JPH02163992A - Manufacture of dip-type hybrid integrated circuit - Google Patents
Manufacture of dip-type hybrid integrated circuitInfo
- Publication number
- JPH02163992A JPH02163992A JP31919888A JP31919888A JPH02163992A JP H02163992 A JPH02163992 A JP H02163992A JP 31919888 A JP31919888 A JP 31919888A JP 31919888 A JP31919888 A JP 31919888A JP H02163992 A JPH02163992 A JP H02163992A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- circuit board
- circuit
- liquid resin
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000011347 resin Substances 0.000 claims abstract description 92
- 229920005989 resin Polymers 0.000 claims abstract description 92
- 239000007788 liquid Substances 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims abstract description 29
- 238000001035 drying Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 abstract description 7
- 238000007654 immersion Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 10
- 238000007598 dipping method Methods 0.000 description 9
- 238000007796 conventional method Methods 0.000 description 4
- 239000012508 resin bead Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
回路基板の一方の対向側からＬ字形のリード端子が同一
方向に導出されたＤＩＰ型混成集積回路の製造方法、特
に回路素子を封止する樹脂外装の形成方法に関し、
ピンホール等の欠陥がなく、厚さの均一な樹脂外装が形
成できるようにすることを目的とし、リード端子の先端
が上方を向く傾斜姿態に支持した回路基板に液状樹脂を
滴下する前処理工程と、該リード端子の先端が上方を向
く水平姿態に支持した該回路基板の下面を容器内の液状
樹脂に浸漬する浸漬工程と、
該浸漬状態で該回路基板の上面に液状樹脂を滴下する樹
脂滴下工程と、
該回路基板の一方の一側が該容器内の液状樹脂と接触し
該一方の他側が該容器内の液状樹脂より離れるように該
回路基板を傾斜させる液切り工程と、
該回路基板を引き上げて乾燥させる乾燥工程と、を含む
ことを特徴とし構成する。[Detailed Description of the Invention] [Summary] A method for manufacturing a DIP type hybrid integrated circuit in which L-shaped lead terminals are led out in the same direction from one opposing side of a circuit board, particularly for forming a resin casing for sealing circuit elements. Regarding the method, liquid resin is dripped onto a circuit board supported in an inclined position with the tips of the lead terminals facing upward, with the aim of forming a resin sheath with a uniform thickness and no defects such as pinholes. a pretreatment step; a dipping step of immersing the lower surface of the circuit board, which is supported in a horizontal position with the tips of the lead terminals facing upward, in liquid resin in a container; and applying liquid resin to the upper surface of the circuit board in the immersed state. a step of dropping the resin, and a draining step of tilting the circuit board so that one side of the circuit board contacts the liquid resin in the container and the other side separates from the liquid resin in the container; The method is characterized in that it includes a drying step of pulling up and drying the circuit board.
本発明はＤＩＰ型混成集積回路の製造方法、特に回路基
板の表面と裏面の双方に回路素子を形成および搭載した
混成集積回路の樹脂外装を形成させる新規方法に関する
。The present invention relates to a method for manufacturing a DIP type hybrid integrated circuit, and more particularly to a new method for forming a resin casing for a hybrid integrated circuit in which circuit elements are formed and mounted on both the front and back surfaces of a circuit board.
第３図はＤＴＰ型混成集積回路の概略構成を示す側面図
、第４図は樹脂外装を形成させる従来方法を説明するた
めの図である。FIG. 3 is a side view showing a schematic configuration of a DTP type hybrid integrated circuit, and FIG. 4 is a diagram for explaining a conventional method of forming a resin exterior.
第３図において、混成集積回路１は絶縁回路基板２の表
面と裏面の双方に回路素子３を形成および搭載し、回路
基板２の一方の対向側のそれぞれに複数本ずつのＬ字形
リード端子４を接続し、全回路素子３を覆う樹脂外装５
を形成してなる。各リード端子４の中間部７はコ字形に
曲げ加工してなり、かかるコ字形中間部７は、混成集積
回路１を一点鎖線で示すプリント板８に実装したとき、
所定のスタンドオフを確保するためである。In FIG. 3, a hybrid integrated circuit 1 has circuit elements 3 formed and mounted on both the front and back surfaces of an insulated circuit board 2, and a plurality of L-shaped lead terminals 4 on each opposing side of the circuit board 2. and a resin exterior 5 that covers all circuit elements 3.
It forms. The intermediate portion 7 of each lead terminal 4 is bent into a U-shape, and when the hybrid integrated circuit 1 is mounted on a printed board 8 indicated by a dashed line, the U-shaped intermediate portion 7
This is to ensure a predetermined standoff.
このような外装５を形成させる従来方法には、液状樹脂
の滴下により回路基Ｆｉ２の表面と裏面に分けて形成さ
せる方法と、回路基板２を液状樹脂に浸漬させ１度に形
成させる方法がある。Conventional methods for forming such an exterior 5 include a method in which it is formed separately on the front and back surfaces of the circuit board Fi2 by dropping liquid resin, and a method in which it is formed at once by immersing the circuit board 2 in liquid resin. .
第４図は液状樹脂に浸漬する樹脂外装５の形成方法を説
明するための図であり、リード端子４を支持し吊り下げ
られた回路基板２は外装用の液状樹脂９に浸漬せしめ、
その状態で適当な振動または揺動を加え回路基板２およ
び回路素子３に被着する気泡を除去するようにしたのち
、液状樹脂９より回路基板２を引き上げて乾燥し、必要
に応じて前記浸漬、乾燥を繰り返して混成集積回路ｌが
完成する。FIG. 4 is a diagram for explaining the method of forming the resin sheath 5 by immersing it in liquid resin, in which the circuit board 2 that supports the lead terminals 4 and is suspended is immersed in the liquid resin 9 for the sheath,
After applying appropriate vibration or rocking in this state to remove air bubbles adhering to the circuit board 2 and circuit elements 3, the circuit board 2 is pulled up from the liquid resin 9 and dried, and if necessary, the circuit board 2 is , drying is repeated to complete the hybrid integrated circuit l.
以上説明したように、従来、樹脂外装の形成には滴下法
または浸漬法が採用されていたが、滴下法は厚さが不均
一となり樹脂玉ができ易いという問題点があった。As explained above, conventionally, the dropping method or the dipping method has been adopted to form the resin exterior, but the dropping method has a problem in that the thickness becomes non-uniform and resin beads are easily formed.
他方、浸漬法による樹脂外装の形成は滴下法より生産性
に優れるが、樹脂がリード端子のスタンドオフに付着し
ないようにする必要から深く浸漬できず、裏面（浸漬時
の上面）に背高の大きい回路素子を搭載できないまたは
、スタンドオフを大きくしなければならず実装時に混成
集積回路の背高が高（なるという問題点があった。On the other hand, forming a resin sheath by the dipping method is more productive than the dripping method, but deep immersion is not possible because it is necessary to prevent the resin from adhering to the standoffs of the lead terminals, and the back surface (top surface when dipping) is There was a problem in that it was not possible to mount large circuit elements, or the standoff had to be made large, resulting in the height of the hybrid integrated circuit during mounting.
さらに、表面（浸漬時の下面）に搭載した回路素子に付
着する気泡は、回路基板に振動または揺動を与えても完
全になくすことが困難であり、該気泡は室内に放置する
樹脂の乾燥中に放出されその後にビンボールがおいて樹
脂外装の信頼性が損なわれたり、凹みができて外観上の
品位を損なうという問題点があった。Furthermore, it is difficult to completely eliminate air bubbles that adhere to circuit elements mounted on the surface (lower surface when immersed) even if the circuit board is vibrated or rocked, and air bubbles can be removed by drying the resin left indoors. There was a problem in that the reliability of the resin exterior was impaired or dents were formed, impairing the quality of the appearance.
本発明の目的は、厚さが均一であって樹脂玉やピンホー
ルおよび凹みのない樹脂外装を形成させることである。An object of the present invention is to form a resin sheath that has a uniform thickness and is free from resin beads, pinholes, and dents.
本発明はその実施例における工程を示す第１図および、
第１図の主要工程に対応する説明図である第２図によれ
ば、回路素子３を形成および搭載した回路基板２の一方
の対向側からＬ字形のリード端子４が同一方向に導出さ
れたＤＩＰ型混成集積回路ｌの樹脂外装５の形成に際し
、
リード端子４の先端が上方を向く傾斜姿態に支持した回
路基板２に液状樹脂９を滴下する前処理工程１１と、
リード端子４の先端が上方を向く水平姿態に支持した回
路基板２の下面を容器内の液状樹脂９に浸漬する浸漬工
程１２と、
該浸漬状態で回路基板２の上面に液状樹脂９を滴下する
樹脂滴下工程１３と、
回路基板２の一方の一側が該容器内の液状樹脂９と接触
し該一方の他側が該容器内の液状樹脂９より離れるよう
に回路基板２を傾斜させる液切り工程１４と、
回路基板２を引き上げて乾燥させる乾燥工程１７と、を
含むことを特徴とする。The present invention includes FIG. 1 showing steps in an embodiment thereof, and
According to FIG. 2, which is an explanatory diagram corresponding to the main steps in FIG. 1, L-shaped lead terminals 4 are led out in the same direction from one opposite side of the circuit board 2 on which the circuit elements 3 are formed and mounted. When forming the resin sheath 5 of the DIP type hybrid integrated circuit l, a pretreatment step 11 is performed in which liquid resin 9 is dropped onto the circuit board 2 supported in an inclined position with the tips of the lead terminals 4 facing upward; a dipping step 12 in which the lower surface of the circuit board 2 supported in a horizontal position facing upward is immersed in liquid resin 9 in a container; a resin dropping step 13 in which liquid resin 9 is dripped onto the upper surface of the circuit board 2 in the immersed state; a liquid draining step 14 of tilting the circuit board 2 so that one side of the circuit board 2 contacts the liquid resin 9 in the container and the other side separates from the liquid resin 9 in the container; It is characterized by including a drying step 17 of pulling up and drying.
」−記手段によれば、前処理工程によって回路基板およ
び回路素子に被着する気泡を除去させたことによって、
ピンホールや凹みの生成をなくし、浸漬法と滴下法を併
用し、回路基板および回路素子に被着した余分の液状樹
脂は回路基板に沿って流れ落ちる液切り工程によって、
樹脂外装の厚さが均一化し樹脂玉ができないようになる
。”-According to the means, by removing air bubbles adhering to the circuit board and circuit elements in the pre-treatment step,
Eliminating the formation of pinholes and dents, using a combination of dipping and dripping methods, excess liquid resin adhering to the circuit board and circuit elements is removed by a draining process that allows it to flow down along the circuit board.
The thickness of the resin sheath becomes uniform and resin beads do not form.
以下に、図面を用いて本発明によるＤＩＰ型混成集積回
路の製造方法を説明する。A method of manufacturing a DIP type hybrid integrated circuit according to the present invention will be explained below with reference to the drawings.
第１図は本発明の一実施例による樹脂外装の主要製造工
程を工程順に示す図、第２図は第１図の工程に対応する
説明図であり２第１図の工程１１〜１６は第２図の（イ
）〜（へ）は対応する。FIG. 1 is a diagram showing the main manufacturing steps of a resin exterior according to an embodiment of the present invention in the order of the steps, and FIG. 2 is an explanatory diagram corresponding to the steps in FIG. (A) to (F) in Figure 2 correspond.
第１図および第２図（イ）において、前処理工程１１は
回路基板２および回路素子３に気泡が被着しないように
するためであり、例えば６０度〜８０度の傾斜姿態で支
持した回路基板２に、液状の樹脂９をデイスペンサ１０
より滴下する。すると、樹脂９は回路基板２および回路
素子３の全面を濡らし余分の樹脂９ａは落下するように
なる。ただし、滴下樹脂９がリード端子４のコ字形折り
曲げ部７に付着しないようにする考慮が必要である。In FIG. 1 and FIG. 2 (A), the pretreatment step 11 is to prevent air bubbles from adhering to the circuit board 2 and the circuit elements 3. A dispenser 10 applies liquid resin 9 to the substrate 2.
Drip more. Then, the resin 9 wets the entire surface of the circuit board 2 and the circuit element 3, and the excess resin 9a falls off. However, consideration must be given to prevent the dripped resin 9 from adhering to the U-shaped bent portion 7 of the lead terminal 4.
第１図および第２図（Ｄ）において、回路基板２を容器
内の液状樹脂９に浸漬する浸漬工程Ｉ２は、少なくとも
回路基板２の下面（表面）が液状樹脂９に浸漬し、リー
ド端子４のコ字形折り曲げ部７の中間部を越えて液状樹
脂９に浸漬しない範囲とする。In FIG. 1 and FIG. 2(D), in the dipping step I2 of immersing the circuit board 2 in the liquid resin 9 in the container, at least the lower surface (surface) of the circuit board 2 is immersed in the liquid resin 9, and the lead terminals 4 are immersed in the liquid resin 9. The area should not be immersed in the liquid resin 9 beyond the middle part of the U-shaped bent part 7.
第１図および第２図（ハ）において、樹脂滴下工程１３
は前記浸漬状態で容器内の液状樹脂９より表呈する回路
基板２の上面（裏面）に、デイスペンサ１０より液状樹
脂９を滴下する工程であり、回路基板２の上面および該
上面に搭載した回路素子３の全体を滴下樹脂９で濡らす
ようにする。In FIG. 1 and FIG. 2 (c), the resin dropping step 13
is a step in which the liquid resin 9 is dropped from the dispenser 10 onto the upper surface (back surface) of the circuit board 2 exposed by the liquid resin 9 in the container in the immersed state, and the upper surface of the circuit board 2 and the circuit elements mounted on the upper surface are 3 so that the entire area is wetted with the dripping resin 9.
第１図および第２図（ニ）において、第１の液切り工程
１４は、回路基板２の右端部が容器内の液状樹脂９から
離れないように回路基板２の左端部を持ち上げ、例えば
回路基板２の幅方向に６０度〜８０度に傾斜させてＩＯ
秒間程度保持させる工程であり、回路基板２および回路
素子３に被着する余分の樹脂は、回路基板２に沿って樹
脂容器内に流れ落ちるようになる。In FIG. 1 and FIG. 2 (d), the first liquid draining step 14 involves lifting the left end of the circuit board 2 so that the right end of the circuit board 2 does not separate from the liquid resin 9 in the container. The IO is tilted at 60 degrees to 80 degrees in the width direction of the board 2.
This is a step in which the resin is held for about seconds, and the excess resin adhering to the circuit board 2 and circuit elements 3 flows down into the resin container along the circuit board 2.
第１図および第２図（ネ）において、第２の液切り工程
１５は余分な樹脂液の除去をさらに確実化するための工
程であり、回路基板２の右端部の一つのコーナ部が樹脂
容器内の液状樹脂９から離れないように、回路基板２を
その幅方向および長さ方向に、例えば幅方向に６０度、
長さ方向に４５度傾斜させる。すると、第１の液切り工
程１４で除去されない余分の樹脂液が、樹脂容器内に流
れ落ちるようになる。In FIG. 1 and FIG. 2 (N), the second liquid draining step 15 is a step to further ensure removal of excess resin liquid, and one corner of the right end of the circuit board 2 is made of resin. In order not to separate from the liquid resin 9 in the container, the circuit board 2 is rotated at an angle of 60 degrees in the width direction and the length direction, for example.
Tilt the length at 45 degrees. Then, the excess resin liquid that is not removed in the first liquid draining step 14 begins to flow down into the resin container.
第１図および第２図（へ）において、回路基板２の引き
上げ工程Ｉ６は、回路基板２を樹脂容器の上方に引き離
す工程であり、引き上げた回路基板２の姿態は、回路基
板２および回路素子３に被着した樹脂液の厚さが均等に
なるようにするためほぼ水平となるようにする。In FIG. 1 and FIG. 2 (f), the step I6 of pulling up the circuit board 2 is a step of pulling the circuit board 2 away above the resin container. In order to make the thickness of the resin liquid adhered to 3 even, it should be approximately horizontal.
第１図において、乾燥工程Ｉ７は樹脂容器より引き上げ
た回路基板２に風をあてる工程であり、例えば３０秒〜
６０秒間温風を当てると被着する樹脂液の溶剤が気化し
、外装５が形成される。In FIG. 1, the drying step I7 is a step in which air is applied to the circuit board 2 pulled up from the resin container, for example, for 30 seconds to
When warm air is applied for 60 seconds, the solvent of the deposited resin liquid evaporates, and the exterior 5 is formed.
なお、前記工程によって形成さる外装５の厚さは、粘度
が１０ボイズ程度の樹脂液９を使用したとき１００〜３
００μｍ程度であり、前記工程を繰り返すことによって
、外装５の厚さを所望値にすることができる。The thickness of the sheath 5 formed by the above process is 100 to 3 mm when using the resin liquid 9 having a viscosity of about 10 voids.
By repeating the above steps, the thickness of the outer sheath 5 can be made to a desired value.
なお、本発明方法の前記実施例に係わる樹脂外装自動機
は、樹脂外装形成前の回路基板を第１のマガジンより受
領し樹脂外装の形成済み回路基（７７゜を第２のマガジ
ンに収容するクランプを具えた本体機構部と、基板浸漬
用の溶融樹脂を入れた容器と、該容器の上方で溶融樹脂
を回路基板に滴下する滴下装置および、制御部等にて構
成する。The automatic resin packaging machine according to the above-mentioned embodiment of the method of the present invention receives the circuit board before the resin packaging is formed from the first magazine, and stores the circuit board with the resin packaging (77°) in the second magazine. It consists of a main body mechanism section equipped with a clamp, a container containing molten resin for immersing the substrate, a dripping device that drips the molten resin onto the circuit board above the container, a control section, etc.
同一列の複数本のリード端子の先端を接続したターイバ
ーを掴持する前記クランプは、樹脂容器の上方で各工程
１１〜１７に対応する動作、即ち回路基板を傾斜、上下
動させるための動作を行うようになる。そして、回路基
板浸漬用の溶融樹脂を入れた前記容器は溶融樹脂のレベ
ルセンサを具え、該センサによって容器内の樹脂レベル
を一定に保つように構成し、前記樹脂滴下装置には樹脂
滴下用デイスペンサを駆動させる３軸直交型ロボツトを
具え、滴下樹脂が回路基板にむらなく被着されるように
構成した。The clamp, which grips the tie bar connecting the tips of a plurality of lead terminals in the same row, performs operations corresponding to steps 11 to 17 above the resin container, that is, operations for tilting and moving the circuit board up and down. I will start doing it. The container containing the molten resin for immersing the circuit board is equipped with a molten resin level sensor, and the sensor is configured to keep the resin level in the container constant, and the resin dripping device includes a resin dripping dispenser. It is equipped with a 3-axis orthogonal robot that drives the robot, and is configured so that the dropped resin is evenly deposited on the circuit board.
また、前記実施例において工程１５は、搭載回路素子が
比較的多い回路基板において液切りを一層値実にするた
めであり、省略可能であることを付記する。Further, in the above-mentioned embodiment, it is added that step 15 can be omitted because it is intended to make draining more efficient in a circuit board having a relatively large number of mounted circuit elements.
以上説明したように本発明によれば、前処理工程によっ
て回路基板および回路素子に被着する気泡を除去させた
ことによって、ピンホールや凹みの生成頻度を従来方法
のＩ／２５とし、浸漬法と滴下法を併用し、回路基板お
よび回路素子に被着した余分の液状樹脂は回路基板に沿
って流れ落ちる液切り工程によって、樹脂外装の厚さが
均一化し樹脂玉ができないようになって、外装の品位を
高め得た効果を有する。As explained above, according to the present invention, by removing air bubbles adhering to the circuit board and circuit elements in the pretreatment process, the frequency of pinholes and dents is reduced to 1/25 compared to the conventional method, and the immersion method The excess liquid resin adhering to the circuit board and circuit elements is drained off along the circuit board, making the thickness of the resin coating uniform and preventing the formation of resin beads. It has the effect of increasing the quality of the product.
第１図は本発明の一実施例による主要製造工程図、
第２図は第１図の工程に対応する説明図、第３図はＤＩ
Ｐ型混成築積回路の概略図、第４図は浸漬法による従来
の外装の形成方法の説明図、
図中において、
ｌはＤＩＰ型混成集積回路、
２は回路基板、
３は回路素子、
４はリード端子、
５は樹脂外装、
９は液状樹脂、
１１は前処理工程、
工２は浸漬工程、
１３は樹脂滴下工程、
Ｉ４は第１の液切り工程、
１５は第２の液切り工程、
１６は引き上げ工程、
１７は乾燥工程、
を示す。
本発明の一実施例（二よる主要製造工程■躬 １ 図
（イｐ
ζ０少
γ
（ハラ
（二ｐ
第１胆ｆ工程ｉ；粧屯イろ説朗釧イｎ１）ゾ
（ホ）
（へっ
第１序〕ｎニオ呈ｌ＝ｑ方（５ずう設ε６月口（そｎ２
ン第 ２ 月Figure 1 is a diagram of the main manufacturing process according to an embodiment of the present invention, Figure 2 is an explanatory diagram corresponding to the process in Figure 1, and Figure 3 is a diagram of the DI
A schematic diagram of a P-type hybrid integrated circuit, and FIG. 4 is an explanatory diagram of the conventional method of forming an exterior by the dipping method. In the figure, l is a DIP-type hybrid integrated circuit, 2 is a circuit board, 3 is a circuit element, and 4 is a lead terminal, 5 is a resin exterior, 9 is a liquid resin, 11 is a pretreatment process, Step 2 is a dipping process, 13 is a resin dropping process, I4 is a first liquid draining process, 15 is a second liquid draining process, 16 indicates a pulling process, and 17 indicates a drying process. An embodiment of the present invention (Main manufacturing process according to 2) 1st introduction] nio presentation l = q direction (5th setting ε June mouth (so n2
2nd month
Claims (1)
一方の対向側からＬ字形のリード端子（４）が同一方向
に導出されたＤＩＰ型混成集積回路の樹脂外装（５）の
形成に際し、 該リード端子（４）の先端が上方を向く傾斜姿態に支持
した該回路基板（２）に液状樹脂（９）を滴下する前処
理工程（１１）と、 該リード端子（４）の先端が上方を向く水平姿態に支持
した該回路基板（２）の下面を容器内の液状樹脂（９）
に浸漬する浸漬工程（１２）と、該浸漬状態で該回路基
板（２）の上面に液状樹脂（９）を滴下する樹脂滴下工
程（１３）と、該回路基板（２）の一方の一側が該容器
内の液状樹脂（９）と接触し該一方の他側が該容器内の
液状樹脂（９）より離れるように該回路基板（２）を傾
斜させる液切り工程（１４）と、 該回路基板（２）を引き上げて乾燥させる乾燥工程（１
７）と、 を含むことを特徴とするＤＩＰ型混成集積回路の製造方
法。[Claims] A resin exterior of a DIP type hybrid integrated circuit in which L-shaped lead terminals (4) are led out in the same direction from one opposite side of a circuit board (2) on which a circuit element (3) is formed and mounted. When forming (5), a pretreatment step (11) of dropping liquid resin (9) onto the circuit board (2) supported in an inclined position with the tips of the lead terminals (4) facing upward; The lower surface of the circuit board (2), which is supported in a horizontal position with the tip of (4) facing upward, is placed in the liquid resin (9) in the container.
a resin dropping step (13) in which liquid resin (9) is dripped onto the upper surface of the circuit board (2) in the immersed state, and one side of the circuit board (2) is a liquid draining step (14) of tilting the circuit board (2) so that the other side comes into contact with the liquid resin (9) in the container and is separated from the liquid resin (9) in the container; (2) Drying process (1) of pulling up and drying the
7) A method for manufacturing a DIP type hybrid integrated circuit, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31919888A JPH07114313B2 (en) | 1988-12-16 | 1988-12-16 | Method for manufacturing DIP hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31919888A JPH07114313B2 (en) | 1988-12-16 | 1988-12-16 | Method for manufacturing DIP hybrid integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02163992A true JPH02163992A (en) | 1990-06-25 |
| JPH07114313B2 JPH07114313B2 (en) | 1995-12-06 |
Family
ID=18107510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31919888A Expired - Lifetime JPH07114313B2 (en) | 1988-12-16 | 1988-12-16 | Method for manufacturing DIP hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07114313B2 (en) |
-
1988
- 1988-12-16 JP JP31919888A patent/JPH07114313B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07114313B2 (en) | 1995-12-06 |
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