JPH0488067A - Conductor paste - Google Patents
Conductor pasteInfo
- Publication number
- JPH0488067A JPH0488067A JP2201208A JP20120890A JPH0488067A JP H0488067 A JPH0488067 A JP H0488067A JP 2201208 A JP2201208 A JP 2201208A JP 20120890 A JP20120890 A JP 20120890A JP H0488067 A JPH0488067 A JP H0488067A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- weight
- glass frit
- adhesive strength
- oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 title abstract description 13
- 239000000843 powder Substances 0.000 claims abstract description 38
- 239000011521 glass Substances 0.000 claims abstract description 17
- 239000000853 adhesive Substances 0.000 abstract description 13
- 230000001070 adhesive effect Effects 0.000 abstract description 13
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 abstract description 7
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 239000011656 manganese carbonate Substances 0.000 abstract description 3
- 235000006748 manganese carbonate Nutrition 0.000 abstract description 3
- 229910000016 manganese(II) carbonate Inorganic materials 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 11
- 239000000919 ceramic Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 230000032683 aging Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 2
- 229940088601 alpha-terpineol Drugs 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- ZFZQOKHLXAVJIF-UHFFFAOYSA-N zinc;boric acid;dihydroxy(dioxido)silane Chemical compound [Zn+2].OB(O)O.O[Si](O)([O-])[O-] ZFZQOKHLXAVJIF-UHFFFAOYSA-N 0.000 description 2
- LNAZSHAWQACDHT-XIYTZBAFSA-N (2r,3r,4s,5r,6s)-4,5-dimethoxy-2-(methoxymethyl)-3-[(2s,3r,4s,5r,6r)-3,4,5-trimethoxy-6-(methoxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6r)-4,5,6-trimethoxy-2-(methoxymethyl)oxan-3-yl]oxyoxane Chemical compound CO[C@@H]1[C@@H](OC)[C@H](OC)[C@@H](COC)O[C@H]1O[C@H]1[C@H](OC)[C@@H](OC)[C@H](O[C@H]2[C@@H]([C@@H](OC)[C@H](OC)O[C@@H]2COC)OC)O[C@@H]1COC LNAZSHAWQACDHT-XIYTZBAFSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 101100513612 Microdochium nivale MnCO gene Proteins 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- AMWRITDGCCNYAT-UHFFFAOYSA-L manganese oxide Inorganic materials [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Paints Or Removers (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子回路のセラミック配線基板、特に低温焼
成多層配線基板に用いる導体用ペーストの組成に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to the composition of a conductor paste used in ceramic wiring boards for electronic circuits, particularly low-temperature fired multilayer wiring boards.
従来、セラミック配線基板には、セラミック基板として
アルミナ基板が、また、その導体用ペーストとしてＡＰ
＞−＾ｄ系などのペーストが主に用いられてきた。Conventionally, ceramic wiring boards have been made using alumina substrates as ceramic substrates and AP as conductor pastes.
>-^d-based pastes have been mainly used.
最近、さらに高密度の配線を達成するために、低温焼成
多層配線基板が開発されている。この基板には、アルミ
ナの他に低温で焼成が可能なように、ガラスなどの低融
点化合物が含まれている。Recently, low-temperature firing multilayer wiring boards have been developed in order to achieve even higher density wiring. In addition to alumina, this substrate contains a low melting point compound such as glass so that it can be fired at low temperatures.
［発明が解決しようとする課題〕
このガラスを含んだ基板に、従来から用いられているＡ
ｇ−Ａｄ系などの導体ペーストを用いると、はんだぬれ
が悪くなったり、接着強度、特に１５０°Ｃ程度の高温
エーシング後の接着強度が低下するという欠点があった
。[Problem to be solved by the invention] The A that has been conventionally used for this glass-containing substrate
The use of conductor pastes such as g-Ad type has disadvantages in that solder wetting becomes poor and adhesive strength, especially after high temperature icing at about 150°C, decreases.
［課題を解決するための手段〕
本発明者らは、低温焼成基板に適した導体ベストの組成
について研究した結果、従来のＡｇ−ＰｄペーストにＭ
ｎの酸化物、Ｃｒ２Ｏ３およびガラスフリットを特定量
添加すれば、この欠点が解消できるとの知見を得て、本
発明を完成させるに至った。[Means for Solving the Problems] As a result of research on the composition of a conductor vest suitable for low-temperature fired substrates, the present inventors found that M
The present invention was completed based on the finding that this drawback can be overcome by adding specific amounts of n oxide, Cr2O3, and glass frit.
すなわち、本発明の要旨は、Ａｇ粉末とＰｄ’ｌｊ）末
の含量に対し、Ａｇ粉末が７０〜９５重量％、Ｐｄ粉末
が５〜３０重量％、Ｍｎの酸化物またはＭｎＣＯ３粉来
がＭｎＯ換算で０．１〜２重量％、Ｃｒｚ（ｈ粉末が０
．２〜３重量％、ガラスフリットが０．２〜５重量％お
よび適量の有機ビヒクルからなる導体ペーストにある。That is, the gist of the present invention is that, with respect to the content of Ag powder and Pd'lj) powder, Ag powder is 70 to 95% by weight, Pd powder is 5 to 30% by weight, and Mn oxide or MnCO3 powder is MnO equivalent. 0.1 to 2% by weight, Crz (h powder is 0.
．． 2-3% by weight of glass frit, 0.2-5% by weight of glass frit and a suitable amount of organic vehicle.
ＡｇとＰｃｌの比率は、厚膜の混成集積回路に用いられ
る範囲、すなわち八ｇが７０〜９５重量％、Ｐｄが５〜
３０重量％にあればよい。Ｐｄが５重量％未満では、／
ｌ［のマイグレーションが起りやず（、またはんだくわ
れしやすい。一方、３０重量％を超えると、シート抵抗
値が高くなり、また、はんだぬれ性が低下する。The ratio of Ag and Pcl is in the range used for thick film hybrid integrated circuits, i.e. 8g is 70-95% by weight and Pd is 5-95% by weight.
It is sufficient if the amount is 30% by weight. When Pd is less than 5% by weight, /
Migration of 1 does not occur (or it is easily soldered). On the other hand, if it exceeds 30% by weight, the sheet resistance value increases and the solder wettability decreases.
Ｍｎの酸化物としては、Ｍｎ０ｚ、 ＭｎｚＯ：＋、
Ｍｎ３Ｏ４，ＭｎＯが使用できる。また、ＭｎＣ（Ｌ＋
も使用できる。Examples of Mn oxides include Mn0z, MnzO:+,
Mn3O4 and MnO can be used. In addition, MnC(L+
can also be used.
これらＭｎの化合物を、へＦ、粉末とＰｄ粉末の含量に
対して、ＭｎＯ換算で０．１〜２重量％添加することに
より、例えば１５０°Ｃ１１００時間の高温エージング
後の接着強度を高くすることができる。０．１重量％未
満ではエージング後の接着強度が低く、また、２重量％
を超えると、初期の接着強度が低下する。By adding these Mn compounds in an amount of 0.1 to 2% by weight in terms of MnO based on the content of F powder and Pd powder, the adhesive strength after high temperature aging at 150° C. for 1100 hours can be increased. I can do it. If it is less than 0.1% by weight, the adhesive strength after aging will be low;
If it exceeds this, the initial adhesive strength will decrease.
初期の接着強度は、２ｋｇ／２ｍｍ角以上あることが、
部品を実装するうえで好ましい。また、高温エーシング
後の接着強度は、１．５ｋｇ／２ｍｍ角以上あることが
望ましい。The initial adhesive strength must be 2 kg/2 mm square or more.
Preferable for mounting parts. Further, it is desirable that the adhesive strength after high-temperature icing is 1.5 kg/2 mm square or more.
ＣｒｚＯ３は、はんだぬれ性の向上に効果があり、その
量はＡｇ粉末とＰｄ粉末の合量に対し、０．２〜３重量
％である。０．２未満ではその効果が少なく、３重量％
を超えると接着強度が低下する。CrzO3 is effective in improving solder wettability, and its amount is 0.2 to 3% by weight based on the total amount of Ag powder and Pd powder. If it is less than 0.2, the effect is small and 3% by weight.
If it exceeds this, the adhesive strength will decrease.
ガラスフリットは、Ａ、粉末とＰｄ粉末の含量に対し、
０．２〜５重量％である。この量が少ないと接着強度が
低下する。反対に多いとはんだぬれ性が悪くなる。Glass frit has A, powder and Pd powder content,
It is 0.2 to 5% by weight. If this amount is small, the adhesive strength will decrease. On the other hand, if it is too large, the solderability will be poor.
ガラスフリットとしては、６５０〜９００°Ｃの熱処理
で結晶化が進むもの、例えばチタン酸ケイ酸亜鉛系のガ
ラスが好ましい。結晶化が進まないガラスフリットは、
導体焼成後に抵抗体を焼成するなどの処理をした場合、
ガラス成分が導体表面ににじみ出し、はんだぬれ性を低
下させることがある。The glass frit is preferably one whose crystallization progresses through heat treatment at 650 to 900°C, such as zinc titanate silicate glass. Glass frit that does not crystallize,
If the resistor is fired after the conductor is fired,
Glass components may bleed onto the conductor surface, reducing solderability.
有機ビヒクルとしては、エチルセルロース、メチルセル
ロース、メタクリレート等の樹脂をαテルピネオール
に溶かしたものが用いられる。その量は、印刷性を考慮
して適量用いられるが、通常、Ａｇ粉末とＰｄ粉末の合
量に対し、１０〜４０重量％である。As the organic vehicle, a resin such as ethyl cellulose, methyl cellulose, methacrylate, etc. dissolved in α-terpineol is used. The amount used is appropriate considering printability, but is usually 10 to 40% by weight based on the total amount of Ag powder and Pd powder.
Ａｇ粉末およびＰｄ粉末は、印刷性の点から、平均粒径
がそれぞれ０． ３ 〜２． ５ ｕｍ， ０． ３
〜１． ５ ｕｍの球形に近いものが好ましい。The Ag powder and the Pd powder each have an average particle size of 0.05 mm from the viewpoint of printability. 3 ~2. 5 um, 0. 3
~1. It is preferable to have a shape close to a sphere of 5 um.
Ｍｎの酸化物およびＭｎＣＯ３粉末ば平均粒径が５μｍ
以下、また、ＣｒｚＯｚ粉末及びガラスフリットは平均
粒径が３μｍ以下のものが望ましい。Mn oxide and MnCO3 powder have an average particle size of 5 μm
Hereinafter, it is desirable that the CrzOz powder and glass frit have an average particle size of 3 μm or less.
なお、セラミック基板は、その材質としてアルミナなど
のセラミックスにホウケイ酸亜鉛系などのガラスを混合
したものに対して、特に本発明の効果がある。Note that the present invention is particularly effective for ceramic substrates made of ceramics such as alumina mixed with glass such as zinc borosilicate.
原材料
Ａｇ粉末は昭栄化学■製の平均粒径的１μｍのものを、
Ｐｄ粉末は住人金属鉱山■製の平均粒径的０、５μｍの
ものを用いた。ＭｎＯ□， ＭｎＣ（Ｌ＋およびＣｒ２
０３は関東化学■製の試薬を、Ｍｎ２０３， Ｍｎ３０
４およびＭｎＯは■高純度化学研究断裂の試薬を用いた
。The raw material Ag powder was manufactured by Shoei Kagaku ■ with an average particle size of 1 μm.
Pd powder with an average particle size of 0.5 .mu.m was used, manufactured by Susumu Metal Mining ■. MnO□, MnC (L+ and Cr2
03 is a reagent manufactured by Kanto Kagaku ■, Mn203, Mn30
4 and MnO, high purity chemical research rupture reagents were used.
ガラスフリットは、その組成が重量％で、Ｓｉ０２３３
、 ＴｉＯｚ １３， 八１２０３ １８，
Ｂ２０３２． ＺｎＯ１７， ＣａＯＬ７になるよ
うに配合し、白金るつは中、１，４００°ＣＴ：溶融し
、急冷後、ボールミルで粉砕した。そのガラスフリット
は、８５０°Ｃで熱処理することにより、結晶が析出す
ることをＸ線回折で確認した。The glass frit has a composition in weight% of Si0233
, TiOz 13, 81203 18,
B2032. ZnO17 and CaOL7 were blended, melted in a platinum melting medium at 1,400°C, rapidly cooled, and then ground in a ball mill. It was confirmed by X-ray diffraction that crystals were precipitated from the glass frit by heat treatment at 850°C.
基板の作製
へ１□０３粉末とホウケイ酸亜鉛系のガラス粉末を１＝
１に混合し、バインダーを加えシート状に成形した。こ
れを８５０°Ｃで焼成して、厚み０． ８ ｍｍの基板
を得た。To prepare the substrate, add 1□03 powder and zinc borosilicate glass powder to 1=
1, a binder was added, and the mixture was formed into a sheet. This was fired at 850°C to a thickness of 0. An 8 mm substrate was obtained.
導体ペーストの作製
エチルセルローズをα−テルピネオールに溶解し、ビヒ
クルを作製した。このビヒクルに前記のＡｇ， Ｐｄ，
ＭｎＯｚ， ＭｎｚＯａ． Ｍｎ３０ａ＋ ＭｎＯ
、 ＭｎＣＯ：＋ 。Preparation of conductor paste Ethyl cellulose was dissolved in α-terpineol to prepare a vehicle. In this vehicle, the above-mentioned Ag, Pd,
MnOz, MnzOa. Mn30a+ MnO
, MnCO:+.
Ｃｒ２０３及びガラスフリットの各粉末を所定量加え、
：本ロールミルで混練し、導体ペーストを得た。Add predetermined amounts of each powder of Cr203 and glass frit,
: Kneaded with this roll mill to obtain a conductor paste.
試験用試料の作製
２５０メツシユのスクリーンを用いて、２インチ角の大
きさにした」１記基板に２ｍｍ角の導体ペーストのパッ
ドを２０個印刷した。これを大気中で８５０゛Ｃ１１０
分間焼成し、試料を得た。Preparation of test sample: Using a 250 mesh screen, 20 2 mm square pads of conductive paste were printed on a 2 inch square substrate. This was heated to 850゛C110 in the atmosphere.
A sample was obtained by baking for a minute.
はんだぬれ性の評価
上記の試料を、２３０°ＣのＡｇ ２％人共品ハンダ中
に５秒間浸漬し、導体がはんだに濡れる面積の割合を求
めた。Evaluation of solder wettability The above sample was immersed in Ag 2% commercially available solder at 230°C for 5 seconds, and the ratio of the area of the conductor wetted by the solder was determined.
初期の接着強度の測定
０．８ｍｍ径のＳｎメツキ銅線をＬ字型にし、その水平
部分を上記試料のパッドにはんだ付けし、その垂直部分
を引張することにより、パッドが基板から剥がれたとき
の強度を測定した。Initial adhesive strength measurement A Sn-plated copper wire with a diameter of 0.8 mm was formed into an L shape, its horizontal part was soldered to the pad of the above sample, and its vertical part was pulled, and when the pad was peeled off from the board. The strength was measured.
高温エージング後の接着強度の測定
リード線を上記試料のパッドにはんだ付けしたのち、１
５０°Ｃの槽内に１００時間放置し、槽から取り出し、
そのリード線を引張することにより、パッドが基板から
剥れたときの強度を測定した。Measurement of adhesive strength after high temperature aging After soldering the lead wire to the pad of the above sample, 1.
Leave it in a tank at 50°C for 100 hours, remove it from the tank,
By pulling the lead wire, the strength when the pad was peeled off from the substrate was measured.
これらの結果を表１に示す。These results are shown in Table 1.
〔発明の効果］
本発明の導体ペーストを用いることにより、基板に焼付
けられた導体ははんだぬれ性が良好であり、また、初期
の接着強度およびエージング後の接着強度を高くするこ
とができる。[Effects of the Invention] By using the conductor paste of the present invention, the conductor baked onto the substrate has good solderability, and the initial adhesive strength and the adhesive strength after aging can be increased.
特許出願人 日本セメント株式会社Patent applicant: Nippon Cement Co., Ltd.
Claims (1)
０〜９５重量％、Ｐｄ粉末が５〜３０重量％、Ｍｎの酸
化物またはＭｎＣＯ＿３粉末がＭｎＯ換算で０．１〜２
重量％、Ｃｒ＿２Ｏ＿３粉末が０．２〜３重量％、ガラ
スフリツトが０．２〜５重量％および適量の有機ビヒク
ルからなる導体ペースト。(1) Ag powder is 7% compared to the total amount of Ag powder and Pd powder.
0 to 95% by weight, Pd powder 5 to 30% by weight, Mn oxide or MnCO_3 powder 0.1 to 2 in terms of MnO
% by weight, 0.2-3% by weight of Cr_2O_3 powder, 0.2-5% by weight of glass frit and an appropriate amount of organic vehicle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20120890A JP2917457B2 (en) | 1990-07-31 | 1990-07-31 | Conductor paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20120890A JP2917457B2 (en) | 1990-07-31 | 1990-07-31 | Conductor paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0488067A true JPH0488067A (en) | 1992-03-19 |
| JP2917457B2 JP2917457B2 (en) | 1999-07-12 |
Family
ID=16437145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20120890A Expired - Lifetime JP2917457B2 (en) | 1990-07-31 | 1990-07-31 | Conductor paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2917457B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6338893B1 (en) | 1998-10-28 | 2002-01-15 | Ngk Spark Plug Co., Ltd. | Conductive paste and ceramic printed circuit substrate using the same |
| JP2005063975A (en) * | 2003-08-14 | 2005-03-10 | E I Du Pont De Nemours & Co | Thick-film conductor paste for automotive glass |
| JP2016032185A (en) * | 2014-07-29 | 2016-03-07 | 京セラクリスタルデバイス株式会社 | Crystal device |
| KR20190072424A (en) * | 2017-12-15 | 2019-06-25 | 스미토모 긴조쿠 고잔 가부시키가이샤 | Powder composition for forming thick film conductor and paste for forming thick film conductor |
| JP2019110105A (en) * | 2017-12-15 | 2019-07-04 | 住友金属鉱山株式会社 | Powder composition for forming thick film conductor and paste for forming thick film conductor |
| JP2020202154A (en) * | 2019-06-13 | 2020-12-17 | 住友金属鉱山株式会社 | Powder composition for forming thick film conductor and paste for forming thick film conductor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006049098A1 (en) * | 2004-11-02 | 2006-05-11 | Matsushita Electric Industrial Co., Ltd. | Image sensor |
| JP2009049858A (en) * | 2007-08-22 | 2009-03-05 | Canon Inc | Imaging apparatus |
| JP2011061514A (en) * | 2009-09-10 | 2011-03-24 | Fujifilm Corp | Imaging apparatus and imaging method |
| JP2011082790A (en) * | 2009-10-07 | 2011-04-21 | Canon Inc | Imaging apparatus |
-
1990
- 1990-07-31 JP JP20120890A patent/JP2917457B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006049098A1 (en) * | 2004-11-02 | 2006-05-11 | Matsushita Electric Industrial Co., Ltd. | Image sensor |
| JP2009049858A (en) * | 2007-08-22 | 2009-03-05 | Canon Inc | Imaging apparatus |
| JP2011061514A (en) * | 2009-09-10 | 2011-03-24 | Fujifilm Corp | Imaging apparatus and imaging method |
| JP2011082790A (en) * | 2009-10-07 | 2011-04-21 | Canon Inc | Imaging apparatus |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6338893B1 (en) | 1998-10-28 | 2002-01-15 | Ngk Spark Plug Co., Ltd. | Conductive paste and ceramic printed circuit substrate using the same |
| JP2005063975A (en) * | 2003-08-14 | 2005-03-10 | E I Du Pont De Nemours & Co | Thick-film conductor paste for automotive glass |
| JP2016032185A (en) * | 2014-07-29 | 2016-03-07 | 京セラクリスタルデバイス株式会社 | Crystal device |
| KR20190072424A (en) * | 2017-12-15 | 2019-06-25 | 스미토모 긴조쿠 고잔 가부시키가이샤 | Powder composition for forming thick film conductor and paste for forming thick film conductor |
| JP2019110105A (en) * | 2017-12-15 | 2019-07-04 | 住友金属鉱山株式会社 | Powder composition for forming thick film conductor and paste for forming thick film conductor |
| TWI796400B (en) * | 2017-12-15 | 2023-03-21 | 日商住友金屬鑛山股份有限公司 | Powder composition for forming thick film conductor and paste for forming thick film conductor |
| JP2020202154A (en) * | 2019-06-13 | 2020-12-17 | 住友金属鉱山株式会社 | Powder composition for forming thick film conductor and paste for forming thick film conductor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2917457B2 (en) | 1999-07-12 |
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