JPH05212891A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH05212891A JPH05212891A JP4810792A JP4810792A JPH05212891A JP H05212891 A JPH05212891 A JP H05212891A JP 4810792 A JP4810792 A JP 4810792A JP 4810792 A JP4810792 A JP 4810792A JP H05212891 A JPH05212891 A JP H05212891A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heating element
- ics
- substrates
- thermal head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、感熱記録あるいは熱転
写記録に使用されるサーマルヘッドに係り、とくに、発
熱体駆動用ＩＣの配置構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal head used for thermal recording or thermal transfer recording, and more particularly to an arrangement structure of heating element driving ICs.
【０００２】[0002]
【従来の技術および発明が解決しようとする課題】図３
（Ａ）は従来の感熱記録あるいは熱転写記録に使用され
る複合基板式のサーマルヘッドの一例を示す平面図、同
（Ｂ）は側面図である。図３（Ａ）、（Ｂ）に示すよう
に、該サ−マルヘッドは、発熱体列１を表面に設けたア
ルミナ等からなる発熱体列形成基板３と、発熱体駆動用
横型ＩＣ２（入力ライン６および出力ライン７の向き
が、おおよそ、ほぼ長方形をなすＩＣの短辺方向の向き
となるように配置されるもの）を表面に設けた印刷配線
基板４とをアルミニウム板等でなるヒートシンク５の上
に固着し、該発熱体列形成基板３と該印刷配線基板４の
上に設けた前記発熱体駆動用ＩＣ２とをボンディングワ
イヤで接続する構造を有している。該発熱体列１は複数
の発熱体１ａ（図２参照）が被印刷物走行方向（矢印Ｘ
方向）に対して直角に、列状に集合しているものであ
り、各発熱体はＩＣ２からの駆動信号で発熱し、感熱型
の被印刷物に印字または印画を行うものである。Prior Art and Problems to be Solved by the Invention FIG.
(A) is a plan view showing an example of a composite substrate type thermal head used for conventional thermal recording or thermal transfer recording, and (B) is a side view. As shown in FIGS. 3A and 3B, the thermal head includes a heating element array forming substrate 3 made of alumina or the like having a heating element array 1 provided on the surface thereof, and a horizontal IC 2 for driving heating elements (input line). 6 and the output line 7 are arranged so that the orientations of the output line 7 and the output line 7 are in the direction of the short side of the IC having a substantially rectangular shape). It has a structure in which the heating element array forming substrate 3 and the heating element driving IC 2 provided on the printed wiring board 4 are fixed to each other by a bonding wire. In the heating element array 1, a plurality of heating elements 1a (see FIG. 2) are arranged in the traveling direction of the print object (arrow X).
The heating elements are arranged in a line at right angles to the (direction), and each heating element generates heat by a driving signal from the IC 2 and prints or prints on a heat-sensitive printing material.
【０００３】このような複合基板式のサーマルヘッドに
おいて、印字および印画の線密度は基板に設ける発熱体
駆動用ＩＣ２の数量が多いほど高密度になり、解像度を
良くすることができる。しかし上述のように印刷配線基
板４に発熱体駆動用ＩＣ２として横型のものを用いた場
合、線密度は１２ドット／ｍｍが限界であった。In such a composite substrate type thermal head, the linear density of printing and printing becomes higher as the number of heating element driving ICs 2 provided on the substrate increases, and the resolution can be improved. However, as described above, when the horizontal type was used as the heating element driving IC 2 for the printed wiring board 4, the linear density was limited to 12 dots / mm.
【０００４】本発明は上記の問題点に鑑み、線密度が高
く、かつ小型で安価な複合基板式のサーマルヘッドを提
供することを目的とする。In view of the above problems, it is an object of the present invention to provide a compact and inexpensive composite substrate type thermal head having a high linear density.
【０００５】[0005]
【課題を解決するための手段】本発明は上記目的を達成
するため、ヒ−トシンク上に、発熱体列を形成した基板
と外部接続用の印刷配線基板とを取り付けたサーマルヘ
ッドにおいて、複数個の発熱体駆動用ＩＣを両基板間に
またがり千鳥状に配置したことを特徴とする。In order to achieve the above object, the present invention provides a plurality of thermal heads in which a heat sink array substrate and a printed wiring board for external connection are mounted on a heat sink. The heating element driving ICs are arranged in a zigzag pattern across both substrates.
【０００６】[0006]
【作用】本発明は上記構造を有するので、基板上に配置
するＩＣの数を増やすことができ、線密度が高くなる。Since the present invention has the above structure, the number of ICs arranged on the substrate can be increased and the linear density can be increased.
【０００７】[0007]
【実施例】図１は本発明によるサーマルヘッドの一実施
例を示す平面図、図２は図１のＩＣ部拡大図である。図
１において、前記のように５はアルミニウム板等でなる
ヒートシンクであり、３は発熱体の集合で形成される発
熱体列１を表面に形成した基板であり、アルミナ等のセ
ラミック板あるいは金属板に絶縁膜を施したものでな
る。４は外部接続用印刷配線基板であり、例えばガラス
エポキシ樹脂等でなる絶縁板に銅箔等の導体を固着した
ものでなる。これらの基板３、４はそれぞれ該ヒートシ
ンク５上に接着により、あるいはビスもしくはリベット
等の適宜の固定具を用いて取り付けられている。1 is a plan view showing an embodiment of a thermal head according to the present invention, and FIG. 2 is an enlarged view of an IC portion of FIG. In FIG. 1, as mentioned above, 5 is a heat sink made of an aluminum plate or the like, 3 is a substrate on the surface of which a heating element array 1 formed of a set of heating elements is formed, and a ceramic plate such as alumina or a metal plate. It is made of an insulating film. Reference numeral 4 denotes a printed wiring board for external connection, which is formed by fixing a conductor such as copper foil to an insulating plate made of glass epoxy resin or the like. These substrates 3 and 4 are attached to the heat sink 5 by adhesion or by using an appropriate fixing tool such as a screw or a rivet.
【０００８】２は発熱体駆動用の横型ＩＣであり、該横
型ＩＣ２は発熱体列形成基板３および印刷配線基板４に
千鳥状に配置する。本実施例においては、発熱体形成基
板３上のＩＣ２と印刷配線基板４上のＩＣ２とが、オ−
バ−ラップ代Ｚを有するように配置している。Reference numeral 2 denotes a horizontal IC for driving a heating element. The horizontal IC 2 is arranged in a zigzag pattern on the heating element row forming substrate 3 and the printed wiring board 4. In this embodiment, the IC 2 on the heating element forming substrate 3 and the IC 2 on the printed wiring board 4 are connected with each other.
It is arranged so as to have a overlap margin Z.
【０００９】図２はＩＣ２に接続される導体パターンを
示す図であり、発熱体列１を構成する各発熱体１ａと各
ＩＣ２の出力端子とは、ＩＣ２の１個に対して複数個の
発熱体１ａに対応させて、該基板３上に形成された導体
７およびボンディングワイヤ１２で接続している。また
基板３上のＩＣ２の入力端子は基板３上の導体６にボン
ディングワイヤ１１で接続し、該導体６を印刷配線基板
４上の導体９とボンディングワイヤ１０で接続してい
る。印刷配線基板４上のＩＣ２の入力端子は印刷配線基
板４上の導体６とボンディングワイヤ１３で接続し、印
刷配線基板４上のＩＣ２の出力端子は発熱体列形成基板
３上の導体７とボンディングワイヤ１４で接続してい
る。FIG. 2 is a diagram showing a conductor pattern connected to the IC 2, wherein each heating element 1a constituting the heating element row 1 and the output terminal of each IC2 have a plurality of heat generations per one IC2. The conductors 7 and the bonding wires 12 formed on the substrate 3 are connected to correspond to the body 1a. The input terminal of the IC 2 on the substrate 3 is connected to the conductor 6 on the substrate 3 by the bonding wire 11, and the conductor 6 is connected to the conductor 9 on the printed wiring board 4 by the bonding wire 10. The input terminal of the IC 2 on the printed wiring board 4 is connected to the conductor 6 on the printed wiring board 4 by the bonding wire 13, and the output terminal of the IC 2 on the printed wiring board 4 is bonded to the conductor 7 on the heating element row forming substrate 3. The wires 14 are connected.
【００１０】上記のようにＩＣ２を発熱体列形成基板３
と印刷配線基板４上に分割して千鳥状に配置すれば、両
基板の大きさを変えずにＩＣ２の搭載数量を増やすこと
ができ、線密度を１６ドット／ｍｍ程度まで高密度化す
ることができる。As described above, the IC 2 is connected to the heating element array forming substrate 3
By dividing and arranging them in a staggered manner on the printed wiring board 4, the number of mounted ICs 2 can be increased without changing the size of both boards, and the line density can be increased to about 16 dots / mm. You can
【００１１】ここで、発熱体列形成基板３は、成膜チャ
ンバに入れてグレーズ層、電極、発熱抵抗体等を形成す
るが、その成膜を能率良く行えるか否かがサーマルヘッ
ドのコストを大きく左右する。すなわち、成膜チャンバ
内に収容できる基板３の数を多くすることができれば、
生産性が良くなるので、コスト低減が達成できる。仮
に、発熱体列形成基板３上のみにすべてのＩＣ２を千鳥
状に搭載したとすれば、該基板３の幅ａ（図１参照）が
大きくなり、該基板３の成膜チャンバに収容可能数が減
少し、コスト高を招く。一方、本実施例によれば、発熱
体列形成基板３の幅ａを増加させる必要がないため、成
膜チャンバに収容する基板３の数を減少させることがな
く、高密度で廉価な、しかも基板３のサイズの小さなサ
ーマルヘッドが提供できる。また、本実施例のように、
ＩＣ２間にオーバーラップ代Ｚを持たせれば、ＩＣ２の
搭載数量をより増加させることができる。Here, the heating element array forming substrate 3 is placed in a film forming chamber to form a glaze layer, electrodes, heating resistors and the like. Whether or not the film formation can be carried out efficiently depends on the cost of the thermal head. It greatly influences. That is, if the number of substrates 3 that can be accommodated in the film forming chamber can be increased,
Since productivity is improved, cost reduction can be achieved. If all the ICs 2 are mounted in a staggered manner only on the heating element array forming substrate 3, the width a of the substrate 3 (see FIG. 1) becomes large and the number of the substrates 3 that can be accommodated in the film forming chamber is large. Is reduced, resulting in higher costs. On the other hand, according to the present embodiment, since it is not necessary to increase the width a of the heating element array forming substrate 3, the number of substrates 3 accommodated in the film forming chamber is not reduced, and the density is high and the cost is low. A thermal head having a small size of the substrate 3 can be provided. Also, as in this embodiment,
If the overlap margin Z is provided between the IC2s, the mounting quantity of the IC2s can be further increased.
【００１２】本発明は、ＩＣ２が縦型ＩＣ（入力ライン
６および出力ライン７の向きが、おおよそ、ほぼ長方形
をなすＩＣの長辺方向の向きとなるように配置されるも
の）である場合にも適用できる。縦型ＩＣは入出力端子
のレイアウトが特殊であるため、横型ＩＣ２と比べてコ
ストが高くなり、また発熱体列形成基板３の幅ａを大き
くする必要があるものの、横型ＩＣに比較してより線密
度を高めることができ、より高品質の印字、印画質が求
められる場合に採用できる。また、縦型ＩＣを用いるに
しても、発熱体列形成基板３の上に千鳥状にＩＣを配列
する場合に比較し、本発明のように基板３と４でＩＣを
分割配置すれば、該基板３の幅も従来の縦型ＩＣを１列
に配置したものと同じ幅ですむ。According to the present invention, when the IC 2 is a vertical IC (arranged so that the input lines 6 and the output lines 7 are oriented in the direction of the long side of the substantially rectangular IC). Can also be applied. Since the vertical IC has a special layout of input / output terminals, the cost is higher than that of the horizontal IC 2, and the width a of the heating element row forming substrate 3 needs to be increased, but it is more than that of the horizontal IC. The linear density can be increased, and it can be used when higher quality printing and printing quality are required. Even if a vertical IC is used, when the ICs are divided and arranged in the substrates 3 and 4 as in the present invention, as compared with the case where the ICs are arranged in a staggered pattern on the heating element array forming substrate 3, The width of the substrate 3 can be the same as that of the conventional vertical ICs arranged in one row.
【００１３】[0013]
【発明の効果】請求項１によれば、発熱体列形成基板の
大きさは従来のままで搭載するＩＣの数量を増やすこと
ができるので、線密度を高密度化することができる。し
たがって成膜チャンバにおける膜形成の生産性を低下さ
せることなく、すなわち価格を大幅に上げることなく、
線密度の向上を達成できるとともに、小型のサーマルヘ
ッドを提供できる。According to the first aspect of the present invention, since the size of the heating element array forming substrate can be increased in the number of ICs mounted as it is, the linear density can be increased. Therefore, without lowering the productivity of film formation in the film formation chamber, that is, without significantly increasing the price,
It is possible to improve the linear density and provide a small thermal head.
【００１４】請求項２によれば、発熱体駆動用ＩＣとし
て横型ＩＣを使用するので、縦型ＩＣを使用する場合と
比べて、高い線密度を有するものでありながら小型で、
かつ安価なサ−マルヘッドを提供できる。According to the second aspect, since the horizontal type IC is used as the heating element driving IC, as compared with the case where the vertical type IC is used, the linear type IC has a high linear density and is small in size.
And an inexpensive thermal head can be provided.
【図１】本発明によるサーマルヘッドの一実施例を示す
平面図である。FIG. 1 is a plan view showing an embodiment of a thermal head according to the present invention.
【図２】本実施例のＩＣ部の部分拡大図である。FIG. 2 is a partially enlarged view of an IC section of this embodiment.
【図３】（Ａ）は従来のサーマルヘッドを示す平面図、
（Ｂ）はその側面図である。FIG. 3A is a plan view showing a conventional thermal head,
(B) is a side view thereof.
１ 発熱体列 １ａ 発熱体 ２ 横型ＩＣ ３ 発熱体列形成基板 ４ 印刷配線基板 ５ ヒートシンク ６、７、９ 導体 １０〜１４ ボンディングワイヤ 1 Heating Element Array 1a Heating Element 2 Horizontal IC 3 Heating Element Array Forming Board 4 Printed Wiring Board 5 Heat Sink 6, 7, 9 Conductor 10-14 Bonding Wire
Claims (2)
板と外部接続用の印刷配線基板とを取り付けたサーマル
ヘッドにおいて、複数個の発熱体駆動用ＩＣを両基板間
にまたがり千鳥状に配置したことを特徴とするサーマル
ヘッド。1. A thermal head in which a substrate having a heating element array and a printed wiring board for external connection are mounted on a heat sink, and a plurality of heating element driving ICs are staggered between the two substrates. The thermal head is characterized by being placed in.
が横型ＩＣでなることを特徴とするサーマルヘッド。2. The IC for driving the heating element according to claim 1.
Is a horizontal IC, which is a thermal head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4810792A JP3169671B2 (en) | 1992-02-04 | 1992-02-04 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4810792A JP3169671B2 (en) | 1992-02-04 | 1992-02-04 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05212891A true JPH05212891A (en) | 1993-08-24 |
| JP3169671B2 JP3169671B2 (en) | 2001-05-28 |
Family
ID=12794096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4810792A Expired - Lifetime JP3169671B2 (en) | 1992-02-04 | 1992-02-04 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3169671B2 (en) |
-
1992
- 1992-02-04 JP JP4810792A patent/JP3169671B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP3169671B2 (en) | 2001-05-28 |
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