JPH05226020A - Anisotropically conductive adhesive film - Google Patents
Anisotropically conductive adhesive filmInfo
- Publication number
- JPH05226020A JPH05226020A JP2662592A JP2662592A JPH05226020A JP H05226020 A JPH05226020 A JP H05226020A JP 2662592 A JP2662592 A JP 2662592A JP 2662592 A JP2662592 A JP 2662592A JP H05226020 A JPH05226020 A JP H05226020A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive film
- temperature
- film
- electrodes
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、液晶表示モジュール等
の電極と相対峙させた回路基板の電極を接続固定するの
に用いられる異方導電性接着フィルムに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive adhesive film used for connecting and fixing an electrode of a circuit board and an electrode of a liquid crystal display module or the like.
【０００２】[0002]
【従来の技術】近年、電子部品の小型化、薄型化、高性
能化が進んでおり、それと共に経済的な高密度実装技術
の開発が活発に行われている。例えば、液晶表示モジュ
ール（ＬＣＤ）とＴＡＢ(Tape Automated Bonding)もし
くはＦＰＣ(Flexible Print Circuit)基板等の微細電極
同士を接続するに際し、異方導電接着フィルムを相対峙
させた電極間に挾み、加熱加圧することにより複数の電
極を一括接続する方法が行われつつある。2. Description of the Related Art In recent years, electronic parts have become smaller, thinner, and have higher performance, and along with that, economical high-density mounting technology has been actively developed. For example, when connecting a liquid crystal display module (LCD) and fine electrodes such as TAB (Tape Automated Bonding) or FPC (Flexible Print Circuit) substrate, an anisotropic conductive adhesive film is sandwiched between the electrodes and heated. A method of collectively connecting a plurality of electrodes by applying pressure is being used.
【０００３】[0003]
【発明が解決しようとする課題】接続は通常、熱盤を有
する圧着機により熱圧着することによりおこなわれる
が、接続中の異方導電性接着フィルムそのものの温度を
直接測定することができないため、接続作業の管理に問
題があった。特に接着剤成分が熱硬化性樹脂の場合に
は、接続時の温度が接続後の信頼性に重要なファクター
となるが、従来は上記熱盤で温度をチェックするだけ
で、被接続物の接続温度は、接続後の導電粒子状態や樹
脂の流動状態等を目視により観察し、間接的に接続温度
を推定する以外なかった。本発明はかかる状況に鑑みな
されたもので、接続時の被接続物の温度をほぼ正確に把
握できる異方導電性接着フィルムを提供することを目的
とする。The connection is usually carried out by thermocompression bonding with a pressure bonding machine having a heating plate. However, since the temperature of the anisotropic conductive adhesive film itself during connection cannot be directly measured, There was a problem managing the connection work. Especially when the adhesive component is a thermosetting resin, the temperature at the time of connection is an important factor for reliability after connection, but in the past it was only necessary to check the temperature with the above hot plate to connect the object to be connected. Regarding the temperature, there was nothing but to estimate the connection temperature indirectly by visually observing the conductive particle state and the resin flow state after the connection. The present invention has been made in view of the above circumstances, and an object thereof is to provide an anisotropic conductive adhesive film capable of almost accurately grasping the temperature of an object to be connected during connection.
【０００４】[0004]
【課題を解決するための手段】かかる目的は本発明によ
れば、接着フィルムの接着剤成分中に、確認したい温度
の融点をもつプラスチック微粉末を配合しフィルム化す
ることにより達成される。本発明において用いられるプ
ラスチック微粉末としては、特に限定するものではない
が、明確な融点を有する結晶性プラスチックが好まし
い。異方導電性接着フィルムによる接続温度は一般に１
５０〜１８０℃であることを考慮すると、ポリプロピレ
ン（融点１６７℃）、ポリエステル（同１７０℃）、ポ
リフッ化ビニリデン（同１８０℃）等の使用が可能であ
る。プラスチック微粉末の形状、粒径は特に限定されな
いが、温度による形状変化が観察しやすい形状で、導電
性微粒子より小さい粒径のものが好ましい。またプラス
チック微粉末は着色してあればより観察しやすくなる。
また配合量は接着剤成分にたいし０．５〜３ｖｏｌ％の
割合である。According to the present invention, such an object can be achieved by blending an adhesive component of an adhesive film with a fine plastic powder having a melting point at a desired temperature to form a film. The fine plastic powder used in the present invention is not particularly limited, but crystalline plastic having a clear melting point is preferable. The connection temperature with anisotropic conductive adhesive film is generally 1
Considering that the temperature is 50 to 180 ° C, it is possible to use polypropylene (melting point 167 ° C), polyester (170 ° C), polyvinylidene fluoride (180 ° C) and the like. The shape and particle size of the fine plastic powder are not particularly limited, but it is preferable that the shape is such that the shape change due to temperature can be easily observed and the particle size is smaller than the conductive fine particles. If the fine plastic powder is colored, it will be easier to observe.
Further, the compounding amount is a ratio of 0.5 to 3 vol% with respect to the adhesive component.
【０００５】[0005]
【作用】本発明によれば、接続時の温度がプラスチック
微粉末の融点以上であればプラスチック微粉末は融解な
いし変形するので、その形状を観察することにより接続
時の被接続物の温度を推定することができる。また融点
の異なる種類のプラスチック微粉末をそれぞれ異なった
色に着色したものを配合することにより、より正確な温
度の推定が可能になる。以下、実施例を用いてさらに詳
細に説明する。According to the present invention, if the temperature at the time of connection is equal to or higher than the melting point of the fine plastic powder, the fine plastic powder melts or deforms. Therefore, the temperature of the connected object at the time of connection can be estimated by observing its shape. can do. Further, by mixing plastic fine powders having different melting points with different colors, it is possible to more accurately estimate the temperature. Hereinafter, it will be described in more detail with reference to examples.
【０００６】[0006]
【実施例】以下、本発明を実施例により説明する。EXAMPLES The present invention will be described below with reference to examples.
【０００７】実施例１ エポキシ系接着成分中に平均粒径が３μｍのＮｉ粒子を
３vol％および平均粒径が２μｍのポリプロピレン粉末
２vol％の割合で配合してなる厚さ１５μｍの接着フィ
ルムを離型フィルム上に流延成形して作製した。この接
着フィルムを、厚み１．１ｍｍのＩＴＯガラス基板（電
極ピッチ０．２ｍｍ）の回路電極上に載置し、更に同じ
ピッチを有する厚さ５０μｍのポリイミドベースのＴＡ
Ｂを電極が相対峙するように位置合わせを行った後、Ｔ
ＡＢ側より１５０℃、１６０℃、１７０℃、１８０℃の
条件で、加熱熱盤により熱圧着した。加圧条件は、いず
れも２０ｋｇｆ／ｃｍ2−２０秒で行った。接続作業の
後、電極ピッチ間の透明部分のポリプロピレン粉末の形
状を拡大鏡によりを観察した結果、熱盤の温度を１８０
℃に設定した場合にはポリプロピレン粉末（融点１６７
℃）の形状に変化が見られたが、１７０℃でおこなった
場合にはポリプロピレン粉末の形状に変化がなかった。
このことから、ポリプロピレン粉末を混合した異方導電
性接着フィルムであれば、接続時の接着フィルムの温度
が１７０℃以上であったかまたはそれ以下であったかが
判定できる。Example 1 An adhesive film having a thickness of 15 μm was prepared by mixing 3 vol% of Ni particles having an average particle diameter of 3 μm and 2% by volume of polypropylene powder having an average particle diameter of 2 μm in an epoxy adhesive component. It was produced by casting on a film. This adhesive film was placed on a circuit electrode of an ITO glass substrate (electrode pitch 0.2 mm) having a thickness of 1.1 mm, and a polyimide-based TA having a thickness of 50 μm and having the same pitch.
After aligning B so that the electrodes face each other, T
From the AB side, thermocompression bonding was performed with a heating hot plate under the conditions of 150 ° C, 160 ° C, 170 ° C, and 180 ° C. The pressurization condition was 20 kgf / cm 2 -20 seconds in all cases. After the connection work, the shape of the polypropylene powder in the transparent part between the electrode pitches was observed with a magnifying glass, and the temperature of the heating plate was 180
If set to ℃, polypropylene powder (melting point 167
Change in the shape of polypropylene powder was not observed when it was carried out at 170 ° C.
From this, it is possible to determine whether the temperature of the adhesive film at the time of connection is 170 ° C. or higher or lower if it is the anisotropic conductive adhesive film mixed with polypropylene powder.
【０００８】実施例２ プラスチック微粉末として青色に着色した変性ポリオレ
フィンアドマー（Ａ、融点１６０℃）、黄色に着色した
ポリエステル（Ｂ、融点１７０℃）および赤色に着色し
たポリフッカビニリデン（Ｃ、融点１８０℃）の微粉末
をそれぞれ１vol％添加した異方導電性接着フィルムを
実施例１に準じて作製した。このフィルムを用いて熱盤
温度を表１に示す温度条件で接続した。その結果を表１
に示した。表から明らかなように、フィルム中の各プラ
スチック微粉末の形状変化から、接続時の温度判定が容
易にできることがわかる。Example 2 As a plastic fine powder, a modified polyolefin admer colored in blue (A, melting point 160 ° C.), a polyester colored in yellow (B, melting point 170 ° C.) and polyfukka vinylidene (C, melting point 180) colored in red. According to the same manner as in Example 1, an anisotropic conductive adhesive film was prepared by adding 1 vol% of fine powder (° C.). Using this film, the hot platen was connected under the temperature conditions shown in Table 1. The results are shown in Table 1.
It was shown to. As is apparent from the table, it can be seen that the temperature determination at the time of connection can be easily made from the shape change of each plastic fine powder in the film.
【０００９】[0009]
【表１】 表１ 接続試験結果 [Table 1] Table 1 Connection test results
【００１０】[0010]
【発明の効果】以上述べたごとく、本発明によれば接続
時の温度判定が容易にでき、接続作業の管理が大幅に改
善することが可能になった。As described above, according to the present invention, it is possible to easily determine the temperature at the time of connection, and it is possible to significantly improve the management of connection work.
Claims (1)
る異方導電性接着フィルムにおいて、１００〜２００℃
の任意の融点を有するプラスチック微粉末を添加するこ
とを特徴とする異方導電性接着フィルム。1. An anisotropic conductive adhesive film comprising conductive fine particles dispersed in an adhesive at 100 to 200 ° C.
An anisotropic conductive adhesive film, characterized in that a fine plastic powder having an arbitrary melting point is added.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2662592A JPH05226020A (en) | 1992-02-13 | 1992-02-13 | Anisotropically conductive adhesive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2662592A JPH05226020A (en) | 1992-02-13 | 1992-02-13 | Anisotropically conductive adhesive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05226020A true JPH05226020A (en) | 1993-09-03 |
Family
ID=12198647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2662592A Pending JPH05226020A (en) | 1992-02-13 | 1992-02-13 | Anisotropically conductive adhesive film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05226020A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007080522A (en) * | 2005-09-09 | 2007-03-29 | Sumitomo Bakelite Co Ltd | Anisotropic conductive film, and electronic/electric apparatus |
| JP2013105886A (en) * | 2011-11-14 | 2013-05-30 | Dexerials Corp | Method for determining joining condition of electronic component |
-
1992
- 1992-02-13 JP JP2662592A patent/JPH05226020A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007080522A (en) * | 2005-09-09 | 2007-03-29 | Sumitomo Bakelite Co Ltd | Anisotropic conductive film, and electronic/electric apparatus |
| JP2013105886A (en) * | 2011-11-14 | 2013-05-30 | Dexerials Corp | Method for determining joining condition of electronic component |
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