JPH045659U - - Google Patents
Info
- Publication number
- JPH045659U JPH045659U JP1990045905U JP4590590U JPH045659U JP H045659 U JPH045659 U JP H045659U JP 1990045905 U JP1990045905 U JP 1990045905U JP 4590590 U JP4590590 U JP 4590590U JP H045659 U JPH045659 U JP H045659U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- light
- bonded
- receiving surface
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 10
- 238000000465 moulding Methods 0.000 claims 6
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 238000006243 chemical reaction Methods 0.000 claims 2
- 239000011159 matrix material Substances 0.000 claims 2
- 239000000919 ceramic Substances 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
第１図は本考案の一実施例の斜視断面図、第２
図は本考案の他の実施例の斜視断面図、第３図は
従来の固定撮像素子の斜視断面図である。
１……セラミツクパツケージ、２，１０……セ
ンサチツプ、３ａ，３ｂ，１３……リード部、１
１……アイランド部、１２……凹部、１４……凸
部。
Fig. 1 is a perspective sectional view of one embodiment of the present invention;
This figure is a perspective sectional view of another embodiment of the present invention, and FIG. 3 is a perspective sectional view of a conventional fixed image sensor. 1... Ceramic package, 2, 10... Sensor chip, 3a, 3b, 13... Lead part, 1
1... Island portion, 12... Concave portion, 14... Convex portion.
Claims (1)
状に配列されてなる半導体チツプと、 この半導体チツプがダイボンデイングされるア
イランド部及び上記半導体チツプとワイヤボンデ
イングされるリード部からなるリードフレームと
、上記半導体チツプを上記リードフレームと共に
モールドする透光性のモールド樹脂と、 を備え、 上記モールド樹脂は、 上記半導体チツプの受光面に対応する領域上に
一定の深さの凹部を有し、 この凹部を除く領域に光を遮光する遮光膜が被
着されていることを特徴とする固体撮像素子。 (2) 受光面に複数の光電変換素子がマトリクス
状に配列されてなる半導体チツプと、 この半導体チツプがダイボンデイングされるア
イランド部及び上記半導体チツプとワイヤボンデ
イングされるリード部からなるリードフレームと
、上記半導体チツプを上記リードフレームと共に
モールドする透光性のモールド樹脂と、 を備え、 上記モールド樹脂は、 上記半導体チツプの受光面に対応する領域上に
一定の高さの凸部を有し、 この凸部を除く領域に光を遮光する遮光膜が被
着されていることを特徴とする固体撮像素子。[Claims for Utility Model Registration] (1) A semiconductor chip having a plurality of photoelectric conversion elements arranged in a matrix on a light-receiving surface, an island portion to which this semiconductor chip is die-bonded, and an island portion to which the semiconductor chip is wire-bonded. A lead frame including a lead portion; and a translucent molding resin for molding the semiconductor chip together with the lead frame, the molding resin having a predetermined depth over a region corresponding to the light-receiving surface of the semiconductor chip. What is claimed is: 1. A solid-state image sensor, comprising: a recessed portion, and a light-shielding film that blocks light is adhered to an area excluding the recessed portion. (2) a semiconductor chip comprising a plurality of photoelectric conversion elements arranged in a matrix on a light-receiving surface; a lead frame comprising an island portion to which the semiconductor chip is die-bonded; and a lead portion to which the semiconductor chip is wire-bonded; a translucent molding resin for molding the semiconductor chip together with the lead frame, the molding resin having a convex portion of a certain height on a region corresponding to the light-receiving surface of the semiconductor chip; 1. A solid-state image sensor, characterized in that a light-shielding film that blocks light is applied to an area other than a convex portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990045905U JPH045659U (en) | 1990-04-27 | 1990-04-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990045905U JPH045659U (en) | 1990-04-27 | 1990-04-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH045659U true JPH045659U (en) | 1992-01-20 |
Family
ID=31560502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990045905U Pending JPH045659U (en) | 1990-04-27 | 1990-04-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH045659U (en) |
-
1990
- 1990-04-27 JP JP1990045905U patent/JPH045659U/ja active Pending