JPH05145366A - Piezoelectric component - Google Patents

Piezoelectric component

Info

Publication number
JPH05145366A
JPH05145366A JP32950691A JP32950691A JPH05145366A JP H05145366 A JPH05145366 A JP H05145366A JP 32950691 A JP32950691 A JP 32950691A JP 32950691 A JP32950691 A JP 32950691A JP H05145366 A JPH05145366 A JP H05145366A
Authority
JP
Japan
Prior art keywords
piezoelectric substrate
electrode
piezoelectric
front cover
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP32950691A
Other languages
Japanese (ja)
Inventor
Shoichi Iwatani
昭一 岩谷
Yoshihisa Suzuki
嘉久 鈴木
Ikuo Kato
郁夫 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP32950691A priority Critical patent/JPH05145366A/en
Publication of JPH05145366A publication Critical patent/JPH05145366A/en
Withdrawn legal-status Critical Current

Links

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

PURPOSE:To obtain the piezoelectric component with high reliability in which the number of components is less, the structure is simple and crack or exfoliation or the like hardly occurrs. CONSTITUTION:A piezoelectric substrate 1 includes a front electrode and a rear electrode. An outer side of a support 4 has external connection terminals 13-15 and the external connection terminals 13-15 are electrically conmected to lead electrodes led from the front electrode and the rear electrode. A front cover 2 and a rear cover 3 have a cavity on one side to form a vibration space around the front electrode and the rear electrode. A side end face 210 of a cavity layer 21 of the front cover 2 is retracted from one side toward the other side and the thickness of the piezoelectric substrate 1 on the side end face is made zero.

Description

【発明の詳細な説明】Detailed Description of the Invention

【産業上の利用分野】本発明は、例えばフィルタ、共振
子または発振子等として使用される圧電部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric component used as, for example, a filter, a resonator or an oscillator.

【従来の技術】この種の圧電部品として、従来技術文献
としては、特開平２ー１８０４１７号公報等が知られて
いる。この従来技術では、圧電基板の表面及び裏面に積
層される表カバー及び裏カバーのそれぞれが空洞層と封
止層とを含み、空洞層が振動部に対応する部分に空洞部
を有して圧電基板に密着している。圧電基板は圧電磁器
材料で構成され、表カバー及び裏カバーは絶縁性の合成
樹脂によって構成されている。 ＜発明が解決しようとする課題＞しかしながら、上述し
た従来技術には、次のような問題点があった。 （Ａ）バネ性金属薄板を用いたキャップ状端子金具を装
着し、この端子金具を振動電極に導通するリード電極に
導通させる構造であったため、部品点数が多くなるこ
と、表カバー及び端子金具の両者において、振動部と端
子金具とを接続するための構造が複雑になること、実装
状態において端子金具が半田付け応力等の外力の影響を
受けて反りや破損等を発生し易い等の問題点がある。 （Ｂ）上述した問題点を解決する手段として、例えば先
に提案された特願平３ー１２６６１６号に開示されるご
とく、電極構造に工夫を加える等して、端子金具を省略
した構造をとることが考えられる。しかしながら、圧電
基板が磁器材料で構成されるのに対し、表カバーが合成
樹脂で構成されるため、圧電基板と表カバーとは線膨張
係数が異る。例えば、圧電基板の線膨張係数は（−１０
〜＋１０）×１０-6であるが、樹脂は（２０〜１００）
×１０-6であり、著しく異なる。このため、端子金具等
の支持固定手段がない構造では、熱衝撃試験、熱サイク
ル試験または使用時の温度変動等に伴って、圧電基板と
表カバーの線膨張係数の差に起因して発生する熱応力に
より、表カバーと圧電基板との接触界面に亀裂、剥離等
を生じてしまうという問題点があることがわかった。 （Ｃ）この種の圧電部品は、ウエハー状圧電基板の上に
多数の圧電素子を形成した後、圧電基板を切断して各圧
電素子毎に分離する工程を経て取出される。ところが、
圧電基板が磁器材料で構成されるのに対し、表カバーが
合成樹脂で構成されるため、切断工程において、圧電基
板と表カバーとが接触する切断面に、欠けや、割れを生
じ易い。このため、圧電基板と表カバーとの接触面に亀
裂や剥離が一層生じ易くなる。 そこで、本発明の課題は上述する従来の問題点を解決
し、部品点数が少なく、構造が簡単で、亀裂、剥離等の
生じにくい高信頼度の圧電部品を提供することである。 ＜課題を解決するための手段＞上述した課題解決のた
め、本発明は、圧電基板と、表カバーと、裏カバーと、
これらを支持する支持体とを有する圧電部品であって、
前記圧電基板は、振動部を有し、前記振動部が表面及び
裏面に互いに対向して配置された表電極及び裏電極を含
んでおり、前記支持体は、外面に外部接続を有し、前記
外部接続端子が前記表電極及び裏電極から導かれたリー
ド電極と導通しており、前記表カバー及び裏カバーは、
厚み方向の一面側に空洞部を有し、前記一面側が前記圧
電基板の表面及び裏面に重ねられて接着され、前記空洞
部が振動部の周りに振動空間を形成しており、前記表カ
バーは、側端面が前記一面側から他面側に向って後退
し、前記圧電基板の側端面上で見た厚みが零となってい
ることを特徴とする。 ＜作用＞圧電基板は振動部が表面及び裏面に互いに対向
して配置された表電極及び裏電極を含んでおり、表カバ
ー及び裏カバーは一面側に空洞部を有し一面側が圧電基
板の表面及び裏面に重ねられて接着され、空洞部が振動
部の周りに振動空間を形成しているから、空洞部によっ
て必要な振動空間を確保した圧電部品が得られる。圧電
基板は、振動部が表面及び裏面に互いに対向して配置さ
れた表電極及び裏電極を含んでおり、支持体は外面に外
部接続を有し外部接続端子が表電極及び裏電極から導か
れたリード電極と導通しているから、従来と異なって、
金属薄板でなるキャップ状端子金具が不要である。この
ため、部品点数が少なくなると共に、振動部取出構造が
簡単になる。キャップ状端子金具が不要であるために、
キャップ状端子金具の反り、破損等による信頼性低下を
招くこともない。更に、支持体に設けられた外部接続端
子を利用して外部回路と接続できる。このため、振動電
極から導出されているリード電極の半田食われ現象等を
防止できる。支持体の外部接続端子は、厚膜として形成
できるから、半田食われの影響は実質的に無視できる。
表カバーは、側端面が前記一面側から他面側に向って後
退し、圧電基板の側端面上で見た厚みが零となっている
から、発生する熱応力が表カバーの側端面の後退に対応
して分散され、接触界面における応力が低下する。ま
た、圧電基板の側端面に仮に欠け、破損、亀裂が生じて
いても、これらを表カバーの厚みが零である領域内に留
め、両者の接触界面に入らないようにすることができ
る。このため、熱衝撃試験、熱サイクル試験または使用
時の温度変動等に伴って、表カバー及び圧電基板の間に
線膨張係数の差に起因する熱応力が発生した場合でも、
圧電基板と表カバーとの接触界面に亀裂、剥離等が生じ
にくくなり、信頼性が向上する。2. Description of the Related Art As a piezoelectric component of this type, Japanese Patent Application Laid-Open No. 2-180417 is known as a prior art document. In this conventional technique, each of the front cover and the back cover laminated on the front surface and the back surface of the piezoelectric substrate includes a cavity layer and a sealing layer, and the cavity layer has a cavity portion at a portion corresponding to the vibrating portion. It adheres to the substrate. The piezoelectric substrate is made of a piezoelectric ceramic material, and the front cover and the back cover are made of insulating synthetic resin. <Problems to be Solved by the Invention> However, the above-described conventional techniques have the following problems. (A) Since the cap-shaped terminal fitting using the thin spring metal plate is mounted and the terminal fitting is electrically connected to the lead electrode that is electrically connected to the vibrating electrode, the number of parts is increased and the front cover and the terminal fitting are In both cases, the structure for connecting the vibrating part and the terminal fitting is complicated, and the terminal fitting is susceptible to warping or breakage under the influence of external force such as soldering stress in the mounted state. There is. (B) As a means for solving the above-mentioned problems, for example, as disclosed in Japanese Patent Application No. 3-126616 previously proposed, the electrode structure is modified so that the terminal metal fitting is omitted. It is possible. However, since the piezoelectric substrate is made of a porcelain material and the front cover is made of synthetic resin, the piezoelectric substrate and the front cover have different linear expansion coefficients. For example, the linear expansion coefficient of the piezoelectric substrate is (-10
~ + 10) × 10 -6 , but the resin is (20-100)
× 10 −6, which is significantly different. For this reason, in a structure without a supporting and fixing means such as a terminal fitting, it occurs due to the difference in the linear expansion coefficient between the piezoelectric substrate and the front cover due to a thermal shock test, a thermal cycle test, or a temperature change during use. It has been found that there is a problem that cracks, peeling, etc. occur at the contact interface between the front cover and the piezoelectric substrate due to thermal stress. (C) This type of piezoelectric component is taken out after a process of forming a large number of piezoelectric elements on a wafer-shaped piezoelectric substrate and then cutting the piezoelectric substrate to separate each piezoelectric element. However,
Since the piezoelectric substrate is made of a porcelain material, while the front cover is made of synthetic resin, a cut surface at which the piezoelectric substrate and the front cover come into contact with each other is easily chipped or cracked in the cutting step. Therefore, cracks and peeling are more likely to occur on the contact surface between the piezoelectric substrate and the front cover. Therefore, an object of the present invention is to solve the above-mentioned conventional problems, and to provide a highly reliable piezoelectric component which has a small number of components, a simple structure, and is unlikely to cause cracks or peeling. <Means for Solving the Problems> In order to solve the above problems, the present invention provides a piezoelectric substrate, a front cover, a back cover,
A piezoelectric component having a support for supporting these,
The piezoelectric substrate has a vibrating portion, the vibrating portion includes a front electrode and a back electrode arranged on the front surface and the back surface facing each other, the support has an external connection on the outer surface, The external connection terminal is in conduction with the lead electrode led from the front electrode and the back electrode, the front cover and the back cover,
A cavity portion is provided on one surface side in the thickness direction, the one surface side is overlapped and adhered to the front surface and the back surface of the piezoelectric substrate, and the cavity portion forms a vibration space around the vibration portion, and the front cover is The side end face recedes from the one face side toward the other face side, and the thickness of the piezoelectric substrate viewed on the side end face is zero. <Operation> The piezoelectric substrate includes a front electrode and a back electrode in which the vibrating portion is arranged on the front surface and the back surface so as to face each other. Also, since the cavity part forms a vibration space around the vibrating part by being laminated and adhered to the back surface, a piezoelectric component in which a necessary vibration space is secured by the cavity part is obtained. The piezoelectric substrate includes a front electrode and a back electrode whose vibrating parts are arranged on the front surface and the back surface so as to face each other, the support has an external connection on the outer surface, and an external connection terminal is guided from the front electrode and the back electrode. Since it is electrically connected to the lead electrode, unlike the conventional
There is no need for a cap-shaped terminal fitting made of a thin metal plate. For this reason, the number of parts is reduced, and the structure for extracting the vibrating portion is simplified. Because a cap-shaped terminal fitting is unnecessary,
The reliability of the cap-shaped terminal fitting due to warping or damage is not reduced. Further, it can be connected to an external circuit by using an external connection terminal provided on the support. Therefore, it is possible to prevent the phenomenon of solder erosion of the lead electrode led out from the vibrating electrode. Since the external connection terminal of the support can be formed as a thick film, the influence of solder erosion can be substantially ignored.
Since the side end surface of the front cover recedes from the one surface side to the other surface side and the thickness seen on the side end surface of the piezoelectric substrate is zero, the generated thermal stress causes the side end surface of the front cover to recede. And the stress at the contact interface is reduced. Further, even if the side end surface of the piezoelectric substrate is chipped, broken, or cracked, these can be kept in the region where the thickness of the front cover is zero so as not to enter the contact interface between them. Therefore, even if a thermal stress due to a difference in linear expansion coefficient occurs between the front cover and the piezoelectric substrate due to a thermal shock test, a thermal cycle test, or a temperature change during use,
Cracks and peeling are less likely to occur at the contact interface between the piezoelectric substrate and the front cover, and reliability is improved.

【実施例】図１は本発明に係る圧電部品の分解斜視図、
図２は同じく組立状態での斜視図、図３は同じく正面部
分断面図、図４は同じく正面断面図、図５は図３のＡ１
ーＡ１線上における断面図、図６は図３のＡ２ーＡ２線
上における断面図である。１は圧電基板、２は表カバ
ー、３は裏カバー、４は支持体、５は接着剤層である。
圧電基板１は、振動部６、７を有する。各振動部６、７
は、圧電基板１の表面及び裏面に互いに対向するように
形成された表電極６１、７１及び裏電極（６２、６
３）、（７２、７３）を備えている。表電極６１、７１
は、リード電極８に共通に接続されている。リード電極
８には圧電基板１の両面に設けたコンデンサ電極９も導
通させてある。裏電極６２、７２は、コンデンサ電極９
と対向するコンデンサ電極１０を介して互いに導通接続
されており、裏電極６３、７３は、圧電基板１に形成さ
れたリード電極６４、７４によって圧電基板１の両隅部
の端部に導かれている。電極配置に関しては、図示とは
逆に、電極（６２、６３）、（７２、７３）を表電極と
し、電極６１、７１を裏電極とするような配置関係をと
ることも可能である。更に、圧電基板１の裏面側には、
表面側のリード電極８と対向するリード電極１１が設け
られている。表面側のリード電極８及び裏面側のリード
電極１１は、圧電基板１を表裏方向に通る導体１２によ
って互いに接続されている。導体１２は主振動モードに
影響を与えない位置であって、リード電極８、１１を相
互接続できる位置であれば、任意の位置が選定できる。
図示の導体１２は圧電基板１に設けられたスルーホール
内に、スパッタ等の薄膜技術または印刷等のあつ膜技術
によって導体を付着させることによって形成できる。ス
ルーホールは焼成前はグリーンシート打抜き、焼成後は
レーザ加工等によって形成できる。表電極６１、７１、
裏電極（６２、６３）、（７２、７３）及びリード電極
６４、７４、８、１１はスパッタ等の薄膜技術または厚
膜技術によって形成できる。このように、圧電基板１
は、表電極６１、７１が圧電基板１を表裏方向に通る導
体１２によって裏面側に設けられたリード電極１１と導
通し、裏電極６３、７３が裏面側に設けられたリード電
極６４、７４と導通しているから、表電極６１、７１及
び裏電極６３、７４を同一面である裏面側で引出すこと
ができる。このため、振動部６、７の外部引出経路が短
くなり、リードインダクタンスの減少、それに伴う特性
向上等の利点が得られる。表カバー２は、空洞層２１と
封止層２２とを含み、裏カバー３も同様に、空洞層３１
と封止層３２とを含んでいる。空洞層２１、３１は、振
動部６、７に対応する部分に空洞部（２１１、２１
２）、（３１１、３１２）を有して、圧電基板１に密着
させてある。空洞部（２１１、２１２）、（３１１、３
１２）は、振動部６、７の表電極６１及び裏電極（６
２、６３）、（７２、７３）から外れた位置に、開口部
２１３、３１３を有している。空洞部（２１１、２１
２）、（３１１、３１２）は、表電極６１、７１及び裏
電極（６２、６３）、（７２、７３）で構成される振動
部を包囲するように形成し、その一部を狭い通路を通し
て、開口部２１３、３１３に連通させてある。裏カバー
３の空洞層３１及び封止層３２は、リード電極６４、１
１及び７４と対応する位置に、欠落部３１４〜３１６、
３２１〜３２３を設けてある。表カバー２を構成する空
洞層２１は、側端面２１０が一面側から他面側に向って
後退し、圧電基板１の側端面上で見た厚みが零となって
いる。図示の空洞層２１は、側端面２１０が平面状の傾
斜面となっていて、圧電基板１の側端面との間に間隔ｄ
が生じるように、圧電基板１の面内に配置されている。
側端面２１０は図４の破線で示す如く、間隔ｄが実質的
に零となるように形成してもよい。側端面２１０は凸も
しくは凹状の弧面、折線状の平面またはこれらの組合せ
であってもよい。更に、図７に示すように、段面として
もよい。封止層２２、３２は、絶縁樹脂でなり、空洞層
２１、３１の上に密着し、開口部２１３、３１３を閉塞
している。封止層２２、３２は紫外線硬化型樹脂によっ
て形成するのが望ましい。支持体４はアルミナ等のセラ
ミックでなり、接着層５によって裏カバー３を構成する
封止層３２の表面に接着されている。支持体４は裏カバ
ー３側に備えられている。支持体４の一端縁には、表カ
バー２の空洞層２１と、裏カバー３の空洞層３１及び封
止層３２の端縁に設けられた欠落部３１４〜３１６、３
２１〜３２３に対応する欠落部４１〜４３を設けてあ
る。欠落部４１〜４３の内部及びその周辺部には、外部
接続端子１３〜１５が被着されている。外部接続端子１
３〜１５は厚膜形成技術、メッキ技術またはその組合せ
によって形成する。組立に当って、支持体１４の上に裏
カバー３、圧電基板１及び表カバー２の積層体を、接着
層５を介して積層一体化する。圧電基板１の裏面側に設
けられたリード電極６４、１１及び７４は、裏カバー３
の空洞層３１及び封止層３２の端縁に設けられた欠落部
３１４〜３１６、３２１〜３２３を介して、支持体４の
欠落部４１〜４３の周辺に設けられた外部接続端子１３
〜１５と対向するように配置する。そして、欠落部３１
４〜３１６、３２１〜３２３、欠落部４１〜４３に導電
塗料等による導電剤１６〜１８（図２参照）を塗布し、
リード電極６４、１１及び７４を外部接続端子１３〜１
５に導通接続させる。上述のように、表電極６１、７１
が圧電基板１を表裏方向に通る導体１２によって裏面側
に設けられたリード電極１１と導通し、裏電極６３、７
３が裏面側に設けられた他のリード電極６４、７４と導
通しており、支持体４は外面に外部接続端子１３〜１５
を有し、外部接続端子１３〜１５がリード電極６４、１
１、７４に導通しているから、従来と異なって、金属薄
板でなるキャップ状端子金具が不要である。このため、
部品点数が少なくなると共に、振動部取出構造が簡単に
なる。キャップ状端子金具が不要であるために、キャッ
プ状端子金具の反り、破損等による信頼性低下を招くこ
とがない。しかも、支持体４は、外面に外部接続端子１
３〜１５を有し、外部接続端子１３〜１５がリード電極
６４、１１、７４に導通しているから、支持体４に設け
られた外部接続端子１３〜１５が外部との接続部分とな
る。このため、振動部６、７から導出され薄膜で構成さ
れているリード電極６４、１１、７４の半田食われ現象
等を防止できる。支持体４の外部接続端子１３〜１５
は、厚膜として形成できるから、半田食われの影響は実
質的に無視できる。また、表カバー２１は、空洞層２１
の側端面２１０が一面側から他面側に向って後退し、圧
電基板１の側端面上で見た厚みが零となっているから、
応力が側端面２１０の後退に対応して分散され、図８に
示す如く、従来の特性Ｓ１１、Ｓ１２から特性Ｓ２１、
Ｓ２２のように低下する。しかも、圧電基板１の側端面
に仮に欠け、破損、亀裂が生じていても、これらを表カ
バー２１の厚みが零である領域の間隔ｄ内に留め、接触
界面に入らないようにすることができる。このため、熱
衝撃試験、熱サイクル試験または使用時の温度変動等に
伴って、表カバー２を構成する空洞層２１及び圧電基板
１の間に線膨張係数の差に起因する熱応力が発生した場
合でも、圧電基板１と表カバー２との接触界面に亀裂、
剥離等が生じにくくなり、信頼性が向上する。図９は熱
衝撃テスト結果を示すデータである。図９において、縦
軸に累積不良率（％）をとり、横軸に熱サイクル数をと
ってある。Ｌ１は従来の圧電部品（従来品）の特性、Ｌ
２は本発明に係る圧電部品（本発明品）の特性を示して
いる。熱衝撃テストに当っては、従来品及び本発明品と
も８０個のサンプルを用意し、−５５℃で３０分、＋１
２５℃で３０分を１サイクルとする熱衝撃を１００サイ
クル加えた。図９に示すように、従来品では、２０サイ
クルで約１４％、５０サイクルで約１９％、１００サイ
クルで約２５％の不良率を生じているが、本発明では１
００サイクルでも殆ど不良品を生じない。FIG. 1 is an exploded perspective view of a piezoelectric component according to the present invention,
2 is a perspective view in the same assembled state, FIG. 3 is a front partial sectional view of the same, FIG. 4 is a front sectional view of the same, and FIG. 5 is A1 of FIG.
6 is a sectional view taken along line A1-A1 and FIG. 6 is a sectional view taken along line A2-A2 in FIG. Reference numeral 1 is a piezoelectric substrate, 2 is a front cover, 3 is a back cover, 4 is a support, and 5 is an adhesive layer.
The piezoelectric substrate 1 has vibrating portions 6 and 7. Each vibrating section 6, 7
Are front electrodes 61, 71 and back electrodes (62, 6) formed on the front surface and the back surface of the piezoelectric substrate 1 so as to face each other.
3) and (72, 73). Front electrodes 61, 71
Are commonly connected to the lead electrode 8. Capacitor electrodes 9 provided on both surfaces of the piezoelectric substrate 1 are also electrically connected to the lead electrodes 8. The back electrodes 62 and 72 are the capacitor electrodes 9
The back electrodes 63 and 73 are electrically connected to each other through the capacitor electrode 10 that faces each other, and the back electrodes 63 and 73 are guided to the ends of both corners of the piezoelectric substrate 1 by the lead electrodes 64 and 74 formed on the piezoelectric substrate 1. There is. Regarding the electrode arrangement, contrary to the illustration, the electrodes (62, 63) and (72, 73) may be used as the front electrodes and the electrodes 61 and 71 may be used as the back electrodes. Furthermore, on the back surface side of the piezoelectric substrate 1,
A lead electrode 11 that faces the lead electrode 8 on the front surface side is provided. The lead electrode 8 on the front surface side and the lead electrode 11 on the back surface side are connected to each other by a conductor 12 passing through the piezoelectric substrate 1 in the front-back direction. The conductor 12 is a position that does not affect the main vibration mode, and any position can be selected as long as it can connect the lead electrodes 8 and 11 to each other.
The illustrated conductor 12 can be formed by depositing a conductor in a through-hole provided in the piezoelectric substrate 1 by a thin film technique such as sputtering or a thick film technique such as printing. The through holes can be formed by punching the green sheet before firing and laser processing after firing. Front electrodes 61, 71,
The back electrodes (62, 63), (72, 73) and the lead electrodes 64, 74, 8, 11 can be formed by a thin film technique such as sputtering or a thick film technique. In this way, the piezoelectric substrate 1
Means that the front electrodes 61, 71 are electrically connected to the lead electrodes 11 provided on the back surface side by the conductors 12 passing through the piezoelectric substrate 1 in the front-back direction, and the back electrodes 63, 73 are provided with the lead electrodes 64, 74 provided on the back surface side. Since they are conducting, the front electrodes 61, 71 and the back electrodes 63, 74 can be drawn out on the same back surface side. For this reason, the external lead-out paths of the vibrating portions 6 and 7 are shortened, and advantages such as a reduction in lead inductance and accompanying improvement in characteristics can be obtained. The front cover 2 includes a cavity layer 21 and a sealing layer 22, and the back cover 3 similarly includes the cavity layer 31.
And a sealing layer 32. The cavity layers 21 and 31 are formed in the cavity portions (211 and 21) at the portions corresponding to the vibrating portions 6 and 7.
2) and (311 and 312) are attached to the piezoelectric substrate 1. Cavities (211, 212), (311, 3)
12) is a front electrode 61 and a back electrode (6) of the vibrating parts 6 and 7.
2, 63) and (72, 73) are provided with openings 213 and 313. Cavity (211, 21
2) and (311, 312) are formed so as to surround the vibrating portion composed of the front electrodes 61, 71 and the back electrodes (62, 63), (72, 73), and a part of them is passed through a narrow passage. , To the openings 213 and 313. The cavity layer 31 and the sealing layer 32 of the back cover 3 are the lead electrodes 64, 1
At the positions corresponding to 1 and 74, the missing portions 314 to 316,
321 to 323 are provided. In the cavity layer 21 forming the front cover 2, the side end surface 210 recedes from one surface side to the other surface side, and the thickness seen on the side end surface of the piezoelectric substrate 1 is zero. In the illustrated cavity layer 21, the side end surface 210 is a flat inclined surface, and a gap d is formed between the side end surface and the side end surface of the piezoelectric substrate 1.
Are arranged in the plane of the piezoelectric substrate 1 so that
The side end surface 210 may be formed so that the distance d is substantially zero, as shown by the broken line in FIG. The side end surface 210 may be a convex or concave arc surface, a polygonal flat surface, or a combination thereof. Furthermore, as shown in FIG. 7, it may be a step. The sealing layers 22 and 32 are made of an insulating resin and adhere to the cavity layers 21 and 31 to close the openings 213 and 313. It is desirable that the sealing layers 22 and 32 be formed of an ultraviolet curable resin. The support 4 is made of ceramic such as alumina and is adhered to the surface of the sealing layer 32 forming the back cover 3 by the adhesive layer 5. The support 4 is provided on the back cover 3 side. At one edge of the support body 4, the cavity layer 21 of the front cover 2, and the missing portions 314 to 316, 3 provided at the edges of the cavity layer 31 and the sealing layer 32 of the back cover 3.
Missing parts 41 to 43 corresponding to 21 to 323 are provided. External connection terminals 13 to 15 are attached to the insides of the cutouts 41 to 43 and their peripheral portions. External connection terminal 1
3 to 15 are formed by a thick film forming technique, a plating technique or a combination thereof. At the time of assembly, a laminated body of the back cover 3, the piezoelectric substrate 1 and the front cover 2 is laminated and integrated on the support body 14 via the adhesive layer 5. The lead electrodes 64, 11 and 74 provided on the back surface side of the piezoelectric substrate 1 include the back cover 3
The external connection terminals 13 provided around the missing portions 41 to 43 of the support body 4 via the missing portions 314 to 316 and 321 to 323 provided at the edges of the cavity layer 31 and the sealing layer 32.
It is arranged so as to face ~ 15. And the missing portion 31
4 to 316, 321 to 323, and the missing parts 41 to 43 are coated with conductive agents 16 to 18 (see FIG. 2) such as conductive paint,
The lead electrodes 64, 11 and 74 are connected to the external connection terminals 13 to 1
Conductive connection to 5. As described above, the front electrodes 61, 71
Is electrically connected to the lead electrode 11 provided on the back surface side by the conductor 12 passing through the piezoelectric substrate 1 in the front-back direction, and the back electrodes 63, 7
3 is electrically connected to the other lead electrodes 64 and 74 provided on the back surface side, and the support body 4 is provided on the outer surface with the external connection terminals 13 to 15
And the external connection terminals 13 to 15 have lead electrodes 64 and 1
Unlike the conventional case, the cap-shaped terminal fitting made of a thin metal plate is unnecessary because it is electrically connected to the terminals 1 and 74. For this reason,
The number of parts is reduced and the vibrating part extraction structure is simplified. Since the cap-shaped terminal fitting is unnecessary, the reliability of the cap-shaped terminal fitting is not deteriorated due to warping or damage. Moreover, the support body 4 has the external connection terminal 1 on the outer surface.
3 to 15 and the external connection terminals 13 to 15 are electrically connected to the lead electrodes 64, 11, and 74, the external connection terminals 13 to 15 provided on the support body 4 serve as connection portions with the outside. Therefore, it is possible to prevent the solder erosion phenomenon of the lead electrodes 64, 11, 74 which are derived from the vibrating portions 6, 7 and are made of a thin film. External connection terminals 13 to 15 of the support 4
Can be formed as a thick film, so the effect of solder erosion can be substantially ignored. In addition, the front cover 21 has a hollow layer 21.
Since the side end surface 210 of 1 moves backward from one surface side to the other surface side, the thickness seen on the side end surface of the piezoelectric substrate 1 is zero,
The stress is dispersed according to the receding of the side end surface 210, and as shown in FIG. 8, the conventional characteristics S11, S12 to S21,
It decreases as in S22. Moreover, even if the side end surface of the piezoelectric substrate 1 is chipped, damaged, or cracked, it can be kept within the interval d of the region where the thickness of the front cover 21 is zero so as not to enter the contact interface. it can. Therefore, due to the thermal shock test, the thermal cycle test, the temperature variation during use, or the like, thermal stress caused by the difference in the linear expansion coefficient was generated between the cavity layer 21 forming the front cover 2 and the piezoelectric substrate 1. Even in the case, cracks occur at the contact interface between the piezoelectric substrate 1 and the front cover 2,
Peeling is less likely to occur and reliability is improved. FIG. 9 is data showing the thermal shock test results. In FIG. 9, the vertical axis represents the cumulative defective rate (%), and the horizontal axis represents the number of thermal cycles. L1 is the characteristic of the conventional piezoelectric component (conventional product), L
2 shows the characteristics of the piezoelectric component (product of the present invention) according to the present invention. In the thermal shock test, 80 samples were prepared for both the conventional product and the product of the present invention, and the sample was added at -55 ° C for 30 minutes, +1.
100 cycles of thermal shock at 25 ° C. for 30 minutes as one cycle were applied. As shown in FIG. 9, in the conventional product, a defect rate of about 14% at 20 cycles, about 19% at 50 cycles, and about 25% at 100 cycles occurred.
Almost no defective products are produced even in 00 cycles.

【発明の効果】以上述べたように、本発明によれば、次
のような効果が得られる。 （ａ）圧電基板は、表電極が圧電基板を表裏方向に通る
導体によって裏面側に設けられたリード電極と導通し、
裏電極が裏面側に設けられた他のリード電極と導通して
おり、支持体は外面に外部接続端子を有し、外部接続端
子がリード電極に導通しているから、従来と異なって、
金属薄板でなるキャップ状端子が不要で、部品点数が少
なく、電極取出構造が簡単で、キャップ状端子の反り、
破損等による信頼性低下を招くことのない圧電部品を提
供できる。 （ｂ）支持体は、外面に外部接続端子を有し、外部接続
端子がリード電極に導通しているから、振動部から導出
されているリード電極の半田食われ現象等を防止し得る
高信頼の圧電部品を提供できる。 （ｃ）表カバーは、側端面が一面側から他面側に向って
後退し、圧電基板の側端面上で見た厚みが零となってい
るから、熱衝撃試験、熱サイクル試験または使用時の温
度変動等に伴って、表カバー及び圧電基板の間に線膨張
係数の差に起因する熱応力が発生した場合でも、圧電基
板と表カバーとの接触界面に亀裂、剥離等が生じにく
く、信頼性の高い圧電部品を提供できる。As described above, according to the present invention, the following effects can be obtained. (A) In the piezoelectric substrate, the front electrode is electrically connected to the lead electrode provided on the back surface side by the conductor passing through the piezoelectric substrate in the front and back directions,
Since the back electrode is electrically connected to the other lead electrode provided on the back surface side, the support has an external connection terminal on the outer surface, and the external connection terminal is electrically connected to the lead electrode, unlike the conventional case,
Cap-shaped terminals made of thin metal plate are unnecessary, the number of parts is small, the electrode extraction structure is simple, and the warp of the cap-shaped terminals
It is possible to provide a piezoelectric component that does not reduce reliability due to damage or the like. (B) The support has an external connection terminal on the outer surface, and the external connection terminal is electrically connected to the lead electrode, so that the lead electrode led out from the vibrating portion can be prevented from being eroded by solder and the like. It is possible to provide the piezoelectric component. (C) Since the side end surface of the front cover recedes from one surface side to the other surface side, and the thickness seen on the side end surface of the piezoelectric substrate is zero, a thermal shock test, a heat cycle test, or a use is performed. Due to temperature fluctuations and the like, even when thermal stress due to a difference in linear expansion coefficient occurs between the front cover and the piezoelectric substrate, cracks or peeling at the contact interface between the piezoelectric substrate and the front cover hardly occur, A highly reliable piezoelectric component can be provided.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明に係る圧電部品の分解斜視図である。FIG. 1 is an exploded perspective view of a piezoelectric component according to the present invention.

【図２】本発明に係る圧電部品の部分破断斜視図であ
る。FIG. 2 is a partially cutaway perspective view of a piezoelectric component according to the present invention.

【図３】本発明に係る圧電部品の正面部分断面図であ
る。FIG. 3 is a front partial cross-sectional view of a piezoelectric component according to the present invention.

【図４】本発明に係る圧電部品の正面断面図である。FIG. 4 is a front sectional view of a piezoelectric component according to the present invention.

【図５】図３のＡ１ーＡ１線上における断面図である。5 is a cross-sectional view taken along the line A1-A1 of FIG.

【図６】図３のＡ２ーＡ２線上における断面図である。6 is a cross-sectional view taken along the line A2-A2 of FIG.

【図７】本発明に係る圧電部品の他の実施例における正
面断面図である。FIG. 7 is a front sectional view of another embodiment of the piezoelectric component according to the present invention.

【図８】本発明に係る圧電部品の作用を説明する図であ
る。FIG. 8 is a diagram illustrating the operation of the piezoelectric component according to the present invention.

【図９】圧電部品の熱衝撃テスト結果をグラフ化して示
す図である。FIG. 9 is a graph showing a result of a thermal shock test of a piezoelectric component.

【符号の説明】[Explanation of symbols]

１ 圧電基板 ６、７ 振動部 ６１、７１ 表電極 ６２、７２、６３、７３ 裏電極 ６４、７４ リード電極 ２ 表カバー ２１０ 側端面 ３ 裏カバー ４ 支持体 ８、１１ リード電極 １２ 導体 DESCRIPTION OF SYMBOLS 1 Piezoelectric substrate 6, 7 Vibrating part 61, 71 Front electrode 62, 72, 63, 73 Back electrode 64, 74 Lead electrode 2 Front cover 210 Side end face 3 Back cover 4 Support body 8, 11 Lead electrode 12 Conductor

【手続補正書】[Procedure amendment]

【提出日】平成４年１１月１９日[Submission date] November 19, 1992

【手続補正１】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】請求項５[Name of item to be corrected] Claim 5

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【手続補正２】[Procedure Amendment 2]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】発明の詳細な説明[Name of item to be amended] Detailed explanation of the invention

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、例えばフィルタ、共振
子または発振子等として使用される圧電部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric component used as, for example, a filter, a resonator or an oscillator.

【０００２】[0002]

【従来の技術】この種の圧電部品として、従来技術文献
としては、特開平２ー１８０４１７号公報等が知られて
いる。この従来技術では、圧電基板の表面及び裏面に積
層される表カバー及び裏カバーのそれぞれが空洞層と封
止層とを含み、空洞層が振動部に対応する部分に空洞部
を有して圧電基板に密着している。圧電基板は圧電磁器
材料で構成され、表カバー及び裏カバーは絶縁性の合成
樹脂によって構成されている。2. Description of the Related Art As a piezoelectric component of this type, Japanese Patent Application Laid-Open No. 2-180417 is known as a prior art document. In this conventional technique, each of the front cover and the back cover laminated on the front surface and the back surface of the piezoelectric substrate includes a cavity layer and a sealing layer, and the cavity layer has a cavity portion at a portion corresponding to the vibrating portion. It adheres to the substrate. The piezoelectric substrate is made of a piezoelectric ceramic material, and the front cover and the back cover are made of insulating synthetic resin.

【０００３】[0003]

【発明が解決しようとする課題】しかしながら、上述し
た従来技術には、次のような問題点があった。 （Ａ）バネ性金属薄板を用いたキャップ状端子金具を装
着し、この端子金具を振動電極に導通するリード電極に
導通させる構造であったため、部品点数が多くなるこ
と、表カバー及び端子金具の両者において、振動部と端
子金具とを接続するための構造が複雑になること、実装
状態において端子金具が半田付け応力等の外力の影響を
受けて反りや破損等を発生し易い等の問題点がある。 （Ｂ）上述した問題点を解決する手段として、例えば先
に提案された特願平３ー１２６６１６号に開示されるご
とく、電極構造に工夫を加える等して、端子金具を省略
した構造をとることが考えられる。しかしながら、圧電
基板が磁器材料で構成されるのに対し、表カバーが合成
樹脂で構成されるため、圧電基板と表カバーとは線膨張
係数が異る。例えば、圧電基板の線膨張係数は（−１０
〜＋１０）×１０-6であるが、樹脂は（２０〜１００）
×１０-6であり、著しく異なる。このため、端子金具等
の支持固定手段がない構造では、熱衝撃試験、熱サイク
ル試験または使用時の温度変動等に伴って、圧電基板と
表カバーの線膨張係数の差に起因して発生する熱応力に
より、表カバーと圧電基板との接触界面に亀裂、剥離等
を生じてしまうという問題点があることがわかった。 （Ｃ）この種の圧電部品は、ウエハー状圧電基板の上に
多数の圧電素子を形成した後、圧電基板を切断して各圧
電素子毎に分離する工程を経て取出される。ところが、
圧電基板が磁器材料で構成されるのに対し、表カバーが
合成樹脂で構成されるため、切断工程において、圧電基
板と表カバーとが接触する切断面に、欠けや、割れを生
じ易い。このため、圧電基板と表カバーとの接触面に亀
裂や剥離が一層生じ易くなる。However, the above-mentioned prior art has the following problems. (A) Since the cap-shaped terminal fitting using the thin spring metal plate is mounted and the terminal fitting is electrically connected to the lead electrode that is electrically connected to the vibrating electrode, the number of parts is increased and the front cover and the terminal fitting are In both cases, the structure for connecting the vibrating part and the terminal fitting is complicated, and the terminal fitting is susceptible to warping or breakage under the influence of external force such as soldering stress in the mounted state. There is. (B) As a means for solving the above-mentioned problems, for example, as disclosed in Japanese Patent Application No. 3-126616 previously proposed, the electrode structure is modified so that the terminal metal fitting is omitted. It is possible. However, since the piezoelectric substrate is made of a porcelain material and the front cover is made of synthetic resin, the piezoelectric substrate and the front cover have different linear expansion coefficients. For example, the linear expansion coefficient of the piezoelectric substrate is (-10
~ + 10) × 10 -6 , but the resin is (20-100)
× 10 −6, which is significantly different. For this reason, in a structure without a supporting and fixing means such as a terminal fitting, it occurs due to the difference in the linear expansion coefficient between the piezoelectric substrate and the front cover due to a thermal shock test, a thermal cycle test, or a temperature change during use. It has been found that there is a problem that cracks, peeling, etc. occur at the contact interface between the front cover and the piezoelectric substrate due to thermal stress. (C) This type of piezoelectric component is taken out after a process of forming a large number of piezoelectric elements on a wafer-shaped piezoelectric substrate and then cutting the piezoelectric substrate to separate each piezoelectric element. However,
Since the piezoelectric substrate is made of a porcelain material, while the front cover is made of synthetic resin, a cut surface at which the piezoelectric substrate and the front cover come into contact with each other is easily chipped or cracked in the cutting step. Therefore, cracks and peeling are more likely to occur on the contact surface between the piezoelectric substrate and the front cover.

【０００４】そこで、本発明の課題は上述する従来の問
題点を解決し、部品点数が少なく、構造が簡単で、亀
裂、剥離等の生じにくい高信頼度の圧電部品を提供する
ことである。Therefore, an object of the present invention is to solve the above-mentioned conventional problems, and to provide a highly reliable piezoelectric component having a small number of components, a simple structure, and less likely to cause cracking or peeling.

【０００５】[0005]

【課題を解決するための手段】上述した課題解決のた
め、本発明は、圧電基板と、表カバーと、裏カバーと、
これらを支持する支持体とを有する圧電部品であって、
前記圧電基板は、振動部を有し、前記振動部が表面及び
裏面に互いに対向して配置された表電極及び裏電極を含
んでおり、前記支持体は、外面に外部接続を有し、前記
外部接続端子が前記表電極及び裏電極から導かれたリー
ド電極と導通しており、前記表カバー及び裏カバーは、
厚み方向の一面側に空洞部を有し、前記一面側が前記圧
電基板の表面及び裏面に重ねられて接着され、前記空洞
部が振動部の周りに振動空間を形成しており、前記表カ
バーは、側端面が前記一面側から他面側に向って後退
し、前記圧電基板の側端面上で見た厚みが零となってい
ることを特徴とする。To solve the above problems, the present invention provides a piezoelectric substrate, a front cover, a back cover,
A piezoelectric component having a support for supporting these,
The piezoelectric substrate has a vibrating portion, the vibrating portion includes a front electrode and a back electrode arranged on the front surface and the back surface facing each other, the support has an external connection on the outer surface, The external connection terminal is in conduction with the lead electrode led from the front electrode and the back electrode, the front cover and the back cover,
A cavity portion is provided on one surface side in the thickness direction, the one surface side is overlapped and adhered to the front surface and the back surface of the piezoelectric substrate, and the cavity portion forms a vibration space around the vibration portion, and the front cover is The side end face recedes from the one face side toward the other face side, and the thickness of the piezoelectric substrate viewed on the side end face is zero.

【０００６】[0006]

【作用】圧電基板は振動部が表面及び裏面に互いに対向
して配置された表電極及び裏電極を含んでおり、表カバ
ー及び裏カバーは一面側に空洞部を有し一面側が圧電基
板の表面及び裏面に重ねられて接着され、空洞部が振動
部の周りに振動空間を形成しているから、空洞部によっ
て必要な振動空間を確保した圧電部品が得られる。The piezoelectric substrate includes a front electrode and a back electrode whose vibrating portions are arranged on the front surface and the back surface of the piezoelectric substrate so as to face each other. The front cover and the back cover have a cavity on one surface side and the one surface side is the front surface of the piezoelectric substrate. Also, since the cavity part forms a vibration space around the vibrating part by being laminated and adhered to the back surface, a piezoelectric component in which a necessary vibration space is secured by the cavity part is obtained.

【０００７】圧電基板は、振動部が表面及び裏面に互い
に対向して配置された表電極及び裏電極を含んでおり、
支持体は外面に外部接続を有し外部接続端子が表電極及
び裏電極から導かれたリード電極と導通しているから、
従来と異なって、金属薄板でなるキャップ状端子金具が
不要である。このため、部品点数が少なくなると共に、
振動部取出構造が簡単になる。キャップ状端子金具が不
要であるために、キャップ状端子金具の反り、破損等に
よる信頼性低下を招くこともない。更に、支持体に設け
られた外部接続端子を利用して外部回路と接続できる。
このため、振動電極から導出されているリード電極の半
田食われ現象等を防止できる。支持体の外部接続端子
は、厚膜として形成できるから、半田食われの影響は実
質的に無視できる。The piezoelectric substrate includes a front electrode and a back electrode whose vibrating portions are arranged on the front surface and the back surface so as to face each other,
Since the support has an external connection on the outer surface and the external connection terminal is electrically connected to the lead electrodes led from the front electrode and the back electrode,
Unlike the conventional case, the cap-shaped terminal fitting made of a thin metal plate is unnecessary. Therefore, the number of parts is reduced and
The vibrating part extraction structure becomes simple. Since the cap-shaped terminal fitting is unnecessary, the reliability of the cap-shaped terminal fitting is not deteriorated due to warping or damage. Further, it can be connected to an external circuit by using an external connection terminal provided on the support.
Therefore, it is possible to prevent the phenomenon of solder erosion of the lead electrode led out from the vibrating electrode. Since the external connection terminal of the support can be formed as a thick film, the influence of solder erosion can be substantially ignored.

【０００８】表カバーは、側端面が前記一面側から他面
側に向って後退し、圧電基板の側端面上で見た厚みが零
となっているから、発生する熱応力が表カバーの側端面
の後退に対応して分散され、接触界面における応力が低
下する。また、圧電基板の側端面に仮に欠け、破損、亀
裂が生じていても、これらを表カバーの厚みが零である
領域内に留め、両者の接触界面に入らないようにするこ
とができる。このため、熱衝撃試験、熱サイクル試験ま
たは使用時の温度変動等に伴って、表カバー及び圧電基
板の間に線膨張係数の差に起因する熱応力が発生した場
合でも、圧電基板と表カバーとの接触界面に亀裂、剥離
等が生じにくくなり、信頼性が向上する。Since the side end surface of the front cover recedes from the one surface side toward the other surface side, and the thickness seen on the side end surface of the piezoelectric substrate is zero, the generated thermal stress is the side of the front cover. The stress is dispersed corresponding to the receding of the end face, and the stress at the contact interface is reduced. Further, even if the side end surface of the piezoelectric substrate is chipped, broken, or cracked, these can be kept in the region where the thickness of the front cover is zero so as not to enter the contact interface between them. Therefore, even if thermal stress due to the difference in linear expansion coefficient occurs between the front cover and the piezoelectric substrate due to thermal shock test, thermal cycle test, or temperature fluctuation during use, etc. Cracks and peeling are less likely to occur at the contact interface with and reliability is improved.

【０００９】[0009]

【実施例】図１は本発明に係る圧電部品の分解斜視図、
図２は同じく組立状態での斜視図、図３は同じく正面部
分断面図、図４は同じく正面断面図、図５は図３のＡ１
ーＡ１線上における断面図、図６は図３のＡ２ーＡ２線
上における断面図である。１は圧電基板、２は表カバ
ー、３は裏カバー、４は支持体、５は接着剤層である。FIG. 1 is an exploded perspective view of a piezoelectric component according to the present invention,
2 is a perspective view in the same assembled state, FIG. 3 is a front partial sectional view of the same, FIG. 4 is a front sectional view of the same, and FIG. 5 is A1 of FIG.
6 is a sectional view taken along line A1-A1 and FIG. 6 is a sectional view taken along line A2-A2 in FIG. Reference numeral 1 is a piezoelectric substrate, 2 is a front cover, 3 is a back cover, 4 is a support, and 5 is an adhesive layer.

【００１０】圧電基板１は、振動部６、７を有する。各
振動部６、７は、圧電基板１の表面及び裏面に互いに対
向するように形成された表電極６１、７１及び裏電極
（６２、６３）、（７２、７３）を備えている。表電極
６１、７１は、リード電極８に共通に接続されている。
リード電極８には圧電基板１の両面に設けたコンデンサ
電極９も導通させてある。The piezoelectric substrate 1 has vibrating portions 6 and 7. Each vibrating section 6, 7 includes front electrodes 61, 71 and back electrodes (62, 63), (72, 73) formed on the front surface and the back surface of the piezoelectric substrate 1 so as to face each other. The front electrodes 61 and 71 are commonly connected to the lead electrode 8.
Capacitor electrodes 9 provided on both surfaces of the piezoelectric substrate 1 are also electrically connected to the lead electrodes 8.

【００１１】裏電極６２、７２は、コンデンサ電極９と
対向するコンデンサ電極１０を介して互いに導通接続さ
れており、裏電極６３、７３は、圧電基板１に形成され
たリード電極６４、７４によって圧電基板１の両隅部の
端部に導かれている。電極配置に関しては、図示とは逆
に、電極（６２、６３）、（７２、７３）を表電極と
し、電極６１、７１を裏電極とするような配置関係をと
ることも可能である。The back electrodes 62 and 72 are electrically connected to each other via the capacitor electrode 10 facing the capacitor electrode 9, and the back electrodes 63 and 73 are piezoelectric by the lead electrodes 64 and 74 formed on the piezoelectric substrate 1. It is guided to the ends of both corners of the substrate 1. Regarding the electrode arrangement, contrary to the illustration, the electrodes (62, 63) and (72, 73) may be used as the front electrodes and the electrodes 61 and 71 may be used as the back electrodes.

【００１２】更に、圧電基板１の裏面側には、表面側の
リード電極８と対向するリード電極１１が設けられてい
る。表面側のリード電極８及び裏面側のリード電極１１
は、圧電基板１を表裏方向に通る導体１２によって互い
に接続されている。導体１２は主振動モードに影響を与
えない位置であって、リード電極８、１１を相互接続で
きる位置であれば、任意の位置が選定できる。図示の導
体１２は圧電基板１に設けられたスルーホール内に、ス
パッタ等の薄膜技術または印刷等のあつ膜技術によって
導体を付着させることによって形成できる。スルーホー
ルは焼成前はグリーンシート打抜き、焼成後はレーザ加
工等によって形成できる。表電極６１、７１、裏電極
（６２、６３）、（７２、７３）及びリード電極６４、
７４、８、１１はスパッタ等の薄膜技術または厚膜技術
によって形成できる。Further, a lead electrode 11 facing the lead electrode 8 on the front surface side is provided on the back surface side of the piezoelectric substrate 1. Lead electrode 8 on the front side and lead electrode 11 on the back side
Are connected to each other by a conductor 12 that passes through the piezoelectric substrate 1 in the front-back direction. The conductor 12 is a position that does not affect the main vibration mode, and any position can be selected as long as it can connect the lead electrodes 8 and 11 to each other. The illustrated conductor 12 can be formed by depositing a conductor in a through-hole provided in the piezoelectric substrate 1 by a thin film technique such as sputtering or a thick film technique such as printing. The through holes can be formed by punching the green sheet before firing and laser processing after firing. Front electrodes 61, 71, back electrodes (62, 63), (72, 73) and lead electrodes 64,
74, 8 and 11 can be formed by a thin film technique such as sputtering or a thick film technique.

【００１３】このように、圧電基板１は、表電極６１、
７１が圧電基板１を表裏方向に通る導体１２によって裏
面側に設けられたリード電極１１と導通し、裏電極６
３、７３が裏面側に設けられたリード電極６４、７４と
導通しているから、表電極６１、７１及び裏電極６３、
７４を同一面である裏面側で引出すことができる。この
ため、振動部６、７の外部引出経路が短くなり、リード
インダクタンスの減少、それに伴う特性向上等の利点が
得られる。As described above, the piezoelectric substrate 1 includes the front electrodes 61,
71 is electrically connected to the lead electrode 11 provided on the back surface side by the conductor 12 passing through the piezoelectric substrate 1 in the front-back direction, and the back electrode 6
Since the electrodes 3 and 73 are electrically connected to the lead electrodes 64 and 74 provided on the back surface side, the front electrodes 61 and 71 and the back electrode 63,
It is possible to pull out 74 on the back surface side, which is the same surface. For this reason, the external lead-out paths of the vibrating portions 6 and 7 are shortened, and advantages such as a reduction in lead inductance and accompanying improvement in characteristics can be obtained.

【００１４】表カバー２は、空洞層２１と封止層２２と
を含み、裏カバー３も同様に、空洞層３１と封止層３２
とを含んでいる。空洞層２１、３１は、振動部６、７に
対応する部分に空洞部（２１１、２１２）、（３１１、
３１２）を有して、圧電基板１に密着させてある。空洞
部（２１１、２１２）、（３１１、３１２）は、振動部
６、７の表電極６１及び裏電極（６２、６３）、（７
２、７３）から外れた位置に、開口部２１３、３１３を
有している。空洞部（２１１、２１２）、（３１１、３
１２）は、表電極６１、７１及び裏電極（６２、６
３）、（７２、７３）で構成される振動部を包囲するよ
うに形成し、その一部を狭い通路を通して、開口部２１
３、３１３に連通させてある。裏カバー３の空洞層３１
及び封止層３２は、リード電極６４、１１及び７４と対
応する位置に、欠落部３１４〜３１６、３２１〜３２３
を設けてある。The front cover 2 includes a cavity layer 21 and a sealing layer 22, and the back cover 3 similarly has a cavity layer 31 and a sealing layer 32.
Includes and. The cavity layers 21 and 31 have cavity portions (211 and 212) and (311) at portions corresponding to the vibrating portions 6 and 7, respectively.
312) and is brought into close contact with the piezoelectric substrate 1. The cavities (211, 212) and (311, 312) are the front electrodes 61 and the back electrodes (62, 63) and (7 of the vibrating sections 6 and 7, respectively.
2, 73) and openings 213 and 313 are provided. Cavities (211, 212), (311, 3)
12) is the front electrodes 61, 71 and the back electrodes (62, 6).
3) and (72, 73) are formed so as to surround the vibrating portion and a part of the vibrating portion is passed through the narrow passage to form the opening 21.
It is connected to 3, 313. Cavity layer 31 of the back cover 3
The sealing layer 32 is provided at the positions corresponding to the lead electrodes 64, 11 and 74 at the missing portions 314 to 316 and 321 to 323.
Is provided.

【００１５】表カバー２を構成する空洞層２１は、側端
面２１０が一面側から他面側に向って後退し、圧電基板
１の側端面上で見た厚みが零となっている。図示の空洞
層２１は、側端面２１０が平面状の傾斜面となってい
て、圧電基板１の側端面との間に間隔ｄが生じるよう
に、圧電基板１の面内に配置されている。側端面２１０
は図４の破線で示す如く、間隔ｄが実質的に零となるよ
うに形成してもよい。側端面２１０は凸もしくは凹状の
弧面、折線状の平面またはこれらの組合せであってもよ
い。更に、図７に示すように、段面としてもよい。In the cavity layer 21 constituting the front cover 2, the side end face 210 recedes from the one face side to the other face side, and the thickness seen on the side end face of the piezoelectric substrate 1 is zero. The illustrated cavity layer 21 is arranged in the plane of the piezoelectric substrate 1 such that the side end face 210 is a flat inclined face and a space d is formed between the side end face 210 and the side end face of the piezoelectric substrate 1. Side end face 210
May be formed so that the distance d becomes substantially zero as shown by the broken line in FIG. The side end surface 210 may be a convex or concave arc surface, a polygonal flat surface, or a combination thereof. Furthermore, as shown in FIG. 7, it may be a step.

【００１６】封止層２２、３２は、絶縁樹脂でなり、空
洞層２１、３１の上に密着し、開口部２１３、３１３を
閉塞している。封止層２２、３２は紫外線硬化型樹脂に
よって形成するのが望ましい。The sealing layers 22 and 32 are made of an insulating resin and adhere to the cavity layers 21 and 31 to close the openings 213 and 313. It is desirable that the sealing layers 22 and 32 be formed of an ultraviolet curable resin.

【００１７】支持体４はアルミナ等のセラミックでな
り、接着層５によって裏カバー３を構成する封止層３２
の表面に接着されている。支持体４は裏カバー３側に備
えられている。支持体４の一端縁には、表カバー２の空
洞層２１と、裏カバー３の空洞層３１及び封止層３２の
端縁に設けられた欠落部３１４〜３１６、３２１〜３２
３に対応する欠落部４１〜４３を設けてある。欠落部４
１〜４３の内部及びその周辺部には、外部接続端子１３
〜１５が被着されている。外部接続端子１３〜１５は厚
膜形成技術、メッキ技術またはその組合せによって形成
する。The support 4 is made of a ceramic such as alumina, and the adhesive layer 5 forms the sealing layer 32 constituting the back cover 3.
Is glued to the surface of. The support 4 is provided on the back cover 3 side. At one edge of the support body 4, the cavity layer 21 of the front cover 2 and the missing portions 314 to 316, 321 to 32 provided at the edges of the cavity layer 31 and the sealing layer 32 of the back cover 3.
The missing portions 41 to 43 corresponding to No. 3 are provided. Missing part 4
External connection terminals 13 are provided inside and around 1 to 43.
~ 15 are applied. The external connection terminals 13 to 15 are formed by a thick film forming technique, a plating technique or a combination thereof.

【００１８】組立に当って、支持体１４の上に裏カバー
３、圧電基板１及び表カバー２の積層体を、接着層５を
介して積層一体化する。圧電基板１の裏面側に設けられ
たリード電極６４、１１及び７４は、裏カバー３の空洞
層３１及び封止層３２の端縁に設けられた欠落部３１４
〜３１６、３２１〜３２３を介して、支持体４の欠落部
４１〜４３の周辺に設けられた外部接続端子１３〜１５
と対向するように配置する。そして、欠落部３１４〜３
１６、３２１〜３２３、欠落部４１〜４３に導電塗料等
による導電剤１６〜１８（図２参照）を塗布し、リード
電極６４、１１及び７４を外部接続端子１３〜１５に導
通接続させる。In assembly, a laminated body of the back cover 3, the piezoelectric substrate 1 and the front cover 2 is laminated and integrated on the support body 14 with the adhesive layer 5 interposed therebetween. The lead electrodes 64, 11 and 74 provided on the back surface side of the piezoelectric substrate 1 include the missing portions 314 provided on the edges of the cavity layer 31 and the sealing layer 32 of the back cover 3.
To 316 and 321 to 323, the external connection terminals 13 to 15 are provided around the missing portions 41 to 43 of the support body 4.
It is placed so as to face with. And the missing parts 314-3
Conductive agents 16 to 18 (see FIG. 2) such as conductive paint are applied to 16, 321 to 323 and the missing portions 41 to 43 to electrically connect the lead electrodes 64, 11 and 74 to the external connection terminals 13 to 15.

【００１９】上述のように、表電極６１、７１が圧電基
板１を表裏方向に通る導体１２によって裏面側に設けら
れたリード電極１１と導通し、裏電極６３、７３が裏面
側に設けられた他のリード電極６４、７４と導通してお
り、支持体４は外面に外部接続端子１３〜１５を有し、
外部接続端子１３〜１５がリード電極６４、１１、７４
に導通しているから、従来と異なって、金属薄板でなる
キャップ状端子金具が不要である。このため、部品点数
が少なくなると共に、振動部取出構造が簡単になる。キ
ャップ状端子金具が不要であるために、キャップ状端子
金具の反り、破損等による信頼性低下を招くことがな
い。As described above, the front electrodes 61 and 71 are electrically connected to the lead electrode 11 provided on the back surface side by the conductor 12 passing through the piezoelectric substrate 1 in the front and back directions, and the back electrodes 63 and 73 are provided on the back surface side. It is electrically connected to the other lead electrodes 64 and 74, and the support body 4 has external connection terminals 13 to 15 on its outer surface.
The external connection terminals 13 to 15 are lead electrodes 64, 11, and 74.
Unlike the conventional case, the cap-shaped terminal fitting made of a thin metal plate is unnecessary because it is electrically connected to. For this reason, the number of parts is reduced, and the structure for extracting the vibrating portion is simplified. Since the cap-shaped terminal fitting is unnecessary, the reliability of the cap-shaped terminal fitting is not deteriorated due to warping or damage.

【００２０】しかも、支持体４は、外面に外部接続端子
１３〜１５を有し、外部接続端子１３〜１５がリード電
極６４、１１、７４に導通しているから、支持体４に設
けられた外部接続端子１３〜１５が外部との接続部分と
なる。このため、振動部６、７から導出され薄膜で構成
されているリード電極６４、１１、７４の半田食われ現
象等を防止できる。支持体４の外部接続端子１３〜１５
は、厚膜として形成できるから、半田食われの影響は実
質的に無視できる。Moreover, since the support 4 has the external connection terminals 13 to 15 on the outer surface thereof and the external connection terminals 13 to 15 are electrically connected to the lead electrodes 64, 11, 74, the support 4 is provided on the support 4. The external connection terminals 13 to 15 serve as connection parts with the outside. Therefore, it is possible to prevent the solder erosion phenomenon of the lead electrodes 64, 11, 74 which are derived from the vibrating portions 6, 7 and are made of a thin film. External connection terminals 13 to 15 of the support 4
Can be formed as a thick film, so the effect of solder erosion can be substantially ignored.

【００２１】また、表カバー２１は、空洞層２１の側端
面２１０が一面側から他面側に向って後退し、圧電基板
１の側端面上で見た厚みが零となっているから、応力が
側端面２１０の後退に対応して分散され、図８に示す如
く、従来の特性Ｓ１１、Ｓ１２から特性Ｓ２１、Ｓ２２
のように低下する。しかも、圧電基板１の側端面に仮に
欠け、破損、亀裂が生じていても、これらを表カバー２
１の厚みが零である領域の間隔ｄ内に留め、接触界面に
入らないようにすることができる。Further, in the front cover 21, the side end surface 210 of the cavity layer 21 recedes from one surface side to the other surface side, and the thickness as seen on the side end surface of the piezoelectric substrate 1 becomes zero. Are dispersed according to the retreat of the side end face 210, and as shown in FIG. 8, the characteristics S11 and S12 from the conventional characteristics S21 and S22 are dispersed.
To fall. Moreover, even if the side end surface of the piezoelectric substrate 1 is chipped, damaged, or cracked, these should be covered by the front cover 2
It can be kept within the interval d of the region where the thickness of 1 is zero so as not to enter the contact interface.

【００２２】このため、熱衝撃試験、熱サイクル試験ま
たは使用時の温度変動等に伴って、表カバー２を構成す
る空洞層２１及び圧電基板１の間に線膨張係数の差に起
因する熱応力が発生した場合でも、圧電基板１と表カバ
ー２との接触界面に亀裂、剥離等が生じにくくなり、信
頼性が向上する。図９は熱衝撃テスト結果を示すデータ
である。図９において、縦軸に累積不良率（％）をと
り、横軸に熱サイクル数をとってある。Ｌ１は従来の圧
電部品（従来品）の特性、Ｌ２は本発明に係る圧電部品
（本発明品）の特性を示している。熱衝撃テストに当っ
ては、従来品及び本発明品とも８０個のサンプルを用意
し、−５５℃で３０分、＋１２５℃で３０分を１サイク
ルとする熱衝撃を１００サイクル加えた。図９に示すよ
うに、従来品では、２０サイクルで約１４％、５０サイ
クルで約１９％、１００サイクルで約２５％の不良率を
生じているが、本発明では１００サイクルでも殆ど不良
品を生じない。Therefore, due to a thermal shock test, a thermal cycle test, temperature fluctuations during use, or the like, thermal stress caused by a difference in coefficient of linear expansion between the cavity layer 21 forming the front cover 2 and the piezoelectric substrate 1. Even if occurs, cracks, peeling, and the like are less likely to occur at the contact interface between the piezoelectric substrate 1 and the front cover 2, and reliability is improved. FIG. 9 is data showing the thermal shock test results. In FIG. 9, the vertical axis represents the cumulative defective rate (%), and the horizontal axis represents the number of thermal cycles. L1 shows the characteristics of the conventional piezoelectric component (conventional product), and L2 shows the characteristics of the piezoelectric component according to the present invention (present invention product). In the thermal shock test, 80 samples were prepared for both the conventional product and the product of the present invention, and 100 cycles of thermal shock were performed, each cycle consisting of 30 minutes at -55 ° C and 30 minutes at + 125 ° C. As shown in FIG. 9, with the conventional product, a defective rate of about 14% at 20 cycles, about 19% at 50 cycles, and about 25% at 100 cycles occurred. Does not happen.

【００２３】[0023]

【発明の効果】以上述べたように、本発明によれば、次
のような効果が得られる。 （ａ）圧電基板は、表電極が圧電基板を表裏方向に通る
導体によって裏面側に設けられたリード電極と導通し、
裏電極が裏面側に設けられた他のリード電極と導通して
おり、支持体は外面に外部接続端子を有し、外部接続端
子がリード電極に導通しているから、従来と異なって、
金属薄板でなるキャップ状端子が不要で、部品点数が少
なく、電極取出構造が簡単で、キャップ状端子の反り、
破損等による信頼性低下を招くことのない圧電部品を提
供できる。 （ｂ）支持体は、外面に外部接続端子を有し、外部接続
端子がリード電極に導通しているから、振動部から導出
されているリード電極の半田食われ現象等を防止し得る
高信頼の圧電部品を提供できる。 （ｃ）表カバーは、側端面が一面側から他面側に向って
後退し、圧電基板の側端面上で見た厚みが零となってい
るから、熱衝撃試験、熱サイクル試験または使用時の温
度変動等に伴って、表カバー及び圧電基板の間に線膨張
係数の差に起因する熱応力が発生した場合でも、圧電基
板と表カバーとの接触界面に亀裂、剥離等が生じにく
く、信頼性の高い圧電部品を提供できる。As described above, according to the present invention, the following effects can be obtained. (A) In the piezoelectric substrate, the front electrode is electrically connected to the lead electrode provided on the back surface side by the conductor passing through the piezoelectric substrate in the front and back directions,
Since the back electrode is electrically connected to the other lead electrode provided on the back surface side, the support has an external connection terminal on the outer surface, and the external connection terminal is electrically connected to the lead electrode, unlike the conventional case,
Cap-shaped terminals made of thin metal plate are unnecessary, the number of parts is small, the electrode extraction structure is simple, and the warp of the cap-shaped terminals
It is possible to provide a piezoelectric component that does not reduce reliability due to damage or the like. (B) The support has an external connection terminal on the outer surface, and the external connection terminal is electrically connected to the lead electrode, so that the lead electrode led out from the vibrating portion can be prevented from being eroded by solder and the like. It is possible to provide the piezoelectric component. (C) Since the side end surface of the front cover recedes from one surface side to the other surface side, and the thickness seen on the side end surface of the piezoelectric substrate is zero, a thermal shock test, a heat cycle test, or a use is performed. Due to temperature fluctuations and the like, even when thermal stress due to a difference in linear expansion coefficient occurs between the front cover and the piezoelectric substrate, cracks or peeling at the contact interface between the piezoelectric substrate and the front cover hardly occur, A highly reliable piezoelectric component can be provided.

Claims (5)

【特許請求の範囲】[Claims] 【請求項１】 圧電基板と、表カバーと、裏カバーと、
これらを支持する支持体とを有する圧電部品であって、 前記圧電基板は、振動部を有し、前記振動部が表面及び
裏面に互いに対向して配置された表電極及び裏電極を含
んでおり、 前記支持体は、外面に外部接続を有し、前記外部接続端
子が前記表電極及び裏電極から導かれたリード電極と導
通しており、 前記表カバー及び裏カバーは、厚み方向の一面側に空洞
部を有し、前記一面側が前記圧電基板の表面及び裏面に
重ねられて接着され、前記空洞部が振動部の周りに振動
空間を形成しており、 前記表カバーは、側端面が前記一面側から他面側に向っ
て後退し、前記圧電基板の側端面上で見た厚みが零とな
っていることを特徴とする圧電部品。1. A piezoelectric substrate, a front cover, a back cover,
A piezoelectric component having a support for supporting these, wherein the piezoelectric substrate has a vibrating portion, and the vibrating portion includes a front electrode and a back electrode arranged on the front surface and the back surface so as to face each other. The support has an external connection on an outer surface, the external connection terminal is electrically connected to a lead electrode led from the front electrode and the back electrode, and the front cover and the back cover are one surface side in a thickness direction. A cavity portion, the one surface side is overlapped and adhered to the front surface and the back surface of the piezoelectric substrate, the cavity portion forms a vibrating space around the vibrating portion, the front cover, the side end surface is the A piezoelectric component, which is retracted from one surface side to the other surface side and has a thickness of zero on the side end surface of the piezoelectric substrate. 【請求項２】 前記表カバーは、前記側端面が傾斜面を
含むことを特徴とする請求項１に記載の圧電部品。2. The piezoelectric component according to claim 1, wherein the front end of the front cover includes an inclined surface. 【請求項３】 前記表カバーは、前記側端面が段部を含
むことを特徴とする請求項１または２に記載の圧電部
品。3. The piezoelectric component according to claim 1, wherein the front end surface of the front cover includes a step portion. 【請求項４】 前記表電極は、前記圧電基板を表裏方向
に通る導体によって裏面側に設けられたリード電極と導
通しており、 前記裏電極は、裏面側に設けられた他のリード電極と導
通していることを特徴とする請求項１、２または３に記
載の圧電部品。4. The front electrode is electrically connected to a lead electrode provided on the back surface side by a conductor passing through the piezoelectric substrate in the front and back directions, and the back electrode is connected to another lead electrode provided on the back surface side. The piezoelectric component according to claim 1, 2 or 3, which is electrically connected. 【請求項５】 前記表カバー及び裏カバーのそれぞれ
は、空洞層と封止層とを含み、前記空洞層が前記空洞部
を有し、前記空洞部が前記表電極及び前記裏電極から外
れた位置に開口部を有し、前記封止層が前記空洞層の上
に密着し前記開口部を閉塞していることを特徴とする請
求項１、２、３または４に記載の圧電部品。5. The front cover and the back cover each include a cavity layer and a sealing layer, the cavity layer has the cavity, and the cavity is separated from the front electrode and the back electrode. The piezoelectric component according to claim 1, 2, 3 or 4, wherein an opening is provided at a position, and the sealing layer is in close contact with the cavity layer to close the opening.
JP32950691A 1991-11-18 1991-11-18 Piezoelectric component Withdrawn JPH05145366A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32950691A JPH05145366A (en) 1991-11-18 1991-11-18 Piezoelectric component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32950691A JPH05145366A (en) 1991-11-18 1991-11-18 Piezoelectric component

Publications (1)

Publication Number Publication Date
JPH05145366A true JPH05145366A (en) 1993-06-11

Family

ID=18222138

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32950691A Withdrawn JPH05145366A (en) 1991-11-18 1991-11-18 Piezoelectric component

Country Status (1)

Country Link
JP (1) JPH05145366A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11312945A (en) * 1998-04-27 1999-11-09 Tdk Corp Piezoelectric parts
JP2006050537A (en) * 2004-06-29 2006-02-16 Kyocera Corp Piezoelectric resonator
WO2007026428A1 (en) * 2005-08-31 2007-03-08 Kyocera Corporation Piezoelectric resonator

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11312945A (en) * 1998-04-27 1999-11-09 Tdk Corp Piezoelectric parts
JP2006050537A (en) * 2004-06-29 2006-02-16 Kyocera Corp Piezoelectric resonator
WO2007026428A1 (en) * 2005-08-31 2007-03-08 Kyocera Corporation Piezoelectric resonator
US7893600B2 (en) 2005-08-31 2011-02-22 Kyocera Corporation Piezoelectric resonator

Similar Documents

Publication Publication Date Title
JPS627214A (en) Electrostatically sealed piezo-electric apparatus
TW201521359A (en) Surface mounting quartz crystal unit
JP2000223359A (en) Ceramic electronic component
JPS6196812A (en) Electronic component
JP2014150333A (en) Piezoelectric component
JPH0575372A (en) Piezoelectric resonator and its manufacture
JPH05145366A (en) Piezoelectric component
KR100245381B1 (en) Electronic component
JPH05145365A (en) Piezoelectric component
JPH10308157A (en) Fuse
JP3642432B2 (en) Piezoelectric parts
JPH05145371A (en) Piezoelectric component
JPH066164A (en) Chip type electronic component and manufacture thereof
JP6629660B2 (en) Ceramic package and manufacturing method thereof
JP2000040936A (en) Piezo-resonator, manufacture of the piezo-resonator, piezo resonance component and manufacture of piezo- resonance part
JP2963420B2 (en) Square chip electronic components
JPH07283683A (en) Piezoelectric oscillation piece, piezoelectric vibrator and piezoelectric oscillator
JPH0735450Y2 (en) Electronic parts
JPH07111433A (en) Mounting structure of piezoelectric component
JPH11312945A (en) Piezoelectric parts
JPH08167823A (en) Electronic parts
JPH04293302A (en) Dielectric filter
JPH0216586B2 (en)
JPH07183754A (en) Lead-out electrode structure for piezoelectric parts
JP2000003775A (en) Chip type surge absorber and manufacture thereof

Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19990204