JPH05193670A - Carrier tape for packaging chip type electronic part - Google Patents
Carrier tape for packaging chip type electronic partInfo
- Publication number
- JPH05193670A JPH05193670A JP4004892A JP489292A JPH05193670A JP H05193670 A JPH05193670 A JP H05193670A JP 4004892 A JP4004892 A JP 4004892A JP 489292 A JP489292 A JP 489292A JP H05193670 A JPH05193670 A JP H05193670A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- carrier tape
- thermoplastic resin
- moisture
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 title claims description 7
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 17
- 239000002131 composite material Substances 0.000 claims abstract description 15
- 238000004049 embossing Methods 0.000 claims abstract description 9
- 230000035699 permeability Effects 0.000 claims abstract description 7
- -1 polypropylene Polymers 0.000 claims description 11
- 229920001577 copolymer Polymers 0.000 claims description 9
- 229920000728 polyester Polymers 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 8
- 229920002239 polyacrylonitrile Polymers 0.000 claims description 6
- 229920002620 polyvinyl fluoride Polymers 0.000 claims description 6
- 239000002033 PVDF binder Substances 0.000 claims description 5
- 239000004743 Polypropylene Substances 0.000 claims description 5
- 239000004793 Polystyrene Substances 0.000 claims description 5
- 239000004417 polycarbonate Substances 0.000 claims description 5
- 239000004800 polyvinyl chloride Substances 0.000 claims description 5
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 5
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 4
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 229920000515 polycarbonate Polymers 0.000 claims description 4
- 229920001155 polypropylene Polymers 0.000 claims description 4
- 229920002223 polystyrene Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 238000009751 slip forming Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 claims 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical group FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 21
- 238000007789 sealing Methods 0.000 abstract description 9
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 47
- 238000012937 correction Methods 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 description 5
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 4
- 239000005033 polyvinylidene chloride Substances 0.000 description 4
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 3
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 229920006369 KF polymer Polymers 0.000 description 1
- 229920004142 LEXAN™ Polymers 0.000 description 1
- 239000004418 Lexan Substances 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
- B60K35/00—Arrangement of adaptations of instruments
-
- B60K35/22—
-
- B60K35/53—
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D7/00—Indicating measured values
- G01D7/02—Indicating value of two or more variables simultaneously
- G01D7/04—Indicating value of two or more variables simultaneously using a separate indicating element for each variable
- G01D7/06—Luminous indications projected on a common screen
-
- G—PHYSICS
- G07—CHECKING-DEVICES
- G07C—TIME OR ATTENDANCE REGISTERS; REGISTERING OR INDICATING THE WORKING OF MACHINES; GENERATING RANDOM NUMBERS; VOTING OR LOTTERY APPARATUS; ARRANGEMENTS, SYSTEMS OR APPARATUS FOR CHECKING NOT PROVIDED FOR ELSEWHERE
- G07C5/00—Registering or indicating the working of vehicles
- G07C5/08—Registering or indicating performance data other than driving, working, idle, or waiting time, with or without registering driving, working, idle or waiting time
- G07C5/0816—Indicating performance data, e.g. occurrence of a malfunction
- G07C5/0825—Indicating performance data, e.g. occurrence of a malfunction using optical means
-
- B60K2360/334—
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はチップ型電子部品の保
管、輸送、装着に際し、チップ型電子部品を汚染から保
護し、電子回路基板に実装するために整列させ、取り出
せる機能を有する包装体のうち、収納ポケットを形成し
たプラスチック製キャリアテープに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package having a function of protecting the chip-type electronic components from contamination during storage, transportation and mounting of the chip-type electronic components and aligning and removing them for mounting on an electronic circuit board. Of these, the present invention relates to a plastic carrier tape having a storage pocket.
【０００２】[0002]
【従来の技術】近年、ＩＣを始めとして、トランジスタ
ー、ダイオード、コンデンサー、圧電素子レジスター、
などの表面実装用チップ型電子部品は、電子部品の形状
に合わせて、収納しうるエンボス成形されたポケットを
連続的に形成したプラスチック製キャリアテープとキャ
リアテープにシール可能なカバーテープとからなる包装
体に包装されて供給されている。内容物の電子部品はキ
ャリアテープ内に収納された状態で輸送・保管の後、包
装体のカバーテープを剥離した後、自動的に取り出され
電子回路基板に表面実装されている。この表面実装技術
の発達に伴い、チップ化される電子部品は次第に機構部
品からＩＣ、ＬＳＩといった高集積化部品に広がってい
る。これらの高集積化部品は電子回路を保護している封
止樹脂が大気中の湿度を吸収するとはんだ実装時のクラ
ックを引き起こし大きな問題となるため、耐熱性のある
トレーによる１２０〜１３５℃でのベーキング工程を経
た後キャリアテープにテーピングされ、ドライパックと
呼ばれるＡｌ防湿袋に密封後輸送・保管され吸湿を防い
でいる。又、実装時にはキャリアテープ１リール中の電
子部品の実装には時間がかかるため、再度トレーに移し
換えを行いベーキングして使用するという工程の繰り返
しを余儀なくされている。このため、工程が繁雑でキャ
リアテープを更に包装したり、再ベーキングを行う等二
度手間をかけており、従来より製品の防湿を維持した上
での工程の簡略化が強く望まれているが、キャリアテー
プ用に成形加工される素材は各種電子部品の形状に対応
できる成形加工性を主に選定されていたため防湿機能は
なく、又、ベーキング温度以上の耐熱性を持つ素材でも
なかった。2. Description of the Related Art In recent years, ICs, transistors, diodes, capacitors, piezoelectric element resistors,
Chip-type electronic components for surface mounting such as are packaging consisting of a plastic carrier tape in which embossed pockets that can be stored are continuously formed according to the shape of the electronic component, and a cover tape that can be sealed on the carrier tape. It is packaged and supplied by the body. The electronic components of the contents are transported and stored in a carrier tape, the cover tape of the package is peeled off, and then automatically taken out and surface-mounted on the electronic circuit board. With the development of this surface mounting technology, electronic parts to be made into chips are gradually spreading from mechanical parts to highly integrated parts such as IC and LSI. In these highly integrated components, if the sealing resin that protects the electronic circuit absorbs humidity in the atmosphere, it causes cracks during solder mounting, which is a serious problem. After undergoing a baking process, the tape is taped to a carrier tape, sealed in an Al moisture-proof bag called a dry pack, and then transported and stored to prevent moisture absorption. Further, since it takes time to mount the electronic components in one reel of the carrier tape at the time of mounting, it is inevitable to repeat the process of transferring to a tray, baking, and using again. For this reason, the process is complicated and further packing of the carrier tape, re-baking, and the like are required twice, and it is strongly desired to simplify the process while maintaining moisture resistance of the product. The material to be molded for the carrier tape was not selected as a moisture-proof function because it was selected mainly for moldability that can be used for the shape of various electronic components, and it was not a material having heat resistance above the baking temperature.
【０００３】[0003]
【発明が解決しようとする課題】本発明は前述の様な問
題を解決すべく、各種エンボス形状への成形加工性を維
持しながら同時に防湿機能の付与されたキャリアテープ
を得んとして鋭意研究した結果、該キャリアテープの少
なくとも一層が成形加工性の良好な熱可塑性樹脂であ
り、少なくとも一層が防湿機能を有する熱可塑性樹脂か
らなる二層以上の複合シートで構成されるキャリアテー
プが良好な特性を持つとの知見を得て、本発明を完成す
るに至ったものである。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention has been earnestly studied to obtain a carrier tape having moisture-proof function while maintaining molding processability into various embossed shapes. As a result, a carrier tape in which at least one layer of the carrier tape is a thermoplastic resin having a good moldability and at least one layer is a composite sheet of two or more layers made of a thermoplastic resin having a moisture-proof function has good properties. The present invention has been completed based on the knowledge that it possesses it.
【０００４】[0004]
【課題を解決するための手段】本発明は、チップ型電子
部品を収納する収納ポケットを連続的に形成したプラス
チック製エンボステープであって、該キャリアテープ
の、少なくとも一方の層が非晶性ポリエステル（非晶Ｐ
ＥＴ）、ポリウレタン（ＰＵ）、ポリプロピレン（Ｐ
Ｐ）、ポリスチレン（ＰＳ）、ポリカーボネイト（Ｐ
Ｃ）、ＡＢＳ、ポリアクリロニトリル（ＰＡＮ）、ポリ
塩化ビニル（ＰＶＣ）のいずれかであるエンボス成形可
能な熱可塑性樹脂であり、少なくとも他方の層がポリテ
トラフルオロエチレン（ＰＴＦＥ）、ポリクロロトリフ
ルオロエチレン（ＰＣＴＦＥ）、テトラフルオロエチレ
ン−ヘキサフルオロプロピレン共重合体（ＦＥＰ）、ポ
リふっ化ビニル（ＰＶＦ）、ポリふっ化ビニリデン（Ｐ
ＶＤＦ）、エチレン−フルオロエチレン共重合体（ＥＴ
ＦＥ）、テトラフルオロエチレン−パーフルオロビニル
エーテル共重合体（ＰＦＡ）、ポリ塩化ビニリデン（Ｐ
ＶＤＣ）、芳香族系液晶性ポリエステル（ＬＣＰ）のい
ずれかである二層以上の複合シートであり、該複合シー
トの透湿度がＪＩＳ Ｚ ０２０８ ４０℃，９０％Ｒ
Ｈによる測定法で１．５ｇ／ｍ2・24ｈｒ以下である、
製品の輸送・保管工程中にポケット中の電子部品が吸湿
することをを抑えた防湿性に優れたチップ型電子部品包
装用キャリアテープである。The present invention is a plastic embossed tape in which storage pockets for storing chip-type electronic components are continuously formed, and at least one layer of the carrier tape is amorphous polyester. (Amorphous P
ET), polyurethane (PU), polypropylene (P
P), polystyrene (PS), polycarbonate (P
C), ABS, polyacrylonitrile (PAN) or polyvinyl chloride (PVC), which is an embossable thermoplastic resin, and at least the other layer is polytetrafluoroethylene (PTFE) or polychlorotrifluoroethylene. (PCTFE), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), polyvinyl fluoride (PVF), polyvinylidene fluoride (P)
VDF), ethylene-fluoroethylene copolymer (ET
FE), tetrafluoroethylene-perfluorovinyl ether copolymer (PFA), polyvinylidene chloride (P)
VDC) or an aromatic liquid crystalline polyester (LCP), which is a composite sheet having two or more layers, and the moisture permeability of the composite sheet is JIS Z 0208 40 ° C., 90% R.
It is 1.5 g / m 2 · 24 hr or less as measured by H.
This is a chip-type carrier tape for packaging electronic components, which has excellent moisture resistance while suppressing moisture absorption of electronic components in pockets during product transportation and storage processes.
【０００５】[0005]
【作用】本発明のキャリアテープ１の構成要素を図１で
説明すると、第一層２が結晶性ポリエステル、非晶性ポ
リエステル、ポリウレタン、ポリプロピレン、ポリスチ
レン、ポリカーボネイト、ＡＢＳ、ポリアクリロニトリ
ル、ポリ塩化ビニルのいずれかであり、厚みが５０〜４
００μｍのエンボス成形可能な熱可塑性樹脂である。５
０μｍ以下ではシート強度が不足し、４００μｍを越え
ると成形性が著しく低下する。又、第二層３はポリテト
ラフルオロエチレン、ポリクロロトリフルオロエチレ
ン、テトラフルオロエチレン−ヘキサフルオロプロピレ
ン共重合体、ポリふっ化ビニル、ポリふっ化ビニリデ
ン、エチレン−フルオロエチレン共重合体、テトラフル
オロエチレン−パーフルオロビニルエーテル共重合体、
ポリ塩化ビニリデン、芳香族系液晶性ポリエステルのい
ずれかであり、厚みが１〜２００μｍの防湿機能を有す
る熱可塑性樹脂である。１μｍ以下では防湿機能が不十
分であり、２００μｍを越えると成形性が著しく低下し
コストも高くなる。第一層２の第二層３に接する側、あ
るいは、第二層３の第一層２に接する側は、二層間の密
着力を向上させる目的で、コロナ処理、プラズマ処理、
サンドブラスト処理、化学処理等の表面処理を施しても
良い。又、同様の目的でイソシアネート系、イミン系等
の熱硬化型の接着剤層を介して両者をラミネートしても
良い。尚、静電気防止性能を付与させる目的で、帯電防
止剤、導電性粉末等を一層または両層の樹脂中に混練ま
たは表面にコーティングしても良い。The components of the carrier tape 1 of the present invention will be explained with reference to FIG. 1. The first layer 2 is made of crystalline polyester, amorphous polyester, polyurethane, polypropylene, polystyrene, polycarbonate, ABS, polyacrylonitrile, polyvinyl chloride. It is either and the thickness is 50-4.
It is a thermoplastic resin of 00 μm that can be embossed. 5
If the thickness is less than 0 μm, the sheet strength will be insufficient, and if it exceeds 400 μm, the formability will be significantly reduced. The second layer 3 is polytetrafluoroethylene, polychlorotrifluoroethylene, tetrafluoroethylene-hexafluoropropylene copolymer, polyvinyl fluoride, polyvinylidene fluoride, ethylene-fluoroethylene copolymer, tetrafluoroethylene. -Perfluorovinyl ether copolymer,
It is a polyvinylidene chloride or an aromatic liquid crystal polyester, and is a thermoplastic resin having a moisture-proof function and having a thickness of 1 to 200 μm. If it is 1 μm or less, the moisture-proof function is insufficient, and if it exceeds 200 μm, the moldability is remarkably lowered and the cost is increased. The side of the first layer 2 in contact with the second layer 3 or the side of the second layer 3 in contact with the first layer 2 is subjected to corona treatment, plasma treatment, for the purpose of improving the adhesion between the two layers.
Surface treatment such as sandblasting and chemical treatment may be applied. Further, for the same purpose, both may be laminated via a thermosetting adhesive layer such as isocyanate type or imine type. For the purpose of imparting antistatic performance, an antistatic agent, a conductive powder or the like may be kneaded or coated on the surface of the resin of one layer or both layers.
【０００６】又、防湿性能については複合シートの透湿
度がＪＩＳ Ｚ ０２０８ ４０℃，９０％ＲＨによる
測定法で少なくとも１．５ｇ／ｍ2・24ｈｒ以下が必要
であり、更に好ましくは０．５ｇ／ｍ2・24ｈｒ以下が
良い。１．５ｇ／ｍ2・24ｈｒを越えるとはんだ実装時
の封止樹脂へのクラック防止機能としては不十分であ
り、後工程での防湿袋での包装による保護・保管、ある
いは再ベーキングの実施が必要となる。尚、エンボス成
形を行う際、キャリアテープのカバーテープとシールさ
れる側の層は、第一層２と第二層３のいずれの側でも良
いが、カバーテープとのシール性をより安定させるため
には第一層２がキャリアテープのカバーテープにシール
される表面になる方が望ましい。又、キャリアテープを
構成する層は上記二層を基本単位とする三層以上の複合
フィルムでも良い。Regarding the moisture proof performance, the moisture permeability of the composite sheet must be at least 1.5 g / m 2 · 24 hr or less as measured by JIS Z 0208 40 ° C. and 90% RH, and more preferably 0.5 g / m 2. m 2 · 24 hr or less is good. If it exceeds 1.5 g / m 2 · 24 hr, the function of preventing cracks in the encapsulating resin during solder mounting is insufficient, so protection and storage by packaging in a moisture-proof bag in the subsequent process, or rebaking is required. Will be needed. When performing embossing molding, the layer on the side of the carrier tape that is sealed with the cover tape may be either the first layer 2 or the second layer 3, but in order to make the sealing property with the cover tape more stable. It is desirable that the first layer 2 be the surface of the carrier tape that is sealed to the cover tape. Further, the layers constituting the carrier tape may be a composite film of three or more layers having the above two layers as a basic unit.
【０００７】[0007]
【実施例】本発明の実施例を以下に示すがこれらの実施
例によって本発明は何ら限定されるものではない。 《実施例１，２，３，４，５，７，８，９及び比較例
Ａ，Ｂ，Ｃ，Ｄ》エンボス成形性に優れた熱可塑性樹脂
からなる２００μｍ厚みにシート加工した第一層と防湿
性に優れた熱可塑性樹脂からなる５０μｍ厚みにシート
加工した第二層とを二液熱硬化型のウレタン系接着剤で
ドライラミネートにより接着し二層構成の総厚み２５０
μｍのキャリアテープ用複合シートを得た。得られた複
合シートを圧空成形機により防湿機能を持つ層をエンボ
スの外側にしてエンボス成形し２４ｍｍ幅のキャリアテ
ープを得た。又、複合シートの透湿度をＪＩＳ Ｚ０２
０８法 ４０℃，９０％ＲＨにより測定した。次に、電
子部品ＱＦＰ ５２Ｐをエンボスに収納し、図２に示す
層構成で外層５の二軸延伸フィルムにＰＥＴ、シーラン
ト層７にアクリル系粘着剤を用いたのカバーテープとシ
ールを行い密封した。その試料を３０℃，７０％ＲＨ環
境下へ６０日投入処理後、カバーテープを剥離して電子
部品の封止樹脂の吸湿による重量変化を測定し吸湿率を
算出した。次に、取り出した電子部品をＩＲリフロー
（２４０℃，１０秒）によるはんだ処理してクラックの
発生の有無を工学顕微鏡（×１００）で観察し、種々の
評価結果を表１に示した。EXAMPLES Examples of the present invention are shown below, but the present invention is not limited to these examples. << Examples 1, 2, 3, 4, 5, 7, 8, 9 and Comparative Examples A, B, C, D >> A first layer sheet-processed to a thickness of 200 μm made of a thermoplastic resin having excellent embossing moldability. The total thickness of the two-layer structure is 250, which is formed by bonding the second layer, which is made of a thermoplastic resin having excellent moisture resistance and processed into a sheet with a thickness of 50 μm, by dry lamination with a two-component thermosetting urethane adhesive
A composite sheet for carrier tape having a thickness of μm was obtained. The obtained composite sheet was emboss-molded by a pressure molding machine with a layer having a moisture-proof function outside the embossing to obtain a carrier tape having a width of 24 mm. In addition, the moisture permeability of the composite sheet can be measured according to JIS Z02.
Method 08 Measured at 40 ° C. and 90% RH. Next, the electronic component QFP 52P was housed in the embossing, and the biaxially stretched film of the outer layer 5 having the layer structure shown in FIG. 2 was sealed with PET and the sealant layer 7 was covered with a cover tape using an acrylic adhesive. .. After the sample was placed in an environment of 30 ° C. and 70% RH for 60 days, the cover tape was peeled off and the weight change due to the moisture absorption of the sealing resin of the electronic component was measured to calculate the moisture absorption rate. Next, the taken out electronic parts were soldered by IR reflow (240 ° C., 10 seconds), and the presence or absence of cracks was observed with an engineering microscope (× 100), and various evaluation results are shown in Table 1.
【０００８】 [0008]
【０００９】注１：使用した樹脂の原料名は下記の通
り。 ＰＶＣ ：住友ベークライト（株）社製 ＶＳＳ−１
２０２ ＰＳ ：三井東圧化学（株）社製 トーポレッ
クス ＰＣ ：ＧＥ（株）社製 レキサン ＰＰ ：住友化学（株）社製 ノーブレン ＰＡＮ ：三井東圧化学（株）社製 ゼクロン ウレタン ：協和発酵工業（株）社製 エスタン ＡＢＳ ：住友ノーガタック（株）社製 クララスチ
ック 非晶ＰＥＴ：イーストマンケミカル（株）社製 ＰＥ
Ｔ−Ｇ ＰＶＤＣ ：旭化成工業（株）社製 サラン ＰＣＴＦＥ：ダイキン工業（株）社製 ＤＡＩＦＬ
ＯＮ ＰＶＤＦ ：呉羽化学工業（株）社製 ＫＦポリマ
ー ＰＶＦ ：ＤｕＰｏｎｔ（株）社製 ＴＥＤＬＥ
Ｒ ＦＥＰ ：ダイキン工業（株）社製 ＮＥＯＦＬ
ＯＮ ＦＥＰ ＥＴＦＥ ：ダイキン工業（株）社製 ＮＥＯＦＬ
ＯＮ ＥＴＦＥ ＰＦＡ ：ダイキン工業（株）社製 ＮＥＯＦＬ
ＯＮ ＰＦＡ ＰＴＦＥ ：ダイキン工業（株）社製 ＰＯＬＹＦ
ＬＯＮ ＬＣＰ ：ポリプラスチック（株）社製 ＶＥＣＴＲ
Ａ 注２：透湿度は成形前の複合シートの状態でＪＩＳ Ｚ
０２０８ ４０℃，９０％ＲＨ下で測定した。 注３：吸湿率はキャリアテープ中へ密封後、３０℃，７
０％ＲＨ，６０日処理したキャリアテープ内のＱＦＰ
５２Ｐ（１４ｍｍ×１４ｍｍ×２ｍｍｔ）の重量変化よ
り算出。 注４：クラックはキャリアテープから取り出した電子部
品をはんだ実装し、その際に封止樹脂の表面観察により
評価した。Note 1: The raw material name of the resin used is as follows. PVC: Sumitomo Bakelite Co., Ltd. VSS-1
202 PS: Mitsui Toatsu Chemical Co., Ltd. Topolex PC: GE Co., Ltd. Lexan PP: Sumitomo Chemical Co., Ltd. Noblene PAN: Mitsui Toatsu Chemical Co., Ltd. Zekron Urethane: Kyowa Hakko Kogyo Co., Ltd. Estan ABS: Sumitomo Nogatac Co., Ltd. Clarastic amorphous PET: Eastman Chemical Co. PE
T-G PVDC: Asahi Kasei Kogyo Co., Ltd. Saran PCTFE: Daikin Kogyo Co., Ltd. DAIFL
ON PVDF: Kureha Chemical Industry Co., Ltd. KF polymer PVF: DuPont Co., Ltd. TEDLE
R FEP: NEOFL manufactured by Daikin Industries, Ltd.
ON FEP ETFE: NEOFL manufactured by Daikin Industries, Ltd.
ON ETFE PFA: NEOFL manufactured by Daikin Industries, Ltd.
ON PFA PTFE: POLYF manufactured by Daikin Industries, Ltd.
LON LCP: VECTR manufactured by Polyplastics Co., Ltd.
A Note 2: Water vapor permeability is JIS Z in the state of the composite sheet before molding
0208 Measured at 40 ° C. and 90% RH. Note 3: Moisture absorption is 30 ℃, 7 after sealing in carrier tape.
QFP in carrier tape treated with 0% RH for 60 days
Calculated from the weight change of 52P (14 mm × 14 mm × 2 mmt). Note 4: The crack was evaluated by soldering the electronic component taken out from the carrier tape and observing the surface of the sealing resin at that time.
【００１０】[0010]
【発明の効果】本発明に従うと、キャリアテープ中に収
納した電子部品は後工程でドライパックにより再度包装
しなくても、電子部品の輸送・保管中に吸湿することは
なく、実装工程時にも再ベーキングの必要はなく、はん
だ工程での封止樹脂へのクラック発生を防ぐことができ
る。同時に、ドライパック包装工程、再ベーキング工程
が省略でき工数の大幅な削減が可能となる。According to the present invention, the electronic components stored in the carrier tape do not absorb moisture during the transportation and storage of the electronic components even if they are not re-packaged by the dry pack in the subsequent process, and even during the mounting process. Rebaking is not necessary, and it is possible to prevent cracks from occurring in the sealing resin during the soldering process. At the same time, the dry pack packaging process and the rebaking process can be omitted, and the number of steps can be significantly reduced.
【図１】本考案のキャリアテープの層構成を示す断面図
である。FIG. 1 is a sectional view showing a layer structure of a carrier tape of the present invention.
【図２】本考案のキャリアテープにシールするカバーテ
ープの層構成の一例を示す断面図である。FIG. 2 is a cross-sectional view showing an example of a layer structure of a cover tape for sealing the carrier tape of the present invention.
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成４年１月１６日[Submission date] January 16, 1992
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００６[Correction target item name] 0006
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００６】又、防湿性能については複合シートの透湿
度がＪＩＳ Ｚ ０２０８ ４０℃，９０％ＲＨによる
測定法で少なくとも１．５ｇ／ｍ2・24ｈｒ以下が必要
であり、更に好ましくは０．７ｇ／ｍ2・24ｈｒ以下が
良い。１．５ｇ／ｍ2・24ｈｒを越えるとはんだ実装時
の封止樹脂へのクラック防止機能としては不十分であ
り、後工程での防湿袋での包装による保護・保管、ある
いは再ベーキングの実施が必要となる。尚、エンボス成
形を行う際、キャリアテープのカバーテープとシールさ
れる側の層は、第一層２と第二層３のいずれの側でも良
いが、カバーテープとのシール性をより安定させるため
には第一層２がキャリアテープのカバーテープにシール
される表面になる方が望ましい。又、キャリアテープを
構成する層は上記二層を基本単位とする三層以上の複合
フィルムでも良い。Regarding the moisture-proof property, the moisture permeability of the composite sheet must be at least 1.5 g / m 2 · 24 hr or less, preferably 0.7 g / m 2 according to JIS Z 0208 40 ° C. and 90% RH. m 2 · 24 hr or less is good. If it exceeds 1.5 g / m 2 · 24 hr, the function of preventing cracks in the encapsulating resin during solder mounting is insufficient, so protection and storage by packaging in a moisture-proof bag in the subsequent process, or rebaking is required. Will be needed. When performing embossing molding, the layer on the side of the carrier tape that is sealed with the cover tape may be either the first layer 2 or the second layer 3, but in order to make the sealing property with the cover tape more stable. It is desirable that the first layer 2 be the surface of the carrier tape that is sealed to the cover tape. Further, the layers constituting the carrier tape may be a composite film of three or more layers having the above two layers as a basic unit.
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００８[Correction target item name] 0008
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００８】 [0008]
【手続補正書】[Procedure amendment]
【提出日】平成４年１０月１２日[Submission date] October 12, 1992
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００５[Correction target item name] 0005
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００５】[0005]
【作用】本発明のキャリアテープ１の構成要素を図１で
説明すると、第一層２が非晶性ポリエステル、ポリウレ
タン、ポリプロピレン、ポリスチレン、ポリカーボネイ
ト、ＡＢＳ、ポリアクリロニトリル、ポリ塩化ビニルの
いずれかであり、厚みが５０〜４００μｍのエンボス成
形可能な熱可塑性樹脂である。５０μｍ以下ではシート
強度が不足し、４００μｍを越えると成形性が著しく低
下する。又、第二層３はポリテトラフルオロエチレン、
ポリクロロトリフルオロエチレン、テトラフルオロエチ
レン−ヘキサフルオロプロピレン共重合体、ポリふっ化
ビニル、ポリふっ化ビニリデン、エチレン−フルオロエ
チレン共重合体、テトラフルオロエチレン−パーフルオ
ロビニルエーテル共重合体、ポリ塩化ビニリデン、芳香
族系液晶性ポリエステルのいずれかであり、厚みが１〜
２００μｍの防湿機能を有する熱可塑性樹脂である。１
μｍ以下では防湿機能が不十分であり、２００μｍを越
えると成形性が著しく低下しコストも高くなる。第一層
２の第二層３に接する側、あるいは、第二層３の第一層
２に接する側は、二層間の密着力を向上させる目的で、
コロナ処理、プラズマ処理、サンドブラスト処理、化学
処理等の表面処理を施しても良い。又、同様の目的でイ
ソシアネート系、イミン系等の熱硬化型の接着剤層を介
して両者をラミネートしても良い。尚、静電気防止性能
を付与させる目的で、帯電防止剤、導電性粉末等を一層
または両層の樹脂中に混練または表面にコーティングし
ても良い。SUMMARY OF To explain the components of the carrier tape 1 of the present invention in FIG. 1, the first layer 2 is non-crystalline polyester, polyurethane, polypropylene, polystyrene, polycarbonate, ABS, polyacrylonitrile, be any of polyvinyl chloride The emboss-moldable thermoplastic resin having a thickness of 50 to 400 μm. If the thickness is less than 50 μm, the sheet strength will be insufficient, and if it exceeds 400 μm, the formability will be significantly reduced. The second layer 3 is polytetrafluoroethylene,
Polychlorotrifluoroethylene, tetrafluoroethylene-hexafluoropropylene copolymer, polyvinyl fluoride, polyvinylidene fluoride, ethylene-fluoroethylene copolymer, tetrafluoroethylene-perfluorovinyl ether copolymer, polyvinylidene chloride, It is one of aromatic liquid crystalline polyesters and has a thickness of 1 to
It is a thermoplastic resin having a moisture-proof function of 200 μm. 1
If it is less than μm, the moisture-proof function is insufficient. The side of the first layer 2 in contact with the second layer 3 or the side of the second layer 3 in contact with the first layer 2 is for the purpose of improving the adhesion between the two layers.
Surface treatment such as corona treatment, plasma treatment, sandblast treatment, and chemical treatment may be performed. Further, for the same purpose, both may be laminated via a thermosetting adhesive layer such as isocyanate type or imine type. For the purpose of imparting antistatic performance, an antistatic agent, a conductive powder or the like may be kneaded or coated on the surface of the resin of one layer or both layers.
Claims (2)
トを連続的に形成したプラスチック製エンボステープで
あって、少なくとも一方の層がエンボス成形可能な熱可
塑性樹脂であり、少なくとも他方の層が防湿機能を有す
る熱可塑性樹脂からなる二層以上の複合シートで、該複
合シートの透湿度がＪＩＳ Ｚ ０２０８ ４０℃，９
０％ＲＨによる測定法で１．５ｇ／ｍ2・24ｈｒ以下で
あるチップ型電子部品包装用キャリアテープ。1. A plastic embossing tape in which storage pockets for storing chip-type electronic components are continuously formed, wherein at least one layer is a thermoplastic resin capable of being embossed and at least the other layer is a moisture-proof function. A composite sheet of two or more layers made of a thermoplastic resin having a water vapor permeability of JIS Z 0208 40 ° C., 9
A carrier tape for packaging chip-type electronic components, which has a content of 1.5 g / m 2 · 24 hr or less measured by 0% RH.
性ポリエステル、ポリウレタン、ポリプロピレン、ポリ
スチレン、ポリカーボネイト、ＡＢＳ、ポリアクリロニ
トリル、ポリ塩化ビニルのいずれかであり、防湿機能を
有する熱可塑性樹脂がポリテトラフルオロエチレン、ポ
リクロロトリフルオロエチレン、エチレン−フルオロエ
チレン共重合体、テトラフルオロエチレン−ヘキサフル
オロプロピレン共重合体、ポリふっ化ビニル、ポリふっ
化ビニリデン、テトラフルオロエチレン−パーフルオロ
ビニルエーテル共重合体、ポリ塩化ビニリデン、芳香族
系液晶性ポリエステルのいずれかである請求項１記載の
チップ型電子部品包装用キャリアテープ。2. The emboss-moldable thermoplastic resin is any of amorphous polyester, polyurethane, polypropylene, polystyrene, polycarbonate, ABS, polyacrylonitrile, and polyvinyl chloride, and the thermoplastic resin having a moisture-proof function is polytetratetrafluoroethylene. Fluoroethylene, polychlorotrifluoroethylene, ethylene-fluoroethylene copolymer, tetrafluoroethylene-hexafluoropropylene copolymer, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-perfluorovinyl ether copolymer, poly The chip-type carrier tape for packaging electronic parts according to claim 1, which is one of vinylidene chloride and aromatic liquid crystalline polyester.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4004892A JPH0825573B2 (en) | 1992-01-14 | 1992-01-14 | Carrier tape for packaging chip-type electronic components |
| DE4300242A DE4300242C2 (en) | 1992-01-14 | 1993-01-07 | Display display unit of a vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4004892A JPH0825573B2 (en) | 1992-01-14 | 1992-01-14 | Carrier tape for packaging chip-type electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05193670A true JPH05193670A (en) | 1993-08-03 |
| JPH0825573B2 JPH0825573B2 (en) | 1996-03-13 |
Family
ID=11596328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4004892A Expired - Lifetime JPH0825573B2 (en) | 1992-01-14 | 1992-01-14 | Carrier tape for packaging chip-type electronic components |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH0825573B2 (en) |
| DE (1) | DE4300242C2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110368786A (en) * | 2019-07-12 | 2019-10-25 | 大连藏龙光电子科技有限公司 | A kind of control method of small-sized sealing optical device internal steam |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2727559A1 (en) * | 1994-11-25 | 1996-05-31 | Magneti Marelli France | Dashboard panel display device for vehicles |
| DE102004061022B4 (en) * | 2004-12-18 | 2015-06-25 | Bayerische Motoren Werke Aktiengesellschaft | Electronic device component with rack drive |
| FR2906505B1 (en) * | 2006-10-03 | 2008-12-12 | Renault Sas | INFORMATION DISPLAY ARRANGEMENT WITHIN A MOTOR VEHICLE INTERIOR. |
| DE102020107726A1 (en) * | 2020-03-20 | 2021-09-23 | Audi Aktiengesellschaft | Laminated display area windshield, display device, and motor vehicle having such a windshield |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0751390Y2 (en) * | 1990-05-17 | 1995-11-22 | 矢崎総業株式会社 | Vehicle display |
-
1992
- 1992-01-14 JP JP4004892A patent/JPH0825573B2/en not_active Expired - Lifetime
-
1993
- 1993-01-07 DE DE4300242A patent/DE4300242C2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110368786A (en) * | 2019-07-12 | 2019-10-25 | 大连藏龙光电子科技有限公司 | A kind of control method of small-sized sealing optical device internal steam |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0825573B2 (en) | 1996-03-13 |
| DE4300242C2 (en) | 1994-12-22 |
| DE4300242A1 (en) | 1993-08-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0501068B1 (en) | Cover tape for packaging chip type electronic parts | |
| EP0466937A1 (en) | Plastic carrier tape and cover tape for electronic component chip | |
| KR100822095B1 (en) | Cover tape for packaging electronic components | |
| JPH05193670A (en) | Carrier tape for packaging chip type electronic part | |
| JP2022044697A (en) | Cover tape for packaging electronic component, electronic component packaging body, and method for producing the same | |
| JP2589020B2 (en) | Cover tape for packaging chip-type electronic components | |
| JPH09193305A (en) | Laminated film and packaging bag for electronic part | |
| JPH03114829A (en) | Packing material | |
| JPH0532288A (en) | Cover tape for packaging chip type electronic component | |
| KR20140046982A (en) | Laminate | |
| JPH058339A (en) | Cover tape for packaging chip-type electronic part | |
| JPH05201461A (en) | Carrier tape for chip type electronic component packaging | |
| JP6507599B2 (en) | Cover tape, packaging material for electronic component packaging, and electronic component package | |
| US6663924B1 (en) | Packaging material for molding material and parts for semiconductor production apparatuses, method for packaging by using same and packaged molding material and parts for semiconductor production apparatuses | |
| JP3059370B2 (en) | Cover tape for packaging electronic components | |
| US20210378156A1 (en) | Apparatus and methods for packaging electronic components using a tape having desiccant entrained polymer on a reel | |
| JP2022063015A (en) | Cover tape and package | |
| JP2589021B2 (en) | Cover tape for packaging chip-type electronic components | |
| JP2809979B2 (en) | Cover tape for packaging chip-type electronic components | |
| JP2511761Y2 (en) | Cover tape for chip type electronic parts packaging | |
| JP2695536B2 (en) | Cover tape for packaging chip-type electronic components | |
| JP4569043B2 (en) | Cover tape for packaging electronic parts | |
| JP6596887B2 (en) | Cover tape for packaging electronic parts | |
| JP2008143170A (en) | Gas barrier film, packaging material and package | |
| JP2740619B2 (en) | Sealing method for carrier tape for electronic parts packaging |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080313 Year of fee payment: 12 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090313 Year of fee payment: 13 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090313 Year of fee payment: 13 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100313 Year of fee payment: 14 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100313 Year of fee payment: 14 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110313 Year of fee payment: 15 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120313 Year of fee payment: 16 |
|
| EXPY | Cancellation because of completion of term |