JPH0474431U - - Google Patents
Info
- Publication number
- JPH0474431U JPH0474431U JP11810790U JP11810790U JPH0474431U JP H0474431 U JPH0474431 U JP H0474431U JP 11810790 U JP11810790 U JP 11810790U JP 11810790 U JP11810790 U JP 11810790U JP H0474431 U JPH0474431 U JP H0474431U
- Authority
- JP
- Japan
- Prior art keywords
- window
- tab tape
- tape
- olb
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Wire Bonding (AREA)
Description
第1図は本考案のTABテープの表面を示す図
であり、第2図は本考案のTABテープの裏面を
示す図である。第3図、第4図および第5図は従
来のTABテープの例を示す図である。
1……TABテープ、2……スプロケツトホー
ル、3……OLB用窓、4……IC、5……試験
用パツド、6……OLB用リード部、7……配線
パターン。
FIG. 1 is a diagram showing the front surface of the TAB tape of the present invention, and FIG. 2 is a diagram showing the back surface of the TAB tape of the present invention. FIGS. 3, 4, and 5 are diagrams showing examples of conventional TAB tapes. 1...TAB tape, 2...Sprocket hole, 3...Window for OLB, 4...IC, 5...Test pad, 6...Lead part for OLB, 7...Wiring pattern.
Claims (1)
Bテープにおいて、各配線パターンに設けられる
試験用パツドをTABテープのOLB用窓の内側
の表面および裏面に2群に分けて設けたことを特
徴とするTABテープ。 TA with window for outer lead bonding
A TAB tape characterized in that, in the B tape, test pads provided for each wiring pattern are divided into two groups and provided on the front and back surfaces inside the OLB window of the TAB tape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11810790U JPH0474431U (en) | 1990-11-09 | 1990-11-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11810790U JPH0474431U (en) | 1990-11-09 | 1990-11-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0474431U true JPH0474431U (en) | 1992-06-30 |
Family
ID=31866012
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11810790U Pending JPH0474431U (en) | 1990-11-09 | 1990-11-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0474431U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101826510A (en) * | 2009-03-04 | 2010-09-08 | 恩益禧电子股份有限公司 | TCP N-type semiconductor N device |
-
1990
- 1990-11-09 JP JP11810790U patent/JPH0474431U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101826510A (en) * | 2009-03-04 | 2010-09-08 | 恩益禧电子股份有限公司 | TCP N-type semiconductor N device |
JP2010206027A (en) * | 2009-03-04 | 2010-09-16 | Renesas Electronics Corp | Tcp semiconductor device |
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