JPH0460017B2 - - Google Patents
Info
- Publication number
- JPH0460017B2 JPH0460017B2 JP12315684A JP12315684A JPH0460017B2 JP H0460017 B2 JPH0460017 B2 JP H0460017B2 JP 12315684 A JP12315684 A JP 12315684A JP 12315684 A JP12315684 A JP 12315684A JP H0460017 B2 JPH0460017 B2 JP H0460017B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- product
- rigid
- transfer
- transfer mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003466 welding Methods 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000013518 transcription Methods 0.000 claims description 4
- 230000035897 transcription Effects 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000011162 core material Substances 0.000 description 5
- 239000006260 foam Substances 0.000 description 4
- 239000012212 insulator Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は高周波などにより製品表面に模様を転
写するウエルダ加工における転写型に係り、特に
加工面と非加工面との区切り部を精密に転写する
ことのできる転写型の構造に関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a transfer mold for welding processing that transfers a pattern to the surface of a product using high frequency waves or the like, and in particular, it is used to accurately transfer a dividing portion between a processed surface and a non-processed surface. Concerning the structure of a transcription type that can be used.
従来高周波などにより製品表面を加熱して転写
型を押圧して模様などを該製品表面に転写する場
合には、形状の転写性の良好なシリコンゴムなど
の半硬質の型を転写型として採用していた。しか
し製品表面の一部分にのみウエルダ加工（溶融加
工）を実施しようとすると、転写型の端末部分が
ウエルダ加工時の加圧力により変形し、製品表面
に転写された模様などの形状が不完全なものとな
り、外観が非常に悪いものとなる問題があつた。
この問題を解消するためには製品表面全域にウエ
ルダ加工を実施しなければならず、デザイン上の
制約が非常に大きかつた。
Conventionally, when transferring patterns, etc. to the product surface by heating the product surface using high frequency waves and pressing a transfer mold, a semi-rigid mold such as silicone rubber, which has good shape transferability, is used as the transfer mold. was. However, if welding (melting processing) is attempted only on a portion of the product surface, the end portion of the transfer mold may be deformed by the pressure applied during welding, resulting in incomplete shapes such as patterns transferred to the product surface. Therefore, there was a problem that the appearance was very bad.
In order to solve this problem, it was necessary to perform welding over the entire surface of the product, which placed very large restrictions on design.
本発明は上記事情に鑑みてなされたもので、そ
の目的とするところは、製品表面への部分的なウ
エルダ加工を精密に外観よく行うことのできる転
写型を提供するにある。
The present invention has been made in view of the above-mentioned circumstances, and its object is to provide a transfer mold that can precisely perform partial welding on the surface of a product with good appearance.
本発明は高周波などを用いて製品表面に模様な
どを転写するウエルダ加工の転写型を、加工すべ
き模様などを表面のほぼ全域に形成した半硬質の
転写型と、この半硬質の転写型の表面と同じ高さ
の面を有し、この面の内周部が、半硬質の転写型
の全外周部に当接するように設けられた剛体の転
写型とによつて構成し、該半硬質の転写型が前記
製品のウエルダ加工面に対向し、該剛体の転写型
が前記製品の非加工面に対向するようにして所期
の目的を達成するようになしたものである。
The present invention consists of a welding transfer mold that uses high frequency waves to transfer patterns, etc. to the surface of a product, a semi-rigid transfer mold in which the pattern to be processed is formed on almost the entire surface, and A rigid transfer mold having a surface at the same height as the surface, the inner peripheral part of this surface being in contact with the entire outer peripheral part of the semi-rigid transcription mold, and the semi-rigid transcription mold The transfer mold faces the welded surface of the product, and the rigid transfer mold faces the non-processed surface of the product to achieve the intended purpose.
以下本発明に係るウエルダ加工の転写型の一実
施例を図面を参照して説明する。
An embodiment of a transfer mold for welding according to the present invention will be described below with reference to the drawings.
第１図に本発明の一実施例を示す。該図におい
て、被加工物の芯材１はABSなどの樹脂や紙な
どで形成されており、該被加工物の製品形状を保
持している。この芯材１の下面にはポリプロピレ
ンppや塩化ビニールで形成された発泡層２を介
して、この発泡層２と一体に接着された薄肉シー
ト３が接着剤４によつて接着されており、この薄
肉シート３がウエルダ加工される製品の表面とな
る。この薄肉シート３のウエルダ加工する部分の
下方には、あらかじめ加工すべき形状を転写した
シリコン型５が設けられており、その外側の非加
工部の下方には本発明の特徴である銅などの剛体
で形成された剛体型６が設けられている。この剛
体型６の前記シリコン型５に当接する一端はほぼ
Ｌ字状に上方に突出し、この突出した上端の高さ
は該シリコン型５の上面ととほぼ同一となつてお
り、しかもこの上端面６ａには意匠上の見切りラ
イン等の彫り込み部６ｂが形成されている。この
剛体型６の上方に突出した一端の内側は前記シリ
コン型５の外周全面にわたつて当接するようにな
つている。該シリコン型５の下部には電極７が設
けられ、剛体型６の下部には絶縁体８を介して電
極９が設けられており、この絶縁体８によつて電
極９と剛体型６および電極７との間がそれぞれ絶
縁されるようになつている。また前記芯材１の上
部には電極１０が設けられており、前記電極７お
よび９との間で製品を上下から挾持している。こ
の電極７は図示しない基台に固定されており、電
極９はフレーム１１を介して油圧シリンダ１２に
よつて昇降自在に支承されている。また電極１０
は油圧シリンダ１３により昇降自在に支承されて
いる。 FIG. 1 shows an embodiment of the present invention. In the figure, a core material 1 of the workpiece is made of resin such as ABS or paper, and maintains the product shape of the workpiece. A thin sheet 3, which is integrally bonded to the foam layer 2, is bonded to the bottom surface of the core material 1 with an adhesive 4 through a foam layer 2 made of polypropylene PP or vinyl chloride. The thin sheet 3 becomes the surface of the product to be welded. Below the part of the thin sheet 3 to be welded, there is provided a silicone mold 5 on which the shape to be processed has been transferred in advance, and below the outer non-processed part there is a silicone mold 5 that is made of copper, etc., which is a feature of the present invention. A rigid body 6 formed of a rigid body is provided. One end of this rigid body 6 that comes into contact with the silicone mold 5 protrudes upward in a substantially L-shape, and the height of this protruding upper end is approximately the same as the upper surface of the silicone mold 5; An engraved portion 6b such as a parting line for design is formed in 6a. The inside of one end of the rigid body 6 that protrudes upward comes into contact with the entire outer periphery of the silicone mold 5. An electrode 7 is provided at the bottom of the silicon mold 5, and an electrode 9 is provided at the bottom of the rigid body 6 via an insulator 8, and the insulator 8 connects the electrode 9 to the rigid body 6 and the electrode. 7 are insulated from each other. Further, an electrode 10 is provided on the upper part of the core material 1, and the product is held between the electrodes 7 and 9 from above and below. This electrode 7 is fixed to a base (not shown), and the electrode 9 is supported via a frame 11 by a hydraulic cylinder 12 so as to be able to move up and down. Also, the electrode 10
is supported by a hydraulic cylinder 13 so as to be movable up and down.
上記の如く構成された本発明の一実施例による
作用を以下に説明する。電極７，９を同一の高さ
に保持し電極１０を上昇させた位置で、芯材１、
発泡層２および薄肉シート３によつて構成された
製品を薄肉シート３を下に向けて、シリコン型５
および剛体型６の上に載置する。次にシリコン１
３により電極１０を下降させて製品を加圧し、電
極１０と電極７および９との間にそれぞれ高周波
電流を流して製品表面の温度を上げて転写を実施
する。このときにシリコン型５が加圧されて外周
の部分を外側に変形させようとする力が加わる
が、外周に設けられた剛体型６によつて変形が阻
止され形状が保持される。また剛体型６の上端面
６ａに形成された彫り込み部６ｂに加熱された薄
肉シート３が食いこむため、加圧による薄肉シー
ト３のずれも阻止されるため製品に正確な転写が
行われる。さらにまた製品への加圧力をシリコン
型５と剛体型６とにおいて一定に保つため、シリ
コン１２の加圧力によつて調整し、これら二つの
型５，６の高周波による発熱量を一定に保つた
め、電気回路中に可変抵抗Ｒを設けたり、剛体型
６に冷却水を通して冷却するようにする。 The operation of one embodiment of the present invention configured as described above will be described below. At a position where the electrodes 7 and 9 are held at the same height and the electrode 10 is raised, the core material 1,
The product composed of the foam layer 2 and the thin sheet 3 is placed in a silicone mold 5 with the thin sheet 3 facing down.
and placed on the rigid body 6. Next, silicon 1
3, the electrode 10 is lowered to apply pressure to the product, and high frequency currents are passed between the electrode 10 and the electrodes 7 and 9, respectively, to raise the temperature of the product surface and perform transfer. At this time, the silicon mold 5 is pressurized and a force is applied to deform the outer periphery outward, but the rigid body 6 provided on the outer periphery prevents the deformation and maintains the shape. Further, since the heated thin sheet 3 bites into the carved portion 6b formed on the upper end surface 6a of the rigid body 6, displacement of the thin sheet 3 due to pressure is also prevented, so that accurate transfer is performed on the product. Furthermore, in order to keep the pressure applied to the product constant between the silicone mold 5 and the rigid body 6, it is adjusted by the pressure applied by the silicone 12, and the amount of heat generated by the high frequency waves of these two molds 5 and 6 is kept constant. , a variable resistor R is provided in the electric circuit, or cooling water is passed through the rigid body 6 for cooling.
本実施例では剛体型６の断面形状がほぼＬ字形
の場合について説明したが、この形状はＬ字形に
限定されるものでないことは云うまでもない。 In this embodiment, a case has been described in which the cross-sectional shape of the rigid body 6 is approximately L-shaped, but it goes without saying that this shape is not limited to the L-shape.
上記のように本発明によれば、製品表面に模様
を転写するウエルダ加工に使用する転写型を、加
工面に当接するシリコン型と、このシリコン型の
外周部に当接する剛体型とによつて構成するよう
にしたものであるから、製品表面への部分的なウ
エルダ加工を精密に外観よく行えるようになつた
ので、その効果は大である。
As described above, according to the present invention, the transfer mold used in welding processing to transfer a pattern onto the surface of a product is composed of a silicon mold that comes into contact with the processing surface and a rigid mold that comes into contact with the outer periphery of this silicon mold. Because of this structure, it is now possible to perform partial welding on the surface of the product with precision and a good appearance, which is highly effective.
第１図は本発明に係るウエルダ加工の転写型の
一実施例を示す縦断面図である。
１…芯材、２…発泡層、３…薄肉シート、４…
接着剤、５…シリコン型、６…剛体型、６ｂ…彫
り込み部、７，９，１０…電極、８…絶縁体、１
２，１３…油圧シリンダ。
FIG. 1 is a longitudinal sectional view showing an embodiment of a transfer mold for welding according to the present invention. 1...Core material, 2...Foam layer, 3...Thin sheet, 4...
Adhesive, 5... Silicon mold, 6... Rigid body, 6b... Engraved part, 7, 9, 10... Electrode, 8... Insulator, 1
2, 13... Hydraulic cylinder.
Claims (1)
写するウエルダ加工の転写型において、前記転写
型が加工すべき模様などを表面のほぼ全域に形成
した半硬質の転写型と、この半硬質の転写型の表
面と同じ高さの面を有し、この面の内周部が、該
半硬質の転写型の全外周部に当接するように設け
られた剛体の転写型とから成り、前記半硬質の転
写型が前記製品のウエルダ加工面に対向し、前記
剛体の転写型が前記製品の非加工面に対向し、こ
の剛体の転写型が前記製品の表面に当接する面
に、該製品表面のウエルダ加工時の加工によるず
れを防止する彫り込み部を設けたことを特徴とす
るウエルダ加工の転写型。1. In a welding transfer mold that transfers a pattern, etc. to the surface of a product using high frequency waves, etc., there is a semi-rigid transfer mold in which the pattern to be processed by the transfer mold is formed over almost the entire surface, and this semi-rigid transfer mold. a rigid transfer mold having a surface at the same height as the surface of the mold, the inner peripheral part of this surface being in contact with the entire outer peripheral part of the semi-rigid transcription mold; The transfer die faces the welded surface of the product, the rigid transfer die faces the non-processed surface of the product, and the rigid transfer die is placed on the surface of the product in contact with the surface of the product. A transfer mold for welding processing characterized by having an engraved part to prevent misalignment due to processing during welding processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12315684A JPS612529A (en) | 1984-06-15 | 1984-06-15 | Transfer mold for welder processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12315684A JPS612529A (en) | 1984-06-15 | 1984-06-15 | Transfer mold for welder processing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS612529A JPS612529A (en) | 1986-01-08 |
| JPH0460017B2 true JPH0460017B2 (en) | 1992-09-24 |
Family
ID=14853562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12315684A Granted JPS612529A (en) | 1984-06-15 | 1984-06-15 | Transfer mold for welder processing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS612529A (en) |
-
1984
- 1984-06-15 JP JP12315684A patent/JPS612529A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS612529A (en) | 1986-01-08 |
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