JPH0462449B2 - - Google Patents

Info

Publication number: JPH0462449B2
Authority: JP; Japan
Prior art keywords: dielectric; insulator; layer; ceramic; laminated ceramic
Prior art date: 1986-01-30
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

JP61019448A

Other languages

English (en)

Japanese (ja)

Other versions

JPS62177906A (ja

Inventor

Takatada Tomioka

Juzo Shimada

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

NEC Corp

Original Assignee

Nippon Electric Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-01-30

Filing date

1986-01-30

Publication date

1992-10-06

1986-01-30 Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd

1986-01-30 Priority to JP61019448A priority Critical patent/JPS62177906A/ja

1987-08-04 Publication of JPS62177906A publication Critical patent/JPS62177906A/ja

1992-10-06 Publication of JPH0462449B2 publication Critical patent/JPH0462449B2/ja

Status Granted legal-status Critical Current

Links

239000000919 ceramic Substances 0.000 claims description 34
239000012212 insulator Substances 0.000 claims description 25
239000002131 composite material Substances 0.000 claims description 19
239000002184 metal Substances 0.000 claims description 16
229910052751 metal Inorganic materials 0.000 claims description 16
239000000463 material Substances 0.000 claims description 13
239000003989 dielectric material Substances 0.000 claims description 12
239000004020 conductor Substances 0.000 claims description 7
239000000203 mixture Substances 0.000 claims description 7
239000003990 capacitor Substances 0.000 description 13
239000000758 substrate Substances 0.000 description 6
238000000034 method Methods 0.000 description 5
239000000843 powder Substances 0.000 description 4
239000011230 binding agent Substances 0.000 description 3
238000005245 sintering Methods 0.000 description 3
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
238000006243 chemical reaction Methods 0.000 description 2
238000009792 diffusion process Methods 0.000 description 2
239000002003 electrode paste Substances 0.000 description 2
230000010354 integration Effects 0.000 description 2
239000007769 metal material Substances 0.000 description 2
238000007639 printing Methods 0.000 description 2
239000002994 raw material Substances 0.000 description 2
239000004065 semiconductor Substances 0.000 description 2
239000002002 slurry Substances 0.000 description 2
239000004698 Polyethylene Substances 0.000 description 1
CNLWCVNCHLKFHK-UHFFFAOYSA-N aluminum;lithium;dioxido(oxo)silane Chemical compound [Li+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O CNLWCVNCHLKFHK-UHFFFAOYSA-N 0.000 description 1
229910052661 anorthite Inorganic materials 0.000 description 1
238000001354 calcination Methods 0.000 description 1
238000005266 casting Methods 0.000 description 1
229910010293 ceramic material Inorganic materials 0.000 description 1
150000001875 compounds Chemical class 0.000 description 1
239000000470 constituent Substances 0.000 description 1
229910052802 copper Inorganic materials 0.000 description 1
229910052878 cordierite Inorganic materials 0.000 description 1
238000005336 cracking Methods 0.000 description 1
238000005520 cutting process Methods 0.000 description 1
238000010586 diagram Methods 0.000 description 1
GWWPLLOVYSCJIO-UHFFFAOYSA-N dialuminum;calcium;disilicate Chemical compound [Al+3].[Al+3].[Ca+2].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] GWWPLLOVYSCJIO-UHFFFAOYSA-N 0.000 description 1
JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
238000007606 doctor blade method Methods 0.000 description 1
229910000174 eucryptite Inorganic materials 0.000 description 1
229910052839 forsterite Inorganic materials 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
239000011810 insulating material Substances 0.000 description 1
238000010406 interfacial reaction Methods 0.000 description 1
238000003475 lamination Methods 0.000 description 1
HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
239000011812 mixed powder Substances 0.000 description 1
229910052863 mullite Inorganic materials 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
239000003960 organic solvent Substances 0.000 description 1
229910052763 palladium Inorganic materials 0.000 description 1
229910052697 platinum Inorganic materials 0.000 description 1
-1 polyethylene Polymers 0.000 description 1
229920000573 polyethylene Polymers 0.000 description 1
238000003825 pressing Methods 0.000 description 1
238000007650 screen-printing Methods 0.000 description 1
229910052709 silver Inorganic materials 0.000 description 1
229910052642 spodumene Inorganic materials 0.000 description 1

Landscapes

Laminated Bodies (AREA)
Ceramic Capacitors (AREA)
Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

JP61019448A 1986-01-30 1986-01-30 複合積層セラミツク部品 Granted JPS62177906A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP61019448A JPS62177906A (ja)	1986-01-30	1986-01-30	複合積層セラミツク部品

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP61019448A JPS62177906A (ja)	1986-01-30	1986-01-30	複合積層セラミツク部品

Publications (2)

Publication Number	Publication Date
JPS62177906A JPS62177906A (ja)	1987-08-04
JPH0462449B2 true JPH0462449B2 (fr)	1992-10-06

Family

ID=11999590

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP61019448A Granted JPS62177906A (ja)	1986-01-30	1986-01-30	複合積層セラミツク部品

Country Status (1)

Country	Link
JP (1)	JPS62177906A (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4658465B2 (ja) *	2003-08-27	2011-03-23	京セラ株式会社	コンデンサ内蔵ガラスセラミック多層配線基板
JP4578134B2 (ja) *	2004-03-29	2010-11-10	京セラ株式会社	コンデンサ内蔵ガラスセラミック多層配線基板

1986
- 1986-01-30 JP JP61019448A patent/JPS62177906A/ja active Granted

Also Published As

Publication number	Publication date
JPS62177906A (ja)	1987-08-04

Legal Events

Date	Code	Title	Description
2006-01-30	EXPY	Cancellation because of completion of term

Publication	Publication Date	Title
JP3407716B2 (ja)	2003-05-19	複合積層電子部品
GB1565421A (en)	1980-04-23	Manufacture of electrical devices
JP2001060767A (ja)	2001-03-06	セラミック基板の製造方法および未焼成セラミック基板
JPH11251723A (ja)	1999-09-17	回路基板
JP3121822B2 (ja)	2001-01-09	導体ペーストおよび配線基板
US6037045A (en)	2000-03-14	Thick-film paste and ceramic circuit substrate using the same
JPH0542159B2 (fr)	1993-06-25
JPS5917232A (ja)	1984-01-28	複合積層セラミツク部品およびその製造方法
JPH0462449B2 (fr)	1992-10-06
JPH0795630B2 (ja)	1995-10-11	複合積層セラミック部品
JPH0513524B2 (fr)	1993-02-22
JPH0513367B2 (fr)	1993-02-22
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JPH0453119B2 (fr)	1992-08-25
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JPH01166599A (ja)	1989-06-30	積層セラミック基板の製造方法
JPH0787226B2 (ja)	1995-09-20	低誘電率絶縁体基板
JPH0544840B2 (fr)	1993-07-07
JPS6092697A (ja)	1985-05-24	複合積層セラミツク部品
JPH04225297A (ja)	1992-08-14	セラミック基板の製造方法
JP4623851B2 (ja)	2011-02-02	多層配線基板
JPH10158032A (ja)	1998-06-16	ガラスセラミック焼結体およびそれを用いた多層配線基板
JPS62139393A (ja)	1987-06-23	複合積層セラミツク部品
JPS60176296A (ja)	1985-09-10	グレ−ズ抵抗素子一体型多層基板の製造方法