図の導電性クリツプの断面
図である。第７図は、基板と導電性クリツプとの
隙間に封止材が進入した様子を示す説明図であ
る。第８図は、更に別の例の導電性クリツプの断
面図である。
主要部分の符号の説明、Ｓ……基板、Ａ……上
部電極、Ｂ……下部電極、B1……下部電極の取
出し部、Ｅ……還元着色性EC層又はWO3層、Ｆ
……上部電極の取出し部、Ｈ……導電性クリツ
プ、Ｇ……封止用ガラス板、Ｒ……封止材、LA，
LB……外部配線、Ｊ……絶縁材料。
FIG. 1 is a schematic vertical sectional view of an ECD according to Example 1 of the present invention. FIG. 2 shows the above-mentioned Example 1.
FIG. 2 is a schematic plan view of a substrate S on which electrodes are formed. FIG. 3 is a sectional view taken along the arrow in FIG. 2. FIG. 4 is a schematic vertical cross-sectional view of a conventional ECD.
FIG. 5 is a perspective view showing an example of a conductive clip. FIG. 6 is a cross-sectional view of the conductive clip of FIG. 5. FIG. 7 is an explanatory diagram showing how the sealing material has entered the gap between the substrate and the conductive clip. FIG. 8 is a cross-sectional view of yet another example of a conductive clip. Explanation of symbols of main parts, S...substrate, A...upper electrode, B...lower electrode, B1 ...lower electrode extraction part, E...reduction coloring EC layer or WO 3 layer, F
... Upper electrode extraction part, H ... Conductive clip, G ... Glass plate for sealing, R ... Sealing material, L A ,
L B ...External wiring, J...Insulating material.
Claims (1)
及び下部電極からなり、前記上部電極及び下部電
極の取り出し部にそれぞれ導電性クリツプを取り
付け、これを介して外部配線を接続したエレクト
ロクロミツク素子に於いて、 前記導電性クリツプの露出面全部を絶縁材料で
被覆して前記導電性クリツプの腐食と短絡を防止
し、かつ前記導電性クリツプが、ほぼコの字形の
断面を有するほぼ樋状の金属からなることを特徴
とするエレクトロクロミツク素子。[Claims for Utility Model Registration] An electrochromic device comprising at least an upper electrode, an electrochromic layer, and a lower electrode, with conductive clips attached to the lead-out portions of the upper electrode and the lower electrode, and external wiring connected through these. In the clip element, the entire exposed surface of the conductive clip is coated with an insulating material to prevent corrosion and short circuiting of the conductive clip, and the conductive clip has a substantially U-shaped cross section. An electrochromic element characterized by being made of a shaped metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986097187U JPH0522919Y2 (en) | 1986-06-25 | 1986-06-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986097187U JPH0522919Y2 (en) | 1986-06-25 | 1986-06-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS634525U JPS634525U (en) | 1988-01-13 |
| JPH0522919Y2 true JPH0522919Y2 (en) | 1993-06-11 |
Family
ID=30963878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986097187U Expired - Lifetime JPH0522919Y2 (en) | 1986-06-25 | 1986-06-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0522919Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19548379A1 (en) * | 1994-12-29 | 1996-07-04 | Murakami Kaimeido Kk | Electrochromic rearview mirror for a motor vehicle |
| CN103380340A (en) * | 2011-02-02 | 2013-10-30 | 红牛有限公司 | Casing for a device that can be used in domestic, gastronomical, or retail sectors |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6068521U (en) * | 1983-10-17 | 1985-05-15 | 日立マクセル株式会社 | electrochromic display element |
-
1986
- 1986-06-25 JP JP1986097187U patent/JPH0522919Y2/ja not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19548379A1 (en) * | 1994-12-29 | 1996-07-04 | Murakami Kaimeido Kk | Electrochromic rearview mirror for a motor vehicle |
| DE19548379C2 (en) * | 1994-12-29 | 2003-08-21 | Murakami Kaimeido Kk | Electrochromic rearview mirror for a motor vehicle |
| CN103380340A (en) * | 2011-02-02 | 2013-10-30 | 红牛有限公司 | Casing for a device that can be used in domestic, gastronomical, or retail sectors |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS634525U (en) | 1988-01-13 |
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