JPH05157462A - Heating furnace for soldering - Google Patents
Heating furnace for solderingInfo
- Publication number
- JPH05157462A JPH05157462A JP34990491A JP34990491A JPH05157462A JP H05157462 A JPH05157462 A JP H05157462A JP 34990491 A JP34990491 A JP 34990491A JP 34990491 A JP34990491 A JP 34990491A JP H05157462 A JPH05157462 A JP H05157462A
- Authority
- JP
- Japan
- Prior art keywords
- heating chamber
- circuit boards
- circuit board
- inert gas
- furnace
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Tunnel Furnaces (AREA)
- Furnace Details (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子部品を回路基板に
半田付けするための半田付け用加熱炉に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heating furnace for soldering an electronic component to a circuit board.
【０００２】[0002]
【従来の技術】電子部品を回路基板に半田付けにより実
装する場合には、電子部品を所定の位置に搭載した回路
基板を加熱炉に通し、半田を溶融させて半田付けを行
う。この場合、加熱炉内には窒素ガスなどの不活性ガス
を充満させて、回路基板や電子部品の酸化を防止してい
る。2. Description of the Related Art When an electronic component is mounted on a circuit board by soldering, the circuit board on which the electronic component is mounted at a predetermined position is passed through a heating furnace to melt the solder for soldering. In this case, the heating furnace is filled with an inert gas such as nitrogen gas to prevent oxidation of the circuit board and electronic components.
【０００３】加熱炉内に不活性ガスを充満させるには従
来、シャッターで炉内外を遮断する方式が一般的であっ
たが、この方式は作業性がわるいため、最近、図３に示
すような非接触シール方式の加熱炉が提案されている。
この加熱炉は、内部にヒーター11が設置された加熱室13
と、入口通路15と、出口通路17とを備えており、その中
を電子部品を搭載した回路基板19がチェーンコンベア21
により両側を支持された状態で走行するようになってい
る。Conventionally, in order to fill the inside of the heating furnace with an inert gas, a method of shutting off the inside and outside of the furnace with a shutter has been generally used. However, since this method is poor in workability, recently as shown in FIG. A non-contact seal type heating furnace has been proposed.
This heating furnace has a heating chamber 13 in which a heater 11 is installed.
And an inlet passage 15 and an outlet passage 17, in which a circuit board 19 on which electronic components are mounted is a chain conveyor 21.
This allows the vehicle to run with both sides supported.
【０００４】加熱室13内には酸化防止のため不活性ガス
を充満させてあり、この不活性ガスは外部からの空気の
侵入を防止するため、入口通路15および出口通路17から
常時外部に流出する状態に保たれている。しかし不活性
ガスを外部へ常時流出させることは不経済であるため、
流出量をできるだけ少なくする必要がある。このため従
来の加熱炉は入口通路15および出口通路17内の上下に、
回路基板19の走行方向に所定の間隔をおいて多数の遮蔽
板23を配置し、これによって外部に流出する不活性ガス
に抵抗を与え、不活性ガスの流出を抑制している。The heating chamber 13 is filled with an inert gas for the purpose of preventing oxidation, and this inert gas constantly flows out from the inlet passage 15 and the outlet passage 17 in order to prevent air from entering from the outside. It is kept in a state of working. However, it is uneconomical to constantly discharge the inert gas to the outside,
It is necessary to minimize the outflow. Therefore, in the conventional heating furnace, the upper and lower parts in the inlet passage 15 and the outlet passage 17 are
A large number of shield plates 23 are arranged at a predetermined interval in the traveling direction of the circuit board 19, thereby providing resistance to the inert gas flowing out and suppressing the outflow of the inert gas.
【０００５】[0005]
【発明が解決しようとする課題】しかしこのような構造
では、回路基板を投入しない状態では加熱室内の酸素濃
度を比較的低く、かつ安定に保持できるのであるが、回
路基板を次々に投入すると、加熱室内の酸素濃度が大幅
に変動するという問題のあることが判明した。ちなみに
回路基板を投入しないときは加熱室内の酸素濃度は約20
ppm程度であるが、回路基板を投入すると加熱室内の酸
素濃度は数1000 ppm以下の範囲で大きく変動してしまう
のである。However, in such a structure, the oxygen concentration in the heating chamber can be kept relatively low and stable in the state where the circuit boards are not charged. However, when the circuit boards are sequentially charged, It was found that there was a problem that the oxygen concentration in the heating chamber fluctuated significantly. By the way, when the circuit board is not put in, the oxygen concentration in the heating chamber is about 20.
Although it is about ppm, when the circuit board is put in, the oxygen concentration in the heating chamber fluctuates greatly within the range of several thousand ppm or less.
【０００６】この原因を究明したところ、例えば図４に
示すように回路基板19が出口通路17を通過するときには
（入口通路15を通過するときも同様）遮蔽板23の間の隙
間が回路基板19によって上下に仕切られるため、炉内の
暖かいガスは回路基板19の上側を通って外部に出て行
き、回路基板19の下側ではこれとは反対に外気が炉内に
吸い込まれる現象が起きていることが分かった。この外
気の吸い込みのため炉内の酸素濃度の大幅に変動するわ
けである。When the cause of this is investigated, for example, as shown in FIG. 4, when the circuit board 19 passes through the outlet passage 17 (also when passing through the inlet passage 15), the gap between the shield plates 23 is a circuit board 19. Since it is partitioned by the upper and lower sides, the warm gas in the furnace goes out through the upper side of the circuit board 19, and on the lower side of the circuit board 19, on the contrary, outside air is sucked into the furnace. I found out that Due to the intake of the outside air, the oxygen concentration in the furnace fluctuates significantly.
【０００７】[0007]
【課題を解決するための手段】本発明は、上記のような
課題を解決した半田付け用加熱炉を提供するもので、そ
の構成は、電子部品を搭載した回路基板を加熱して両者
を半田付けする加熱室と、加熱室に前記回路基板を導入
する入口通路と、加熱室から前記回路基板を導出する出
口通路とを備え、入口通路および出口通路内の上下に
は、前記回路基板の走行方向に所定の間隔をおいて加熱
室内の不活性ガスが炉外に流出するのを抑制する多数の
遮蔽板を配置してなる半田付け用加熱炉において、入口
通路および出口通路の少なくとも一方の、少なくとも下
側に配置された遮蔽板の先端に、遮蔽板の断面がＴ形と
なるように水平板部を設けたことを特徴とする。SUMMARY OF THE INVENTION The present invention provides a heating furnace for soldering which solves the above-mentioned problems, and has a structure in which a circuit board on which electronic components are mounted is heated to solder the both. A heating chamber to be attached, an inlet passage for introducing the circuit board into the heating chamber, and an outlet passage for leading out the circuit board from the heating chamber are provided, and the circuit board runs above and below the inlet passage and the outlet passage. In a heating furnace for soldering, in which a large number of shielding plates that suppress the outflow of the inert gas in the heating chamber to the outside of the heating chamber at predetermined intervals are arranged, at least one of the inlet passage and the outlet passage, It is characterized in that a horizontal plate portion is provided at least at the tip of the shield plate arranged on the lower side so that the shield plate has a T-shaped cross section.
【０００８】[0008]
【作用】このようにすると回路基板の下側から炉内に吸
い込まれる空気が、遮蔽板の先端に設けられた水平板部
により、遮蔽板と遮蔽板の間の空間に巻き込まれて滞留
するようになり、加熱室まで侵入する空気はごく僅かと
なり、加熱室内の酸素濃度を低く保つことが可能とな
る。By doing so, the air sucked into the furnace from the lower side of the circuit board is trapped in the space between the shield plates by the horizontal plate portion provided at the tip of the shield plate and stays there. The amount of air entering the heating chamber is very small, and the oxygen concentration in the heating chamber can be kept low.
【０００９】[0009]
【実施例】以下、本発明の実施例を図面を参照して詳細
に説明する。図１は本発明の一実施例に係る半田付け用
加熱炉を示す。図１において先に説明した図３の加熱炉
と同一部分には同一符号が付してある。この加熱炉が図
３の加熱炉と異なるところは、入口通路15および出口通
路17内に配置された遮蔽板23の先端に、遮蔽板の断面が
Ｔ形となるように水平板部25を設けたことである。Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 shows a heating furnace for soldering according to an embodiment of the present invention. In FIG. 1, the same parts as those of the heating furnace of FIG. 3 described above are designated by the same reference numerals. This heating furnace is different from the heating furnace of FIG. 3 in that a horizontal plate portion 25 is provided at the tip of the shielding plate 23 disposed in the inlet passage 15 and the outlet passage 17 so that the shielding plate has a T-shaped cross section. That is.
【００１０】このような水平板部25を設けると、図４に
示すように回路基板19の下側から炉内に吸い込まれる空
気が、遮蔽板23と遮蔽板23の間の空間に巻き込まれて滞
留するようになるため、加熱室13まで空気が侵入し難く
なり、加熱室13内の酸素濃度を低く保つことができる。
また回路基板19の上側でも加熱された不活性ガスの巻き
込みが起こりやすくなるため、不活性ガスの流出量を少
なくできる。When such a horizontal plate portion 25 is provided, as shown in FIG. 4, the air sucked into the furnace from the lower side of the circuit board 19 is caught in the space between the shield plates 23. Since the air stays in the heating chamber 13, it becomes difficult for air to enter the heating chamber 13, and the oxygen concentration in the heating chamber 13 can be kept low.
In addition, since the heated inert gas is easily entangled on the upper side of the circuit board 19, the outflow amount of the inert gas can be reduced.
【００１１】図１の加熱炉で実験したところでは、窒素
ガス流量220 リットル／分、チェーンコンベア速度0.9
ｍ／分、回路基板サイズ250mm×250mm 、回路基板投入
枚数50枚、回路基板投入タクト30秒とした場合、加熱室
13内の酸素濃度は14.0〜19.3ppmの範囲で安定すること
が分かった。In the experiment using the heating furnace shown in FIG. 1, the nitrogen gas flow rate is 220 liters / minute, and the chain conveyor speed is 0.9.
m / min, circuit board size 250 mm × 250 mm, 50 circuit boards loaded, circuit board loading tact 30 seconds, heating chamber
It was found that the oxygen concentration in 13 was stable in the range of 14.0 to 19.3 ppm.
【００１２】なお、水平板部25は図示のように遮蔽板１
枚おきに設けることが最も効果的である。これは、すべ
ての遮蔽板23に水平板部25を設けると、かえってガスの
巻き込みが生じ難くなり、また遮蔽板２枚おき又は３枚
おきに水平板部を設けると水平板部が少な過ぎてガスの
巻き込み作用が小さくなるからである。The horizontal plate 25 is provided with a shield plate 1 as shown in the figure.
It is most effective to provide every other sheet. This is because if all the shield plates 23 are provided with the horizontal plate portions 25, it becomes more difficult for gas to be entrapped, and if two or three shield plates are provided, the horizontal plate portions are too small. This is because the gas entrainment action becomes small.
【００１３】また、断面Ｔ形の遮蔽板は、垂直な遮蔽板
23の先端に水平板部25を溶接すること等により構成でき
るが、断面Ｌ形の遮蔽板を背中合せに組み合わせて構成
することも可能である。The shield plate having a T-shaped cross section is a vertical shield plate.
It can be constructed by welding the horizontal plate portion 25 to the tip of 23, but it is also possible to construct it by combining back-to-back shield plates having an L-shaped cross section.
【００１４】[0014]
【発明の効果】以上説明したように本発明によれば、回
路基板の下側から炉内に侵入しようとする空気が、遮蔽
板の先端に設けた水平板部により、遮蔽板と遮蔽板の間
の空間に巻き込まれて滞留し、加熱室まで侵入し難くな
るため、加熱室内の酸素濃度を低く、かつ安定に保持す
ることができる。したがって回路基板と電子部品の半田
付けを酸化による不良を発生させることなく良好に行う
ことができる。As described above, according to the present invention, the air that is about to enter the furnace from the lower side of the circuit board is generated between the shield plates by the horizontal plate portion provided at the tip of the shield plate. The oxygen concentration in the heating chamber can be kept low and stable because it is caught in the space and stays there, and it is difficult for the heating chamber to enter. Therefore, the circuit board and the electronic component can be satisfactorily soldered without causing defects due to oxidation.
【図１】 図１は本発明の一実施例に係る半田付け用加
熱炉を示す断面図。FIG. 1 is a sectional view showing a heating furnace for soldering according to an embodiment of the present invention.
【図２】 図１の加熱炉の作用を要部を拡大して示す説
明図。FIG. 2 is an explanatory view showing the action of the heating furnace of FIG.
【図３】 従来の半田付け用加熱炉を示す断面図。FIG. 3 is a cross-sectional view showing a conventional heating furnace for soldering.
【図４】 図３の加熱炉の問題点を要部を拡大して示す
説明図。 11：ヒーター 13：加熱室 15：入口通路 17：出口通
路 19：電子部品を搭載した回路基板 21：チェー
ンコンベア 23：遮蔽板 25：水平板
部FIG. 4 is an explanatory view showing the problems of the heating furnace of FIG. 3 by enlarging a main part. 11: Heater 13: Heating chamber 15: Inlet passage 17: Outlet passage 19: Circuit board with electronic components 21: Chain conveyor 23: Shielding plate 25: Horizontal plate
Claims (2)
者を半田付けする加熱室と、加熱室に前記回路基板を導
入する入口通路と、加熱室から前記回路基板を導出する
出口通路とを備え、入口通路および出口通路内の上下に
は、前記回路基板の走行方向に所定の間隔をおいて加熱
室内の不活性ガスが炉外に流出するのを抑制する多数の
遮蔽板を配置してなる半田付け用加熱炉において、入口
通路および出口通路の少なくとも一方の、少なくとも下
側に配置された遮蔽板の先端に、遮蔽板の断面がＴ形と
なるように水平板部を設けたことを特徴とする半田付け
用加熱炉。1. A heating chamber for heating a circuit board on which electronic components are mounted to solder them together, an inlet passage for introducing the circuit substrate into the heating chamber, and an outlet passage for leading the circuit board out of the heating chamber. A plurality of shielding plates are provided above and below the inlet passage and the outlet passage at predetermined intervals in the traveling direction of the circuit board to prevent the inert gas in the heating chamber from flowing out of the furnace. In the heating furnace for soldering, a horizontal plate portion is provided at the tip of at least the lower shield plate of at least one of the inlet passage and the outlet passage so that the shield plate has a T-shaped cross section. A heating furnace for soldering.
平板部を有する遮蔽板と、先端に水平板部を有しない遮
蔽板とが回路基板の走行方向に交互に配置されているこ
とを特徴とするもの。2. The heating furnace according to claim 1, wherein a shield plate having a horizontal plate portion at the tip and a shield plate having no horizontal plate portion at the tip are alternately arranged in the traveling direction of the circuit board. What is characterized by being.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3349904A JP2977981B2 (en) | 1991-12-10 | 1991-12-10 | Heating furnace for soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3349904A JP2977981B2 (en) | 1991-12-10 | 1991-12-10 | Heating furnace for soldering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05157462A true JPH05157462A (en) | 1993-06-22 |
| JP2977981B2 JP2977981B2 (en) | 1999-11-15 |
Family
ID=18406897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3349904A Expired - Fee Related JP2977981B2 (en) | 1991-12-10 | 1991-12-10 | Heating furnace for soldering |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2977981B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014214988A (en) * | 2013-04-26 | 2014-11-17 | 東海高熱工業株式会社 | Continuous burning furnace |
-
1991
- 1991-12-10 JP JP3349904A patent/JP2977981B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014214988A (en) * | 2013-04-26 | 2014-11-17 | 東海高熱工業株式会社 | Continuous burning furnace |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2977981B2 (en) | 1999-11-15 |
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