JPH05145366A - Piezoelectric component - Google Patents
Piezoelectric componentInfo
- Publication number
- JPH05145366A JPH05145366A JP32950691A JP32950691A JPH05145366A JP H05145366 A JPH05145366 A JP H05145366A JP 32950691 A JP32950691 A JP 32950691A JP 32950691 A JP32950691 A JP 32950691A JP H05145366 A JPH05145366 A JP H05145366A
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- Japan
- Prior art keywords
- piezoelectric substrate
- electrode
- piezoelectric
- front cover
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【産業上の利用分野】本発明は、例えばフィルタ、共振
子または発振子等として使用される圧電部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric component used as, for example, a filter, a resonator or an oscillator.
【従来の技術】この種の圧電部品として、従来技術文献
としては、特開平2ー180417号公報等が知られて
いる。この従来技術では、圧電基板の表面及び裏面に積
層される表カバー及び裏カバーのそれぞれが空洞層と封
止層とを含み、空洞層が振動部に対応する部分に空洞部
を有して圧電基板に密着している。圧電基板は圧電磁器
材料で構成され、表カバー及び裏カバーは絶縁性の合成
樹脂によって構成されている。 <発明が解決しようとする課題>しかしながら、上述し
た従来技術には、次のような問題点があった。 (A)バネ性金属薄板を用いたキャップ状端子金具を装
着し、この端子金具を振動電極に導通するリード電極に
導通させる構造であったため、部品点数が多くなるこ
と、表カバー及び端子金具の両者において、振動部と端
子金具とを接続するための構造が複雑になること、実装
状態において端子金具が半田付け応力等の外力の影響を
受けて反りや破損等を発生し易い等の問題点がある。 (B)上述した問題点を解決する手段として、例えば先
に提案された特願平3ー126616号に開示されるご
とく、電極構造に工夫を加える等して、端子金具を省略
した構造をとることが考えられる。しかしながら、圧電
基板が磁器材料で構成されるのに対し、表カバーが合成
樹脂で構成されるため、圧電基板と表カバーとは線膨張
係数が異る。例えば、圧電基板の線膨張係数は(−10
〜+10)×10-6であるが、樹脂は(20〜100)
×10-6であり、著しく異なる。このため、端子金具等
の支持固定手段がない構造では、熱衝撃試験、熱サイク
ル試験または使用時の温度変動等に伴って、圧電基板と
表カバーの線膨張係数の差に起因して発生する熱応力に
より、表カバーと圧電基板との接触界面に亀裂、剥離等
を生じてしまうという問題点があることがわかった。 (C)この種の圧電部品は、ウエハー状圧電基板の上に
多数の圧電素子を形成した後、圧電基板を切断して各圧
電素子毎に分離する工程を経て取出される。ところが、
圧電基板が磁器材料で構成されるのに対し、表カバーが
合成樹脂で構成されるため、切断工程において、圧電基
板と表カバーとが接触する切断面に、欠けや、割れを生
じ易い。このため、圧電基板と表カバーとの接触面に亀
裂や剥離が一層生じ易くなる。 そこで、本発明の課題は上述する従来の問題点を解決
し、部品点数が少なく、構造が簡単で、亀裂、剥離等の
生じにくい高信頼度の圧電部品を提供することである。 <課題を解決するための手段>上述した課題解決のた
め、本発明は、圧電基板と、表カバーと、裏カバーと、
これらを支持する支持体とを有する圧電部品であって、
前記圧電基板は、振動部を有し、前記振動部が表面及び
裏面に互いに対向して配置された表電極及び裏電極を含
んでおり、前記支持体は、外面に外部接続を有し、前記
外部接続端子が前記表電極及び裏電極から導かれたリー
ド電極と導通しており、前記表カバー及び裏カバーは、
厚み方向の一面側に空洞部を有し、前記一面側が前記圧
電基板の表面及び裏面に重ねられて接着され、前記空洞
部が振動部の周りに振動空間を形成しており、前記表カ
バーは、側端面が前記一面側から他面側に向って後退
し、前記圧電基板の側端面上で見た厚みが零となってい
ることを特徴とする。 <作用>圧電基板は振動部が表面及び裏面に互いに対向
して配置された表電極及び裏電極を含んでおり、表カバ
ー及び裏カバーは一面側に空洞部を有し一面側が圧電基
板の表面及び裏面に重ねられて接着され、空洞部が振動
部の周りに振動空間を形成しているから、空洞部によっ
て必要な振動空間を確保した圧電部品が得られる。圧電
基板は、振動部が表面及び裏面に互いに対向して配置さ
れた表電極及び裏電極を含んでおり、支持体は外面に外
部接続を有し外部接続端子が表電極及び裏電極から導か
れたリード電極と導通しているから、従来と異なって、
金属薄板でなるキャップ状端子金具が不要である。この
ため、部品点数が少なくなると共に、振動部取出構造が
簡単になる。キャップ状端子金具が不要であるために、
キャップ状端子金具の反り、破損等による信頼性低下を
招くこともない。更に、支持体に設けられた外部接続端
子を利用して外部回路と接続できる。このため、振動電
極から導出されているリード電極の半田食われ現象等を
防止できる。支持体の外部接続端子は、厚膜として形成
できるから、半田食われの影響は実質的に無視できる。
表カバーは、側端面が前記一面側から他面側に向って後
退し、圧電基板の側端面上で見た厚みが零となっている
から、発生する熱応力が表カバーの側端面の後退に対応
して分散され、接触界面における応力が低下する。ま
た、圧電基板の側端面に仮に欠け、破損、亀裂が生じて
いても、これらを表カバーの厚みが零である領域内に留
め、両者の接触界面に入らないようにすることができ
る。このため、熱衝撃試験、熱サイクル試験または使用
時の温度変動等に伴って、表カバー及び圧電基板の間に
線膨張係数の差に起因する熱応力が発生した場合でも、
圧電基板と表カバーとの接触界面に亀裂、剥離等が生じ
にくくなり、信頼性が向上する。2. Description of the Related Art As a piezoelectric component of this type, Japanese Patent Application Laid-Open No. 2-180417 is known as a prior art document. In this conventional technique, each of the front cover and the back cover laminated on the front surface and the back surface of the piezoelectric substrate includes a cavity layer and a sealing layer, and the cavity layer has a cavity portion at a portion corresponding to the vibrating portion. It adheres to the substrate. The piezoelectric substrate is made of a piezoelectric ceramic material, and the front cover and the back cover are made of insulating synthetic resin. <Problems to be Solved by the Invention> However, the above-described conventional techniques have the following problems. (A) Since the cap-shaped terminal fitting using the thin spring metal plate is mounted and the terminal fitting is electrically connected to the lead electrode that is electrically connected to the vibrating electrode, the number of parts is increased and the front cover and the terminal fitting are In both cases, the structure for connecting the vibrating part and the terminal fitting is complicated, and the terminal fitting is susceptible to warping or breakage under the influence of external force such as soldering stress in the mounted state. There is. (B) As a means for solving the above-mentioned problems, for example, as disclosed in Japanese Patent Application No. 3-126616 previously proposed, the electrode structure is modified so that the terminal metal fitting is omitted. It is possible. However, since the piezoelectric substrate is made of a porcelain material and the front cover is made of synthetic resin, the piezoelectric substrate and the front cover have different linear expansion coefficients. For example, the linear expansion coefficient of the piezoelectric substrate is (-10
~ + 10) × 10 -6 , but the resin is (20-100)
× 10 −6, which is significantly different. For this reason, in a structure without a supporting and fixing means such as a terminal fitting, it occurs due to the difference in the linear expansion coefficient between the piezoelectric substrate and the front cover due to a thermal shock test, a thermal cycle test, or a temperature change during use. It has been found that there is a problem that cracks, peeling, etc. occur at the contact interface between the front cover and the piezoelectric substrate due to thermal stress. (C) This type of piezoelectric component is taken out after a process of forming a large number of piezoelectric elements on a wafer-shaped piezoelectric substrate and then cutting the piezoelectric substrate to separate each piezoelectric element. However,
Since the piezoelectric substrate is made of a porcelain material, while the front cover is made of synthetic resin, a cut surface at which the piezoelectric substrate and the front cover come into contact with each other is easily chipped or cracked in the cutting step. Therefore, cracks and peeling are more likely to occur on the contact surface between the piezoelectric substrate and the front cover. Therefore, an object of the present invention is to solve the above-mentioned conventional problems, and to provide a highly reliable piezoelectric component which has a small number of components, a simple structure, and is unlikely to cause cracks or peeling. <Means for Solving the Problems> In order to solve the above problems, the present invention provides a piezoelectric substrate, a front cover, a back cover,
A piezoelectric component having a support for supporting these,
The piezoelectric substrate has a vibrating portion, the vibrating portion includes a front electrode and a back electrode arranged on the front surface and the back surface facing each other, the support has an external connection on the outer surface, The external connection terminal is in conduction with the lead electrode led from the front electrode and the back electrode, the front cover and the back cover,
A cavity portion is provided on one surface side in the thickness direction, the one surface side is overlapped and adhered to the front surface and the back surface of the piezoelectric substrate, and the cavity portion forms a vibration space around the vibration portion, and the front cover is The side end face recedes from the one face side toward the other face side, and the thickness of the piezoelectric substrate viewed on the side end face is zero. <Operation> The piezoelectric substrate includes a front electrode and a back electrode in which the vibrating portion is arranged on the front surface and the back surface so as to face each other. Also, since the cavity part forms a vibration space around the vibrating part by being laminated and adhered to the back surface, a piezoelectric component in which a necessary vibration space is secured by the cavity part is obtained. The piezoelectric substrate includes a front electrode and a back electrode whose vibrating parts are arranged on the front surface and the back surface so as to face each other, the support has an external connection on the outer surface, and an external connection terminal is guided from the front electrode and the back electrode. Since it is electrically connected to the lead electrode, unlike the conventional
There is no need for a cap-shaped terminal fitting made of a thin metal plate. For this reason, the number of parts is reduced, and the structure for extracting the vibrating portion is simplified. Because a cap-shaped terminal fitting is unnecessary,
The reliability of the cap-shaped terminal fitting due to warping or damage is not reduced. Further, it can be connected to an external circuit by using an external connection terminal provided on the support. Therefore, it is possible to prevent the phenomenon of solder erosion of the lead electrode led out from the vibrating electrode. Since the external connection terminal of the support can be formed as a thick film, the influence of solder erosion can be substantially ignored.
Since the side end surface of the front cover recedes from the one surface side to the other surface side and the thickness seen on the side end surface of the piezoelectric substrate is zero, the generated thermal stress causes the side end surface of the front cover to recede. And the stress at the contact interface is reduced. Further, even if the side end surface of the piezoelectric substrate is chipped, broken, or cracked, these can be kept in the region where the thickness of the front cover is zero so as not to enter the contact interface between them. Therefore, even if a thermal stress due to a difference in linear expansion coefficient occurs between the front cover and the piezoelectric substrate due to a thermal shock test, a thermal cycle test, or a temperature change during use,
Cracks and peeling are less likely to occur at the contact interface between the piezoelectric substrate and the front cover, and reliability is improved.
【実施例】図1は本発明に係る圧電部品の分解斜視図、
図2は同じく組立状態での斜視図、図3は同じく正面部
分断面図、図4は同じく正面断面図、図5は図3のA1
ーA1線上における断面図、図6は図3のA2ーA2線
上における断面図である。1は圧電基板、2は表カバ
ー、3は裏カバー、4は支持体、5は接着剤層である。
圧電基板1は、振動部6、7を有する。各振動部6、7
は、圧電基板1の表面及び裏面に互いに対向するように
形成された表電極61、71及び裏電極(62、6
3)、(72、73)を備えている。表電極61、71
は、リード電極8に共通に接続されている。リード電極
8には圧電基板1の両面に設けたコンデンサ電極9も導
通させてある。裏電極62、72は、コンデンサ電極9
と対向するコンデンサ電極10を介して互いに導通接続
されており、裏電極63、73は、圧電基板1に形成さ
れたリード電極64、74によって圧電基板1の両隅部
の端部に導かれている。電極配置に関しては、図示とは
逆に、電極(62、63)、(72、73)を表電極と
し、電極61、71を裏電極とするような配置関係をと
ることも可能である。更に、圧電基板1の裏面側には、
表面側のリード電極8と対向するリード電極11が設け
られている。表面側のリード電極8及び裏面側のリード
電極11は、圧電基板1を表裏方向に通る導体12によ
って互いに接続されている。導体12は主振動モードに
影響を与えない位置であって、リード電極8、11を相
互接続できる位置であれば、任意の位置が選定できる。
図示の導体12は圧電基板1に設けられたスルーホール
内に、スパッタ等の薄膜技術または印刷等のあつ膜技術
によって導体を付着させることによって形成できる。ス
ルーホールは焼成前はグリーンシート打抜き、焼成後は
レーザ加工等によって形成できる。表電極61、71、
裏電極(62、63)、(72、73)及びリード電極
64、74、8、11はスパッタ等の薄膜技術または厚
膜技術によって形成できる。このように、圧電基板1
は、表電極61、71が圧電基板1を表裏方向に通る導
体12によって裏面側に設けられたリード電極11と導
通し、裏電極63、73が裏面側に設けられたリード電
極64、74と導通しているから、表電極61、71及
び裏電極63、74を同一面である裏面側で引出すこと
ができる。このため、振動部6、7の外部引出経路が短
くなり、リードインダクタンスの減少、それに伴う特性
向上等の利点が得られる。表カバー2は、空洞層21と
封止層22とを含み、裏カバー3も同様に、空洞層31
と封止層32とを含んでいる。空洞層21、31は、振
動部6、7に対応する部分に空洞部(211、21
2)、(311、312)を有して、圧電基板1に密着
させてある。空洞部(211、212)、(311、3
12)は、振動部6、7の表電極61及び裏電極(6
2、63)、(72、73)から外れた位置に、開口部
213、313を有している。空洞部(211、21
2)、(311、312)は、表電極61、71及び裏
電極(62、63)、(72、73)で構成される振動
部を包囲するように形成し、その一部を狭い通路を通し
て、開口部213、313に連通させてある。裏カバー
3の空洞層31及び封止層32は、リード電極64、1
1及び74と対応する位置に、欠落部314〜316、
321〜323を設けてある。表カバー2を構成する空
洞層21は、側端面210が一面側から他面側に向って
後退し、圧電基板1の側端面上で見た厚みが零となって
いる。図示の空洞層21は、側端面210が平面状の傾
斜面となっていて、圧電基板1の側端面との間に間隔d
が生じるように、圧電基板1の面内に配置されている。
側端面210は図4の破線で示す如く、間隔dが実質的
に零となるように形成してもよい。側端面210は凸も
しくは凹状の弧面、折線状の平面またはこれらの組合せ
であってもよい。更に、図7に示すように、段面として
もよい。封止層22、32は、絶縁樹脂でなり、空洞層
21、31の上に密着し、開口部213、313を閉塞
している。封止層22、32は紫外線硬化型樹脂によっ
て形成するのが望ましい。支持体4はアルミナ等のセラ
ミックでなり、接着層5によって裏カバー3を構成する
封止層32の表面に接着されている。支持体4は裏カバ
ー3側に備えられている。支持体4の一端縁には、表カ
バー2の空洞層21と、裏カバー3の空洞層31及び封
止層32の端縁に設けられた欠落部314〜316、3
21〜323に対応する欠落部41〜43を設けてあ
る。欠落部41〜43の内部及びその周辺部には、外部
接続端子13〜15が被着されている。外部接続端子1
3〜15は厚膜形成技術、メッキ技術またはその組合せ
によって形成する。組立に当って、支持体14の上に裏
カバー3、圧電基板1及び表カバー2の積層体を、接着
層5を介して積層一体化する。圧電基板1の裏面側に設
けられたリード電極64、11及び74は、裏カバー3
の空洞層31及び封止層32の端縁に設けられた欠落部
314〜316、321〜323を介して、支持体4の
欠落部41〜43の周辺に設けられた外部接続端子13
〜15と対向するように配置する。そして、欠落部31
4〜316、321〜323、欠落部41〜43に導電
塗料等による導電剤16〜18(図2参照)を塗布し、
リード電極64、11及び74を外部接続端子13〜1
5に導通接続させる。上述のように、表電極61、71
が圧電基板1を表裏方向に通る導体12によって裏面側
に設けられたリード電極11と導通し、裏電極63、7
3が裏面側に設けられた他のリード電極64、74と導
通しており、支持体4は外面に外部接続端子13〜15
を有し、外部接続端子13〜15がリード電極64、1
1、74に導通しているから、従来と異なって、金属薄
板でなるキャップ状端子金具が不要である。このため、
部品点数が少なくなると共に、振動部取出構造が簡単に
なる。キャップ状端子金具が不要であるために、キャッ
プ状端子金具の反り、破損等による信頼性低下を招くこ
とがない。しかも、支持体4は、外面に外部接続端子1
3〜15を有し、外部接続端子13〜15がリード電極
64、11、74に導通しているから、支持体4に設け
られた外部接続端子13〜15が外部との接続部分とな
る。このため、振動部6、7から導出され薄膜で構成さ
れているリード電極64、11、74の半田食われ現象
等を防止できる。支持体4の外部接続端子13〜15
は、厚膜として形成できるから、半田食われの影響は実
質的に無視できる。また、表カバー21は、空洞層21
の側端面210が一面側から他面側に向って後退し、圧
電基板1の側端面上で見た厚みが零となっているから、
応力が側端面210の後退に対応して分散され、図8に
示す如く、従来の特性S11、S12から特性S21、
S22のように低下する。しかも、圧電基板1の側端面
に仮に欠け、破損、亀裂が生じていても、これらを表カ
バー21の厚みが零である領域の間隔d内に留め、接触
界面に入らないようにすることができる。このため、熱
衝撃試験、熱サイクル試験または使用時の温度変動等に
伴って、表カバー2を構成する空洞層21及び圧電基板
1の間に線膨張係数の差に起因する熱応力が発生した場
合でも、圧電基板1と表カバー2との接触界面に亀裂、
剥離等が生じにくくなり、信頼性が向上する。図9は熱
衝撃テスト結果を示すデータである。図9において、縦
軸に累積不良率(%)をとり、横軸に熱サイクル数をと
ってある。L1は従来の圧電部品(従来品)の特性、L
2は本発明に係る圧電部品(本発明品)の特性を示して
いる。熱衝撃テストに当っては、従来品及び本発明品と
も80個のサンプルを用意し、−55℃で30分、+1
25℃で30分を1サイクルとする熱衝撃を100サイ
クル加えた。図9に示すように、従来品では、20サイ
クルで約14%、50サイクルで約19%、100サイ
クルで約25%の不良率を生じているが、本発明では1
00サイクルでも殆ど不良品を生じない。FIG. 1 is an exploded perspective view of a piezoelectric component according to the present invention,
2 is a perspective view in the same assembled state, FIG. 3 is a front partial sectional view of the same, FIG. 4 is a front sectional view of the same, and FIG. 5 is A1 of FIG.
6 is a sectional view taken along line A1-A1 and FIG. 6 is a sectional view taken along line A2-A2 in FIG. Reference numeral 1 is a piezoelectric substrate, 2 is a front cover, 3 is a back cover, 4 is a support, and 5 is an adhesive layer.
The piezoelectric substrate 1 has vibrating portions 6 and 7. Each vibrating section 6, 7
Are front electrodes 61, 71 and back electrodes (62, 6) formed on the front surface and the back surface of the piezoelectric substrate 1 so as to face each other.
3) and (72, 73). Front electrodes 61, 71
Are commonly connected to the lead electrode 8. Capacitor electrodes 9 provided on both surfaces of the piezoelectric substrate 1 are also electrically connected to the lead electrodes 8. The back electrodes 62 and 72 are the capacitor electrodes 9
The back electrodes 63 and 73 are electrically connected to each other through the capacitor electrode 10 that faces each other, and the back electrodes 63 and 73 are guided to the ends of both corners of the piezoelectric substrate 1 by the lead electrodes 64 and 74 formed on the piezoelectric substrate 1. There is. Regarding the electrode arrangement, contrary to the illustration, the electrodes (62, 63) and (72, 73) may be used as the front electrodes and the electrodes 61 and 71 may be used as the back electrodes. Furthermore, on the back surface side of the piezoelectric substrate 1,
A lead electrode 11 that faces the lead electrode 8 on the front surface side is provided. The lead electrode 8 on the front surface side and the lead electrode 11 on the back surface side are connected to each other by a conductor 12 passing through the piezoelectric substrate 1 in the front-back direction. The conductor 12 is a position that does not affect the main vibration mode, and any position can be selected as long as it can connect the lead electrodes 8 and 11 to each other.
The illustrated conductor 12 can be formed by depositing a conductor in a through-hole provided in the piezoelectric substrate 1 by a thin film technique such as sputtering or a thick film technique such as printing. The through holes can be formed by punching the green sheet before firing and laser processing after firing. Front electrodes 61, 71,
The back electrodes (62, 63), (72, 73) and the lead electrodes 64, 74, 8, 11 can be formed by a thin film technique such as sputtering or a thick film technique. In this way, the piezoelectric substrate 1
Means that the front electrodes 61, 71 are electrically connected to the lead electrodes 11 provided on the back surface side by the conductors 12 passing through the piezoelectric substrate 1 in the front-back direction, and the back electrodes 63, 73 are provided with the lead electrodes 64, 74 provided on the back surface side. Since they are conducting, the front electrodes 61, 71 and the back electrodes 63, 74 can be drawn out on the same back surface side. For this reason, the external lead-out paths of the vibrating portions 6 and 7 are shortened, and advantages such as a reduction in lead inductance and accompanying improvement in characteristics can be obtained. The front cover 2 includes a cavity layer 21 and a sealing layer 22, and the back cover 3 similarly includes the cavity layer 31.
And a sealing layer 32. The cavity layers 21 and 31 are formed in the cavity portions (211 and 21) at the portions corresponding to the vibrating portions 6 and 7.
2) and (311 and 312) are attached to the piezoelectric substrate 1. Cavities (211, 212), (311, 3)
12) is a front electrode 61 and a back electrode (6) of the vibrating parts 6 and 7.
2, 63) and (72, 73) are provided with openings 213 and 313. Cavity (211, 21
2) and (311, 312) are formed so as to surround the vibrating portion composed of the front electrodes 61, 71 and the back electrodes (62, 63), (72, 73), and a part of them is passed through a narrow passage. , To the openings 213 and 313. The cavity layer 31 and the sealing layer 32 of the back cover 3 are the lead electrodes 64, 1
At the positions corresponding to 1 and 74, the missing portions 314 to 316,
321 to 323 are provided. In the cavity layer 21 forming the front cover 2, the side end surface 210 recedes from one surface side to the other surface side, and the thickness seen on the side end surface of the piezoelectric substrate 1 is zero. In the illustrated cavity layer 21, the side end surface 210 is a flat inclined surface, and a gap d is formed between the side end surface and the side end surface of the piezoelectric substrate 1.
Are arranged in the plane of the piezoelectric substrate 1 so that
The side end surface 210 may be formed so that the distance d is substantially zero, as shown by the broken line in FIG. The side end surface 210 may be a convex or concave arc surface, a polygonal flat surface, or a combination thereof. Furthermore, as shown in FIG. 7, it may be a step. The sealing layers 22 and 32 are made of an insulating resin and adhere to the cavity layers 21 and 31 to close the openings 213 and 313. It is desirable that the sealing layers 22 and 32 be formed of an ultraviolet curable resin. The support 4 is made of ceramic such as alumina and is adhered to the surface of the sealing layer 32 forming the back cover 3 by the adhesive layer 5. The support 4 is provided on the back cover 3 side. At one edge of the support body 4, the cavity layer 21 of the front cover 2, and the missing portions 314 to 316, 3 provided at the edges of the cavity layer 31 and the sealing layer 32 of the back cover 3.
Missing parts 41 to 43 corresponding to 21 to 323 are provided. External connection terminals 13 to 15 are attached to the insides of the cutouts 41 to 43 and their peripheral portions. External connection terminal 1
3 to 15 are formed by a thick film forming technique, a plating technique or a combination thereof. At the time of assembly, a laminated body of the back cover 3, the piezoelectric substrate 1 and the front cover 2 is laminated and integrated on the support body 14 via the adhesive layer 5. The lead electrodes 64, 11 and 74 provided on the back surface side of the piezoelectric substrate 1 include the back cover 3
The external connection terminals 13 provided around the missing portions 41 to 43 of the support body 4 via the missing portions 314 to 316 and 321 to 323 provided at the edges of the cavity layer 31 and the sealing layer 32.
It is arranged so as to face ~ 15. And the missing portion 31
4 to 316, 321 to 323, and the missing parts 41 to 43 are coated with conductive agents 16 to 18 (see FIG. 2) such as conductive paint,
The lead electrodes 64, 11 and 74 are connected to the external connection terminals 13 to 1
Conductive connection to 5. As described above, the front electrodes 61, 71
Is electrically connected to the lead electrode 11 provided on the back surface side by the conductor 12 passing through the piezoelectric substrate 1 in the front-back direction, and the back electrodes 63, 7
3 is electrically connected to the other lead electrodes 64 and 74 provided on the back surface side, and the support body 4 is provided on the outer surface with the external connection terminals 13 to 15
And the external connection terminals 13 to 15 have lead electrodes 64 and 1
Unlike the conventional case, the cap-shaped terminal fitting made of a thin metal plate is unnecessary because it is electrically connected to the terminals 1 and 74. For this reason,
The number of parts is reduced and the vibrating part extraction structure is simplified. Since the cap-shaped terminal fitting is unnecessary, the reliability of the cap-shaped terminal fitting is not deteriorated due to warping or damage. Moreover, the support body 4 has the external connection terminal 1 on the outer surface.
3 to 15 and the external connection terminals 13 to 15 are electrically connected to the lead electrodes 64, 11, and 74, the external connection terminals 13 to 15 provided on the support body 4 serve as connection portions with the outside. Therefore, it is possible to prevent the solder erosion phenomenon of the lead electrodes 64, 11, 74 which are derived from the vibrating portions 6, 7 and are made of a thin film. External connection terminals 13 to 15 of the support 4
Can be formed as a thick film, so the effect of solder erosion can be substantially ignored. In addition, the front cover 21 has a hollow layer 21.
Since the side end surface 210 of 1 moves backward from one surface side to the other surface side, the thickness seen on the side end surface of the piezoelectric substrate 1 is zero,
The stress is dispersed according to the receding of the side end surface 210, and as shown in FIG. 8, the conventional characteristics S11, S12 to S21,
It decreases as in S22. Moreover, even if the side end surface of the piezoelectric substrate 1 is chipped, damaged, or cracked, it can be kept within the interval d of the region where the thickness of the front cover 21 is zero so as not to enter the contact interface. it can. Therefore, due to the thermal shock test, the thermal cycle test, the temperature variation during use, or the like, thermal stress caused by the difference in the linear expansion coefficient was generated between the cavity layer 21 forming the front cover 2 and the piezoelectric substrate 1. Even in the case, cracks occur at the contact interface between the piezoelectric substrate 1 and the front cover 2,
Peeling is less likely to occur and reliability is improved. FIG. 9 is data showing the thermal shock test results. In FIG. 9, the vertical axis represents the cumulative defective rate (%), and the horizontal axis represents the number of thermal cycles. L1 is the characteristic of the conventional piezoelectric component (conventional product), L
2 shows the characteristics of the piezoelectric component (product of the present invention) according to the present invention. In the thermal shock test, 80 samples were prepared for both the conventional product and the product of the present invention, and the sample was added at -55 ° C for 30 minutes, +1.
100 cycles of thermal shock at 25 ° C. for 30 minutes as one cycle were applied. As shown in FIG. 9, in the conventional product, a defect rate of about 14% at 20 cycles, about 19% at 50 cycles, and about 25% at 100 cycles occurred.
Almost no defective products are produced even in 00 cycles.
【発明の効果】以上述べたように、本発明によれば、次
のような効果が得られる。 (a)圧電基板は、表電極が圧電基板を表裏方向に通る
導体によって裏面側に設けられたリード電極と導通し、
裏電極が裏面側に設けられた他のリード電極と導通して
おり、支持体は外面に外部接続端子を有し、外部接続端
子がリード電極に導通しているから、従来と異なって、
金属薄板でなるキャップ状端子が不要で、部品点数が少
なく、電極取出構造が簡単で、キャップ状端子の反り、
破損等による信頼性低下を招くことのない圧電部品を提
供できる。 (b)支持体は、外面に外部接続端子を有し、外部接続
端子がリード電極に導通しているから、振動部から導出
されているリード電極の半田食われ現象等を防止し得る
高信頼の圧電部品を提供できる。 (c)表カバーは、側端面が一面側から他面側に向って
後退し、圧電基板の側端面上で見た厚みが零となってい
るから、熱衝撃試験、熱サイクル試験または使用時の温
度変動等に伴って、表カバー及び圧電基板の間に線膨張
係数の差に起因する熱応力が発生した場合でも、圧電基
板と表カバーとの接触界面に亀裂、剥離等が生じにく
く、信頼性の高い圧電部品を提供できる。As described above, according to the present invention, the following effects can be obtained. (A) In the piezoelectric substrate, the front electrode is electrically connected to the lead electrode provided on the back surface side by the conductor passing through the piezoelectric substrate in the front and back directions,
Since the back electrode is electrically connected to the other lead electrode provided on the back surface side, the support has an external connection terminal on the outer surface, and the external connection terminal is electrically connected to the lead electrode, unlike the conventional case,
Cap-shaped terminals made of thin metal plate are unnecessary, the number of parts is small, the electrode extraction structure is simple, and the warp of the cap-shaped terminals
It is possible to provide a piezoelectric component that does not reduce reliability due to damage or the like. (B) The support has an external connection terminal on the outer surface, and the external connection terminal is electrically connected to the lead electrode, so that the lead electrode led out from the vibrating portion can be prevented from being eroded by solder and the like. It is possible to provide the piezoelectric component. (C) Since the side end surface of the front cover recedes from one surface side to the other surface side, and the thickness seen on the side end surface of the piezoelectric substrate is zero, a thermal shock test, a heat cycle test, or a use is performed. Due to temperature fluctuations and the like, even when thermal stress due to a difference in linear expansion coefficient occurs between the front cover and the piezoelectric substrate, cracks or peeling at the contact interface between the piezoelectric substrate and the front cover hardly occur, A highly reliable piezoelectric component can be provided.
【図1】本発明に係る圧電部品の分解斜視図である。FIG. 1 is an exploded perspective view of a piezoelectric component according to the present invention.
【図2】本発明に係る圧電部品の部分破断斜視図であ
る。FIG. 2 is a partially cutaway perspective view of a piezoelectric component according to the present invention.
【図3】本発明に係る圧電部品の正面部分断面図であ
る。FIG. 3 is a front partial cross-sectional view of a piezoelectric component according to the present invention.
【図4】本発明に係る圧電部品の正面断面図である。FIG. 4 is a front sectional view of a piezoelectric component according to the present invention.
【図5】図3のA1ーA1線上における断面図である。5 is a cross-sectional view taken along the line A1-A1 of FIG.
【図6】図3のA2ーA2線上における断面図である。6 is a cross-sectional view taken along the line A2-A2 of FIG.
【図7】本発明に係る圧電部品の他の実施例における正
面断面図である。FIG. 7 is a front sectional view of another embodiment of the piezoelectric component according to the present invention.
【図8】本発明に係る圧電部品の作用を説明する図であ
る。FIG. 8 is a diagram illustrating the operation of the piezoelectric component according to the present invention.
【図9】圧電部品の熱衝撃テスト結果をグラフ化して示
す図である。FIG. 9 is a graph showing a result of a thermal shock test of a piezoelectric component.
1 圧電基板 6、7 振動部 61、71 表電極 62、72、63、73 裏電極 64、74 リード電極 2 表カバー 210 側端面 3 裏カバー 4 支持体 8、11 リード電極 12 導体 DESCRIPTION OF SYMBOLS 1 Piezoelectric substrate 6, 7 Vibrating part 61, 71 Front electrode 62, 72, 63, 73 Back electrode 64, 74 Lead electrode 2 Front cover 210 Side end face 3 Back cover 4 Support body 8, 11 Lead electrode 12 Conductor
【手続補正書】[Procedure amendment]
【提出日】平成4年11月19日[Submission date] November 19, 1992
【手続補正1】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】請求項5[Name of item to be corrected] Claim 5
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【手続補正2】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】発明の詳細な説明[Name of item to be amended] Detailed explanation of the invention
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【発明の詳細な説明】Detailed Description of the Invention
【0001】[0001]
【産業上の利用分野】本発明は、例えばフィルタ、共振
子または発振子等として使用される圧電部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric component used as, for example, a filter, a resonator or an oscillator.
【0002】[0002]
【従来の技術】この種の圧電部品として、従来技術文献
としては、特開平2ー180417号公報等が知られて
いる。この従来技術では、圧電基板の表面及び裏面に積
層される表カバー及び裏カバーのそれぞれが空洞層と封
止層とを含み、空洞層が振動部に対応する部分に空洞部
を有して圧電基板に密着している。圧電基板は圧電磁器
材料で構成され、表カバー及び裏カバーは絶縁性の合成
樹脂によって構成されている。2. Description of the Related Art As a piezoelectric component of this type, Japanese Patent Application Laid-Open No. 2-180417 is known as a prior art document. In this conventional technique, each of the front cover and the back cover laminated on the front surface and the back surface of the piezoelectric substrate includes a cavity layer and a sealing layer, and the cavity layer has a cavity portion at a portion corresponding to the vibrating portion. It adheres to the substrate. The piezoelectric substrate is made of a piezoelectric ceramic material, and the front cover and the back cover are made of insulating synthetic resin.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、上述し
た従来技術には、次のような問題点があった。 (A)バネ性金属薄板を用いたキャップ状端子金具を装
着し、この端子金具を振動電極に導通するリード電極に
導通させる構造であったため、部品点数が多くなるこ
と、表カバー及び端子金具の両者において、振動部と端
子金具とを接続するための構造が複雑になること、実装
状態において端子金具が半田付け応力等の外力の影響を
受けて反りや破損等を発生し易い等の問題点がある。 (B)上述した問題点を解決する手段として、例えば先
に提案された特願平3ー126616号に開示されるご
とく、電極構造に工夫を加える等して、端子金具を省略
した構造をとることが考えられる。しかしながら、圧電
基板が磁器材料で構成されるのに対し、表カバーが合成
樹脂で構成されるため、圧電基板と表カバーとは線膨張
係数が異る。例えば、圧電基板の線膨張係数は(−10
〜+10)×10-6であるが、樹脂は(20〜100)
×10-6であり、著しく異なる。このため、端子金具等
の支持固定手段がない構造では、熱衝撃試験、熱サイク
ル試験または使用時の温度変動等に伴って、圧電基板と
表カバーの線膨張係数の差に起因して発生する熱応力に
より、表カバーと圧電基板との接触界面に亀裂、剥離等
を生じてしまうという問題点があることがわかった。 (C)この種の圧電部品は、ウエハー状圧電基板の上に
多数の圧電素子を形成した後、圧電基板を切断して各圧
電素子毎に分離する工程を経て取出される。ところが、
圧電基板が磁器材料で構成されるのに対し、表カバーが
合成樹脂で構成されるため、切断工程において、圧電基
板と表カバーとが接触する切断面に、欠けや、割れを生
じ易い。このため、圧電基板と表カバーとの接触面に亀
裂や剥離が一層生じ易くなる。However, the above-mentioned prior art has the following problems. (A) Since the cap-shaped terminal fitting using the thin spring metal plate is mounted and the terminal fitting is electrically connected to the lead electrode that is electrically connected to the vibrating electrode, the number of parts is increased and the front cover and the terminal fitting are In both cases, the structure for connecting the vibrating part and the terminal fitting is complicated, and the terminal fitting is susceptible to warping or breakage under the influence of external force such as soldering stress in the mounted state. There is. (B) As a means for solving the above-mentioned problems, for example, as disclosed in Japanese Patent Application No. 3-126616 previously proposed, the electrode structure is modified so that the terminal metal fitting is omitted. It is possible. However, since the piezoelectric substrate is made of a porcelain material and the front cover is made of synthetic resin, the piezoelectric substrate and the front cover have different linear expansion coefficients. For example, the linear expansion coefficient of the piezoelectric substrate is (-10
~ + 10) × 10 -6 , but the resin is (20-100)
× 10 −6, which is significantly different. For this reason, in a structure without a supporting and fixing means such as a terminal fitting, it occurs due to the difference in the linear expansion coefficient between the piezoelectric substrate and the front cover due to a thermal shock test, a thermal cycle test, or a temperature change during use. It has been found that there is a problem that cracks, peeling, etc. occur at the contact interface between the front cover and the piezoelectric substrate due to thermal stress. (C) This type of piezoelectric component is taken out after a process of forming a large number of piezoelectric elements on a wafer-shaped piezoelectric substrate and then cutting the piezoelectric substrate to separate each piezoelectric element. However,
Since the piezoelectric substrate is made of a porcelain material, while the front cover is made of synthetic resin, a cut surface at which the piezoelectric substrate and the front cover come into contact with each other is easily chipped or cracked in the cutting step. Therefore, cracks and peeling are more likely to occur on the contact surface between the piezoelectric substrate and the front cover.
【0004】そこで、本発明の課題は上述する従来の問
題点を解決し、部品点数が少なく、構造が簡単で、亀
裂、剥離等の生じにくい高信頼度の圧電部品を提供する
ことである。Therefore, an object of the present invention is to solve the above-mentioned conventional problems, and to provide a highly reliable piezoelectric component having a small number of components, a simple structure, and less likely to cause cracking or peeling.
【0005】[0005]
【課題を解決するための手段】上述した課題解決のた
め、本発明は、圧電基板と、表カバーと、裏カバーと、
これらを支持する支持体とを有する圧電部品であって、
前記圧電基板は、振動部を有し、前記振動部が表面及び
裏面に互いに対向して配置された表電極及び裏電極を含
んでおり、前記支持体は、外面に外部接続を有し、前記
外部接続端子が前記表電極及び裏電極から導かれたリー
ド電極と導通しており、前記表カバー及び裏カバーは、
厚み方向の一面側に空洞部を有し、前記一面側が前記圧
電基板の表面及び裏面に重ねられて接着され、前記空洞
部が振動部の周りに振動空間を形成しており、前記表カ
バーは、側端面が前記一面側から他面側に向って後退
し、前記圧電基板の側端面上で見た厚みが零となってい
ることを特徴とする。To solve the above problems, the present invention provides a piezoelectric substrate, a front cover, a back cover,
A piezoelectric component having a support for supporting these,
The piezoelectric substrate has a vibrating portion, the vibrating portion includes a front electrode and a back electrode arranged on the front surface and the back surface facing each other, the support has an external connection on the outer surface, The external connection terminal is in conduction with the lead electrode led from the front electrode and the back electrode, the front cover and the back cover,
A cavity portion is provided on one surface side in the thickness direction, the one surface side is overlapped and adhered to the front surface and the back surface of the piezoelectric substrate, and the cavity portion forms a vibration space around the vibration portion, and the front cover is The side end face recedes from the one face side toward the other face side, and the thickness of the piezoelectric substrate viewed on the side end face is zero.
【0006】[0006]
【作用】圧電基板は振動部が表面及び裏面に互いに対向
して配置された表電極及び裏電極を含んでおり、表カバ
ー及び裏カバーは一面側に空洞部を有し一面側が圧電基
板の表面及び裏面に重ねられて接着され、空洞部が振動
部の周りに振動空間を形成しているから、空洞部によっ
て必要な振動空間を確保した圧電部品が得られる。The piezoelectric substrate includes a front electrode and a back electrode whose vibrating portions are arranged on the front surface and the back surface of the piezoelectric substrate so as to face each other. The front cover and the back cover have a cavity on one surface side and the one surface side is the front surface of the piezoelectric substrate. Also, since the cavity part forms a vibration space around the vibrating part by being laminated and adhered to the back surface, a piezoelectric component in which a necessary vibration space is secured by the cavity part is obtained.
【0007】圧電基板は、振動部が表面及び裏面に互い
に対向して配置された表電極及び裏電極を含んでおり、
支持体は外面に外部接続を有し外部接続端子が表電極及
び裏電極から導かれたリード電極と導通しているから、
従来と異なって、金属薄板でなるキャップ状端子金具が
不要である。このため、部品点数が少なくなると共に、
振動部取出構造が簡単になる。キャップ状端子金具が不
要であるために、キャップ状端子金具の反り、破損等に
よる信頼性低下を招くこともない。更に、支持体に設け
られた外部接続端子を利用して外部回路と接続できる。
このため、振動電極から導出されているリード電極の半
田食われ現象等を防止できる。支持体の外部接続端子
は、厚膜として形成できるから、半田食われの影響は実
質的に無視できる。The piezoelectric substrate includes a front electrode and a back electrode whose vibrating portions are arranged on the front surface and the back surface so as to face each other,
Since the support has an external connection on the outer surface and the external connection terminal is electrically connected to the lead electrodes led from the front electrode and the back electrode,
Unlike the conventional case, the cap-shaped terminal fitting made of a thin metal plate is unnecessary. Therefore, the number of parts is reduced and
The vibrating part extraction structure becomes simple. Since the cap-shaped terminal fitting is unnecessary, the reliability of the cap-shaped terminal fitting is not deteriorated due to warping or damage. Further, it can be connected to an external circuit by using an external connection terminal provided on the support.
Therefore, it is possible to prevent the phenomenon of solder erosion of the lead electrode led out from the vibrating electrode. Since the external connection terminal of the support can be formed as a thick film, the influence of solder erosion can be substantially ignored.
【0008】表カバーは、側端面が前記一面側から他面
側に向って後退し、圧電基板の側端面上で見た厚みが零
となっているから、発生する熱応力が表カバーの側端面
の後退に対応して分散され、接触界面における応力が低
下する。また、圧電基板の側端面に仮に欠け、破損、亀
裂が生じていても、これらを表カバーの厚みが零である
領域内に留め、両者の接触界面に入らないようにするこ
とができる。このため、熱衝撃試験、熱サイクル試験ま
たは使用時の温度変動等に伴って、表カバー及び圧電基
板の間に線膨張係数の差に起因する熱応力が発生した場
合でも、圧電基板と表カバーとの接触界面に亀裂、剥離
等が生じにくくなり、信頼性が向上する。Since the side end surface of the front cover recedes from the one surface side toward the other surface side, and the thickness seen on the side end surface of the piezoelectric substrate is zero, the generated thermal stress is the side of the front cover. The stress is dispersed corresponding to the receding of the end face, and the stress at the contact interface is reduced. Further, even if the side end surface of the piezoelectric substrate is chipped, broken, or cracked, these can be kept in the region where the thickness of the front cover is zero so as not to enter the contact interface between them. Therefore, even if thermal stress due to the difference in linear expansion coefficient occurs between the front cover and the piezoelectric substrate due to thermal shock test, thermal cycle test, or temperature fluctuation during use, etc. Cracks and peeling are less likely to occur at the contact interface with and reliability is improved.
【0009】[0009]
【実施例】図1は本発明に係る圧電部品の分解斜視図、
図2は同じく組立状態での斜視図、図3は同じく正面部
分断面図、図4は同じく正面断面図、図5は図3のA1
ーA1線上における断面図、図6は図3のA2ーA2線
上における断面図である。1は圧電基板、2は表カバ
ー、3は裏カバー、4は支持体、5は接着剤層である。FIG. 1 is an exploded perspective view of a piezoelectric component according to the present invention,
2 is a perspective view in the same assembled state, FIG. 3 is a front partial sectional view of the same, FIG. 4 is a front sectional view of the same, and FIG. 5 is A1 of FIG.
6 is a sectional view taken along line A1-A1 and FIG. 6 is a sectional view taken along line A2-A2 in FIG. Reference numeral 1 is a piezoelectric substrate, 2 is a front cover, 3 is a back cover, 4 is a support, and 5 is an adhesive layer.
【0010】圧電基板1は、振動部6、7を有する。各
振動部6、7は、圧電基板1の表面及び裏面に互いに対
向するように形成された表電極61、71及び裏電極
(62、63)、(72、73)を備えている。表電極
61、71は、リード電極8に共通に接続されている。
リード電極8には圧電基板1の両面に設けたコンデンサ
電極9も導通させてある。The piezoelectric substrate 1 has vibrating portions 6 and 7. Each vibrating section 6, 7 includes front electrodes 61, 71 and back electrodes (62, 63), (72, 73) formed on the front surface and the back surface of the piezoelectric substrate 1 so as to face each other. The front electrodes 61 and 71 are commonly connected to the lead electrode 8.
Capacitor electrodes 9 provided on both surfaces of the piezoelectric substrate 1 are also electrically connected to the lead electrodes 8.
【0011】裏電極62、72は、コンデンサ電極9と
対向するコンデンサ電極10を介して互いに導通接続さ
れており、裏電極63、73は、圧電基板1に形成され
たリード電極64、74によって圧電基板1の両隅部の
端部に導かれている。電極配置に関しては、図示とは逆
に、電極(62、63)、(72、73)を表電極と
し、電極61、71を裏電極とするような配置関係をと
ることも可能である。The back electrodes 62 and 72 are electrically connected to each other via the capacitor electrode 10 facing the capacitor electrode 9, and the back electrodes 63 and 73 are piezoelectric by the lead electrodes 64 and 74 formed on the piezoelectric substrate 1. It is guided to the ends of both corners of the substrate 1. Regarding the electrode arrangement, contrary to the illustration, the electrodes (62, 63) and (72, 73) may be used as the front electrodes and the electrodes 61 and 71 may be used as the back electrodes.
【0012】更に、圧電基板1の裏面側には、表面側の
リード電極8と対向するリード電極11が設けられてい
る。表面側のリード電極8及び裏面側のリード電極11
は、圧電基板1を表裏方向に通る導体12によって互い
に接続されている。導体12は主振動モードに影響を与
えない位置であって、リード電極8、11を相互接続で
きる位置であれば、任意の位置が選定できる。図示の導
体12は圧電基板1に設けられたスルーホール内に、ス
パッタ等の薄膜技術または印刷等のあつ膜技術によって
導体を付着させることによって形成できる。スルーホー
ルは焼成前はグリーンシート打抜き、焼成後はレーザ加
工等によって形成できる。表電極61、71、裏電極
(62、63)、(72、73)及びリード電極64、
74、8、11はスパッタ等の薄膜技術または厚膜技術
によって形成できる。Further, a lead electrode 11 facing the lead electrode 8 on the front surface side is provided on the back surface side of the piezoelectric substrate 1. Lead electrode 8 on the front side and lead electrode 11 on the back side
Are connected to each other by a conductor 12 that passes through the piezoelectric substrate 1 in the front-back direction. The conductor 12 is a position that does not affect the main vibration mode, and any position can be selected as long as it can connect the lead electrodes 8 and 11 to each other. The illustrated conductor 12 can be formed by depositing a conductor in a through-hole provided in the piezoelectric substrate 1 by a thin film technique such as sputtering or a thick film technique such as printing. The through holes can be formed by punching the green sheet before firing and laser processing after firing. Front electrodes 61, 71, back electrodes (62, 63), (72, 73) and lead electrodes 64,
74, 8 and 11 can be formed by a thin film technique such as sputtering or a thick film technique.
【0013】このように、圧電基板1は、表電極61、
71が圧電基板1を表裏方向に通る導体12によって裏
面側に設けられたリード電極11と導通し、裏電極6
3、73が裏面側に設けられたリード電極64、74と
導通しているから、表電極61、71及び裏電極63、
74を同一面である裏面側で引出すことができる。この
ため、振動部6、7の外部引出経路が短くなり、リード
インダクタンスの減少、それに伴う特性向上等の利点が
得られる。As described above, the piezoelectric substrate 1 includes the front electrodes 61,
71 is electrically connected to the lead electrode 11 provided on the back surface side by the conductor 12 passing through the piezoelectric substrate 1 in the front-back direction, and the back electrode 6
Since the electrodes 3 and 73 are electrically connected to the lead electrodes 64 and 74 provided on the back surface side, the front electrodes 61 and 71 and the back electrode 63,
It is possible to pull out 74 on the back surface side, which is the same surface. For this reason, the external lead-out paths of the vibrating portions 6 and 7 are shortened, and advantages such as a reduction in lead inductance and accompanying improvement in characteristics can be obtained.
【0014】表カバー2は、空洞層21と封止層22と
を含み、裏カバー3も同様に、空洞層31と封止層32
とを含んでいる。空洞層21、31は、振動部6、7に
対応する部分に空洞部(211、212)、(311、
312)を有して、圧電基板1に密着させてある。空洞
部(211、212)、(311、312)は、振動部
6、7の表電極61及び裏電極(62、63)、(7
2、73)から外れた位置に、開口部213、313を
有している。空洞部(211、212)、(311、3
12)は、表電極61、71及び裏電極(62、6
3)、(72、73)で構成される振動部を包囲するよ
うに形成し、その一部を狭い通路を通して、開口部21
3、313に連通させてある。裏カバー3の空洞層31
及び封止層32は、リード電極64、11及び74と対
応する位置に、欠落部314〜316、321〜323
を設けてある。The front cover 2 includes a cavity layer 21 and a sealing layer 22, and the back cover 3 similarly has a cavity layer 31 and a sealing layer 32.
Includes and. The cavity layers 21 and 31 have cavity portions (211 and 212) and (311) at portions corresponding to the vibrating portions 6 and 7, respectively.
312) and is brought into close contact with the piezoelectric substrate 1. The cavities (211, 212) and (311, 312) are the front electrodes 61 and the back electrodes (62, 63) and (7 of the vibrating sections 6 and 7, respectively.
2, 73) and openings 213 and 313 are provided. Cavities (211, 212), (311, 3)
12) is the front electrodes 61, 71 and the back electrodes (62, 6).
3) and (72, 73) are formed so as to surround the vibrating portion and a part of the vibrating portion is passed through the narrow passage to form the opening 21.
It is connected to 3, 313. Cavity layer 31 of the back cover 3
The sealing layer 32 is provided at the positions corresponding to the lead electrodes 64, 11 and 74 at the missing portions 314 to 316 and 321 to 323.
Is provided.
【0015】表カバー2を構成する空洞層21は、側端
面210が一面側から他面側に向って後退し、圧電基板
1の側端面上で見た厚みが零となっている。図示の空洞
層21は、側端面210が平面状の傾斜面となってい
て、圧電基板1の側端面との間に間隔dが生じるよう
に、圧電基板1の面内に配置されている。側端面210
は図4の破線で示す如く、間隔dが実質的に零となるよ
うに形成してもよい。側端面210は凸もしくは凹状の
弧面、折線状の平面またはこれらの組合せであってもよ
い。更に、図7に示すように、段面としてもよい。In the cavity layer 21 constituting the front cover 2, the side end face 210 recedes from the one face side to the other face side, and the thickness seen on the side end face of the piezoelectric substrate 1 is zero. The illustrated cavity layer 21 is arranged in the plane of the piezoelectric substrate 1 such that the side end face 210 is a flat inclined face and a space d is formed between the side end face 210 and the side end face of the piezoelectric substrate 1. Side end face 210
May be formed so that the distance d becomes substantially zero as shown by the broken line in FIG. The side end surface 210 may be a convex or concave arc surface, a polygonal flat surface, or a combination thereof. Furthermore, as shown in FIG. 7, it may be a step.
【0016】封止層22、32は、絶縁樹脂でなり、空
洞層21、31の上に密着し、開口部213、313を
閉塞している。封止層22、32は紫外線硬化型樹脂に
よって形成するのが望ましい。The sealing layers 22 and 32 are made of an insulating resin and adhere to the cavity layers 21 and 31 to close the openings 213 and 313. It is desirable that the sealing layers 22 and 32 be formed of an ultraviolet curable resin.
【0017】支持体4はアルミナ等のセラミックでな
り、接着層5によって裏カバー3を構成する封止層32
の表面に接着されている。支持体4は裏カバー3側に備
えられている。支持体4の一端縁には、表カバー2の空
洞層21と、裏カバー3の空洞層31及び封止層32の
端縁に設けられた欠落部314〜316、321〜32
3に対応する欠落部41〜43を設けてある。欠落部4
1〜43の内部及びその周辺部には、外部接続端子13
〜15が被着されている。外部接続端子13〜15は厚
膜形成技術、メッキ技術またはその組合せによって形成
する。The support 4 is made of a ceramic such as alumina, and the adhesive layer 5 forms the sealing layer 32 constituting the back cover 3.
Is glued to the surface of. The support 4 is provided on the back cover 3 side. At one edge of the support body 4, the cavity layer 21 of the front cover 2 and the missing portions 314 to 316, 321 to 32 provided at the edges of the cavity layer 31 and the sealing layer 32 of the back cover 3.
The missing portions 41 to 43 corresponding to No. 3 are provided. Missing part 4
External connection terminals 13 are provided inside and around 1 to 43.
~ 15 are applied. The external connection terminals 13 to 15 are formed by a thick film forming technique, a plating technique or a combination thereof.
【0018】組立に当って、支持体14の上に裏カバー
3、圧電基板1及び表カバー2の積層体を、接着層5を
介して積層一体化する。圧電基板1の裏面側に設けられ
たリード電極64、11及び74は、裏カバー3の空洞
層31及び封止層32の端縁に設けられた欠落部314
〜316、321〜323を介して、支持体4の欠落部
41〜43の周辺に設けられた外部接続端子13〜15
と対向するように配置する。そして、欠落部314〜3
16、321〜323、欠落部41〜43に導電塗料等
による導電剤16〜18(図2参照)を塗布し、リード
電極64、11及び74を外部接続端子13〜15に導
通接続させる。In assembly, a laminated body of the back cover 3, the piezoelectric substrate 1 and the front cover 2 is laminated and integrated on the support body 14 with the adhesive layer 5 interposed therebetween. The lead electrodes 64, 11 and 74 provided on the back surface side of the piezoelectric substrate 1 include the missing portions 314 provided on the edges of the cavity layer 31 and the sealing layer 32 of the back cover 3.
To 316 and 321 to 323, the external connection terminals 13 to 15 are provided around the missing portions 41 to 43 of the support body 4.
It is placed so as to face with. And the missing parts 314-3
Conductive agents 16 to 18 (see FIG. 2) such as conductive paint are applied to 16, 321 to 323 and the missing portions 41 to 43 to electrically connect the lead electrodes 64, 11 and 74 to the external connection terminals 13 to 15.
【0019】上述のように、表電極61、71が圧電基
板1を表裏方向に通る導体12によって裏面側に設けら
れたリード電極11と導通し、裏電極63、73が裏面
側に設けられた他のリード電極64、74と導通してお
り、支持体4は外面に外部接続端子13〜15を有し、
外部接続端子13〜15がリード電極64、11、74
に導通しているから、従来と異なって、金属薄板でなる
キャップ状端子金具が不要である。このため、部品点数
が少なくなると共に、振動部取出構造が簡単になる。キ
ャップ状端子金具が不要であるために、キャップ状端子
金具の反り、破損等による信頼性低下を招くことがな
い。As described above, the front electrodes 61 and 71 are electrically connected to the lead electrode 11 provided on the back surface side by the conductor 12 passing through the piezoelectric substrate 1 in the front and back directions, and the back electrodes 63 and 73 are provided on the back surface side. It is electrically connected to the other lead electrodes 64 and 74, and the support body 4 has external connection terminals 13 to 15 on its outer surface.
The external connection terminals 13 to 15 are lead electrodes 64, 11, and 74.
Unlike the conventional case, the cap-shaped terminal fitting made of a thin metal plate is unnecessary because it is electrically connected to. For this reason, the number of parts is reduced, and the structure for extracting the vibrating portion is simplified. Since the cap-shaped terminal fitting is unnecessary, the reliability of the cap-shaped terminal fitting is not deteriorated due to warping or damage.
【0020】しかも、支持体4は、外面に外部接続端子
13〜15を有し、外部接続端子13〜15がリード電
極64、11、74に導通しているから、支持体4に設
けられた外部接続端子13〜15が外部との接続部分と
なる。このため、振動部6、7から導出され薄膜で構成
されているリード電極64、11、74の半田食われ現
象等を防止できる。支持体4の外部接続端子13〜15
は、厚膜として形成できるから、半田食われの影響は実
質的に無視できる。Moreover, since the support 4 has the external connection terminals 13 to 15 on the outer surface thereof and the external connection terminals 13 to 15 are electrically connected to the lead electrodes 64, 11, 74, the support 4 is provided on the support 4. The external connection terminals 13 to 15 serve as connection parts with the outside. Therefore, it is possible to prevent the solder erosion phenomenon of the lead electrodes 64, 11, 74 which are derived from the vibrating portions 6, 7 and are made of a thin film. External connection terminals 13 to 15 of the support 4
Can be formed as a thick film, so the effect of solder erosion can be substantially ignored.
【0021】また、表カバー21は、空洞層21の側端
面210が一面側から他面側に向って後退し、圧電基板
1の側端面上で見た厚みが零となっているから、応力が
側端面210の後退に対応して分散され、図8に示す如
く、従来の特性S11、S12から特性S21、S22
のように低下する。しかも、圧電基板1の側端面に仮に
欠け、破損、亀裂が生じていても、これらを表カバー2
1の厚みが零である領域の間隔d内に留め、接触界面に
入らないようにすることができる。Further, in the front cover 21, the side end surface 210 of the cavity layer 21 recedes from one surface side to the other surface side, and the thickness as seen on the side end surface of the piezoelectric substrate 1 becomes zero. Are dispersed according to the retreat of the side end face 210, and as shown in FIG. 8, the characteristics S11 and S12 from the conventional characteristics S21 and S22 are dispersed.
To fall. Moreover, even if the side end surface of the piezoelectric substrate 1 is chipped, damaged, or cracked, these should be covered by the front cover 2
It can be kept within the interval d of the region where the thickness of 1 is zero so as not to enter the contact interface.
【0022】このため、熱衝撃試験、熱サイクル試験ま
たは使用時の温度変動等に伴って、表カバー2を構成す
る空洞層21及び圧電基板1の間に線膨張係数の差に起
因する熱応力が発生した場合でも、圧電基板1と表カバ
ー2との接触界面に亀裂、剥離等が生じにくくなり、信
頼性が向上する。図9は熱衝撃テスト結果を示すデータ
である。図9において、縦軸に累積不良率(%)をと
り、横軸に熱サイクル数をとってある。L1は従来の圧
電部品(従来品)の特性、L2は本発明に係る圧電部品
(本発明品)の特性を示している。熱衝撃テストに当っ
ては、従来品及び本発明品とも80個のサンプルを用意
し、−55℃で30分、+125℃で30分を1サイク
ルとする熱衝撃を100サイクル加えた。図9に示すよ
うに、従来品では、20サイクルで約14%、50サイ
クルで約19%、100サイクルで約25%の不良率を
生じているが、本発明では100サイクルでも殆ど不良
品を生じない。Therefore, due to a thermal shock test, a thermal cycle test, temperature fluctuations during use, or the like, thermal stress caused by a difference in coefficient of linear expansion between the cavity layer 21 forming the front cover 2 and the piezoelectric substrate 1. Even if occurs, cracks, peeling, and the like are less likely to occur at the contact interface between the piezoelectric substrate 1 and the front cover 2, and reliability is improved. FIG. 9 is data showing the thermal shock test results. In FIG. 9, the vertical axis represents the cumulative defective rate (%), and the horizontal axis represents the number of thermal cycles. L1 shows the characteristics of the conventional piezoelectric component (conventional product), and L2 shows the characteristics of the piezoelectric component according to the present invention (present invention product). In the thermal shock test, 80 samples were prepared for both the conventional product and the product of the present invention, and 100 cycles of thermal shock were performed, each cycle consisting of 30 minutes at -55 ° C and 30 minutes at + 125 ° C. As shown in FIG. 9, with the conventional product, a defective rate of about 14% at 20 cycles, about 19% at 50 cycles, and about 25% at 100 cycles occurred. Does not happen.
【0023】[0023]
【発明の効果】以上述べたように、本発明によれば、次
のような効果が得られる。 (a)圧電基板は、表電極が圧電基板を表裏方向に通る
導体によって裏面側に設けられたリード電極と導通し、
裏電極が裏面側に設けられた他のリード電極と導通して
おり、支持体は外面に外部接続端子を有し、外部接続端
子がリード電極に導通しているから、従来と異なって、
金属薄板でなるキャップ状端子が不要で、部品点数が少
なく、電極取出構造が簡単で、キャップ状端子の反り、
破損等による信頼性低下を招くことのない圧電部品を提
供できる。 (b)支持体は、外面に外部接続端子を有し、外部接続
端子がリード電極に導通しているから、振動部から導出
されているリード電極の半田食われ現象等を防止し得る
高信頼の圧電部品を提供できる。 (c)表カバーは、側端面が一面側から他面側に向って
後退し、圧電基板の側端面上で見た厚みが零となってい
るから、熱衝撃試験、熱サイクル試験または使用時の温
度変動等に伴って、表カバー及び圧電基板の間に線膨張
係数の差に起因する熱応力が発生した場合でも、圧電基
板と表カバーとの接触界面に亀裂、剥離等が生じにく
く、信頼性の高い圧電部品を提供できる。As described above, according to the present invention, the following effects can be obtained. (A) In the piezoelectric substrate, the front electrode is electrically connected to the lead electrode provided on the back surface side by the conductor passing through the piezoelectric substrate in the front and back directions,
Since the back electrode is electrically connected to the other lead electrode provided on the back surface side, the support has an external connection terminal on the outer surface, and the external connection terminal is electrically connected to the lead electrode, unlike the conventional case,
Cap-shaped terminals made of thin metal plate are unnecessary, the number of parts is small, the electrode extraction structure is simple, and the warp of the cap-shaped terminals
It is possible to provide a piezoelectric component that does not reduce reliability due to damage or the like. (B) The support has an external connection terminal on the outer surface, and the external connection terminal is electrically connected to the lead electrode, so that the lead electrode led out from the vibrating portion can be prevented from being eroded by solder and the like. It is possible to provide the piezoelectric component. (C) Since the side end surface of the front cover recedes from one surface side to the other surface side, and the thickness seen on the side end surface of the piezoelectric substrate is zero, a thermal shock test, a heat cycle test, or a use is performed. Due to temperature fluctuations and the like, even when thermal stress due to a difference in linear expansion coefficient occurs between the front cover and the piezoelectric substrate, cracks or peeling at the contact interface between the piezoelectric substrate and the front cover hardly occur, A highly reliable piezoelectric component can be provided.
Claims (5)
これらを支持する支持体とを有する圧電部品であって、 前記圧電基板は、振動部を有し、前記振動部が表面及び
裏面に互いに対向して配置された表電極及び裏電極を含
んでおり、 前記支持体は、外面に外部接続を有し、前記外部接続端
子が前記表電極及び裏電極から導かれたリード電極と導
通しており、 前記表カバー及び裏カバーは、厚み方向の一面側に空洞
部を有し、前記一面側が前記圧電基板の表面及び裏面に
重ねられて接着され、前記空洞部が振動部の周りに振動
空間を形成しており、 前記表カバーは、側端面が前記一面側から他面側に向っ
て後退し、前記圧電基板の側端面上で見た厚みが零とな
っていることを特徴とする圧電部品。1. A piezoelectric substrate, a front cover, a back cover,
A piezoelectric component having a support for supporting these, wherein the piezoelectric substrate has a vibrating portion, and the vibrating portion includes a front electrode and a back electrode arranged on the front surface and the back surface so as to face each other. The support has an external connection on an outer surface, the external connection terminal is electrically connected to a lead electrode led from the front electrode and the back electrode, and the front cover and the back cover are one surface side in a thickness direction. A cavity portion, the one surface side is overlapped and adhered to the front surface and the back surface of the piezoelectric substrate, the cavity portion forms a vibrating space around the vibrating portion, the front cover, the side end surface is the A piezoelectric component, which is retracted from one surface side to the other surface side and has a thickness of zero on the side end surface of the piezoelectric substrate.
含むことを特徴とする請求項1に記載の圧電部品。2. The piezoelectric component according to claim 1, wherein the front end of the front cover includes an inclined surface.
むことを特徴とする請求項1または2に記載の圧電部
品。3. The piezoelectric component according to claim 1, wherein the front end surface of the front cover includes a step portion.
に通る導体によって裏面側に設けられたリード電極と導
通しており、 前記裏電極は、裏面側に設けられた他のリード電極と導
通していることを特徴とする請求項1、2または3に記
載の圧電部品。4. The front electrode is electrically connected to a lead electrode provided on the back surface side by a conductor passing through the piezoelectric substrate in the front and back directions, and the back electrode is connected to another lead electrode provided on the back surface side. The piezoelectric component according to claim 1, 2 or 3, which is electrically connected.
は、空洞層と封止層とを含み、前記空洞層が前記空洞部
を有し、前記空洞部が前記表電極及び前記裏電極から外
れた位置に開口部を有し、前記封止層が前記空洞層の上
に密着し前記開口部を閉塞していることを特徴とする請
求項1、2、3または4に記載の圧電部品。5. The front cover and the back cover each include a cavity layer and a sealing layer, the cavity layer has the cavity, and the cavity is separated from the front electrode and the back electrode. The piezoelectric component according to claim 1, 2, 3 or 4, wherein an opening is provided at a position, and the sealing layer is in close contact with the cavity layer to close the opening.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32950691A JPH05145366A (en) | 1991-11-18 | 1991-11-18 | Piezoelectric component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32950691A JPH05145366A (en) | 1991-11-18 | 1991-11-18 | Piezoelectric component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05145366A true JPH05145366A (en) | 1993-06-11 |
Family
ID=18222138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32950691A Withdrawn JPH05145366A (en) | 1991-11-18 | 1991-11-18 | Piezoelectric component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05145366A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11312945A (en) * | 1998-04-27 | 1999-11-09 | Tdk Corp | Piezoelectric parts |
JP2006050537A (en) * | 2004-06-29 | 2006-02-16 | Kyocera Corp | Piezoelectric resonator |
WO2007026428A1 (en) * | 2005-08-31 | 2007-03-08 | Kyocera Corporation | Piezoelectric resonator |
-
1991
- 1991-11-18 JP JP32950691A patent/JPH05145366A/en not_active Withdrawn
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11312945A (en) * | 1998-04-27 | 1999-11-09 | Tdk Corp | Piezoelectric parts |
JP2006050537A (en) * | 2004-06-29 | 2006-02-16 | Kyocera Corp | Piezoelectric resonator |
WO2007026428A1 (en) * | 2005-08-31 | 2007-03-08 | Kyocera Corporation | Piezoelectric resonator |
US7893600B2 (en) | 2005-08-31 | 2011-02-22 | Kyocera Corporation | Piezoelectric resonator |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990204 |