JPH05172512A - Position detecting apparatus for electronic part and mounting pattern - Google Patents
Position detecting apparatus for electronic part and mounting patternInfo
- Publication number
- JPH05172512A JPH05172512A JP3338148A JP33814891A JPH05172512A JP H05172512 A JPH05172512 A JP H05172512A JP 3338148 A JP3338148 A JP 3338148A JP 33814891 A JP33814891 A JP 33814891A JP H05172512 A JPH05172512 A JP H05172512A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- electronic component
- beam splitter
- image
- suction nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Image Processing (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Image Analysis (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子部品をプリント回路
基板（以下、基板と略称する）等に装着する装置におい
て、電子部品の位置及び基板等の装着パターンの位置を
検出するための装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for mounting an electronic component on a printed circuit board (hereinafter abbreviated as a substrate) or the like, for detecting the position of the electronic component and the position of a mounting pattern on the substrate or the like. ..
【０００２】[0002]
【従来の技術】従来の電子部品装着機の装着ヘッドで
は、例えば、特開平2−124404 号公報に記載のように、
装着ヘッドに搭載された装着パターン検出用カメラの光
軸と吸着ノズルの軸との間に一定の距離を置いた構成の
ものが有った。以下この一定距離をオフセット距離と称
す。この構成の装置では、電子部品と装着パターンの位
置をそれぞれ検出したのちに、電子部品を吸着ノズルに
吸着したまま装着ヘッドが移動して、検出値に基づいて
補正された装着指令位置の真上まで電子部品を搬送し、
電子部品を基板上に装着するという動作を行っていた。2. Description of the Related Art In a mounting head of a conventional electronic component mounting machine, for example, as described in JP-A-2-124404,
There is a configuration in which a fixed distance is provided between the optical axis of the mounting pattern detection camera mounted on the mounting head and the axis of the suction nozzle. Hereinafter, this fixed distance is referred to as an offset distance. In the device of this configuration, after the positions of the electronic component and the mounting pattern are respectively detected, the mounting head moves while the electronic component is being sucked by the suction nozzle, and the mounting command position is corrected directly on the basis of the detected value. Transport electronic components to
The electronic component was mounted on the board.
【０００３】一方、オフセット距離を持たない構造の例
は、特開昭61−63099 号公報に従来例として記載のもの
が有った。これは吸着ノズルにより電子部品を装着指令
位置の真上に保持し、電子部品と装着パターンとの間に
光学系を介して撮像装置を差し入れ、電子部品と装着パ
ターンの両画像を撮影して各位置偏差の値または相対変
位を検出してから補正距離（基板に平行な平面内でのベ
クトル量）を演算し、装着ヘッドまたは基板の位置を補
正するとともに光学部品を退避させて吸着ノズルを下降
させ、電子部品を基板上に装着するという動作を行って
いた。On the other hand, as an example of the structure having no offset distance, there is a conventional example described in Japanese Patent Laid-Open No. 61-63099. This is to hold the electronic component right above the mounting command position by the suction nozzle, insert an image pickup device between the electronic component and the mounting pattern via an optical system, and take both images of the electronic component and the mounting pattern. After detecting the position deviation value or relative displacement, calculate the correction distance (vector amount in the plane parallel to the board) to correct the position of the mounting head or the board, retract the optical parts, and lower the suction nozzle. Then, the operation of mounting the electronic component on the substrate was performed.
【０００４】[0004]
【発明が解決しようとする課題】第一の従来例では、装
着パターン位置を検出したのち装着ヘッドがロボットに
よりオフセット距離だけ移動してから、電子部品を基板
上の補正を加えられた指令位置に装着するという運転方
法が必要とされる。即ち、たとえ位置偏差の値が正確に
測定され補正距離が正確に演算されたとしても、そのの
ち装着ヘッドがおよそ数十mmの距離を移動するので、装
着パターンに対する最終的な電子部品の変位は知り得
ず、いわゆる、オープンループ制御を実行することにな
る。このため、装着位置誤差には装着ヘッド搬送機構の
位置誤差成分が含まれ、装着位置精度が粗くなってい
た。In the first conventional example, after the mounting pattern position is detected, the mounting head is moved by the robot by the offset distance, and then the electronic component is moved to the corrected command position on the substrate. A driving method of wearing them is required. That is, even if the position deviation value is accurately measured and the correction distance is accurately calculated, since the mounting head then moves a distance of several tens of mm, the final displacement of the electronic component with respect to the mounting pattern is It is impossible to know, and so-called open loop control will be executed. Therefore, the mounting position error includes the position error component of the mounting head transport mechanism, and the mounting position accuracy is rough.
【０００５】第二の従来例では、位置検出後の機械的動
作は、基板に平行な面内での微小な位置補正と、吸着ノ
ズルの角度補正と、吸着ノズルの下降だけであって、装
着ヘッド搬送機構はほぼ停止したままであるから、第一
の従来例と比較して装着位置精度の値が小さく抑えられ
るという効果があった。しかし、（特に高速な装着が要
求されている比較的小型の電子部品の装着作業に装着パ
ターン位置検出をするこの装置を用いると、動作速度が
非実用的な低速となる。また、）ＩＣ，ＬＳＩ等の比較
的大型の電子部品を含む汎用的装着作業に上記装置を用
いるときは、広い検出視野を要するので光学系が大型と
なる。また大型化に起因して、光学系とこれに固定され
た撮像装置の差し入れ動作及び退避動作に、より長時間
を要し、装置の高速動作を妨げることになる。各種電子
部品の形状に応じて適宜分割指定された複数の検出視野
を順次撮影することによって光学系の大型化を防ぐこと
は可能であろうが、この場合には差し入れ動作，複数回
の手順を要する視野変更のための移動，退避動作、及び
複数回の撮像に更に一層の長時間を要することになり、
やはり動作の高速化を妨げることになる。In the second conventional example, the mechanical operations after position detection are only minute position correction in a plane parallel to the substrate, angle correction of the suction nozzle, and lowering of the suction nozzle. Since the head transport mechanism is almost stopped, there is an effect that the value of the mounting position accuracy can be suppressed to be small as compared with the first conventional example. However, (when this device for detecting the mounting pattern position is used for the mounting work of a relatively small electronic component that requires particularly high-speed mounting, the operation speed becomes an impractical low speed.) When the above device is used for a general-purpose mounting operation including a relatively large electronic component such as an LSI, a large detection field of view is required, and the optical system becomes large. Further, due to the increase in size, it takes a longer time to insert and retract the optical system and the imaging device fixed to the optical system, which hinders high-speed operation of the device. It may be possible to prevent the size of the optical system from becoming large by sequentially photographing multiple detection fields of view that are appropriately divided and designated according to the shapes of various electronic components, but in this case, the inserting operation and the procedure of multiple times are required. It takes an even longer time to move, retreat to change the field of view, and take multiple shots.
After all, it will hinder the speeding up of the operation.
【０００６】本発明の第一の目的は、装着速度を損なわ
ずに第一の従来例で問題となった装着位置精度を向上さ
せるような装置を提供することにある。A first object of the present invention is to provide a device which improves the mounting position accuracy, which has been a problem in the first conventional example, without impairing the mounting speed.
【０００７】本発明の第二の目的は、装着位置精度を損
なわずに第二の従来例で問題となった装着速度を向上さ
せるような装置を提供することにある。A second object of the present invention is to provide a device which can improve the mounting speed which has been a problem in the second conventional example without impairing the mounting position accuracy.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
本発明では、装着ヘッドに吸着ノズルと、表面の一平面
（光学面）に金属を蒸着され内部に半透過反射面を有す
る移動可能なビームスプリッタと、撮像装置と、装着ヘ
ッドに固定され、そのビームスプリッタを保持し、前記
撮像装置に対してビームスプリッタの相対運動を行わせ
る駆動装置とを設け、前記ビームスプリッタを電子部品
と装着パターンとの間に位置決めすることにより、吸着
ノズルに吸着された電子部品の画像を撮影可能とすると
ともに、吸着ノズルが装着指令位置のほぼ真上にある状
態で装着パターンの画像を撮影可能としたものである。In order to achieve the above object, according to the present invention, the mounting head is movable and has a suction nozzle and a semi-transmissive reflective surface inside which metal is vapor-deposited on one plane (optical surface) of the surface. A beam splitter, an imaging device, and a drive device fixed to the mounting head, holding the beam splitter, and performing relative movement of the beam splitter with respect to the imaging device are provided, and the beam splitter is mounted with electronic components and a mounting pattern. By positioning it between the suction nozzle and the electronic component, the image of the electronic component sucked by the suction nozzle can be captured, and the image of the mounting pattern can be captured while the suction nozzle is almost directly above the mounting command position. Is.
【０００９】[0009]
【作用】図２により、本発明の装置を組み込んだ電子部
品装着機の一連の動作を説明する。The operation of the electronic component mounting machine incorporating the device of the present invention will be described with reference to FIG.
【００１０】まず、吸着ノズルを付けた装着ヘッドが電
子部品供給装置の上方に停止し、吸着ノズルが下降して
電子部品を真空吸着する。次に吸着ノズルが上昇すると
ともに、電子部品装着機のヘッド移動装置（ロボット）
によって装着ヘッドが基板上の装着指令位置、即ち、装
着パターン（ランドパターン）の中心位置に向けて移動
して電子部品を搬送する。移動作業前，作業中，作業
後、または電子部品を吸着したまま移動作業を一旦中断
して停止した時、のうちいずれかの時点で電子部品の画
像を、装着ヘッドに搭載された撮像装置により撮影し
て、電子部品の吸着ノズルに対する変位を測定する。装
着ヘッドが装着パターンの中心位置上空まで移動を完了
した後、撮像装置により装着パターンの画像を撮影す
る。First, the mounting head provided with the suction nozzle stops above the electronic component supply device, and the suction nozzle descends to vacuum-suction the electronic component. Next, the suction nozzle rises and the head moving device (robot) of the electronic component mounting machine
The mounting head moves toward the mounting command position on the substrate, that is, the center position of the mounting pattern (land pattern), and carries the electronic component. An image of the electronic component is taken by the image pickup device mounted on the mounting head at any time before the moving work, during the work, after the work, or when the moving work is interrupted and stopped while the electronic component is sucked. A photograph is taken to measure the displacement of the electronic component with respect to the suction nozzle. After the mounting head completes the movement above the central position of the mounting pattern, an image of the mounting pattern is taken by the imaging device.
【００１１】撮影された電子部品と装着パターンとの両
画像から、画像処理装置が電子部品の装着パターンに対
する位置偏差と角度偏差とを検出し、電子部品装着機の
制御装置が検出値に基づいて装着ヘッドの位置及び吸着
ノズルの姿勢角を補正する位置指令を発し、位置指令に
基づいてヘッド移動装置が装着ヘッドをわずかに移動さ
せ、吸着ノズルが下降して電子部品を装着パターン上に
置く。The image processing apparatus detects the positional deviation and the angular deviation of the electronic component with respect to the mounting pattern from both the photographed images of the electronic component and the mounting pattern, and the controller of the electronic component mounting machine detects the positional deviation and the angular deviation. A position command for correcting the position of the mounting head and the attitude angle of the suction nozzle is issued, the head moving device slightly moves the mounting head based on the position command, and the suction nozzle descends to place the electronic component on the mounting pattern.
【００１２】装着パターンを撮影する際には、吸着ノズ
ル及び吸着されている電子部品は駆動装置により装着パ
ターンの直上の位置から移動退避させられる。この退避
動作は、吸着ノズルの上昇，下降を行う駆動装置による
上方への退避動作とする。When the mounting pattern is photographed, the suction nozzle and the sucked electronic component are moved and retracted from the position immediately above the mounting pattern by the driving device. This evacuation operation is an upward evacuation operation by a drive device that raises and lowers the suction nozzle.
【００１３】上方への退避動作の間に、吸着ノズルの軸
の真下に、側面の一つの光学平面に金属が蒸着されて反
射面となしたキューブ型ビームスプリッタを位置決めし
て、電子部品の画像と、装着パターンの画像とを、装着
ヘッド内で例えば光学部品の側方に設置された撮像装置
により順次撮影する。During the upward retreat operation, a cube-type beam splitter having a reflecting surface formed by depositing metal on one side optical plane is positioned just below the axis of the suction nozzle, and an image of the electronic component is positioned. And the image of the mounting pattern are sequentially photographed in the mounting head by, for example, an imaging device installed on the side of the optical component.
【００１４】[0014]
【実施例】以下、本発明の実施例を図面に基づいて詳述
する。Embodiments of the present invention will now be described in detail with reference to the drawings.
【００１５】図１、及び図３は、本発明の第一の実施例
を示している。図１において、電子部品装着機のロボッ
ト１に搭載された装着ヘッド２には、吸着ノズル３が設
けられている。吸着ノズル３は、電子部品供給装置４の
上に置かれた電子部品５を真空吸着して、ロボット１の
動作により電子部品５を搬送し、基板６の面上の装着パ
ターン７の上に位置決めされて電子部品５を装着する。
図１では、装着ヘッド２と、基板６の面と平行な面に関
して装着ヘッド２に固定されて電子部品５を真空吸着し
た吸着ノズル３と、が装着パターン７の真上の位置に停
止した状態を示している。装着ヘッド２には、吸着ノズ
ル３をノズル軸線方向に移動させる第三の駆動装置８
と、吸着ノズル３を回転させることにより吸着された電
子部品５の姿勢を変更させる第三の駆動装置９とが設け
られている。さらに装着ヘッド２には、電子部品５の画
像及び装着パターン７の画像を取り込む撮像装置１０が
固定されている。1 and 3 show a first embodiment of the present invention. In FIG. 1, a suction nozzle 3 is provided on a mounting head 2 mounted on a robot 1 of an electronic component mounting machine. The suction nozzle 3 vacuum-sucks the electronic component 5 placed on the electronic component supply device 4, conveys the electronic component 5 by the operation of the robot 1, and positions it on the mounting pattern 7 on the surface of the substrate 6. Then, the electronic component 5 is mounted.
In FIG. 1, the mounting head 2 and the suction nozzle 3 that is fixed to the mounting head 2 with respect to a surface parallel to the surface of the substrate 6 and vacuum-sucks the electronic component 5 are stopped at a position directly above the mounting pattern 7. Is shown. The mounting head 2 has a third drive device 8 for moving the suction nozzle 3 in the nozzle axis direction.
And a third drive device 9 that changes the posture of the electronic component 5 that is sucked by rotating the suction nozzle 3. Further, an imaging device 10 that captures the image of the electronic component 5 and the image of the mounting pattern 7 is fixed to the mounting head 2.
【００１６】吸着ノズル３と装着パターン７との間に
は、内部の半透過反射面１１と表面の反射面１２とを有
するキューブ型ビームスプリッタ１３が、第一の駆動装
置１４によって位置決めされている。上述の状態で半透
過反射面１１は、吸着ノズル３のノズル軸線方向から見
る電子部品５の画像の光路を撮像装置１０へ向かうよう
に変換している。また反射面１２は、半透過反射面１１
によって既に水平方向に変換された、装着パターン７の
画像の光路をビームスプリッタ１３の内部へと戻して、
撮像装置１０へ向かうように変換している。Between the suction nozzle 3 and the mounting pattern 7, a cube-type beam splitter 13 having an internal semi-transmissive reflection surface 11 and a front reflection surface 12 is positioned by a first driving device 14. .. In the above-mentioned state, the semi-transmissive reflection surface 11 converts the optical path of the image of the electronic component 5 viewed from the nozzle axis direction of the suction nozzle 3 so as to be directed to the imaging device 10. The reflective surface 12 is a semi-transmissive reflective surface 11
The optical path of the image of the mounting pattern 7, which has already been converted in the horizontal direction by, is returned to the inside of the beam splitter 13,
The conversion is performed so as to be directed to the imaging device 10.
【００１７】電子部品装着機には、ロボット１や各駆動
装置８，９，１４、及び基板搬送装置等の図示しないそ
の他の構成部品を制御する制御装置１５が備わってい
る。また、撮像装置１０を制御するとともに、撮影され
た画像から被写体の位置偏差と角度偏差の検出，補正距
離の演算、並びに吸着異常の有無判定等を実行する画像
処理装置１６が備わっている。The electronic component mounting machine is provided with a control device 15 for controlling the robot 1, the driving devices 8, 9, 14 and other components (not shown) such as the substrate transfer device. Further, the image processing apparatus 16 is provided which controls the image pickup apparatus 10 and detects the position deviation and the angle deviation of the object from the picked-up image, calculates the correction distance, and determines whether or not there is a suction abnormality.
【００１８】なお、本実施例で撮影時のビームスプリッ
タ１３の中心は、電子部品５の下面と装着パターン７と
の中間点よりもビームスプリッタ１３の一辺の長さのち
ょうど半分だけ下方に位置決めさせて、両光路長を等し
くさせる。In this embodiment, the center of the beam splitter 13 at the time of photographing is positioned just half the length of one side of the beam splitter 13 below the midpoint between the lower surface of the electronic component 5 and the mounting pattern 7. And make both optical path lengths equal.
【００１９】次に、本実施例の装置の動作を説明する。
まず、ロボット１の動作により装着ヘッド２が電子部品
供給装置４の上方に移動し、吸着ノズル３が第二の駆動
装置８の動作により下降して、電子部品供給装置４の上
に置かれた電子部品５を真空吸着する。この際、ビーム
スプリッタ１３は第一の駆動装置１４により吸着ノズル
３の軸線から離れた位置に退避して置かれている。次
に、吸着ノズル３が電子部品５を吸着したまま第二の駆
動装置８の動作により、ビームスプリッタ１３の動作経
路より上方の位置まで上昇するとともに、再びロボット
１の動作により装着ヘッド２が移動を開始する。装着ヘ
ッド２が移動している間に、第一の駆動装置１４により
吸着ノズル３の軸線の延長位置、即ち電子部品５の真下
の位置にビームスプリッタ１３が位置決めされる。ビー
ムスプリッタ１３の半透過反射面１１ともう一つの固定
平面鏡１７によって２回反射された電子部品５の画像を
撮像装置１０が撮影する。Next, the operation of the apparatus of this embodiment will be described.
First, the mounting head 2 is moved above the electronic component supply device 4 by the operation of the robot 1, and the suction nozzle 3 is lowered by the operation of the second drive device 8 and placed on the electronic component supply device 4. The electronic component 5 is vacuum-sucked. At this time, the beam splitter 13 is retracted and placed by the first drive device 14 at a position away from the axis of the suction nozzle 3. Next, while the suction nozzle 3 sucks the electronic component 5, the second driving device 8 operates to move up to a position above the operation path of the beam splitter 13, and the mounting head 2 moves again by the operation of the robot 1. To start. While the mounting head 2 is moving, the first drive device 14 positions the beam splitter 13 at an extended position of the axis of the suction nozzle 3, that is, a position directly below the electronic component 5. The imaging device 10 captures an image of the electronic component 5 that is reflected twice by the semi-transmissive reflective surface 11 of the beam splitter 13 and another fixed plane mirror 17.
【００２０】電子部品５が装着パターン７の中心位置の
ほぼ上方にある、当初の装着指令位置まで搬送された
時、図１に示すように、ビームスプリッタ１３は吸着ノ
ズル３の軸線の延長位置、即ち電子部品５と装着パター
ン７との間の位置に置かれている。ビームスプリッタ１
３の半透過反射面１１で水平方向へ反射し、ビームスプ
リッタ１３の側面として位置した反射面１２でほぼ反対
方向に反射し、再び半透過反射面１１を透過して、さら
に固定平面鏡１７によって反射された装着パターン７の
画像を撮像装置１０が撮影する。光路の選択は、図示し
ないが、電子部品５と装着パターン７との両被写体に向
けた２組の照明光源（装着ヘッド２に搭載される）の切
り替え式の点灯または、２枚のシャッタ板の選択的開閉
によって行われる。照明切り替えまたはシャッタ板開閉
の動作は制御装置１５の指令によって実行される。When the electronic component 5 is transported to the original mounting command position, which is almost above the center position of the mounting pattern 7, the beam splitter 13 extends the axis of the suction nozzle 3 as shown in FIG. That is, it is placed at a position between the electronic component 5 and the mounting pattern 7. Beam splitter 1
3 is reflected in the horizontal direction by the semi-transmissive reflective surface 11, is reflected by the reflective surface 12 positioned as the side surface of the beam splitter 13 in substantially the opposite direction, is transmitted through the semi-transmissive reflective surface 11 again, and is further reflected by the fixed plane mirror 17. The imaging device 10 captures an image of the attached mounting pattern 7. The selection of the optical path is not shown, but the switching type lighting of two sets of illumination light sources (mounted on the mounting head 2) for both the electronic component 5 and the mounting pattern 7 toward the subject or switching between the two shutter plates. It is done by selective opening and closing. The operation of switching the illumination or opening / closing the shutter plate is executed by a command from the control device 15.
【００２１】画像処理装置１６は、撮影された電子部品
５の画像から吸着異常の有無を判定し、撮影された２つ
の画像から電子部品５の装着パターン７に対する相対位
置偏差と角度偏差を検出し、補正ベクトルを演算する。
制御装置１５は当初の装着指令位置座標に補正ベクトル
を加算して補正装着指令位置座標を求める。ビームスプ
リッタ１３が吸着ノズル３の軸線から離れた位置に再び
退避し、吸着ノズル３が下降するとともに、ロボット１
が補正装着指令位置まで位置修正動作をして電子部品５
を装着パターン７上に装着する。The image processing device 16 determines whether or not there is a suction abnormality from the taken images of the electronic component 5, and detects the relative position deviation and the angular deviation of the electronic component 5 with respect to the mounting pattern 7 from the two taken images. , Calculate the correction vector.
The controller 15 adds the correction vector to the initial mounting command position coordinates to obtain the corrected mounting command position coordinates. The beam splitter 13 retreats to a position away from the axis of the suction nozzle 3, the suction nozzle 3 descends, and the robot 1
Performs the position correction operation up to the correction mounting command position and the electronic component 5
Is mounted on the mounting pattern 7.
【００２２】本実施例において、図３に示すように、駆
動装置１４と第２の駆動装置８とを共用化した単一の駆
動装置１８を用いて、カム１９とリンク機構２０によっ
て吸着ノズル３の上方への退避動作とビームスプリッタ
１３の吸着ノズル軸上位置への接近位置決め動作とを同
期させることもできる。In this embodiment, as shown in FIG. 3, a single drive unit 18 in which the drive unit 14 and the second drive unit 8 are shared is used, and the suction nozzle 3 is formed by the cam 19 and the link mechanism 20. It is also possible to synchronize the upward retreat operation of the beam splitter and the approach positioning operation of the beam splitter 13 to the axial position of the suction nozzle.
【００２３】なお本実施例で、側面に蒸着処理を施した
キューブ型ビームスプリッタ１３に代えて通常のビーム
スプリッタと通常の平面表面鏡とを密着させて（または
接近させて固定して）併用してもほぼ同様の機能を達成
できることはいうまでもない。In this embodiment, instead of the cube-type beam splitter 13 whose side surface is vapor-deposited, an ordinary beam splitter and an ordinary plane surface mirror are used in close contact (or fixed close to each other) together. However, it goes without saying that almost the same functions can be achieved.
【００２４】本実施例によれば、電子部品５の画像とと
もに、装着ヘッド２及び吸着ノズル３が装着指令位置の
真上にある状態で装着パターン７の画像も撮影でき、撮
像後に装着ヘッド２が僅かな補正距離だけしか移動しな
いので、ロボット１の機構精度などの絶対精度に起因す
る誤差成分が電子部品５の装着精度に含まれず、装着精
度が向上する。According to the present embodiment, the image of the electronic component 5 and the image of the mounting pattern 7 can be taken with the mounting head 2 and the suction nozzle 3 right above the mounting command position, and the mounting head 2 can be imaged after the imaging. Since only a slight correction distance is moved, an error component resulting from absolute accuracy such as the mechanism accuracy of the robot 1 is not included in the mounting accuracy of the electronic component 5, and the mounting accuracy is improved.
【００２５】また本実施例を、図４のように１個の直角
プリズム２１の直角を挾む二平面２２ａ，２２ｂを各々
電子部品５の画像と装着パターン７の画像とに使用する
構造や、図５のように２個の直角プリズム２３ａ，２３
ｂを上下に並べる構造と比較すると、同一の必要視野に
対して装置の中でビームスプリッタ１３の占める上下方
向の長さが直角プリズムの上下方向長さに対して半減で
き、装置の小型化が可能となる。Further, in the present embodiment, as shown in FIG. 4, a structure in which two planes 22a and 22b which sandwich a right angle of one right-angle prism 21 are used for an image of the electronic component 5 and an image of the mounting pattern 7, respectively, As shown in FIG. 5, two right angle prisms 23a, 23
Compared with the structure in which b is arranged vertically, the vertical length occupied by the beam splitter 13 in the device for the same required field of view can be halved with respect to the vertical length of the right-angle prism, and the device can be downsized. It will be possible.
【００２６】また本実施例では、装着ヘッド２に搭載さ
れた単一の撮像装置１０によって電子部品５と装着パタ
ーン７との両画像を撮影するので、図４のような複数個
の撮像装置、または、図５のように別個に２個の反射面
を設けて光路を合成するという構造を要する従来装置よ
りも、小型で安価な装着ヘッド２を構成できるという効
果がある。Further, in the present embodiment, since the single image pickup device 10 mounted on the mounting head 2 captures both images of the electronic component 5 and the mounting pattern 7, a plurality of image pickup devices as shown in FIG. Alternatively, there is an effect that the mounting head 2 that is smaller and less expensive can be configured than the conventional device that requires a structure in which two reflecting surfaces are separately provided as shown in FIG. 5 to combine the optical paths.
【００２７】また本実施例によれば、装着ヘッド２が装
着パターン７の上方に到着した後に限らず、装着ヘッド
２が移動中であっても電子部品５の撮影ができる。この
撮影前に吸着ノズル３とビームスプリッタ１３とを予め
位置決めしておくことが可能である。このため、装着ヘ
ッド２が装着パターン７の上に停止した後に、撮像装置
１０に対するビームスプリッタ１３の相対振動の静定待
ち時間を置くこと無しに、直ちに、装着パターン７を撮
影できる。また、受光系全体を吸着ノズル３に対して移
動させるのではなく、反射面１１、及び１２をもつ光学
素子だけを移動させるので、比較的に高速移動が可能で
ある。したがって、装着速度の向上に効果がある。According to the present embodiment, the electronic component 5 can be photographed not only after the mounting head 2 has arrived above the mounting pattern 7 but also while the mounting head 2 is moving. It is possible to position the suction nozzle 3 and the beam splitter 13 in advance before this photographing. For this reason, after the mounting head 2 stops on the mounting pattern 7, the mounting pattern 7 can be immediately photographed without waiting for the static vibration waiting time of the relative vibration of the beam splitter 13 with respect to the imaging device 10. Further, since the entire light receiving system is not moved with respect to the suction nozzle 3 but only the optical element having the reflecting surfaces 11 and 12 is moved, a relatively high speed movement is possible. Therefore, it is effective in improving the mounting speed.
【００２８】次に、本発明の第二の実施例を図６により
説明する。図６に示すように、全体の構成は第一の実施
例とほぼ同様であるが、ビームスプリッタ１３に代えて
ビームスプリッタ２４を、第一の実施例とは上下逆転し
た姿勢で設置する。撮影時のビームスプリッタ２４の中
心は、電子部品５の下面と装着パターン７との中間点よ
りもビームスプリッタ１３の一辺の長さのちょうど半分
だけ上方に位置決めさせて、両光路長を等しくさせる。Next, a second embodiment of the present invention will be described with reference to FIG. As shown in FIG. 6, the overall structure is almost the same as that of the first embodiment, but the beam splitter 24 is installed in a posture inverted from that of the first embodiment instead of the beam splitter 13. The center of the beam splitter 24 at the time of photographing is positioned just half the length of one side of the beam splitter 13 above the midpoint between the lower surface of the electronic component 5 and the mounting pattern 7 so that both optical path lengths are equal.
【００２９】本実施例によれば、第一の実施例に記載し
た効果に加えて、基板６とビームスプリッタ２４との間
の距離を、基板６とビームスプリッタ１３との間の距離
より長くすることが可能である。ビームスプリッタ２４
の底面２５と基板６との間の距離ｄ1 は、装着動作中ま
たは移動中に既に装着済の他の電子部品群とビームスプ
リッタ２４とが干渉しないように一定値ｈ（概ね５ない
し１０mm）以上であることが要求されている。このこと
は第一の実施例においても同様に要求されている。しか
し、本実施例ではビームスプリッタの底面２５と基板６
との間の距離ｄ1はビームスプリッタの上面２６と電子
部品５との間の距離ｄ2よりも大きいので、その一部
（又は全部）を余裕距離ｈに充当させ、ｄ2 を０に近付
けると、両距離の和（ｄ1＋ｄ2）は第一の実施例と比べ
て短縮できる。According to this embodiment, in addition to the effect described in the first embodiment, the distance between the substrate 6 and the beam splitter 24 is made longer than the distance between the substrate 6 and the beam splitter 13. It is possible. Beam splitter 24
The distance d 1 between the bottom surface 25 and the substrate 6 is a constant value h (generally 5 to 10 mm) so that the beam splitter 24 does not interfere with another electronic component group already mounted during the mounting operation or movement. The above is required. This is also required in the first embodiment. However, in this embodiment, the bottom surface 25 of the beam splitter and the substrate 6 are
Since the distance d 1 between the beam splitter and the electronic component 5 is larger than the distance d 2 between the upper surface 26 of the beam splitter and the electronic component 5, a part (or the whole) of the distance d 1 is applied to the allowance distance h to bring d 2 close to 0. Then, the sum of both distances (d 1 + d 2 ) can be shortened as compared with the first embodiment.
【００３０】これにより、吸着ノズル３の上下ストロー
クを大幅に（概ねｈと同等の寸法だけ）短縮できるの
で、吸着ノズル３の上下移動に伴って生じ、装着精度の
低下要因ともなる機構誤差をその分だけ減少させること
ができる。さらに上下ストロークの短縮により、吸着ノ
ズル３の上下移動時間も短縮され、図４や図５の従来構
造よりも装着速度を向上することができる。As a result, the vertical stroke of the suction nozzle 3 can be greatly shortened (approximately the same size as h), so that a mechanical error that occurs with the vertical movement of the suction nozzle 3 and causes a decrease in mounting accuracy is caused. It can be reduced by minutes. Further, by shortening the vertical stroke, the vertical movement time of the suction nozzle 3 is also shortened, and the mounting speed can be improved as compared with the conventional structure of FIGS. 4 and 5.
【００３１】[0031]
【発明の効果】本発明によれば、装着ヘッドが装着指令
位置の真上にある状態で装着パターンの画像を撮影で
き、撮像後に装着ヘッドが僅かな補正距離だけしか移動
しないので、ロボットの機構精度などの絶対精度に起因
する誤差成分が電子部品の装着精度に含まれず、装着精
度が向上するという効果がある。According to the present invention, an image of a mounting pattern can be taken in a state where the mounting head is directly above the mounting command position, and the mounting head moves only a slight correction distance after the image capturing, so that the robot mechanism An error component resulting from absolute accuracy such as accuracy is not included in the mounting accuracy of the electronic component, and the mounting accuracy is improved.
【００３２】また一つの側面に金属を蒸着されたビーム
スプリッタを使用することにより、従来例よりも上下方
向に小さな装置寸法で電子部品及び装着パターンの位置
を検出できる上に、ビームスプリッタの取り付け姿勢を
選べば吸着ノズルの上下ストロークが短縮されるので、
吸着ノズルの上下移動に伴って生じ、装着精度の低下要
因となる機構誤差をも減少させることができるという効
果がある。Further, by using a beam splitter with metal vapor-deposited on one side, the positions of electronic parts and mounting patterns can be detected with a smaller device size in the vertical direction than the conventional example, and the beam splitter mounting posture If you select, the vertical stroke of the suction nozzle will be shortened.
There is an effect that it is possible to reduce a mechanical error that is caused by the vertical movement of the suction nozzle and causes a reduction in mounting accuracy.
【００３３】また単一の撮像装置によって電子部品及び
装着パターンの両画像を撮影することが可能となるの
で、小型で安価な装着ヘッドを構成できる。Further, since it is possible to capture both images of the electronic component and the mounting pattern with a single image pickup device, a small and inexpensive mounting head can be constructed.
【図１】本発明の第１実施例の構成及び動作を示す斜視
図。FIG. 1 is a perspective view showing the configuration and operation of a first embodiment of the present invention.
【図２】本発明の装置を組み込んだ電子部品装着機の構
成及び動作を示す斜視図。FIG. 2 is a perspective view showing the configuration and operation of an electronic component mounting machine incorporating the device of the present invention.
【図３】本発明の第１実施例の一部を置き換えた構成を
示す側面図。FIG. 3 is a side view showing a configuration in which a part of the first embodiment of the present invention is replaced.
【図４】従来技術の要部の構造を抜粋して示す説明図。FIG. 4 is an explanatory diagram showing an extracted structure of a main part of a conventional technique.
【図５】従来技術の要部の構造を抜粋して示す説明図。FIG. 5 is an explanatory diagram showing an extracted structure of a main part of a conventional technique.
【図６】本発明の第２実施例の構成及び動作を示す説明
図。FIG. 6 is an explanatory diagram showing the configuration and operation of the second embodiment of the present invention.
１…ロボット、２…装着ヘッド、３…吸着ノズル、４…
電子部品供給装置、５…電子部品、６…基板、７…装着
パターン、８…第２の駆動装置、９…第３の駆動装置、
１０…撮像装置、１１…半透過反射面、１２…反射面、
１３…ビームスプリッタ、１４…第１の駆動装置、１５
…制御装置、１６…画像処理装置、１７…固定平面鏡。1 ... Robot, 2 ... Mounting head, 3 ... Suction nozzle, 4 ...
Electronic component supply device, 5 ... Electronic component, 6 ... Substrate, 7 ... Mounting pattern, 8 ... Second driving device, 9 ... Third driving device,
10 ... Imaging device, 11 ... Semi-transmissive reflective surface, 12 ... Reflective surface,
13 ... Beam splitter, 14 ... First drive device, 15
... Control device, 16 ... Image processing device, 17 ... Fixed plane mirror.
Claims (1)
ノズルと、前記基板の面に対しほぼ垂直に前記吸着ノズ
ルを支持する装着ヘッドと、前記装着ヘッドを搬送する
ロボットと、前記装着ヘッドに固定され、前記電子部品
の画像と前記基板の面上の装着パターンの画像とを取り
込む撮像装置と、吸着された前記電子部品の画像をとら
えてその光線を反射して撮像装置に送る半透過反射面及
び、前記装着パターンの画像をとらえてその画像を前記
撮像装置に送る金属を蒸着された１反射表面を有するビ
ームスプリッタと、装着ヘッドに固定され、前記ビーム
スプリッタを保持し、前記撮像装置に対して前記ビーム
スプリッタの相対運動を行わせる第一の駆動装置と、前
記装着ヘッドに固定され、前記吸着ノズルを軸線方向に
移動させる第二の駆動装置と、前記装着ヘッドに保持さ
れ、吸着された前記電子部品の姿勢を変更させる第三の
駆動装置とを備える電子部品及び装着パターンの位置検
出装置。1. A suction nozzle that sucks and mounts an electronic component on a substrate, a mounting head that supports the suction nozzle substantially perpendicularly to the surface of the substrate, a robot that conveys the mounting head, and the mounting head. Fixed to the image pickup device for capturing the image of the electronic component and the image of the mounting pattern on the surface of the substrate, and the semi-transmission that captures the image of the electronic component adsorbed and reflects the light beam to send it to the image pickup device. A beam splitter having a reflecting surface and one reflecting surface on which a metal is vapor-deposited for capturing an image of the mounting pattern and sending the image to the imaging device, and a beam splitter fixed to a mounting head and holding the beam splitter, the imaging device A first drive device that causes relative movement of the beam splitter with respect to the second drive device, and a second drive device that is fixed to the mounting head and moves the suction nozzle in the axial direction. And the dynamic device is held in the mounting head, the position detecting device for an electronic component and mounting pattern and a third driving device for changing the posture of the electronic component sucked.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3338148A JPH05172512A (en) | 1991-12-20 | 1991-12-20 | Position detecting apparatus for electronic part and mounting pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3338148A JPH05172512A (en) | 1991-12-20 | 1991-12-20 | Position detecting apparatus for electronic part and mounting pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05172512A true JPH05172512A (en) | 1993-07-09 |
Family
ID=18315365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3338148A Pending JPH05172512A (en) | 1991-12-20 | 1991-12-20 | Position detecting apparatus for electronic part and mounting pattern |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05172512A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0843057A (en) * | 1994-07-28 | 1996-02-16 | Copal Co Ltd | Apparatus for confirming alignment |
| JP2007315844A (en) * | 2006-05-24 | 2007-12-06 | Matsushita Electric Works Ltd | Beam splitter and laser marker using same |
-
1991
- 1991-12-20 JP JP3338148A patent/JPH05172512A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0843057A (en) * | 1994-07-28 | 1996-02-16 | Copal Co Ltd | Apparatus for confirming alignment |
| JP2007315844A (en) * | 2006-05-24 | 2007-12-06 | Matsushita Electric Works Ltd | Beam splitter and laser marker using same |
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