JPH0511661Y2 - - Google Patents
Info
- Publication number
- JPH0511661Y2 JPH0511661Y2 JP1986144212U JP14421286U JPH0511661Y2 JP H0511661 Y2 JPH0511661 Y2 JP H0511661Y2 JP 1986144212 U JP1986144212 U JP 1986144212U JP 14421286 U JP14421286 U JP 14421286U JP H0511661 Y2 JPH0511661 Y2 JP H0511661Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- board
- integrated circuit
- hole
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 28
- 229910000679 solder Inorganic materials 0.000 description 14
- 239000006071 cream Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は、ハイブリツト集積回路装置の、特
に、基板の側縁部における、端子ピンを備えた端
子部の構造に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to the structure of a terminal portion provided with terminal pins in a hybrid integrated circuit device, particularly at a side edge of a substrate.
（考案の概要）
本考案は、基板の側縁部にそれぞれ端子ピンを
備えた多数の端子部が設けられるハイブリツド集
積回路装置において、基板の側縁部にそれぞれ電
極を備えた多数のスルーホールを形成し、このス
ルーホールにそれぞれ端子ピンを挿入して、この
端子ピンを上記の電極に半田付けすることによつ
て、工程数の少ない、端子ピンの取り付けのため
に特殊な治具や半田デイツプ槽などを必要としな
い方法により、低廉なコストで装置を製造するこ
とができるようにしたものである。(Summary of the invention) The present invention provides a hybrid integrated circuit device in which a large number of terminal parts each having a terminal pin are provided on the side edge of the board. By inserting terminal pins into these through holes and soldering the terminal pins to the above electrodes, special jigs and solder dips can be used to attach the terminal pins with fewer steps. The device can be manufactured at low cost using a method that does not require a tank or the like.
（従来の技術）
ハイブリツド集積回路装置において、装置を別
の基板上に取り付けるために、装置の基板の側縁
部にそれぞれ端子ピンを備えた多数の端子部を設
ける場合、従来は、実開昭59−135667号公報など
に示されるように、基板の両面に電極を形成する
とともに、端子ピンとして基板を挾さむ形状のも
のを用意し、この端子ピンを基板に装着して上記
の電極に半田付けしている。(Prior Art) In a hybrid integrated circuit device, when a large number of terminal portions each having a terminal pin are provided on the side edge of a substrate of the device in order to attach the device to another substrate, conventionally, As shown in Publication No. 59-135667, electrodes are formed on both sides of the board, terminal pins shaped to sandwich the board are prepared, and the terminal pins are attached to the board and soldered to the above electrodes. It is attached.
すなわち、第４図および第５図に示すように、
基板４０の側縁部において基板４０の両面に電極
４１および４２が形成されるとともに、端子ピン
５０は一端部に基板４０を挾さむ一対の弾性片５
１および５２が形成されたものとされ、これら弾
性片５１および５２で基板４０を挾さむように端
子ピン５０が基板４０に装着されて、第５図に示
すように、弾性片５１および５２が半田４３およ
び４４により電極４１および４２に固定されてい
る。 That is, as shown in FIGS. 4 and 5,
Electrodes 41 and 42 are formed on both sides of the substrate 40 at the side edges of the substrate 40, and a terminal pin 50 has a pair of elastic pieces 5 at one end that sandwich the substrate 40.
1 and 52 are formed, the terminal pin 50 is attached to the board 40 so that the board 40 is sandwiched between the elastic pieces 51 and 52, and the elastic pieces 51 and 52 are soldered as shown in FIG. It is fixed to the electrodes 41 and 42 by 43 and 44.
電極４１および４２は、基板４０上のパターン
の一部として形成される。また、基板４０は、予
め割れ目が形成され、電極４１および４２を含む
パターンが形成された一枚の基板を回路部品の取
り付け後に複数に分割したうちの一つで、この分
割された基板４０に上述のように端子ピン５０を
取り付ける。 Electrodes 41 and 42 are formed as part of a pattern on substrate 40. Further, the board 40 is one of the boards on which cracks are formed in advance and a pattern including electrodes 41 and 42 is formed, which is divided into a plurality of parts after circuit components are attached. Attach the terminal pins 50 as described above.
すなわち、従来のハイブリツド集積回路装置の
製造にあたつては、予め割れ目が形成され、電極
４１および４２を含むパターンが形成された一枚
の基板上にクリーム半田を印刷し、次に基板上に
回路部品を載置ないし装着し、次いでリフローを
行うことにより基板上に回路部品を取り付け、次
に基板を割れ目に沿つて分解して基板４０を得、
次いで特殊な治具を用いて基板４０に端子ピン５
０を装着し、次に基板４０を半田デイツプ槽に浸
して端子ピン５０を電極４１および４２に半田付
けする。 That is, in manufacturing a conventional hybrid integrated circuit device, cream solder is printed on a single substrate on which cracks are formed in advance and a pattern including electrodes 41 and 42 is formed, and then cream solder is printed on the substrate. Place or attach the circuit components, then reflow to attach the circuit components onto the board, and then disassemble the board along the cracks to obtain the board 40,
Next, terminal pins 5 are attached to the board 40 using a special jig.
0 is attached, then the board 40 is immersed in a solder dip bath and the terminal pins 50 are soldered to the electrodes 41 and 42.
（考案が解決しようとする問題点）
しかし、従来のハイブリツド集積回路装置にお
いては、基板への回路部品および端子ピンの取り
付けにあたつて、クリーム半田の印刷、回路部品
の載置ないし装着、リフロー、基板の分割、端子
ピンの装着、端子ピンの半田付け、という多数の
工程を必要とするとともに、端子ピンの取り付け
のために特殊な治具および半田デイツプ槽を必要
とし、装置の製造コストが著しく高くなる不都合
がある。(Problem that the invention aims to solve) However, in conventional hybrid integrated circuit devices, when attaching circuit components and terminal pins to the board, printing cream solder, placing or attaching circuit components, and reflowing are required. In addition to requiring multiple steps such as dividing the board, attaching the terminal pins, and soldering the terminal pins, a special jig and a solder dip bath are required for attaching the terminal pins, which increases the manufacturing cost of the device. There is an inconvenience that the cost becomes significantly higher.
かかる点に鑑み、本考案は、工程数の少ない、
端子ピンの取り付けのために特殊な治具や半田デ
イツプ槽などを必要としない方法により、低廉な
コストで装置を製造することができるようにした
ものである。 In view of this, the present invention has a small number of steps.
The device can be manufactured at low cost by a method that does not require special jigs or solder dip baths for attaching terminal pins.
（問題点を解決するための手段）
本考案に係るハイブリツド集積回路装置は、集
積回路およびその他の回路部品が取り付けられた
基板の側縁部に、各々が基板の両面にそれぞれ設
けられた電極を備える複数のスルーホールが形成
され、各スルーホールに、一端部及び他端部が中
間部に比べて細く、かつ、先細り形状に形成さ
れ、中間部における一端部側の両側縁部分が互い
に逆向きに折り曲げられて設けられた一対の係止
片を有する端子ピンが、一対の係止片をスルーホ
ールに設けられた基板の一方の面に位置する電極
に当接させるとともに一端部をスルーホールに挿
入せしめて配され、各端子ピンの一端部及び一対
の係止片がその一端部が挿入されたスルーホール
に設けられた基板の両面に位置する電極に夫々半
田付けされて構成される。(Means for Solving the Problems) A hybrid integrated circuit device according to the present invention has electrodes provided on both sides of the substrate, respectively, on the side edges of the substrate on which the integrated circuit and other circuit components are attached. A plurality of through-holes are formed, and each through-hole has one end and the other end narrower and tapered than the middle part, and both side edge parts on the one end side of the middle part are opposite to each other. A terminal pin that has a pair of locking pieces bent to abut the pair of locking pieces against an electrode located on one side of the board provided in the through hole, and one end of the pin that is bent into the through hole. One end of each terminal pin and a pair of locking pieces are respectively soldered to electrodes located on both sides of a substrate provided in the through hole into which the one end is inserted.
（作用）
上記のように構成した本考案に係るハイブリツ
ド集積回路装置によれば、基板への回路部品およ
び端子ピンの取り付けにあたつては、予め割れ目
およびパターンが形成され、分割後の基板の側縁
部となるべき位置に電極を備えたスルーホールが
形成された一枚の基板上に上記の電極上を含んで
クリーム半田を印刷し、次に基板上に回路部品を
載置ないし装着するとともに上記のスルーホール
に端子ピンを装着し、次いでリフローを行うこと
により基板に回路部品および端子ピンを取り付
け、次に基板を割れ目に沿つて分割すればよく、
工程数が少なくて済むとともに、端子ピンの取り
付けのために特殊な治具や半田デイツプ槽などを
必要とせず、低廉なコストで装置を製造すること
ができる。(Function) According to the hybrid integrated circuit device according to the present invention configured as described above, when attaching circuit components and terminal pins to the board, cracks and patterns are formed in advance, and the board after being divided is attached. Cream solder is printed on a board with through-holes with electrodes formed at the positions that should become the side edges, including on the electrodes, and then circuit components are placed or mounted on the board. At the same time, terminal pins are attached to the above-mentioned through holes, and then circuit components and terminal pins are attached to the board by performing reflow, and then the board is divided along the cracks.
The number of steps is reduced, and special jigs and solder dip tanks are not required for attaching terminal pins, making it possible to manufacture the device at low cost.
（実施例）
第１図および第２図は、本考案に係るハイブリ
ツド集積回路装置の一例の要部を示す。(Embodiment) FIGS. 1 and 2 show essential parts of an example of a hybrid integrated circuit device according to the present invention.
基板１０上には、パターンが形成されていると
ともに、集積回路２１およびその他の回路部品２
２が取り付けられている。この基板１０の所定の
側縁部には、スルーホール１１が多数形成されて
いる。スルーホール１１には基板１０の両面にそ
れぞれ位置する電極１２が設けられており、電極
１２はそれぞれパターンに接続されている。そし
て、スルーホール１１にはそれぞれ端子ピン３０
が挿入されており、この端子ピン３０がそれぞれ
半田１３により、スルーホール１１及び電極１２
に固定されている。 A pattern is formed on the substrate 10, and an integrated circuit 21 and other circuit components 2 are formed on the substrate 10.
2 is installed. A large number of through holes 11 are formed at a predetermined side edge of this substrate 10 . The through holes 11 are provided with electrodes 12 located on both sides of the substrate 10, and the electrodes 12 are connected to a pattern. Each through hole 11 has a terminal pin 30.
is inserted, and this terminal pin 30 is connected to the through hole 11 and electrode 12 by solder 13, respectively.
is fixed.
第３図に示すように、端子ピン３０は、一端部
３１および他端部３２が中間部３３に比べて細
く、かつ、先細り形状に形成された板状のものと
されており、中間部３３の一端部３１側の両側に
中間部３３に対して互いに逆向きに垂直に折り曲
げられた係止片３４および３５を有している。そ
して、一端部３１がスルーホール１１に挿入さ
れ、係止片３４および３５が電極１２に当接する
状態で、端子ピン３０が基板１０に垂直に取り付
けられている。 As shown in FIG. 3, the terminal pin 30 has a plate shape in which one end portion 31 and the other end portion 32 are thinner than the intermediate portion 33 and tapered. Locking pieces 34 and 35 are provided on both sides of one end portion 31 and are bent perpendicularly in opposite directions to the intermediate portion 33 . The terminal pin 30 is vertically attached to the substrate 10 with the one end 31 inserted into the through hole 11 and the locking pieces 34 and 35 in contact with the electrode 12.
スルーホール１１および電極１２は、集積回路
２１ないしその他の回路部品２２を基板１０に取
り付けるために基板１０に設けられる、集積回路
２１ないしその他の回路部品２２の端子ピンが挿
入されるべきスルーホールおよび電極と一緒に形
成される。 The through holes 11 and the electrodes 12 are through holes into which terminal pins of the integrated circuit 21 or other circuit components 22 are inserted, which are provided on the substrate 10 in order to attach the integrated circuit 21 or other circuit components 22 to the substrate 10. formed together with the electrode.
上述した本考案に係るハイブリツド集積回路装
置の一例の製造にあたつては、予め割れ目および
パターンが形成され、分割後の基板１０の所定の
側縁部となるべき位置に電極１２を備えたスルー
ホール１１が形成された一枚の基板上に電極１２
上に含んでクリーム半田を印刷し、次に基板上に
集積回路２１およびその他の回路部品２２を含む
回路部品を載置ないし装着するとともにスルーホ
ール１１に端子ピン３０を装着し、次いでリフロ
ーを行うことにより基板に集積回路２１およびそ
の他の回路部品２２を含む回路部品と端子ピン３
０を取り付け、次に基板を割れ目に沿つて分割す
ればよく、工程数が少なくて済むとともに、端子
ピン３０の取り付けのために特殊な治具や半田デ
イツプ槽などを必要としない。 In manufacturing the above-described example of the hybrid integrated circuit device according to the present invention, cracks and patterns are formed in advance, and through-holes are provided with electrodes 12 at predetermined side edges of the substrate 10 after division. An electrode 12 is placed on a single substrate in which a hole 11 is formed.
Cream solder is printed on the board, then circuit components including the integrated circuit 21 and other circuit components 22 are placed or attached on the board, and terminal pins 30 are attached to the through holes 11, and then reflow is performed. Circuit components including an integrated circuit 21 and other circuit components 22 and terminal pins 3 may be mounted on the substrate.
0 and then divide the board along the cracks, which reduces the number of steps and does not require special jigs or solder dip baths for attaching the terminal pins 30.
（考案の効果）
本考案によれば、基板の側縁部にそれぞれ端子
ピンを備えた多数の端子部が設けられるハイブリ
ツド集積回路装置において、端子ピンの一端部及
び他端部が中間部に比べて細く、かつ、先細り形
状に形成されることにより、端子ピンの基板に設
けられたスルーホールへの挿入が極めて容易とさ
れ、工程数の少ない、端子ピンの取り付けのため
に特殊な治具や半田デイツプ槽などを必要としな
い方法により、低廉なコストで装置を製造するこ
とができる。しかも、各端子ピンが、その一部が
互いに逆向きに折り曲げられて形成される一対の
係止片を有したものとされ、その一対の係止片を
スルーホールに設けられた基板の一方の面に位置
する電極に当接せしめて半田付けされることによ
り、基板におけるスルーホールに対する固定が堅
固になされるものとされる利点が得られる。(Effects of the invention) According to the invention, in a hybrid integrated circuit device in which a large number of terminal parts each having a terminal pin are provided on the side edge of the board, one end and the other end of the terminal pin are smaller than the middle part. By forming the terminal pin into a thin and tapered shape, it is extremely easy to insert the terminal pin into the through hole provided on the board, and special jigs and tools are required to attach the terminal pin with fewer steps. The device can be manufactured at low cost by a method that does not require a solder dip tank or the like. Moreover, each terminal pin has a pair of locking pieces formed by partially bending the pins in opposite directions, and the pair of locking pieces are attached to one side of the board provided in the through hole. By soldering the electrode in contact with the electrode located on the surface, there is an advantage that the fixation to the through hole in the substrate is firmly achieved.
第１図および第２図は本考案に係るハイブリツ
ド集積回路装置の一例の要部を示す斜視図および
断面図、第３図は本考案に係るハイブリツド集積
回路装置の一例における端子ピンを示す斜視図、
第４図および第５図は従来のハイブリツド集積回
路装置の一例の要部を示す斜視図および断面図で
ある。
図中、１０は基板、１１はスルーホール、１２
は電極、１３は半田、２１は集積回路、２２はそ
の他の回路部品、３０は端子ピン、３４および３
５は係止片である。
1 and 2 are perspective views and sectional views showing essential parts of an example of a hybrid integrated circuit device according to the present invention, and FIG. 3 is a perspective view showing terminal pins in an example of a hybrid integrated circuit device according to the present invention. ,
FIGS. 4 and 5 are a perspective view and a sectional view showing essential parts of an example of a conventional hybrid integrated circuit device. In the figure, 10 is a substrate, 11 is a through hole, 12
are electrodes, 13 is solder, 21 is an integrated circuit, 22 is other circuit components, 30 is a terminal pin, 34 and 3
5 is a locking piece.
Claims (1)
れた基板の側縁部に、各々が上記基板の両面にそ
れぞれ設けられた電極を備える複数のスルーホー
ルが形成され、 該複数のスルーホールのそれぞれに、一端部及
び他端部が中間部に比べて細く、かつ、先細り形
状に形成され、上記中間部における上記一端部側
の両側縁部分が互いに逆向きに折り曲げられて設
けられた一対の係止片を有する端子ピンが、上記
一対の係止片を該スルーホールに設けられた上記
基板の一方の面に位置する電極に当接させるとと
もに上記一端部を該スルーホールに挿入せしめて
配され、 上記端子ピンの一端部及び上記一対の係止片
が、上記一端部が挿入されたスルーホールに設け
られた上記基板の両面に位置する電極にそれぞれ
半田付けされて成るハイブリツド集積回路装置。[Claims for Utility Model Registration] A plurality of through holes are formed in the side edges of a substrate on which integrated circuits and other circuit components are attached, each having an electrode provided on both sides of the substrate, the plurality Each of the through-holes is formed such that one end and the other end are thinner and tapered than the intermediate portion, and both side edge portions on the one end side of the intermediate portion are bent in opposite directions. A terminal pin having a pair of locking pieces is configured to bring the pair of locking pieces into contact with an electrode located on one surface of the substrate provided in the through hole, and to attach the one end portion to the through hole. A hybrid device in which one end of the terminal pin and the pair of locking pieces are respectively soldered to electrodes located on both sides of the substrate provided in the through hole into which the one end is inserted. Integrated circuit device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986144212U JPH0511661Y2 (en) | 1986-09-20 | 1986-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986144212U JPH0511661Y2 (en) | 1986-09-20 | 1986-09-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6350459U JPS6350459U (en) | 1988-04-05 |
| JPH0511661Y2 true JPH0511661Y2 (en) | 1993-03-23 |
Family
ID=31054602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986144212U Expired - Lifetime JPH0511661Y2 (en) | 1986-09-20 | 1986-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0511661Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5650594A (en) * | 1979-09-29 | 1981-05-07 | Matsushita Electric Works Ltd | Electric path board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS501858U (en) * | 1973-05-04 | 1975-01-09 | ||
| JPS5515337Y2 (en) * | 1974-05-01 | 1980-04-09 | ||
| JPS5180644U (en) * | 1974-12-20 | 1976-06-26 |
-
1986
- 1986-09-20 JP JP1986144212U patent/JPH0511661Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5650594A (en) * | 1979-09-29 | 1981-05-07 | Matsushita Electric Works Ltd | Electric path board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6350459U (en) | 1988-04-05 |
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