JPH0466159A - Rotary type coating apparatus - Google Patents
Rotary type coating apparatusInfo
- Publication number
- JPH0466159A JPH0466159A JP2179974A JP17997490A JPH0466159A JP H0466159 A JPH0466159 A JP H0466159A JP 2179974 A JP2179974 A JP 2179974A JP 17997490 A JP17997490 A JP 17997490A JP H0466159 A JPH0466159 A JP H0466159A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- rotary
- rotary table
- coating
- rotating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 118
- 239000011248 coating agent Substances 0.000 title claims abstract description 111
- 239000000758 substrate Substances 0.000 claims abstract description 163
- 239000007788 liquid Substances 0.000 claims abstract description 118
- 239000002699 waste material Substances 0.000 claims abstract description 17
- 238000004140 cleaning Methods 0.000 claims description 53
- 239000003595 mist Substances 0.000 abstract description 19
- 230000002093 peripheral effect Effects 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 6
- 238000011084 recovery Methods 0.000 abstract description 3
- 239000002904 solvent Substances 0.000 description 11
- 239000010408 film Substances 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000009834 vaporization Methods 0.000 description 4
- 230000008016 vaporization Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、液晶表示パネル用のガラス基板、半導体ウェ
ハ、半導体装置製造用のマスク基板などの基板の表面に
フォトレジスト液などの塗布液を薄膜状に塗布する際に
用いる回転式塗布装置に関する。[Detailed Description of the Invention] <Industrial Application Field> The present invention applies a coating liquid such as a photoresist liquid to the surface of a substrate such as a glass substrate for a liquid crystal display panel, a semiconductor wafer, or a mask substrate for manufacturing semiconductor devices. The present invention relates to a rotary coating device used for coating in the form of a thin film.
〈従来の技術〉
この種の回転式塗布装置は、水平な回転台上に基板を搭
載支持し、基板上面中央部シこ滴下した塗布液を基板の
回転に伴う遠心力によって外周側に拡張離散させて基亭
反上面二こ均一な１模を塗布形成するものであり、いわ
ゆる開放型と閉鎖型とに大別できる。<Prior art> This type of rotary coating device supports a substrate mounted on a horizontal rotary table, and spreads and disperses the coating liquid dropped onto the center of the top surface of the substrate toward the outer circumference by centrifugal force as the substrate rotates. A uniform pattern is formed on the upper surface of the base by coating, and can be roughly divided into so-called open type and closed type.
開放型の回転式塗布装置は、基板上方を開放した状態、
すなわち、回転時に基板が周囲大気に対して風を切る状
態で塗布処理を行うもので、基板回転時の気流が膜厚の
分布に余り影響を及ぼさない、略円形状の基板（例えば
、半導体ウェハ）などに主として用いられている。The open-type rotary coating device has the upper part of the substrate open,
In other words, the coating process is performed while the substrate is exposed to the surrounding air while being rotated, and the coating process is performed on approximately circular substrates (for example, semiconductor wafers) where the air flow during substrate rotation does not have much effect on the film thickness distribution. ), etc.
これに対し閉鎖型の回転式塗布装置は、回転周速度が太
き（なる大型の基板や風切りによる気流の乱れが発生し
易い角形基板（例えば、液晶表示器用のガラス基板）の
塗布処理に適しており、この形式の装置は、基板を容器
の中に収納装填して容器と共に回転させもので、次の特
徴を有する。On the other hand, closed-type rotary coating equipment is suitable for coating large substrates with a high peripheral rotational speed (such as glass substrates for liquid crystal display devices) and square substrates that are prone to airflow disturbance due to wind. This type of device is one in which the substrate is loaded into a container and rotated together with the container, and has the following features.
回転容器に基板を収納した状態で回転塗布することによ
って、基板の周囲を塗布液溶剤雰囲気とし、回転によっ
て生しる風の影響、すなわち基板表面において風が強く
当たる部分で塗布液溶剤成分の気化が他よりも促進され
て、そこだけ塗布液の粘度が高くなるために部分的に膜
厚が厚くなるという影響を、防止するものである。つま
り、塗布液溶剤雰囲気とすることによって、風が強く当
たっても、風による影響を生じないようにして、Ｍ厚ム
ラの発生を押さえることができるｖＦ徴を有している。By rotating and coating the substrate while it is housed in a rotating container, a coating solution solvent atmosphere is created around the substrate, and the influence of the wind generated by the rotation, that is, the vaporization of the coating solution solvent components on the parts of the substrate surface that are strongly hit by the wind, is reduced. This prevents the effect that the film thickness becomes thicker in some areas because the viscosity of the coating liquid increases in those areas where the coating liquid is promoted more than in other areas. In other words, by creating a coating solution solvent atmosphere, even if the wind blows strongly, there is no effect of the wind, and the vF characteristic can be suppressed to suppress the occurrence of M thickness unevenness.
このような閉鎖型の回転式塗布装置の一例として、特開
平１−１３５５６５号公報で開示されたものが知られて
いる。As an example of such a closed-type rotary coating device, one disclosed in Japanese Patent Laid-Open No. 1-135565 is known.
〈発明が解決しようとする課題〉
上記公知装置は気流による悪影響を受けることなく、均
一な厚さのＦｉｌｌ！を塗布形成できるものであるが、
塗布処理中に容器内に飛散浮遊する塗布液のミストが基
板の下面に回り込んで付着しやすく、付着固化した塗布
液が基板下面を汚染して、後の露光工程やエンチング工
程に悪影響を及ぼしたり、基板の透過性を悪化させたり
するなどの問題点がある。<Problems to be Solved by the Invention> The above-mentioned known device is capable of producing a uniform thickness of Fill! without being adversely affected by airflow. Although it can be formed by coating,
During the coating process, the mist of the coating solution that floats in the container easily wraps around and adheres to the bottom surface of the substrate, and the adhered and solidified coating solution contaminates the bottom surface of the substrate, adversely affecting the subsequent exposure and etching processes. There are also problems such as deterioration of the transparency of the substrate.
このような場合、塗布処理後に基板下面を洗浄処理する
工程を別途設けると、工程数が増えて生産性が低下する
のみならず、そのための設備および運転コストを必要と
してコスト高になるものであった。In such a case, if a separate process for cleaning the bottom surface of the substrate is provided after the coating process, not only will the number of processes increase and productivity decrease, but the equipment and operating costs for this will also be required, resulting in high costs. Ta.
一方、上述した開放型の回転式塗布装置にあっては、例
えば特公昭５Ｂ−１９３５０号公報に開示された装置の
ように、基板の回転塗布時に基板下面へ向けて洗浄液を
吹き付けて、基板下面への塗布液の付着を防止したもの
が揚案されている。On the other hand, in the above-mentioned open-type rotary coating apparatus, such as the apparatus disclosed in Japanese Patent Publication No. 5B-19350, cleaning liquid is sprayed toward the lower surface of the substrate during rotational coating of the substrate. A method has been proposed that prevents the coating liquid from adhering to the surface.
しかし、上記のような基板下面洗浄機構を、密閉型の回
転式塗布装置に通用することは、構造上の困難性が高い
ために、従来、大形基板や角形基板に好適な回転式塗布
装置において、基板下面への塗布液の回り込みを有効に
防止した装置はなく、その実現が望まれていた。However, it is structurally difficult to apply the above-mentioned substrate bottom surface cleaning mechanism to a closed type rotary coating device. However, there is no device that effectively prevents the coating liquid from leaking to the bottom surface of the substrate, and the realization of such a device has been desired.
本発明はこのような実情に着目してなされたものであっ
て、回転によって生しる風に起因する膜厚の不均一性の
解消と、基板の下面への塗布液のミストの付着の解消の
双方を両立した回転式塗布装置を提供することを目的と
する。The present invention has been made in view of these circumstances, and aims to eliminate the non-uniformity in film thickness caused by wind generated by rotation, and to eliminate the adhesion of coating liquid mist to the bottom surface of the substrate. The purpose of the present invention is to provide a rotary coating device that achieves both of the following.
〈課題を解決するための手段〉
上記目的を達成するために本発明は次のような構成をさ
る。<Means for Solving the Problems> In order to achieve the above object, the present invention has the following configuration.
すなわち、請求項（＋）に記載の第１の発明は、基板を
水平回転することによって、塗布液を基板上面に均一に
塗布する回転式塗布装置において、基板の外形と同等以
上の大きさを有し、基板を水平支持した状態で回転させ
る回転台と、この回転台の上面と基板下面との間に間隙
ができるように、前記回転台上に立設された基板支持用
の突出体と、
この回転台上に支持された基板の上面と所定の小間隔を
もって平行に配備されるとともに、基板の外形と同等以
上の大きさを有し、かつ、回転台と一体に回転される上
部回転板と、
前記突出体に支持された基板の下面に向けて、前記回転
台の回転軸を通して洗浄液を供給する洗浄液供給機構と
、
を備えたものである。That is, the first invention described in claim (+) is a rotary coating device that uniformly applies a coating liquid to the upper surface of a substrate by horizontally rotating the substrate. a rotary table for rotating the substrate while horizontally supporting the substrate; a protrusion for supporting the substrate that is erected on the rotary table so as to create a gap between the upper surface of the rotary table and the lower surface of the substrate; , an upper rotating section that is arranged parallel to the upper surface of the substrate supported on the rotating table at a predetermined small interval, has a size equal to or larger than the external shape of the substrate, and is rotated integrally with the rotating table. The cleaning liquid supply mechanism includes: a plate; and a cleaning liquid supply mechanism that supplies cleaning liquid through a rotating shaft of the rotary table toward the lower surface of the substrate supported by the protruding body.
また、請求項（２）に記載の第２の発明は、基板を水平
回転することによって、塗布液を基板上面に均一に塗布
する回転式塗布装置において、基板の外形より大きく、
基板を水平支持した状態で回転させる回転台と、
回転台の上面と基板の下面との間に間隙ができるように
、回転台上に立設された基板支持用の突出体と、
回転台と一体に回転され、基板の上下および回転台の半
径方向外側を囲み、廃液の排出部が形成され、少なくと
も一部が開閉可能な回転容器と、突出体に支持された基
板の下面に向けて、回転台の回転軸を通して洗浄液を供
給する洗浄液供給機構と、
を備えたものである。A second aspect of the invention as set forth in claim (2) is a rotary coating device that uniformly applies a coating liquid to an upper surface of a substrate by horizontally rotating the substrate.
A rotary table that rotates the substrate while horizontally supporting it; a protrusion for supporting the substrate that is erected on the rotary table so as to create a gap between the top surface of the rotary table and the bottom surface of the substrate; and the rotary table. A rotary container that is rotated together, surrounds the upper and lower sides of the substrate and the radial outside of the rotary table, has a waste liquid discharge part formed therein, and is at least partially openable and closable, and is directed toward the lower surface of the substrate supported by the protruding body A cleaning liquid supply mechanism that supplies cleaning liquid through a rotating shaft of a rotary table.
〈作用〉
第１の発明の作用は次のとおりである０回転台と上部回
転板との間に形成された偏平な塗布処理空間の空気層は
、偏平な空間であるが故に粘性流体のような挙動をとり
、一体に回転する回転台と上部回転板と供に連れ回りし
て塗布処理空間内に収まっている基板の表面での気流の
発生はない。<Operation> The operation of the first invention is as follows.Since the air layer in the flat coating processing space formed between the zero rotation table and the upper rotation plate is a flat space, it is like a viscous fluid. There is no air flow generated on the surface of the substrate, which rotates together with the rotary table and the upper rotary plate and is housed in the coating processing space.
このため、基板表面には風が生しないから、風によって
生しる塗布液溶剤成分の気化促進および塗布液粘度の上
昇と言った不都合がなく、基板上面全域に均一な薄膜が
形成される。Therefore, since no wind is generated on the substrate surface, a uniform thin film is formed over the entire upper surface of the substrate without the disadvantages of accelerated vaporization of coating solution solvent components and increase in coating solution viscosity caused by wind.
また、このような塗布処理中および処理後、基板は、基
板の外形と同等以上の大きさを有する回転台に立設され
た突出体に支持され、基板の下面は回転台との間の間隙
が形成されており、この間隙の中へ、回転台の回転軸を
介して導入された洗浄液が回転する基板の下面へ向けて
供給され、基板下面に付着した塗布液が洗浄除去され、
あるいは基板下面と回転台との間隙へ侵入した塗布液ミ
ストが基板下面に付着するのが阻止される。Also, during and after such coating processing, the substrate is supported by a protrusion mounted on a rotary table having a size equal to or larger than the outer shape of the substrate, and the lower surface of the substrate is placed in the gap between the rotary table and the substrate. A cleaning liquid is introduced into this gap through the rotating shaft of the rotary table and is supplied toward the lower surface of the rotating substrate, and the coating liquid adhering to the lower surface of the substrate is cleaned and removed.
Alternatively, coating liquid mist that has entered the gap between the lower surface of the substrate and the rotary table is prevented from adhering to the lower surface of the substrate.
なお、前記塗布処理空間における回転台の半径方向外側
は、開放しているため、洗浄液や基板から飛散した余剰
塗布液ミスト等の廃液は、塗布処理空間から速やかに排
除される。Note that, since the radially outer side of the rotary table in the coating processing space is open, waste liquids such as cleaning liquid and excess coating liquid mist scattered from the substrate are quickly removed from the coating processing space.
第２の発明の作用は次のとおりである。The operation of the second invention is as follows.
基板の上下および回転台の半径方向外側を囲む回転容器
内に基板を装填して回転することによって、基板に供給
された塗布液が周囲に拡散流動して基板上面に薄膜が塗
布形成されるものであるが、この際、回転容器内は塗布
液剤雰囲気にあり、基板表面に風が当たっても、そこだ
けが塗布液溶剤の気化が他よりも進行するのを阻止し、
風による影響は生しないから、基板上面全域に均一な薄
膜が形成される。By loading the substrate into a rotating container that surrounds the top and bottom of the substrate and the radial outside of the rotary table and rotating it, the coating liquid supplied to the substrate diffuses and flows around the substrate, forming a thin film on the top surface of the substrate. However, at this time, the inside of the rotating container is in a coating liquid atmosphere, and even if wind hits the substrate surface, the vaporization of the coating liquid solvent is prevented from progressing more in this area than elsewhere.
Since there is no influence from wind, a uniform thin film is formed over the entire upper surface of the substrate.
また、このような塗布処理中および処理後、基板は、基
板の外形より大きい回転台に立設された突出体に支持さ
れているから、基板の下面と回転台との間に形成された
間隙の中へ、回転台の回転軸を介して導入された洗浄液
が基板の下面に向けて供給され、基板の下面に付着した
塗布液の洗浄除去、あるいは付着しようとする塗布液ミ
ストの排除が行われる。In addition, during and after such coating processing, the substrate is supported by a protrusion mounted on a rotary table that is larger than the outer diameter of the substrate, so that the gap formed between the bottom surface of the substrate and the rotary table is A cleaning liquid is introduced into the substrate through the rotating shaft of the rotary table and is supplied toward the bottom surface of the substrate to clean and remove the coating liquid that has adhered to the bottom surface of the substrate or to eliminate the coating liquid mist that is about to adhere. be exposed.
なお、洗浄液や基板から飛散した余剰塗布液ミスト等の
廃液は、回転容器に形成した廃液部から排除される。Incidentally, waste liquids such as cleaning liquid and excess coating liquid mist scattered from the substrate are removed from a waste liquid part formed in the rotating container.
〈実施例〉
以下、本発明の実施例を１面に基づいて詳細に説明する
。<Example> Hereinafter, an example of the present invention will be described in detail based on one page.
呈上１呈■
第１ＩＩないし第１３図に第１の発明による回転式塗布
装Ｗの一実施例を示す。Presentation 1 Presentation (1) Figures 1II to 13 show an embodiment of the rotary coating device W according to the first invention.
この回転式塗布装置は、角形の基板ｌを搭載して縦軸心
２周りに水平回転する回転台２と、その上方において回
転台２と平行に設置されて回転台２と共に一体回転する
上部回転板３と、これら回転する部材の下方および周辺
部を外囲するように固定配置された廃液回収ケース４と
、塗布液供給用のノズル５と、回転台２の中央上部にお
いて搭載基板１の下面に洗浄液を吹き付ける洗浄液供給
機構６とを備えている。This rotary coating device consists of a rotary table 2 on which a rectangular substrate l is mounted and horizontally rotated around a vertical axis 2, and an upper rotary unit installed above the rotary table 2 in parallel with the rotary table 2 and rotating integrally with the rotary table 2. A plate 3 , a waste liquid collection case 4 fixedly arranged so as to surround the lower part and the periphery of these rotating members, a nozzle 5 for supplying the coating liquid, and the lower surface of the mounting board 1 at the upper center of the rotary table 2 . A cleaning liquid supply mechanism 6 that sprays cleaning liquid onto the cleaning liquid supply mechanism 6 is provided.
前記回転台２は、垂直に立設されて回転駆動される縦向
き回転軸７の上端に連結ボス８を介して水平に取付けら
れたものであり、基板１の外形形状より充分大きい直径
の円板状に構成されている。The rotary table 2 is horizontally attached via a connecting boss 8 to the upper end of a vertical rotary shaft 7 which is vertically erected and rotationally driven, and is formed into a circle having a diameter sufficiently larger than the external shape of the substrate 1. It is configured in a plate shape.
そして、この回転台２の上面に、基板支持用の突出体と
しての多数の基板支持ピン９群があり、この基板支持ピ
ン９群を介して基板ｌが回転台２上に所定の上下間隔を
もって水平に搭載支持されるとともに、第４図に示すよ
うに、回転台２上に立設した一対づつ４組の係合ビン１
０で基板ｌの四隅を係合して、回転台２と共に基板ｌを
水平回転させるよう構成されている。On the upper surface of this rotary table 2, there are a large number of groups of substrate support pins 9 as protrusions for supporting the substrate, and the substrate l is placed on the rotary table 2 at a predetermined vertical interval via these 9 groups of substrate support pins. Four sets of engaging bins 1, one pair each, are mounted and supported horizontally and are erected on a rotary table 2, as shown in FIG.
0, the four corners of the substrate l are engaged, and the substrate l is horizontally rotated together with the rotary table 2.
また、回転台２の外周上面には、回転台２と同外形のス
ペーサリング１４およびリングプレー目５が同方向複数
箇所で連結されるとともに、このリングプレート１５に
前記回転板３を支持する上部支持板１３がノブボルト１
６を介して着脱自在に装着され、上部支持板１３を取り
外すことで、リングプレート１５の中央開口から基板１
を出し入れすることができるようになっている。なお、
上部回転板３の中央上面には着脱用の把手１７が備えら
れている。Further, on the outer peripheral upper surface of the rotary table 2, a spacer ring 14 having the same external shape as the rotary table 2 and ring play eyes 5 are connected at a plurality of locations in the same direction, and an upper portion supporting the rotary plate 3 is connected to the ring plate 15. The support plate 13 is the knob bolt 1
By removing the upper support plate 13, the substrate 1 can be removed from the center opening of the ring plate 15.
can be taken in and out. In addition,
A handle 17 for attachment and detachment is provided on the central upper surface of the upper rotary plate 3.
前記スペーサリング１４は断面が台形状に構成されたも
のであり、連結ボルト１８に外嵌した上下の座金１９の
厚さに相当する廃液流出用の間隔１１が上下に形成され
ている。The spacer ring 14 has a trapezoidal cross section, and is provided with intervals 11 above and below for draining the waste liquid, which correspond to the thicknesses of the upper and lower washers 19 fitted onto the connecting bolts 18.
前記上部回転機３は基板ｌの外形形状より大形の円板に
構成されて、前記上部支持板１３の下面にカラー１２を
介してボルト連結され、基板１と一定の小間隔（例えば
約１０ａ＋ｍ ）をもって平行に対向するようになって
いる。The upper rotary machine 3 is configured as a circular plate larger than the outer shape of the substrate 1, and is bolted to the lower surface of the upper support plate 13 via a collar 12, and is spaced apart from the substrate 1 by a certain small distance (for example, about 10 mm). ) so that they face each other in parallel.
前記廃液回収ケース４の底部は絞り込まれ、その下端に
廃液排出口４ａが形成されるとともに、周方向の複数箇
所には塗布液から莫発した溶剤ガスや塗布液ミストを排
気する排気口４ｂが形成されている。The bottom of the waste liquid recovery case 4 is narrowed, and a waste liquid discharge port 4a is formed at the lower end thereof, and exhaust ports 4b are provided at multiple locations in the circumferential direction to exhaust solvent gas and coating liquid mist emitted from the coating liquid. It is formed.
洗浄液供給機構６は、第１図、第３図および第４図に示
すように、筒軸に構成された前記縦向き回転軸７の中心
部に挿通して非回転状態に設置された洗浄液供給管２０
と、その上部に固定された中空状のノズル盤２１とから
なり、ノズル盤２１の上面に形成された多数の吹出し口
２２から洗浄液が基板１の下面に向けて吹付けられるよ
う構成されてい第１実施例の回転式塗布装置は以上のよ
うに構成されたものであり、塗布処理に際しては、先ず
上部支持板１３を適宜手段で持ち上げて中央開口を大き
く開放し、基板１を基板支持ピン９群に水平姿勢に搭載
セットする。As shown in FIG. 1, FIG. 3, and FIG. 4, the cleaning liquid supply mechanism 6 is a cleaning liquid supply mechanism that is inserted into the center of the vertical rotating shaft 7 configured as a cylindrical shaft and installed in a non-rotating state. tube 20
and a hollow nozzle board 21 fixed to the upper part thereof, and the cleaning liquid is sprayed toward the bottom surface of the substrate 1 from a number of blow-off ports 22 formed on the top surface of the nozzle board 21. The rotary coating apparatus of the first embodiment is constructed as described above, and in the coating process, first, the upper support plate 13 is lifted up by appropriate means to widen the central opening, and the substrate 1 is attached to the substrate support pins 9. Set it on board in a horizontal position in the group.
次に塗布液供給ノズル５を中央開口の中央に移動させる
とともに基板１上の適当高さまで下降させて、所定量の
塗布液を基板１上の中央に滴下供給する。Next, the coating liquid supply nozzle 5 is moved to the center of the central opening and lowered to an appropriate height above the substrate 1, and a predetermined amount of the coating liquid is dripped onto the center of the substrate 1.
その後、ノズル５を退避させるとともに、上部支持板１
３をリングプレー目５に装着固定した上で、回転軸７を
駆動して回転台２、上部支持板１３および上部回転板３
とともに基板１を水平回転させる。After that, the nozzle 5 is evacuated, and the upper support plate 1
3 is attached and fixed to the ring play eye 5, and then the rotating shaft 7 is driven to rotate the rotating table 2, the upper support plate 13, and the upper rotating plate 3.
At the same time, the substrate 1 is horizontally rotated.
この回転によって基板１上の塗布液は外方に拡散流動し
て基板１上面に薄く塗布される。この場合、回転台２と
上部回転板３とで挟まれた処理室２３内の空気も基板ｌ
と共に回転し、基板ｌの周縁による風切り現象を生しな
い状態で、塗布液は基板１上面に均一に塗布される。Due to this rotation, the coating liquid on the substrate 1 is diffused and flowed outward, and is applied thinly to the upper surface of the substrate 1. In this case, the air in the processing chamber 23 sandwiched between the rotating table 2 and the upper rotating plate 3 also
The coating liquid is uniformly applied to the upper surface of the substrate 1 without causing wind blowing due to the peripheral edge of the substrate 1.
基板１上を流動して外周に至った余剰の塗布液は基板１
周縁から処理室２３の周部にミスト状に飛散し、スペー
サリングＩ４の上下に形成されている間隙１１を通って
廃液回収ケース４内に流出し、排気口４ｂから排気され
る。The excess coating liquid that has flowed on the substrate 1 and reached the outer periphery is removed from the substrate 1.
It scatters in the form of a mist from the periphery to the periphery of the processing chamber 23, flows into the waste liquid collection case 4 through the gap 11 formed above and below the spacer ring I4, and is exhausted from the exhaust port 4b.
このような塗布液回転式塗布処理の間、あるいは回転式
塗布処理の後に、洗浄液供給機構６を介して回転してい
る基板１の下面に洗浄液を吹付けることによって、洗浄
液は基板ｌ下面に沿って中央側から外周側に向けて流動
し、基板１の下面に付着した塗布液ミスト、あるいは付
着しようとする塗布液ミストを洗い流し、スペーサリン
グ１４の間隔１１を通って廃液回収ケース４に流出し、
排液だけが排液口４ａから回収排出されてゆく。During or after the rotary coating process, the cleaning liquid is sprayed onto the lower surface of the rotating substrate 1 via the cleaning liquid supply mechanism 6, so that the cleaning liquid is distributed along the lower surface of the substrate 1. The liquid flows from the center toward the outer periphery, washes off the coating liquid mist that has adhered to the lower surface of the substrate 1 or is about to adhere, and flows out into the waste liquid collection case 4 through the interval 11 of the spacer ring 14. ,
Only the drained liquid is collected and discharged from the drain port 4a.
次に第１実施例の変形例の幾つかを例示する。Next, some modifications of the first embodiment will be illustrated.
第５図に、上部支持板を設けずに、上部回転板５３をリ
ングプレート１５に直接取り付けるようにし、上部回転
板５３を閉じた状態で塗布液供給を行えるよう構成した
例が示されている。FIG. 5 shows an example in which the upper rotary plate 53 is directly attached to the ring plate 15 without providing an upper support plate, and the coating liquid can be supplied with the upper rotary plate 53 closed. .
この場合、上部回転板５３の中央に、筒状の塗布液供給
口２４が備えられるとともに、常態ではウェイト２５に
よって閉塞付勢した蓋体２６で塗布液供給口２４が閉じ
られている。そして、この供給口２４の上方に配備した
塗布液供給ノズル５を下降してくると、第６図に示すよ
うに、ノズル５と共に下降してくるブツシュロッド２７
の下端ローラ２８が、蓋体２６に連結した開放用レバー
２６ａに当接して蓋体２６が揺動開放される。この蓋体
２６は一定の開放姿勢まで揺動するとこれに連設のス）
７パー２６ｂが供給口２４の外面に当接してそれ以上揺
動しなくり、この常態で更にノズル５を下降して供給口
２４に突入すると、第７図に示すように、固定状態の開
放レバー２６ａに当接支持されたブツシュロッド２７は
バネ２９に抗して相対的に上方にスライドする。塗布液
供給後にノズル５を上昇させると、上記作動が逆に行わ
れて、蓋体２６によって供給口２４が自動的に閉しられ
る。In this case, a cylindrical coating liquid supply port 24 is provided at the center of the upper rotating plate 53, and the coating liquid supply port 24 is normally closed by a lid body 26 which is biased to close by a weight 25. When the coating liquid supply nozzle 5 disposed above the supply port 24 descends, a bushing rod 27 descends together with the nozzle 5, as shown in FIG.
The lower end roller 28 contacts the opening lever 26a connected to the lid 26, and the lid 26 is swung open. When this lid body 26 is swung to a certain open position, a
When the par 26b comes into contact with the outer surface of the supply port 24 and no longer swings, and in this normal state, the nozzle 5 is further lowered and enters the supply port 24, the fixed state is released as shown in FIG. The bushing rod 27, which is supported in contact with the lever 26a, slides relatively upward against the spring 29. When the nozzle 5 is raised after the application liquid is supplied, the above operation is performed in reverse, and the supply port 24 is automatically closed by the lid 26.
洗浄液供給機構６は、次のように種々の形態で変形実施
することが可能である。The cleaning liquid supply mechanism 6 can be modified and implemented in various forms as follows.
例えば、第８図に示すように、前記ノズル！２１に代え
て単孔ノズル３０を使用することもできる。For example, as shown in FIG. 8, the nozzle! A single hole nozzle 30 can also be used instead of 21.
また、第９図および第１０図に示すように、前記ノズル
盤２１に代えて複数のノズルパイプ３１ａをｍえた複孔
ノズル３１を用いるもよい。Further, as shown in FIGS. 9 and 10, a multi-hole nozzle 31 having a plurality of nozzle pipes 31a may be used instead of the nozzle disk 21.
さらに、第１１図および第１２図に示すように、周部に
のみ吹出し口２２ををするノズル盤２１を用いて、基板
１の下面の外周部付近から外向きに洗浄液を噴出するよ
うにすれば、基板１の外周部から周縁にかけての洗浄効
果とともに、基板１の中央部への塗布液のミストの侵入
を防止することも可能である。Furthermore, as shown in FIGS. 11 and 12, a nozzle disk 21 having an outlet 22 only on the periphery is used to spray the cleaning liquid outward from near the outer periphery of the bottom surface of the substrate 1. For example, in addition to cleaning the substrate 1 from the outer periphery to the periphery, it is also possible to prevent coating liquid mist from entering the center of the substrate 1.
また、第１３図に示すように、回転台２の上面中央にノ
ズル盤２１を連結するとともに、縦向き回転軸７内の供
給路３２を通して洗浄液を供給するようにし、ノズル盤
２１自体をも回転させる形態で実施することもできる。In addition, as shown in FIG. 13, the nozzle plate 21 is connected to the center of the upper surface of the rotary table 2, and the cleaning liquid is supplied through the supply path 32 in the vertical rotating shaft 7, so that the nozzle plate 21 itself can also be rotated. It can also be implemented in the form of
なお、図示しないが、回転台２と上部回転板３とをつな
ぐスペーサリング１４に代えてビン状の支持部材を用い
、処理室２３の周部を略全長にわたって開放してもよい
。Although not shown, a bottle-shaped support member may be used in place of the spacer ring 14 that connects the rotary table 2 and the upper rotary plate 3, and the periphery of the processing chamber 23 may be opened over substantially the entire length thereof.
また、紺向き回転軸７内の供給路３２へは、洗浄液の他
に、−時的に窒素ガスや洗浄空気のようなガスを供給す
るようにしてもよい。Further, in addition to the cleaning liquid, a gas such as nitrogen gas or cleaning air may be occasionally supplied to the supply path 32 in the dark blue rotating shaft 7.
茅ｌ災旌炎
第１４１１ｆｆｌに第２の発明による回転式塗布装置の
一実施例を示す。An embodiment of the rotary coating device according to the second invention is shown in No. 1411ffl.
この回転式塗布装置は、角形の基板１を搭載して縦軸心
２周りに水平回転する回転台１０２と、回転台１０２と
一体に形成された回転容器１０３と、回転容器１０３の
下方および周辺部を外囲するように固定配置された廃液
回収ケース１０４と、塗布液供給用のノズル５と、回転
台１０２の中央上部において搭載基板１の下面に洗浄液
を吹き付ける洗浄液供給機構６とを備えている。This rotary coating device includes a rotary table 102 on which a rectangular substrate 1 is mounted and rotates horizontally around a vertical axis 2, a rotary container 103 formed integrally with the rotary table 102, and a portion below and around the rotary container 103. A waste liquid collection case 104 fixedly arranged so as to surround the main body, a nozzle 5 for supplying a coating liquid, and a cleaning liquid supply mechanism 6 for spraying a cleaning liquid onto the lower surface of the mounting substrate 1 at the upper center of the rotary table 102. There is.
回転台１０２は、回転軸７の上端に連結ボス８を介して
水平に取り付けられたものであり、基板１の外形形状よ
り充分大きい直径の円板状の部材であり、回転容器１０
３の底壁をなす、そして、この回転台１０２の上面に、
基板支持用の突出体としての多数の基板支持ビン９群が
あり、この基板支持ビン９群を介して基板ｌが回転台１
０２上にｒ６ｉｌ！支持されるとともに、回転台１０２
上に立設した一対づつ４＆１１の係合ビン１０で基＋ｆ
ｆＥ ｌの四隅を係合して、回転台１０２と供に基板ｌ
を水平回転させるよう構成されている。The rotating table 102 is horizontally attached to the upper end of the rotating shaft 7 via a connecting boss 8, and is a disc-shaped member having a diameter sufficiently larger than the external shape of the substrate 1.
3, and on the top surface of this rotary table 102,
There are a large number of substrate support bins 9 groups as protrusions for supporting the substrate, and the substrate l is transferred to the rotary table 1 via the substrate support bins 9 groups.
r6il on 02! In addition to being supported, the rotating table 102
Base +f with the engagement bins 10 of 4 & 11 installed in pairs on the top.
By engaging the four corners of fE l, the substrate l is
It is configured to rotate horizontally.
回転容器１０３は、前記回転台１０２を底壁部とし、後
述する傾斜壁体１１１を０！！！壁とし、周部カバー本
体１１２と上蓋１１３を上壁部とし、基板１の上下およ
び回転台の半径方向外側を囲って、基板ｌと同期回転す
る容器である。The rotary container 103 has the rotary table 102 as a bottom wall, and a tilted wall body 111 (to be described later). ! ! The container has a wall, a peripheral cover main body 112 and an upper lid 113 as upper walls, surrounds the upper and lower sides of the substrate 1 and the radially outer side of the rotary table, and rotates in synchronization with the substrate 1.
傾斜壁体１１１は、下端が回転台１０２と気密に接合さ
れた上方開放向きに傾斜した壁体である。ただし、傾斜
壁体１１１の下端数カ所は、回転容器１゜３内の余剰塗
布液や洗浄液を排出するための排液孔１１４ａが開口形
成され、また、ｔ＠斜壁体１１１の上端数カ所には、回
転容器１０３内の塗布液ミストを逃がすためのミスト排
出孔１１４ ｂが開口形成されている。The inclined wall body 111 is a wall body whose lower end is airtightly joined to the rotary table 102 and is inclined to open upward. However, drain holes 114a are formed at several places at the lower end of the inclined wall body 111 for draining excess coating liquid and cleaning liquid in the rotary container 1゜3, and at several places at the upper end of the inclined wall body 111. , a mist discharge hole 114b is formed to allow the coating liquid mist in the rotating container 103 to escape.
周部カバ一体１１２は、傾斜壁体１１１の上端に気密に
接合され、中央部に基板出入用の中央開口を備えたリン
グ状の部材であり、その中央開口は上蓋１１３にて上方
より閉塞する。なお、上蓋１１３は、周部カバ一体１１
２から取り外し可能であり、周部カバ一体１１２へは、
シールリング（開示せず）を介して気密に閉じるように
取り付けられる。The peripheral cover unit 112 is a ring-shaped member that is airtightly joined to the upper end of the inclined wall body 111 and has a central opening in the center for board entry and exit, and the central opening is closed from above by the upper lid 113. . Note that the upper lid 113 is composed of the peripheral cover 11
2, and to the peripheral cover integral 112,
It is attached in a hermetically closed manner via a sealing ring (not disclosed).
なお、基板１と上ｌＨ３との間隔は、必ずしも狭い間隔
にすることを要しない。第２実施例においては基板１を
回転容器１０３に囲って塗布液溶剤雰囲気中で回転塗布
処理がなされるようにすることで風の影響を回避して均
一塗布を達成するものであって、第１実施例における基
板１と上部回転板３との回転のように、両者の間隔を近
づけて間の空気を基板と同期回転させて風の発生を阻止
して均一塗布を達成するものとは異なるからである。Note that the distance between the substrate 1 and the upper lH3 does not necessarily have to be narrow. In the second embodiment, the substrate 1 is surrounded by a rotating container 103 so that the spin coating process is performed in a coating solution solvent atmosphere to avoid the influence of wind and achieve uniform coating. This is different from the rotation of the substrate 1 and the upper rotary plate 3 in the first embodiment, in which the space between them is brought close and the air between them is rotated in synchronization with the substrate to prevent the generation of wind and achieve uniform coating. It is from.
つまり、第１実施例のように基板１表面の空気を同期回
転させる必要が無いからである。That is, there is no need to synchronously rotate the air on the surface of the substrate 1 as in the first embodiment.
廃液回収ケース１０４には回転台１０２および上蓋１１
３の周部に臨む環状の廃液回収室１１６と、回転台１０
２の下面に臨む偏平な排気室１１７が形成され、前記第
１実施例と同様に排液口１０４ａ、排気口１０４ ｂ、
ラビリンス部１１８，１１９が設けられている。The waste liquid collection case 104 includes a turntable 102 and an upper lid 11.
An annular waste liquid recovery chamber 116 facing the periphery of 3 and a rotary table 10
A flat exhaust chamber 117 is formed facing the lower surface of the liquid drain port 104a, an exhaust port 104b, and
Labyrinth parts 118 and 119 are provided.
洗浄液供給機構６は、筒袖に構成された縦向き回転軸７
の中心部に挿通して非回転状態に段重された洗浄液供給
配管２０と、その上部に固定された中空状のノズル盤２
１とからなり、ノズル盤２１の上面に形成された多数の
吹出し口から洗浄液が基板１の下面に向けて吹付けられ
るように構成されている。The cleaning liquid supply mechanism 6 has a vertical rotating shaft 7 configured in a sleeve.
A cleaning liquid supply pipe 20 is inserted into the center of the pipe and is stacked in a non-rotating state, and a hollow nozzle plate 2 is fixed to the upper part of the pipe.
1, and is configured such that cleaning liquid is sprayed toward the bottom surface of the substrate 1 from a large number of blow-off ports formed on the top surface of the nozzle board 21.
第２の実施例の回転式塗布装置は以上のように構成され
たものであり、塗布処理に際しては、先ず上１ｉ１１３
を適宜手段で持ち上げて中央開口を大きく開放して、基
板１を基板支持ピン９群に水平姿勢に搭載セットする。The rotary coating device of the second embodiment is constructed as described above, and during coating processing, first the upper 1i113
is lifted up by appropriate means to widen the central opening, and the board 1 is mounted and set in a horizontal position on the board support pins 9 group.
次に塗布液供給ノズル５の中央開口も中央に移動させる
とともに基板１上の適当な高さまで下降させて、所定量
の塗布液を基板１上の中央に滴下供給する。Next, the center opening of the coating liquid supply nozzle 5 is also moved to the center and lowered to an appropriate height above the substrate 1, and a predetermined amount of the coating liquid is dripped onto the center of the substrate 1.
その後、ノズル５を退避させるとともに、上蓋１１３で
中央開口を密閉し、回転軸７を駆動して回転容器１０３
とともに基板１を水平回転させる。この回転によって、
基板１上の塗布液は外方に拡散流動して基板１に薄く塗
布される。この場合、回転容器１０３内は、塗布液溶剤
で満たされた雰囲気にあるから、基板１に風が当たって
も、その箇所で塗布液溶剤成分が１発して塗布液の粘度
が他より高まって膜厚が不均一になるといった不都合は
解消され、塗布液は基板ｌ上面に均一に塗布される。Thereafter, the nozzle 5 is evacuated, the central opening is sealed with the upper lid 113, and the rotating shaft 7 is driven to remove the rotating container 103.
At the same time, the substrate 1 is horizontally rotated. With this rotation,
The coating liquid on the substrate 1 diffuses outward and is thinly applied to the substrate 1. In this case, the inside of the rotating container 103 is in an atmosphere filled with the coating solution solvent, so even if the substrate 1 is hit by wind, the coating solution solvent component will be shot at that point, making the viscosity of the coating solution higher than other parts. The inconvenience of non-uniform film thickness is eliminated, and the coating liquid is uniformly applied to the upper surface of the substrate l.
基板１上を流動して外部に至った余剰の塗布液は基板１
周縁から回転容器１０３内にミスト状に飛散し、遠心力
によってミスト排出孔１１４ｂを通って廃液回収室１１
６に入り、排気口１０４ｂから排気される。洗浄液は排
液孔１１４ａから廃液回収室１１６を経て排液口１０４
ａから排出される。Excess coating liquid that flows on the substrate 1 and reaches the outside is removed from the substrate 1.
It scatters in the form of mist from the periphery into the rotating container 103, and passes through the mist discharge hole 114b due to centrifugal force to the waste liquid collection chamber 11.
6 and is exhausted from the exhaust port 104b. The cleaning liquid flows from the drain hole 114a through the waste liquid collection chamber 116 to the drain port 104.
It is discharged from a.
なお、第２実施例の変形例として、前記第５図に示す構
成と同じように、上蓋１１３の中央に塗布液供給口２４
．ウェイト２５．蓋体２６を付設し、ノズル５にブツシ
ュロッド２７．下端ローラ２８．バネ２９を付設して、
上蓋１１３を閉じた状態で塗布液供給できようにしても
よい。As a modification of the second embodiment, a coating liquid supply port 24 is provided in the center of the upper lid 113, similar to the configuration shown in FIG.
．． Weight 25. A cover body 26 is attached, and a bushing rod 27 is attached to the nozzle 5. Lower end roller 28. Attaching the spring 29,
The coating liquid may be supplied with the upper lid 113 closed.
また、洗浄液供給機溝を、前記第８図から第１３図にお
ける洗浄液供給機構のようにしてもよい。Further, the cleaning liquid supply groove may be configured as the cleaning liquid supply mechanism shown in FIGS. 8 to 13 above.
〈発明の効果〉
以上説明したように、第１の発明の回転式塗布装置によ
れば、回転台と上部回転板との間に形成された偏平な塗
布空間内では、偏平な空間であるために、空気が基板と
ともに回転して、基板周縁の風切り現象がないので、基
板上の膜厚を均一にすることが可能である。また、第１
の発明において、回転台は、基板の外形と同等以上の大
きさを有し、上面に突出体を立設して基板の下面と回転
台との間に間隙を形成し、その間隙へ回転台の回転軸を
通して基板下面に向けて洗浄液を供給する構成を備えて
いるので、基板下面の全面が洗浄液と接触し、余剰塗布
液のミストが基板下面に付着するのが防止され、下面汚
染のない状態で塗布処理を行えるようになった。<Effects of the Invention> As explained above, according to the rotary coating device of the first invention, since the flat coating space formed between the rotary table and the upper rotary plate is a flat space, In addition, since the air rotates with the substrate and there is no wind-cutting phenomenon around the periphery of the substrate, it is possible to make the film thickness on the substrate uniform. Also, the first
In the invention, the rotary table has a size equal to or larger than the outer shape of the substrate, a protrusion is erected on the upper surface to form a gap between the lower surface of the substrate and the rotary table, and the rotary table is inserted into the gap. Since the cleaning liquid is supplied to the bottom surface of the substrate through the rotating shaft, the entire bottom surface of the substrate comes into contact with the cleaning liquid, preventing excess coating liquid mist from adhering to the bottom surface of the substrate, and preventing contamination of the bottom surface. It is now possible to perform coating processing in the current state.
また、第２の発明では、基板の上下および回転半径方向
外側を囲む回転容器内に基板を装填して回転塗布するこ
とによって、溶剤雰囲気で回転塗布するから、基板表面
に風が当たっても、そこだけが塗布液溶剤の気化が他よ
りも進行すると言ったことがなく、風による影響が解消
され、基板上全域に均一な薄膜が形成される。また、回
転台は、基板の外形と同等以上の大きさを有し、上面に
突出体を立設して基板の下面と回転台との間ごこ間隙を
形成し、その間隙へ、回転台の回転軸を通して基板下面
へ向けて洗浄液を供給する機構を備えているので、基板
下面の全面が洗浄液と接触し、余剰塗布液のミストが基
板下面に付着するのが防止され、下面汚染のない状態で
塗布処理を行なえるようになった。In addition, in the second invention, the substrate is loaded into a rotating container that surrounds the top and bottom of the substrate and the outside in the radial direction of rotation, and spin coating is performed in a solvent atmosphere, so even if the substrate surface is exposed to wind, This is not the only place where the vaporization of the coating solution solvent progresses more than anywhere else, the influence of wind is eliminated, and a uniform thin film is formed over the entire area of the substrate. In addition, the rotary table has a size equal to or larger than the external shape of the board, and a protrusion is erected on the upper surface to form a small gap between the bottom surface of the board and the rotary table, and the rotary table is inserted into the gap. Equipped with a mechanism that supplies the cleaning liquid toward the bottom surface of the substrate through the rotating shaft, the entire bottom surface of the substrate comes into contact with the cleaning liquid, preventing excess coating liquid mist from adhering to the bottom surface of the substrate, and preventing contamination of the bottom surface. It is now possible to perform coating processing in this state.
なお、第１と第２いずれの発明の回転式塗布装置も、塗
布液ミストの洗浄機構が塗布装置自体を組み込まれてい
るので、塗布処理中、あるいは塗布処理の直後に洗浄を
行うことができ、専用の洗浄装置に移し替える手間もな
く、能率よく処理することができる。Note that in both the rotary coating apparatuses of the first and second inventions, the coating liquid mist cleaning mechanism is built into the coating apparatus itself, so cleaning can be performed during or immediately after the coating process. , it can be processed efficiently without the need to transfer to a dedicated cleaning device.
第１図ないし第４回は本発明の第１の実施例を示し、第
１１１Ｊは回転式塗布装置の全体縦断面図、第２図は洗
浄液供給機構の縦断面図、第３回は上部回転板の一部を
示す拡大断面図、第４閣は基板搭載状態を示す一部切欠
き平面図である。
第５圀は塗布液供給手段を変更した他の実施例の全体縦
断面図、第６図および第７圀はそれぞれノズル突入作動
を説明する要部の断面図である。
第８図は洗浄液供給機構の他の実施例を示す要部の断面
図である。
第９図は洗浄液供給機構の更に別の実施例を示す要部の
断面図、第１Ｏ図はその構成部品の斜視図である。
第１１図は洗浄液供給機構の変形例を示す要部の断面図
、第１２図はその構成部品の一部切欠き斜視図である。
第１３図は洗浄液供給機構の更に別の実施例を示す断面
図、また、第１４図は本発明の第２実施例の回転式塗布
装置の全体断面図である。
１・・・基板 ２・・・回転台３・・・上部
回転板
５・・・塗布液供給ノズル（塗布液供給手段）７・・・
回転軸 ６・・・洗浄液供給機構９・・・基板
支持ピン（突出体）
第３図Figures 1 to 4 show the first embodiment of the present invention, No. 111J is an overall vertical cross-sectional view of the rotary coating device, Figure 2 is a vertical cross-sectional view of the cleaning liquid supply mechanism, and No. 3 is a top rotation An enlarged sectional view showing a part of the board, and the fourth part is a partially cutaway plan view showing the state in which the board is mounted. The fifth section is an overall vertical sectional view of another embodiment in which the coating liquid supply means is changed, and FIGS. 6 and 7 are sectional views of essential parts, respectively, illustrating the nozzle thrust operation. FIG. 8 is a sectional view of essential parts showing another embodiment of the cleaning liquid supply mechanism. FIG. 9 is a sectional view of a main part showing still another embodiment of the cleaning liquid supply mechanism, and FIG. 1O is a perspective view of its constituent parts. FIG. 11 is a sectional view of a main part showing a modified example of the cleaning liquid supply mechanism, and FIG. 12 is a partially cutaway perspective view of its constituent parts. FIG. 13 is a sectional view showing still another embodiment of the cleaning liquid supply mechanism, and FIG. 14 is an overall sectional view of a rotary coating device according to the second embodiment of the present invention. 1... Substrate 2... Turntable 3... Upper rotating plate 5... Coating liquid supply nozzle (coating liquid supply means) 7...
Rotating shaft 6...Cleaning liquid supply mechanism 9...Substrate support pin (projection) Fig. 3
Claims (2)
上面に塗布する回転式塗布装置において、基板の外形と
同等以上の大きさを有し、基板を水平支持した状態で回
転させる回転台と、 この回転台の上面と基板下面との間に間隙ができるよう
に、前記回転台上に立設された基板支持用の突出体と、 この回転台上に支持された基板の上面と所定の小間隔を
もって平行に配備されるとともに、基板の外形と同等以
上の大きさを有し、かつ、回転台と一体に回転される上
部回転板と、 前記突出体に支持された基板の下面に向けて、前記回転
台の回転軸を通して洗浄液を供給する洗浄液供給機構と
、 を備えたことを特徴とする回転式塗布装置。(1) In a rotary coating device that applies a coating liquid to the top surface of a substrate by horizontally rotating the substrate, a rotating table having a size equal to or larger than the external shape of the substrate and rotating the substrate while horizontally supporting it; , a substrate supporting protrusion erected on the rotary table so as to create a gap between the upper surface of the rotary table and the lower surface of the substrate; an upper rotary plate that is arranged in parallel with a small interval, has a size equal to or larger than the external shape of the board, and is rotated together with the rotary table; A rotary coating device comprising: a cleaning liquid supply mechanism that supplies cleaning liquid through a rotating shaft of the rotary table.
上面に均一に塗布する回転式塗布装置において、 基板の外形より大きく、基板を水平支持した状態で回転
させる回転台と、 回転台の上面と基板の下面との間に間隙ができるように
、回転台上に立設された基板支持用の突出体と、 回転台と一体に回転され、基板の上下および回転台の半
径方向外側を囲み、廃液の排出部が形成され、少なくと
も一部が開閉可能な回転容器と、突出体に支持された基
板の下面に向けて、回転台の回転軸を通して洗浄液を供
給する洗浄液供給機構と、 を備えたことを特徴とする回転式塗布装置。(2) In a rotary coating device that applies a coating liquid uniformly to the top surface of a substrate by horizontally rotating the substrate, there is a rotating table that is larger than the outer diameter of the substrate and that rotates the substrate while horizontally supporting it, and a top surface of the rotating table. A protrusion for supporting the board is installed on the rotary table so as to create a gap between the board and the lower surface of the board, and a protrusion that rotates together with the rotary table and surrounds the top and bottom of the board and the outside of the rotary table in the radial direction. , a rotary container in which a waste liquid discharge part is formed and at least a portion of which can be opened and closed; and a cleaning liquid supply mechanism that supplies cleaning liquid through a rotating shaft of a rotary table toward the lower surface of a substrate supported by a protruding body. A rotary coating device characterized by:
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2179974A JP2561371B2 (en) | 1990-07-06 | 1990-07-06 | Rotary coating device |
| US07/719,203 US5234499A (en) | 1990-06-26 | 1991-06-21 | Spin coating apparatus |
| KR1019910010714A KR930007336B1 (en) | 1990-06-26 | 1991-06-26 | Rotary coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2179974A JP2561371B2 (en) | 1990-07-06 | 1990-07-06 | Rotary coating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0466159A true JPH0466159A (en) | 1992-03-02 |
| JP2561371B2 JP2561371B2 (en) | 1996-12-04 |
Family
ID=16075240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2179974A Expired - Lifetime JP2561371B2 (en) | 1990-06-26 | 1990-07-06 | Rotary coating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2561371B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000023376A (en) * | 1998-09-24 | 2000-04-25 | 히가시 데쓰로 | Rotating cup and coating apparatus and coating method |
| JP2000189883A (en) * | 1994-08-08 | 2000-07-11 | Tokyo Electron Ltd | Method and apparatus for forming coating film |
| JP2001209166A (en) * | 2000-01-26 | 2001-08-03 | Dainippon Printing Co Ltd | Spin processing device for manufacturing photomask |
| JP2002502309A (en) * | 1997-05-30 | 2002-01-22 | カール・ジュース・ヴァイヒンゲン・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング | Method and apparatus for chemical spin coating |
| JP2009176323A (en) * | 2009-04-30 | 2009-08-06 | Konica Minolta Business Technologies Inc | Information processor |
| JP2014179642A (en) * | 2010-03-24 | 2014-09-25 | Tokyo Electron Ltd | Liquid processing apparatus, liquid processing method and recording medium with program for executing liquid processing method recorded thereon |
-
1990
- 1990-07-06 JP JP2179974A patent/JP2561371B2/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000189883A (en) * | 1994-08-08 | 2000-07-11 | Tokyo Electron Ltd | Method and apparatus for forming coating film |
| JP2002502309A (en) * | 1997-05-30 | 2002-01-22 | カール・ジュース・ヴァイヒンゲン・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング | Method and apparatus for chemical spin coating |
| KR20000023376A (en) * | 1998-09-24 | 2000-04-25 | 히가시 데쓰로 | Rotating cup and coating apparatus and coating method |
| JP2001209166A (en) * | 2000-01-26 | 2001-08-03 | Dainippon Printing Co Ltd | Spin processing device for manufacturing photomask |
| JP4488322B2 (en) * | 2000-01-26 | 2010-06-23 | 大日本印刷株式会社 | Spin processing equipment for photomask manufacturing |
| JP2009176323A (en) * | 2009-04-30 | 2009-08-06 | Konica Minolta Business Technologies Inc | Information processor |
| JP2014179642A (en) * | 2010-03-24 | 2014-09-25 | Tokyo Electron Ltd | Liquid processing apparatus, liquid processing method and recording medium with program for executing liquid processing method recorded thereon |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2561371B2 (en) | 1996-12-04 |
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