JPH0353844U - - Google Patents
Info
- Publication number
- JPH0353844U JPH0353844U JP11450789U JP11450789U JPH0353844U JP H0353844 U JPH0353844 U JP H0353844U JP 11450789 U JP11450789 U JP 11450789U JP 11450789 U JP11450789 U JP 11450789U JP H0353844 U JPH0353844 U JP H0353844U
- Authority
- JP
- Japan
- Prior art keywords
- test pad
- olb
- tab
- wiring pattern
- tab tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案のＴＡＢテープの表面図、第２
図は本考案の試験用パツド周辺図、第３図は従来
のＴＡＢテープの例を示す図、第４図は従来のＴ
ＡＢテープの配線パターン短絡不良の例を示す図
である。
１０１……ＴＡＢテープ、１０２……スプロケ
ツトホール、１０３……ＯＬＢ用窓、１０４……
ＩＣ、１０５……試験用パツド、１０６……ＯＬ
Ｂ用リード部、１０７……配線パターン、２０１
……ＯＬＢ用窓、２０２……試験用パツド、２０
３……ＯＬＢ用リード部、３０１……ＴＡＢテー
プ、３０２……スプロケツトホール、３０３……
ＯＬＢ用窓、３０４……ＩＣ、３０５……試験用
パツド、３０６……ＯＬＢ用リード部、３０７…
…配線パターン、４０１……ＯＬＢ用窓、４０２
……試験用パツド、４０３……ＯＬＢ用リード部
、４０４……短絡不良箇所。
Figure 1 is a surface view of the TAB tape of the present invention, Figure 2
The figure shows a peripheral view of the test pad of the present invention, Figure 3 shows an example of a conventional TAB tape, and Figure 4 shows a conventional TAB tape.
It is a figure which shows the example of the wiring pattern short-circuit defect of AB tape. 101...TAB tape, 102...Sprocket hole, 103...OLB window, 104...
IC, 105...Test pad, 106...OL
Lead part for B, 107...Wiring pattern, 201
... OLB window, 202 ... Test pad, 20
3... Lead part for OLB, 301... TAB tape, 302... Sprocket hole, 303...
OLB window, 304...IC, 305...test pad, 306...OLB lead part, 307...
...Wiring pattern, 401...OLB window, 402
...Test pad, 403...OLB lead part, 404...Short-circuit defective location.
Claims (1)
テープにおいて、該試験用パツドの形状を円形と
することを特徴とするＴＡＢテープ。 TAB with test pads on each wiring pattern
A TAB tape characterized in that the test pad has a circular shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11450789U JPH0353844U (en) | 1989-09-29 | 1989-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11450789U JPH0353844U (en) | 1989-09-29 | 1989-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0353844U true JPH0353844U (en) | 1991-05-24 |
Family
ID=31662872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11450789U Pending JPH0353844U (en) | 1989-09-29 | 1989-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0353844U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008078668A (en) * | 2007-09-28 | 2008-04-03 | Kyocera Corp | Package for housing solid-state imaging sensor and imaging device |
-
1989
- 1989-09-29 JP JP11450789U patent/JPH0353844U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008078668A (en) * | 2007-09-28 | 2008-04-03 | Kyocera Corp | Package for housing solid-state imaging sensor and imaging device |
| JP4646960B2 (en) * | 2007-09-28 | 2011-03-09 | 京セラ株式会社 | Package for storing solid-state imaging device and imaging apparatus |