JPH05218261A - Fluxing method - Google Patents
Fluxing methodInfo
- Publication number
- JPH05218261A JPH05218261A JP1726192A JP1726192A JPH05218261A JP H05218261 A JPH05218261 A JP H05218261A JP 1726192 A JP1726192 A JP 1726192A JP 1726192 A JP1726192 A JP 1726192A JP H05218261 A JPH05218261 A JP H05218261A
- Authority
- JP
- Japan
- Prior art keywords
- flux
- terminal
- electronic component
- depositing
- constant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Coating With Molten Metal (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、溶融はんだに電子部品
の端子を浸漬して予備はんだする前のフラックスの被着
方法、特に電子部品の端子にフラックスを薄く且つ均一
の厚さで被着できるとともに、端子へのフラックスの被
着領域を一定にできるフラックスの被着方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for depositing a flux before dipping a terminal of an electronic component in molten solder and pre-soldering, and particularly depositing the flux on the terminal of an electronic component in a thin and uniform thickness. The present invention relates to a method of depositing a flux, which is capable of maintaining a constant flux deposit area on a terminal.
【０００２】[0002]
【従来の技術】次に、電子部品の端子に予備はんだする
際の従来のフラックスの被着方法について図２を参照し
て説明する。2. Description of the Related Art Next, a conventional flux deposition method for pre-soldering a terminal of an electronic component will be described with reference to FIG.
【０００３】図２は、従来のフラックスの被着方法を説
明するための図であって、同図(a)は電子部品の端子を
フラックスに浸漬する状態を模式的に示す要部側断面
図、同図(b) は端子へのフラックスの付着量を模式的に
示す要部拡大側断面図、同図(c) はフラックスの被着領
域を示す端子の要部拡大側断面図である。FIG. 2 is a view for explaining a conventional method for depositing a flux, and FIG. 2 (a) is a side sectional view of an essential part schematically showing a state in which a terminal of an electronic component is dipped in the flux. FIG. 6B is an enlarged side sectional view of an essential part schematically showing the amount of flux adhered to the terminal, and FIG. 6C is an enlarged side sectional view of the essential part of the terminal showing a flux deposition area.
【０００４】電子部品の端子への従来のフラックスの被
着方法は、同図(a) に示すように、電子部品10を矢印Ｄ
方向、すなわち、鉛直方向に移動してフラックス容器12
に入れられた液状のフラックス11にその端子10a を浸漬
した後に、矢印Ｕ方向に引き上げて行なっていた。In the conventional method of depositing the flux on the terminals of the electronic component, as shown in FIG.
Direction, that is, the vertical direction, the flux container 12
After immersing the terminal 10a in the liquid flux 11 put in the container, the terminal 10a was pulled up in the direction of the arrow U.
【０００５】[0005]
【発明が解決しようとする課題】前述した従来のフラッ
クスの被着方法により電子部品10の端子10a にフラック
ス11を被着すると、図２の(b) 図で示すように端子10a
へのフラックス11の被着量が変動する問題、すなわち、
フラックス11の粘度が低いと端子10a への被着量が少な
くなり、またフラックス11の粘度が高くなると端子10a
への被着量が多くなるという問題や、また、図２の(a)
及び(b) 図に示すように電子部品10の端子10a にフラッ
クス11を被着する際のこの電子部品10の移動量Ｓを一定
にしてもフラックス容器12の底からフラックス11の液面
までの距離Ｈの変動により端子10aへのフラックス11の
被着領域がバラツキという問題があった。When the flux 11 is adhered to the terminal 10a of the electronic component 10 by the above-described conventional flux adhering method, the terminal 10a as shown in FIG. 2 (b) is obtained.
Problem that the amount of flux 11 deposited on the
If the viscosity of the flux 11 is low, the amount of adhesion to the terminal 10a will be small, and if the viscosity of the flux 11 is high, the terminal 10a will be
The problem that the amount of deposition on the
And (b) As shown in the figure, from the bottom of the flux container 12 to the liquid surface of the flux 11 even if the moving amount S of the electronic component 10 when the flux 11 is applied to the terminal 10a of the electronic component 10 is fixed. There is a problem that the area where the flux 11 is adhered to the terminal 10a varies due to the variation of the distance H.
【０００６】本発明は、このような問題を解消するため
になされたものであって、その目的は、電子部品の端子
にフラックスを薄く且つ均一の厚さで被着できるととも
に、端子へのフラックスの被着領域を一定にできるフラ
ックスの被着方法を提供することにある。The present invention has been made in order to solve such a problem, and an object thereof is to make it possible to deposit a flux on a terminal of an electronic component with a thin and uniform thickness, and Another object of the present invention is to provide a method for depositing a flux that can make the deposition area of the flux constant.
【０００７】[0007]
【課題を解決するための手段】前記目的は、図１に示す
ように、溶融はんだに電子部品の端子を浸漬して予備は
んだする前のフラックスの被着方法において、フラック
ス11を染み込ませたゴム弾性を有する海綿状部材13に電
子部品10の端子10a を押し付け、この端子10a の表面に
フラックス11を被着することを特徴とするフラックスの
被着方法により達成される。As shown in FIG. 1, the purpose of the invention is to apply a flux impregnated with a flux 11 in a method of depositing a flux before immersing a terminal of an electronic component in molten solder and pre-soldering. This is accomplished by a flux deposition method characterized in that the terminal 10a of the electronic component 10 is pressed against the spongy member 13 having elasticity, and the flux 11 is deposited on the surface of the terminal 10a.
【０００８】[0008]
【作用】本発明のフラックスの被着方法は、フラックス
11を染み込ませたゴム弾性を有する海綿状部材13に電子
部品10の端子10a を押し付け、この端子10a の表面にフ
ラックス11を被着するように構成している。The method of depositing the flux of the present invention is
The terminal 10a of the electronic component 10 is pressed against the spongy member 13 having rubber elasticity and impregnated with 11 and the flux 11 is attached to the surface of the terminal 10a.
【０００９】したがって、フラックス11が染み込んだ海
綿状部材13に電子部品10の端子10aを押し付けた後に、
この電子部品10を引き上げると海綿状部材13が端子10a
に被着したフラックス11を吸い取るから、この端子10a
に被着したフラックス11は薄く且つ均一の厚さとなる。Therefore, after pressing the terminal 10a of the electronic component 10 against the spongy member 13 soaked with the flux 11,
When the electronic component 10 is pulled up, the sponge-like member 13 is connected to the terminal 10a.
The flux 11 deposited on the
The flux 11 deposited on the thin film has a thin and uniform thickness.
【００１０】また、海綿状部材13の形状は一定している
から電子部品10の端子10a にフラックス11を被着する際
のこの電子部品10の移動量Ｓ（図２の(a) 図参照) を一
定にしておけば、この海綿状部材13への電子部品10の端
子10a の押し込み深さは一定となり、端子10a へのフラ
ックス11の被着領域が一定となる。Further, since the shape of the spongy member 13 is constant, the movement amount S of the electronic component 10 when the flux 11 is applied to the terminal 10a of the electronic component 10 (see FIG. 2 (a)). If the distance is kept constant, the pushing depth of the terminal 10a of the electronic component 10 into the spongy member 13 becomes constant, and the area where the flux 11 is adhered to the terminal 10a becomes constant.
【００１１】[0011]
【実施例】以下、本発明の一実施例のフラックスの被着
方法について図１を参照して説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A flux depositing method according to an embodiment of the present invention will be described below with reference to FIG.
【００１２】図１は、本発明の一実施例のフラックスの
被着方法を説明するための図で、同図(a) は電子部品の
端子にフラックスを被着する状態を模式的に示す要部側
断面図、同図(b) は端子へのフラックスの付着量を模式
的に示す要部拡大側断面図、同図(c) はフラックスの被
着領域を示す端子の要部拡大側断面図である。FIG. 1 is a diagram for explaining a method of depositing flux according to an embodiment of the present invention. FIG. 1 (a) is a schematic diagram showing a state in which flux is deposited on terminals of an electronic component. Side sectional view, Figure (b) is an enlarged side sectional view of the main part that schematically shows the amount of flux adhered to the terminal, and Figure (c) is an enlarged side sectional view of the main part of the terminal that shows the flux deposition area. It is a figure.
【００１３】なお、本明細書においては、同一部品、同
一材料等に対しては全図をとおして同じ符号を付与して
ある。本発明の一実施例のフラックスの被着方法は、同
図(a) に示すように、フラックス11を適量入れた浅い升
状のフラックス容器12に嵌着されて、このフラックス11
が十分に染み込んだ厚さが一様で板状をした海綿状部
材、例えば、ウレタンに無数の気泡を含ませてなる発泡
ウレタンブロック13に、電子部品10の端子10a を押し付
けてフラックス11を被着するように構成したものであ
る。In the present specification, the same parts and the same materials are allotted with the same reference numerals throughout the drawings. As shown in FIG. 1A, the flux deposition method according to the embodiment of the present invention is performed by fitting the flux 11 into a shallow box-shaped flux container 12 containing an appropriate amount of the flux 11.
The terminal 10a of the electronic component 10 is pressed against the sponge-like member with a uniform thickness and a plate-like sponge-like member, for example, urethane foam block 13 made of urethane containing innumerable bubbles, and the flux 11 is covered. It is designed to be worn.
【００１４】したがって、同図(a) に示すように電子部
品10を鉛直下方向、すなわち矢印Ｄ方向に移動し、フラ
ックス11が染み込んだ発泡ウレタンブロック13に端子10
a を押し付けた後に、この電子部品10を矢印Ｕ方向に引
き上げると発泡ウレタンブロック13が端子10a に付着し
たフラックス11を吸い取るから、この端子10a に付着し
たフラックス11は薄く且つ均一の厚さとなる（同図(b)
参照）。Therefore, as shown in FIG. 1A, the electronic component 10 is moved vertically downward, that is, in the direction of arrow D, and the terminal 10 is attached to the urethane foam block 13 soaked with the flux 11.
When this electronic component 10 is pulled up in the direction of arrow U after pressing a, the urethane foam block 13 absorbs the flux 11 adhering to the terminal 10a, so that the flux 11 adhering to this terminal 10a has a thin and uniform thickness ( Figure (b)
reference).
【００１５】また、図２により説明した従来のフラック
スの被着方法におけるフラックスの液面に相当する発泡
ウレタンブロック13の表面とこの発泡ウレタンブロック
13を嵌着したフラックス容器12の底との距離Ｈは一定し
ている。Further, the surface of the urethane foam block 13 corresponding to the liquid surface of the flux in the conventional method for depositing the flux described with reference to FIG. 2 and this urethane foam block.
The distance H from the bottom of the flux container 12 in which 13 is fitted is constant.
【００１６】このため、電子部品10の端子10a にフラッ
クス11を被着する際に、この電子部品10の移動量Ｓを一
定にしておけば、この発泡ウレタンブロック13への電子
部品10の端子10a の押し込み深さは一定となり、端子10
a へのフラックス11の被着領域が一定となる（同図(c)
参照）。For this reason, when the flux 11 is applied to the terminal 10a of the electronic component 10, if the moving amount S of the electronic component 10 is kept constant, the terminal 10a of the electronic component 10 to the urethane foam block 13 is fixed. The pushing depth of is constant and the
The area where the flux 11 adheres to a becomes constant ((c) in the figure).
reference).
【００１７】このように本発明の一実施例のフラックス
の被着方法は、電子部品10の端子10a にフラックス11を
薄く且つ均一の厚さで塗布できるとともに、端子10a へ
のフラックス11の被着領域を一定にできる。As described above, according to the flux deposition method of the embodiment of the present invention, the flux 11 can be applied to the terminal 10a of the electronic component 10 in a thin and uniform thickness, and the flux 11 can be deposited on the terminal 10a. The area can be constant.
【００１８】[0018]
【発明の効果】以上説明したように本発明は、電子部品
の端子にフラックスを薄く且つ均一の厚さで塗布できる
とともに、端子へのフラックスの被着領域を一定にでき
るフラックスの被着方法を提供できる。As described above, the present invention provides a method for depositing a flux that can apply a flux to the terminals of an electronic component in a thin and uniform thickness, and can keep the flux deposition area on the terminals constant. Can be provided.
【図１】は本発明の一実施例のフラックスの被着方法を
説明するための図、FIG. 1 is a diagram for explaining a method of depositing a flux according to an embodiment of the present invention,
【図２】は従来のフラックスの被着方法を説明するため
の図である。FIG. 2 is a diagram for explaining a conventional flux deposition method.
10は、電子部品、 10a は、端子、 11は、フラックス、 12は、フラックス容器、 13は、発泡ウレタンブロック (海綿状部材) をそれぞれ
示す。10 is an electronic component, 10a is a terminal, 11 is a flux, 12 is a flux container, and 13 is a urethane foam block (sponge-like member).
Claims (1)
予備はんだする前のフラックスの被着方法において、 前記フラックス(11)を染み込ませたゴム弾性を有する海
綿状部材(13)に前記電子部品(10)の端子(10a) を押し付
け、この端子(10a) の表面にフラックス(11)を被着する
ことを特徴とするフラックスの被着方法。1. A method of depositing a flux before dipping a terminal of an electronic component in molten solder to perform pre-soldering, comprising: a spongy member (13) having rubber elasticity impregnated with the flux (11); A method for depositing flux, comprising pressing a terminal (10a) of a component (10) and depositing a flux (11) on the surface of the terminal (10a).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1726192A JPH05218261A (en) | 1992-02-03 | 1992-02-03 | Fluxing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1726192A JPH05218261A (en) | 1992-02-03 | 1992-02-03 | Fluxing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05218261A true JPH05218261A (en) | 1993-08-27 |
Family
ID=11939029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1726192A Withdrawn JPH05218261A (en) | 1992-02-03 | 1992-02-03 | Fluxing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05218261A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111705282A (en) * | 2020-06-24 | 2020-09-25 | 浙江东南新材科技有限公司 | Production process of high-strength galvanized steel coil |
-
1992
- 1992-02-03 JP JP1726192A patent/JPH05218261A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111705282A (en) * | 2020-06-24 | 2020-09-25 | 浙江东南新材科技有限公司 | Production process of high-strength galvanized steel coil |
| CN111705282B (en) * | 2020-06-24 | 2022-04-08 | 浙江东南新材科技有限公司 | Production process of high-strength galvanized steel coil |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990518 |