JPS63268285A - Surface mounting component - Google Patents
Surface mounting componentInfo
- Publication number
- JPS63268285A JPS63268285A JP10354587A JP10354587A JPS63268285A JP S63268285 A JPS63268285 A JP S63268285A JP 10354587 A JP10354587 A JP 10354587A JP 10354587 A JP10354587 A JP 10354587A JP S63268285 A JPS63268285 A JP S63268285A
- Authority
- JP
- Japan
- Prior art keywords
- surface mounting
- mounting component
- circuit board
- surface mount
- circuit substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 5
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000005476 soldering Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は回路基板上に実装される面実装部品に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to surface mount components mounted on circuit boards.
従来の技術
近年、電子機器の軽薄短小指向に伴ない、これに使用す
る電子部品も小型化されている。その一つとして、回路
基板の表面に直接搭載、半田付されるように考慮された
微小部品である面実装部品が開発され、各種電子機器へ
の採用が急速に進んでいる。2. Description of the Related Art In recent years, as electronic devices have become lighter, thinner, and smaller, the electronic components used therein have also become smaller. One example of this is the development of surface mount components, which are minute components designed to be mounted and soldered directly onto the surface of a circuit board, and are rapidly being adopted in various electronic devices.
第２図イは従来の面実装部品の代表例の斜視図、第２図
口は従来の面実装部品の実装断面図を示し２へ一／
ている。この面実装部品は有極性の部品で実装の際、方
向性をもっているものとする。2A is a perspective view of a typical example of a conventional surface mount component, and the opening of FIG. 2 is a sectional view of the conventional surface mount component. This surface mount component is a polar component and has directionality when mounted.
ここで１は有極性の面実装部品で、その一方の電極１１
と他方の電極１３は半田２を介して回路基板３上に形成
された対向電極３１．３２に各々電気的に接続される。Here, 1 is a polar surface mount component, and one electrode 11
and the other electrode 13 are electrically connected via solder 2 to counter electrodes 31 and 32 formed on the circuit board 3, respectively.
一般に上記面実装部品１と回路基板Ｓ上の対向電極３１
．３２を接続する際には対向電極３１．３２上に半田ペ
ーストを印刷等によって塗布した後、面実装部品１を上
記半田ペースト上に搭載し、その後リフロー等の工法に
より半田を熔融することにより電気的接続がなされてい
る。In general, the surface-mounted component 1 and the opposing electrode 31 on the circuit board S
．． 32, after applying solder paste on the counter electrodes 31 and 32 by printing or the like, mounting the surface mount component 1 on the solder paste, and then melting the solder using a method such as reflow to connect the solder paste. A physical connection is made.
発明が解決しようとする問題点
しかしながら従来の方法では半田付後の面実装部品の回
路基板上での位置精度にはバラツキが多く、その位置は
回路基板上の電極形状、半田ペースト材質、半田ペース
ト量９面実装部品の電極形状、リフロー条件によって大
きく変化する。Problems to be Solved by the Invention However, in the conventional method, there are many variations in the positional accuracy of surface-mounted components on the circuit board after soldering, and the position depends on the electrode shape on the circuit board, the solder paste material, and the solder paste. Quantity 9 varies greatly depending on the electrode shape of surface-mounted parts and reflow conditions.
一方、第２図に示す有極性の面実装部品においては方向
を誤って、本体１２の長手方向に１８０３ ヘ一／゛
変異なった方向に回路基板に搭載しても半田付は通常通
り行われ、その後の電気特性の検査において初めてその
異常が検知されるか、最悪の場合は検出されることなし
に長時間の使用後機能面で不具合が発生する。On the other hand, even if the polarized surface mount components shown in FIG. 2 are mounted on the circuit board in the wrong direction and the direction is 1803 in the longitudinal direction of the main body 12, soldering will still be carried out normally. The abnormality will only be detected during a subsequent electrical characteristic test, or in the worst case, it will not be detected and a functional failure will occur after a long period of use.
本発明は上記欠点に鑑み、面実装部品の回路基板に対す
る正確な部品固定と有極性面実装部品の方向誤まりを防
止出来る面実装電子部品を提供するものである。In view of the above-mentioned drawbacks, the present invention provides a surface-mounted electronic component that can accurately fix a surface-mounted component to a circuit board and prevent polarized surface-mounted components from being oriented incorrectly.
問題点を解決するだめの手段
本発明は上記問題点を解決するために、回路基板上に設
けた面実装部品の位置・方向固定用のガイド穴に挿入固
定可能な形状の位置決め部材を設けたものである。Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a positioning member having a shape that can be inserted and fixed into a guide hole for fixing the position and direction of a surface-mounted component provided on a circuit board. It is something.
作用
本発明は上記構成により、本発明による面実装部品の位
置・方向固定用外形構造に対応したガイド穴を回路基板
上に設け、このガイド穴に涜って上記面実装部品を、回
路基板に挿入搭載すれば、回路基板上における面実装部
品の位置は一義的に定まり、正確な位置に部品搭載を行
なうことが出来ると共に面実装部品の方向誤マクも防止
することが出来る。According to the above-mentioned structure, the present invention provides a guide hole on the circuit board corresponding to the external structure for fixing the position and direction of the surface mount component according to the present invention, and the surface mount component is attached to the circuit board through the guide hole. By inserting and mounting, the position of the surface mount component on the circuit board is uniquely determined, the component can be mounted at an accurate position, and it is also possible to prevent the surface mount component from being oriented incorrectly.
実施例
第１図イは本発明の一実施例による面実装部品の斜視図
、第１図口はその実装断面図、第１図ノ・は第１図口の
底面図である。Embodiment FIG. 1A is a perspective view of a surface-mounted component according to an embodiment of the present invention, FIG. 1 is a sectional view of its mounting, and FIG.
図において、面実装部品１は本体１２８電極１１゜１３
及び実装する回路基板３に設けられた位置方向固定用の
ガイド穴３３に挿入するための突出部１４より構成され
る。今、上記ガイド穴３３と突出部１４の形状を第１図
ハに示す２等辺三角形の例のように回路基板３の平面内
に一義的に定まる形状に考慮すれば、面実装部品１は回
路基板３に対し正確な位置、正確な方向で実装されるこ
とになる。In the figure, the surface mount component 1 has a main body 128 electrodes 11°13
and a protrusion 14 for insertion into a guide hole 33 for fixing the position and direction provided in the circuit board 3 to be mounted. Now, if we consider the shapes of the guide hole 33 and the protrusion 14 to be uniquely defined within the plane of the circuit board 3, such as the isosceles triangle example shown in FIG. It will be mounted on the board 3 at a precise position and in a precise direction.
実際の実装後の状況は第１図口に示す通っである。ここ
で２は半田、３１．３２は回路基板３上の対向電極であ
る。The actual situation after implementation is as shown in Figure 1. Here, 2 is solder, and 31 and 32 are counter electrodes on the circuit board 3.
実際に回路基板に本発明による面実装部品を誤５ ベー
／゛
った方向で搭載しようとしても面実装部品はガイド穴に
挿入されず回路基板より浮上るため、正常挿入時との差
を面実装部品搭載機で検知することにより、不具合品の
検出を行うことが出来る。Even if a surface mount component according to the present invention is actually mounted on a circuit board in the wrong direction, the surface mount component will not be inserted into the guide hole and will float above the circuit board. Defective products can be detected by detecting them with a mounted component mounting machine.
又、第１図においては面実装部品の本体１２の底部に位
置・方向固定用の突出部１４を設けて説明しているが、
これと等価な機能を面実装部品の電極部１１．１３に設
けてもよい。Furthermore, in FIG. 1, a protrusion 14 for fixing the position and direction is provided at the bottom of the main body 12 of the surface mount component.
A function equivalent to this may be provided in the electrode section 11.13 of the surface mount component.
発明の効果
以上述べてきたように、本発明によれば、簡単な構造で
面実装部品が回路基板上に位置精度よく、かつ方向性も
正しく実装出来、実用上極めて有用である。Effects of the Invention As described above, according to the present invention, surface-mounted components can be mounted on a circuit board with good positional accuracy and directionality with a simple structure, and are extremely useful in practice.
第１図イは本発明の一実施例による面実装部品の斜視図
、第１図口は同じくその実装した状態の断面図、第１図
ハはその底面図、第２図イは従来の面実装部品の斜視図
、第２図口はその実装した状態の断面図である。
１・・・・面実装部品、２・・・・・・半田、３・・・
・・・回路基６へ−７
板、１２・・・・・・本体、１４・・・・・・突出部。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
第２図FIG. 1A is a perspective view of a surface mount component according to an embodiment of the present invention, FIG. 1A is a cross-sectional view of the mounted state, FIG. A perspective view of the mounted component, and the opening in FIG. 2 is a sectional view of the mounted component. 1...Surface mount components, 2...Solder, 3...
... To the circuit board 6 -7 Plate, 12 ... Main body, 14 ... Protrusion. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2
Claims (1)
ド穴に挿入固定可能な形状の位置決め部材を設けた面実
装部品。A surface mount component that has a positioning member that can be inserted and fixed into a guide hole on a circuit board for fixing the component position and direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10354587A JPS63268285A (en) | 1987-04-27 | 1987-04-27 | Surface mounting component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10354587A JPS63268285A (en) | 1987-04-27 | 1987-04-27 | Surface mounting component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63268285A true JPS63268285A (en) | 1988-11-04 |
Family
ID=14356807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10354587A Pending JPS63268285A (en) | 1987-04-27 | 1987-04-27 | Surface mounting component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63268285A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6640415B2 (en) | 1999-06-07 | 2003-11-04 | Formfactor, Inc. | Segmented contactor |
| US6690185B1 (en) | 1997-01-15 | 2004-02-10 | Formfactor, Inc. | Large contactor with multiple, aligned contactor units |
| US6741085B1 (en) | 1993-11-16 | 2004-05-25 | Formfactor, Inc. | Contact carriers (tiles) for populating larger substrates with spring contacts |
-
1987
- 1987-04-27 JP JP10354587A patent/JPS63268285A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6741085B1 (en) | 1993-11-16 | 2004-05-25 | Formfactor, Inc. | Contact carriers (tiles) for populating larger substrates with spring contacts |
| US7140883B2 (en) | 1993-11-16 | 2006-11-28 | Formfactor, Inc. | Contact carriers (tiles) for populating larger substrates with spring contacts |
| US6690185B1 (en) | 1997-01-15 | 2004-02-10 | Formfactor, Inc. | Large contactor with multiple, aligned contactor units |
| US6640415B2 (en) | 1999-06-07 | 2003-11-04 | Formfactor, Inc. | Segmented contactor |
| US7065870B2 (en) | 1999-06-07 | 2006-06-27 | Formfactor, Inc. | Segmented contactor |
| US7215131B1 (en) | 1999-06-07 | 2007-05-08 | Formfactor, Inc. | Segmented contactor |
| US7578057B2 (en) | 1999-06-07 | 2009-08-25 | Formfactor, Inc. | Method of fabricating segmented contactor |
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