JPH05218282A - Semiconductor package - Google Patents
Semiconductor packageInfo
- Publication number
- JPH05218282A JPH05218282A JP4022649A JP2264992A JPH05218282A JP H05218282 A JPH05218282 A JP H05218282A JP 4022649 A JP4022649 A JP 4022649A JP 2264992 A JP2264992 A JP 2264992A JP H05218282 A JPH05218282 A JP H05218282A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- protective film
- semiconductor package
- lead
- time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、表面実装タイプの半導
体パッケージ、特にそのリード線の保護装置に関する。
最近のリード線ピッチの微細化・多ピン化に伴い１本当
りのリード線強度も低下し、それに伴い例えば搬送時に
リード線の変形が生じ易く、その対策が要求されてい
る。本発明はそのようなリード線の変形を防止する技術
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type semiconductor package, and more particularly to a lead wire protection device for the same.
With recent miniaturization of the lead wire pitch and increase in the number of pins, the strength of the lead wire per wire is also reduced. As a result, for example, the lead wire is likely to be deformed at the time of transportation, and a countermeasure is required. The present invention relates to a technique for preventing such lead wire deformation.
【０００２】[0002]
【従来の技術】従来この種のパッケージは、図５に示す
様に、本体１０から四方に延びる個々のリード１１（ピ
ン）が個々に独立しており、単ピン毎に曲がりが発生す
るという問題があった。そこで、例えば図６に示す如
く、矩形の支持フレーム１３をフレームの周囲端部に挟
みつけるようにして接着させ、この状態で搬送あるいは
性能テストに供することが提案されている。尚、このフ
レームは性能テスト時に位置合わせガイドとしても役立
つ。2. Description of the Related Art Conventionally, in this type of package, as shown in FIG. 5, individual leads 11 (pins) extending in four directions from a main body 10 are independent from each other, and bending occurs for each single pin. was there. Therefore, for example, as shown in FIG. 6, it has been proposed that a rectangular support frame 13 be sandwiched between the peripheral edges of the frame and adhered to each other, and the support frame 13 is conveyed or tested for performance in this state. The frame also serves as a positioning guide during performance testing.
【０００３】[0003]
【発明が解決しようとする課題】しかるに、図６に示す
如き従来技術にあっては、最終的にプリント板に実装す
る際に、ユーザ側で図７に示す如く、支持フレーム１３
を切除し、更にリードの曲げ加工を行なう必要がある
（尚、図７では一部のリード線のみを拡大して示してあ
る）。また、性能テストの際には、各リード線の中央部
分が接続部分となり好ましくない。何となれば、リード
線の中央部にテスタのコンタクタを接触させる方法では
接触が不安定となるからである。そのため、従来から一
般に、好ましくは性能テストはリード線の端部底面を接
続部として行われている。In the prior art as shown in FIG. 6, however, when the user finally mounts it on the printed board, the support frame 13 as shown in FIG.
It is necessary to cut off the lead wire and to further bend the lead (note that in FIG. 7, only a part of the lead wire is enlarged). Further, in the performance test, the central part of each lead wire is not preferable because it becomes a connection part. This is because the contact becomes unstable in the method of bringing the contactor of the tester into contact with the central portion of the lead wire. Therefore, conventionally, preferably, the performance test is generally performed using the bottom surface of the end portion of the lead wire as the connection portion.
【０００４】[0004]
【課題を解決するための手段】本発明の目的はこのよう
な問題、即ち、ユーザサイドでの作業負担を軽減すると
共に、従来のコンタクタを用いてリード線底面を接続部
として利用可能な半導体パッケージを提供することにあ
る。上記目的を達成するために、本発明によれば、パッ
ケージ本体と該パッケージ本体から周囲に延びる多数の
リード線とを有する半導体パッケージにおいて、リード
線の端部にこれを覆う保護フィルムを貼付し該保護フィ
ルムはリード線の半田接合時にその熱により軟化しリー
ド線に融着される材料により形成されることを構成上の
特徴とする。SUMMARY OF THE INVENTION An object of the present invention is to solve such a problem, that is, to reduce the work load on the user side and to use the bottom surface of the lead wire as a connecting portion by using a conventional contactor. To provide. In order to achieve the above object, according to the present invention, in a semiconductor package having a package main body and a large number of lead wires extending from the package main body, a protective film covering the lead wires is attached to the end portions of the lead wires. The protective film is characterized in that it is formed of a material that is softened by the heat of the lead wire when it is joined by solder and is fused to the lead wire.
【０００５】また、好ましくは、上記保護フィルムは中
央部をパッケージ本体の形状に応じてくり抜いた略矩形
形状を有する。また更に好ましくは、上記保護フィルム
には半導体パッケージの実装方向を示す表示手段が施さ
れている。Further, preferably, the protective film has a substantially rectangular shape in which the central portion is cut out in accordance with the shape of the package body. Still more preferably, the protective film is provided with display means for indicating the mounting direction of the semiconductor package.
【０００６】[0006]
【作用】上記構成によれば、従来の支持フレームに替え
て、リード線の端部上面上に保護フィルムを貼着するこ
とにより各リード線は一体結合されるので、機械的衝撃
等を受けても曲げが発生し難く、また、リード線の端部
底面は露出したままなので、たとえば性能テスト時の接
続部としてそのまま使用出来る。保護フィルムを熱によ
り軟化する材料で形成することにより、リード線のプリ
ント板実装時の半田溶融熱で保護フィルムは融け、従っ
て、保護フィルムを除去する作業が不要となる。また、
保護フィルムの貼着をリード線（ピン）の曲げ加工後に
行なえば、ユーザサイドでの曲げ作業は不要である。According to the above construction, the lead wires are integrally joined by attaching a protective film on the upper surface of the end portions of the lead wires instead of the conventional support frame, so that they are subjected to mechanical shock or the like. Bending is less likely to occur, and the bottom surface of the end of the lead wire remains exposed, so it can be used as it is, for example, as a connection portion during a performance test. By forming the protective film with a material that is softened by heat, the protective film is melted by the solder melting heat when the lead wire is mounted on the printed board, and therefore, the work of removing the protective film is unnecessary. Also,
If the attachment of the protective film is performed after bending the lead wire (pin), the bending work on the user side is unnecessary.
【０００７】[0007]
【実施例】以下、本発明の好ましい実施例につき図面
（特に、図１〜図４）を参照して詳細に説明する。尚、
上記に説明した図５以下に示すものと対応する部品につ
いては同一の部品番号を付与しその重複説明を省略す
る。本発明では、好ましくは、図１に示す如くユーザへ
の出荷前に必要なリード線１１の端部折曲加工を予め済
ましておく。その後、図４に示す如き形状の保護フィル
ム１５を、曲げ加工したリード線１１の端部周囲の上面
上に接着材（図示せず）等を介して被着する。保護フィ
ルム１５は半導体パッケージ本体１０に対応する部分を
くり抜いた略矩形の形状を呈するが、その形状は半導体
パッケージ本体１０及びリード線１１の形状に応じて適
宜決められる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will now be described in detail with reference to the drawings (in particular, FIGS. 1 to 4). still,
The parts corresponding to those shown in FIG. 5 and subsequent figures explained above are given the same part numbers, and duplicate explanations thereof are omitted. In the present invention, preferably, the end portion bending process of the lead wire 11 required before shipping to the user is completed in advance as shown in FIG. After that, a protective film 15 having a shape as shown in FIG. 4 is adhered to the upper surface around the end of the bent lead wire 11 with an adhesive (not shown) or the like. The protective film 15 has a substantially rectangular shape in which a portion corresponding to the semiconductor package body 10 is hollowed out, and the shape thereof is appropriately determined according to the shapes of the semiconductor package body 10 and the lead wire 11.
【０００８】半導体パッケージは最終的にはプリント板
２０（図３）に実装されるが、その際にリード線１１の
底面はプリント板２０の対応導体パターンに半田付けさ
れる。そこで、保護フィルム１５はこの半田作業時の熱
により軟化し溶融、蒸発する材料で形成する。そうする
ことにより、保護フィルム１５を態々取り除く作業は必
要なくなる。また、蒸発しないまでも溶融する材料であ
れば接着材として寄与し、従来のものと機能上差はな
い。The semiconductor package is finally mounted on the printed board 20 (FIG. 3), and at this time, the bottom surface of the lead wire 11 is soldered to the corresponding conductor pattern of the printed board 20. Therefore, the protective film 15 is formed of a material that is softened, melted, and evaporated by the heat during the soldering work. By doing so, the work of removing the protective film 15 from time to time becomes unnecessary. Further, if it is a material that melts even if it does not evaporate, it contributes as an adhesive and there is no functional difference from the conventional one.
【０００９】そのような保護フィルム１５の材料として
は例えば、以下のものが考えられる。 材料 軟化温度（℃） エコノール ２００ ペス １７０ ウルテムＰＥＩ １７０ ＡＢＳ ８０ ポリエステル ８０ 一般に、実装時の温度は２１５〜２３５℃程度であり、
上記の材料はいずれも実用に供する。As the material of such a protective film 15, for example, the following can be considered. Material Softening temperature (° C) Econol 200 Pes 170 Ultem PEI 170 ABS 80 Polyester 80 Generally, the temperature at the time of mounting is about 215 to 235 ° C,
All of the above materials are put to practical use.
【００１０】保護フィルム１５には図４に示す如く、必
要に応じて半導体本体１０に対する位置合わせ用の孔１
７を設けることが出来る。即ち、半導体本体１０に形成
された対応の孔１８と保護フィルム１５の孔１７とを合
わせることにより両者の位置合わせが確実に行なわれ
る。半導体本体１０との関係で保護フィルム１５に特定
の方向性がない場合には当然のことながら位置合わせ孔
１７は不要である。また、同様にプリント板２０（図
３）に対する方向性を特定する必要が有る場合には、保
護フィルム１５の一隅に例えば切欠き２１（図２，４）
を形成しておけば容易に位置決めが出来る。As shown in FIG. 4, the protective film 15 has holes 1 for positioning the semiconductor body 10 as necessary.
7 can be provided. That is, by aligning the corresponding holes 18 formed in the semiconductor body 10 with the holes 17 of the protective film 15, the positions of the two can be surely aligned. When the protective film 15 does not have a specific directionality in relation to the semiconductor body 10, the alignment hole 17 is naturally unnecessary. Similarly, when it is necessary to specify the directionality with respect to the printed board 20 (FIG. 3), for example, a notch 21 (FIGS. 2 and 4) is provided at one corner of the protective film 15.
Positioning can be done easily by forming.
【００１１】[0011]
【発明の効果】以上に記載した如く、本発明によれば、
保護フィルムによりリード線の保護を確実に行なうこと
が出来、リード線の偶発的な曲がりや破損によるリード
ダメージを防止出来る。また、ユーザサイドでの作業負
担が軽減され、かつ、プリント板への搭載も容易に行な
うことが出来、完全自動化への道を開くものである。更
に、リード端子はその底面が露出しているので、従来と
全く同様なコンタクトを用いて性能試験等を行なうこと
が出来る。As described above, according to the present invention,
The protective film can protect the lead wire reliably, and can prevent lead damage due to accidental bending or breakage of the lead wire. Further, the work load on the user side can be reduced, and it can be easily mounted on a printed board, thus paving the way for full automation. Furthermore, since the bottom surface of the lead terminal is exposed, the performance test or the like can be performed using a contact that is exactly the same as the conventional one.
【図１】本発明に係る半導体パッケージの保護フィルム
被着前の状態を示す図である。FIG. 1 is a diagram showing a state before a protective film is attached to a semiconductor package according to the present invention.
【図２】本発明に係る半導体パッケージの保護フィルム
被着後の状態を示す図である。FIG. 2 is a view showing a state after a protective film is attached to a semiconductor package according to the present invention.
【図３】図２のＡ部拡大図である。FIG. 3 is an enlarged view of part A of FIG.
【図４】本発明に係る保護フィルムの拡大斜視図であ
る。FIG. 4 is an enlarged perspective view of a protective film according to the present invention.
【図５】従来の半導体パッケージの保護フレーム被着前
の状態を示す図である。FIG. 5 is a diagram showing a state before a protective frame is attached to a conventional semiconductor package.
【図６】従来の半導体パッケージの保護フレーム被着後
の状態を示す図である。FIG. 6 is a view showing a state after a protective frame of a conventional semiconductor package is attached.
【図７】図６に示す保護フレームを切除し、リード線端
部の曲げ加工後の状態を示す図である。FIG. 7 is a diagram showing a state after cutting the protective frame shown in FIG. 6 and bending the end portion of the lead wire.
１０…パッケージ本体 １１…リード線 １５…保護フィルム 10 ... Package body 11 ... Lead wire 15 ... Protective film
Claims (3)
本体から周囲に延びる多数のリード線（１１）とを有す
る半導体パッケージにおいて、リード線の端部上面にこ
れを覆う保護フィルム（１５）を貼付し該保護フィルム
はリード線の半田接合時にその熱により軟化しリード線
に融着される材料により形成されることを特徴とする半
導体パッケージ。1. In a semiconductor package having a package body (10) and a large number of lead wires (11) extending from the package body to the periphery, a protective film (15) for covering the lead wires is attached to the upper end surface of the lead wires. A semiconductor package, wherein the protective film is formed of a material that is softened by heat when the lead wire is soldered and is fused to the lead wire.
本体の形状に応じてくり抜いた略矩形形状を有すること
を特徴とする請求項１に記載の半導体パッケージ。2. The semiconductor package according to claim 1, wherein the protective film has a substantially rectangular shape in which a central portion is cut out according to the shape of the package body.
の実装方向を示す表示手段（１７，２１）が施されてい
ることを特徴とする請求項２に記載の半導体パッケー
ジ。3. The semiconductor package according to claim 2, wherein the protective film is provided with display means (17, 21) for indicating a mounting direction of the semiconductor package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4022649A JPH05218282A (en) | 1992-02-07 | 1992-02-07 | Semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4022649A JPH05218282A (en) | 1992-02-07 | 1992-02-07 | Semiconductor package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05218282A true JPH05218282A (en) | 1993-08-27 |
Family
ID=12088699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4022649A Pending JPH05218282A (en) | 1992-02-07 | 1992-02-07 | Semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05218282A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100759358B1 (en) * | 2005-01-27 | 2007-09-19 | 아이신세이끼가부시끼가이샤 | Opening and closing member control apparatus |
-
1992
- 1992-02-07 JP JP4022649A patent/JPH05218282A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100759358B1 (en) * | 2005-01-27 | 2007-09-19 | 아이신세이끼가부시끼가이샤 | Opening and closing member control apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5895970A (en) | Semiconductor package having semiconductor element, mounting structure of semiconductor package mounted on circuit board, and method of assembling semiconductor package | |
| JPH0411349Y2 (en) | ||
| JP2878066B2 (en) | Connection method of printed circuit board | |
| US4839713A (en) | Package structure for semiconductor device | |
| JPS6298737A (en) | Replacement of semiconductor device | |
| US3984739A (en) | Structure for packaging integrated circuits | |
| JPH0856100A (en) | Apparatus for mounting surface mount device on circuit board | |
| JPH05218282A (en) | Semiconductor package | |
| JP2557583B2 (en) | Chip life tester for semiconductor devices | |
| JPH07122713B2 (en) | Flexible wiring board, manufacturing method thereof, and electronic component | |
| EP0616367A1 (en) | Lead structure and lead connecting method for semiconductor device | |
| JPH10294552A (en) | Mount circuit device | |
| JPH01143389A (en) | Hybrid integrated circuit device | |
| JP3895465B2 (en) | Board mounting method, board mounting structure | |
| JP2542675B2 (en) | Semiconductor device | |
| JP2002026179A (en) | Semiconductor device and its manufacturing method | |
| JPH11145373A (en) | Tape carrier package, and liquid crystal display using the tape carrier package | |
| JP2786047B2 (en) | Resin-sealed semiconductor device | |
| JPH0225245Y2 (en) | ||
| JP2699557B2 (en) | Manufacturing method of TAB type semiconductor device | |
| JP2001060600A (en) | Semiconductor device | |
| JP2606673B2 (en) | Mounted body | |
| JPH11126798A (en) | Lead terminal for surface mounting, its maufacture and circuit component having the lead terminal | |
| JPS6242376B2 (en) | ||
| JPH07235628A (en) | Mounting method of electronic device and semiconductor integrated circuit device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19991026 |