JPH0456157A - Lead mounting structure for semiconductor device - Google Patents
Lead mounting structure for semiconductor deviceInfo
- Publication number
- JPH0456157A JPH0456157A JP16340890A JP16340890A JPH0456157A JP H0456157 A JPH0456157 A JP H0456157A JP 16340890 A JP16340890 A JP 16340890A JP 16340890 A JP16340890 A JP 16340890A JP H0456157 A JPH0456157 A JP H0456157A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- metallized layer
- layer
- brazing material
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 19
- 238000007747 plating Methods 0.000 claims abstract description 50
- 238000005219 brazing Methods 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 31
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 abstract description 6
- 230000001846 repelling effect Effects 0.000 abstract 2
- 230000002265 prevention Effects 0.000 description 14
- 239000000945 filler Substances 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 238000001465 metallisation Methods 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 230000005499 meniscus Effects 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 210000004556 brain Anatomy 0.000 description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 235000013405 beer Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野］
本発明は、半導体装置の表面積の広いメタライズ層表面
の一部にリードを取り付ける際に用いるリード取り付け
構造に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a lead attachment structure used when attaching a lead to a part of the surface of a metallized layer having a large surface area of a semiconductor device.
Ｖ従来の技術］
従来より、半導体装置の背面などに、グランドプレーン
、電源プレーン等を構成するメタライズ層を広（備えて
、そのメタライズ層表面に銀ろうやはんだなどのろう材
（以下、ろう材という）に濡れやすいニッケルめっきな
どの下地めっきを施し、その下地めっきを施した表面積
の広いメタライズ層表面の一部に、基板の回路等の外部
回路接続用の金属製のリードを、ろう材を用いて接続し
てなる半導体装置がある。V. Prior Art] Conventionally, a metallized layer constituting a ground plane, power plane, etc. is spread on the back surface of a semiconductor device, and a brazing material (hereinafter referred to as brazing material) such as silver solder or solder is applied to the surface of the metallized layer. A base plating such as nickel plating, which is easy to wet, is applied to the base plating, and a metal lead for connecting external circuits such as circuits on the board is placed on a part of the surface of the metallized layer with a large surface area. There are semiconductor devices that are connected using this method.
［発明が解決しようとする課題］
しかしながら、上記半導体装置においては、リードが下
地めっきを施したメタライズ層表面の一部に確実に接続
されていなくて、リードにその長手方向やその長手方向
に直角な方向に力を加えてその接続強度を計測する引っ
張試験やビール（剥離）試験に合格しないものが多数発
生した。[Problems to be Solved by the Invention] However, in the above-mentioned semiconductor device, the leads are not reliably connected to a part of the surface of the metallized layer on which base plating is applied, and the leads are not connected in the longitudinal direction or perpendicular to the longitudinal direction. Many products failed to pass the tensile test and beer (peel) test, which measure the connection strength by applying force in a certain direction.
これは、リードを上記表面積の広いメタライズ層表面の
一部に接続した際に、リード接続用のろう材が、リード
周辺のろう材に濡れやすい下地めっきを施したメタライ
ズ層表面に広（流れ出してしまって、そのろう材かリー
ド周囲表面とその周辺の下地めっきを施したメタライズ
層表面部分に亙って的確にメニスカス形状等を描いて十
分に付着しないからである。This is because when a lead is connected to a part of the surface of the metallized layer with a large surface area, the brazing material for connecting the lead spreads (flows out) onto the surface of the metallized layer, which has a base plating that easily wets the brazing material around the lead. This is because the brazing filler metal does not form a meniscus shape accurately over the peripheral surface of the lead and the surface portion of the underlying metallized layer around it, and does not adhere sufficiently.
本発明は、このような間居点を解消した、半導体装置の
リード取り付け構造（以下、リード取り付け構造という
）を提供することを目的としている。An object of the present invention is to provide a lead attachment structure for a semiconductor device (hereinafter referred to as a lead attachment structure) that eliminates such a problem.
［課題を解決するための手段〕
上記目的のために、本発明の第１のリード取り付け構造
は、半導体装置の表面積の広いメタライズ層表面のリー
ドを接続する部分周辺に、ろう材に濡れにくくそれらを
はじく流れ止め部材を備えて、その流れ止め部材内側の
ろう材に濡れやすい下地めっきを施したメタライズ層表
面部分に、リードをろう材を用いて接続したことを特徴
としている。[Means for Solving the Problems] For the above-mentioned purpose, the first lead attachment structure of the present invention has a metallized layer with a large surface area, around the part where the leads are connected, which is difficult to get wet with the brazing material. The lead is connected to the surface of the metallized layer, which is coated with a base plating that easily wets the brazing material inside the flow preventing member, using a brazing material.
また、本発明の第２のリード取り付け構造は、半導体装
置の表面積の広いメタライズ層表面のリートを接続する
部分に、ろう材に濡れやすい下地めっきを部分的に施し
て、その下地めっきを施したメタライズ層表面部分に、
リードをろう材を用いて接続したことを特徴としている
。Further, in the second lead attachment structure of the present invention, a base plating that is easily wetted by the brazing material is partially applied to the part of the surface of the metallized layer with a large surface area of the semiconductor device where the lead is connected, and the base plating is applied. On the surface of the metallized layer,
The feature is that the leads are connected using brazing material.
「作用」
上記構成の第１のリード取り付け構造おいては、リード
を流れ止め部材内側の下地めっきを施したメタライズ層
表面部分にろう材を用いて接続した際に、ろう材に濡れ
にくい流れ止め部材が、その流れ止め部材を乗り越えて
メタライズ層表面に広く流れ出そうとするリード接続用
のろう材を、流れ止め部材内側へとはじき返して、流れ
止め部材内側にくい止める。そして、その流れ止め部材
内側にくい止められたろう材が、リード周囲表面とその
周辺の下地めっきを施したメタライズ層表面部分に亙っ
て、的確にメニスカス形状等を描いて十分に付着する。"Operation" In the first lead attachment structure configured as described above, when the lead is connected to the surface portion of the metallized layer with the base plating inside the flow prevention member using the brazing material, the flow prevention material prevents the lead from getting wet with the solder material. The member repels the brazing material for lead connection which is about to flow out widely onto the surface of the metallized layer by overcoming the flow stopper member to the inside of the flow stopper member, and stops the filler material from inside the flow stopper member. Then, the brazing filler metal that has been stopped inside the flow prevention member is sufficiently adhered to the surrounding surface of the lead and the surface portion of the metallized layer that has been subjected to base plating around the lead, accurately drawing a meniscus shape or the like.
上記構成の第２のリード取り付け構造においては、リー
ドを下地めっきを部分的に施したメタライズ層表面部分
にろう材を用いて接続した際に、下地めっきを施したメ
タライズ層表面部分からその周辺のメタライズ層表面に
広く流れ出そうとするリード接続用のろう材が、その下
地めっきを施したメタライズ層表面部分周囲のろう材に
濡れに（いメタライズが露出しているメタライズ層表面
にはじき返されて、下地めっきを施したメタライズ層表
面部分にくい止められる。そして、そのくい止められた
ろう材が、リード周囲表面とその周辺の下地めっきを施
したメタライズ層表面部分に亙って、的確にメニスカス
形状等を描いて十分に付着する。In the second lead attachment structure having the above configuration, when the lead is connected to the surface portion of the metallized layer partially plated with the base plate using a brazing material, the surface area of the metallize layer partially plated with the base plate is connected to the surrounding area. The solder metal for lead connection that is about to flow out widely onto the surface of the metallized layer is wetted by the solder metal around the surface of the metallized layer that has been plated under it (and is repelled by the surface of the metallized layer where the metallization is exposed). , the surface of the metallized layer with the base plating is held firmly in place.Then, the held brazing filler metal accurately forms a meniscus shape, etc. over the surface around the lead and the surface area of the metallized layer with the base plating around it. Draw and adhere well.
それと共に、上記第２のリード取り付け構造においては
、上記第１のリード取り付け構造のように、めっきが付
きにくい等する流れ止め部材を、リードを接続したメタ
ライズ層表面部分周辺に備えていないので、リードとそ
れを接続したメタライズ層表面に広く防錆用の金めつき
等の表面めっきを施した場合に、流れ止め部材に邪魔さ
れずに、リードとそれを接続したメタライズ層表面に亙
って途切れのない表面めっき層か形成される。そして、
その途切れのない抵抗値の低い金めつき層等の表面めっ
き層を介して、リードがメタライズ層に接続抵抗超低（
接続される。At the same time, unlike the first lead attachment structure, the second lead attachment structure does not include a flow prevention member that prevents plating from sticking around the surface of the metallized layer to which the leads are connected. When surface plating such as gold plating for rust prevention is widely applied to the surface of the lead and the metallized layer that connects it, the surface of the lead and the metallized layer that connects it can be coated without being obstructed by the flow prevention member. A continuous surface plating layer is formed. and,
The leads are connected to the metallized layer through an uninterrupted surface plating layer such as a gold-plated layer with low resistance.
Connected.
［実施例コ 次に、本発明の実施例を図面に従い説明する。[Example code] Next, embodiments of the present invention will be described with reference to the drawings.
第１図および第２図は本発明の第１のリード取り付け構
造の好適な実施例を示し、第１図はその平面図、第２図
は第１図のＡ−Ａ断面図である。1 and 2 show a preferred embodiment of the first lead attachment structure of the present invention, with FIG. 1 being a plan view thereof, and FIG. 2 being a sectional view taken along the line AA in FIG. 1.
以下、この図中の実施例を説明する。The embodiment shown in this figure will be described below.
図において、１０は、半導体装置の半導体チップを収容
するセラミックなどからなるパッケージ本体である。In the figure, 10 is a package body made of ceramic or the like that houses a semiconductor chip of a semiconductor device.
このパッケージ本体１０背面には、表面積の広いタング
ステン等からなメタライズ層２０を広く一体に備えてい
る。このメタライズ層２０は、パッケージ本体１０に備
えた内部回路（図示せず）を介して接地回路または電源
回路（図示せず）に接続されていて、グランドブレーン
または電源ブレーンを構成している。A metallized layer 20 made of tungsten or the like having a large surface area is widely and integrally provided on the back side of the package body 10. This metallized layer 20 is connected to a ground circuit or a power supply circuit (not shown) via an internal circuit (not shown) provided in the package body 10, and constitutes a ground brain or a power supply brain.
メタライズ層２０表面の後述のリードを接続する部分周
辺（図では、メタライズ層２０の側縁中途部）には、ろ
う材に濡れにくくそれらをはじく流れ止め部材３０を、
リードを接続する部分周囲を途切れなく囲むようにコの
字状に備えている。Around the part of the surface of the metallized layer 20 where the leads described below are connected (in the figure, the middle part of the side edge of the metallized layer 20), a flow stopper member 30 that does not easily get wet with the brazing filler metal and repels it is placed.
It is provided in a U-shape so as to seamlessly surround the area where the lead is connected.
この流れ止め部材３０は、例えばアルミナ（Ａ１．０３
）層からなり、アルミナ粉末を含むペーストを、スクリ
ーン印刷等の技法を用いて、焼成前のパッケージ本体１
０形成用の例えば最下層のグリーンシート背面のメタラ
イズ層２０形成用の乾燥させたメタライズペースト層表
面の所定部位にコの字状に塗布して、それらグリーンシ
ート、メタライズペースト層、アルミナ粉末を含むペー
ストを共に一体焼成することにより形成している。This flow prevention member 30 is made of, for example, alumina (A1.03
) layer and containing alumina powder is applied to the package body 1 before firing using techniques such as screen printing.
For example, it is applied in a U-shape to a predetermined portion of the surface of the dried metallization paste layer for forming the metallization layer 20 on the back side of the lowest layer green sheet for forming the green sheet, the metallization paste layer, and the alumina powder. It is formed by integrally firing the paste together.
このアルミナ層などからなるめっきが付きにくい流れ止
め部材３０表面を除くメタライズ層１０表面には、ろう
材に濡れやすい二・ノケルめつき等の下地めっき４０を
広く施している。The surface of the metallized layer 10, except for the surface of the flow prevention member 30, which is difficult to be coated with plating made of alumina layer, etc., is extensively coated with base plating 40 such as Ni-Nokel plating, which is easily wetted by the brazing material.
流れ止め部材３０内側の下地めっき４０が施されたメタ
ライズ層２０表面部分には、細帯状をした金属製のり−
ド５０後端を、ろう材６０を用いて接続している。そし
て、リード５０先端を、パッケージ本体１０外方に水平
に延出させている。On the surface of the metallized layer 20 on which the base plating 40 is applied inside the flow prevention member 30, there is a strip-shaped metal glue.
The rear ends of the leads 50 are connected using a brazing material 60. The tips of the leads 50 are horizontally extended outward from the package body 10.
第１図および第２図に示した第１のリード取り付け構造
は、以上のように構成していて、リード５０後端を、メ
タライズ層２０表面の一部に接続した際に、リード接続
用のろう材６０が、流れ止め部材３０内側にくい止めら
れて、リード５０後端周囲表面とその周辺の下地めつき
４０が施されたメタライズ層２０表面部分に亙って十分
に付着する。The first lead attachment structure shown in FIGS. 1 and 2 is configured as described above, and when the rear end of the lead 50 is connected to a part of the surface of the metallized layer 20, a The brazing filler metal 60 is held tightly inside the flow stopper member 30 and sufficiently adheres to the peripheral surface of the rear end of the lead 50 and the surface portion of the metallized layer 20 on which the base plating 40 has been applied around the rear end of the lead 50 .
なお、上述実施例において、流れ止め部材３０は、その
中途部を途切れさせたり、または第３図に示したように
、リード５０を接続するメタライズ層２０表面部分の両
側に縦帯状に備えたり、または第４図に示したように、
メタライズ層２０表面の一部に複数本のリード５０を並
べて接続する場合は、その隣合うリード５０を接続する
メタライズ層２０表面部分の間に横帯状に連続して備え
たりして、リード５０を接続するメタライズ層２０表面
部分周辺の一部に流れ止め部材３０を備えずに、その一
部を解放させておいても良く、そのようにしても、ろう
材６０に、溶融状態において粘性の高い接合金を用いる
ことにより、上述実施例と同様に、リード接続用のろう
材６０を、上記流れ止め部材３０内側にくい止めて、リ
ード５０周囲表面とその周辺のニッケルめっき等の下地
めっき４０が施されたメタライズ層２０表面部分に亙っ
て十分に付着させることができる。In the above-described embodiment, the flow prevention member 30 is discontinued in the middle, or as shown in FIG. Or as shown in Figure 4,
When connecting a plurality of leads 50 side by side to a part of the surface of the metallized layer 20, the leads 50 are connected in a continuous horizontal band shape between the surface parts of the metallized layer 20 connecting adjacent leads 50. A part of the periphery of the surface of the metallized layer 20 to be connected may be left open without providing the stopper member 30, and even if this is done, the brazing filler metal 60 may have high viscosity in the molten state. By using the bonding metal, the brazing material 60 for lead connection is firmly fixed inside the flow prevention member 30, and the base plating 40 such as nickel plating is applied to the surface around the lead 50 and the surrounding area. The metallized layer 20 can be sufficiently adhered to the entire surface of the metallized layer 20.
第５図ないし第８図は本発明の第２のリード取り付け構
造の好適な実施例を示し、詳しくは第５図および第６図
はその取り付け工程途中における平面図とそのＢ−Ｂ断
面図、第７図および第８図はその正面図とそのＣ−Ｃ断
面図である。以下、この図中の実施例を説明する。5 to 8 show a preferred embodiment of the second lead attachment structure of the present invention, and in detail, FIGS. 5 and 6 are a plan view and a BB sectional view thereof during the attachment process, FIGS. 7 and 8 are a front view and a cross-sectional view taken along the line CC. The embodiment shown in this figure will be described below.
図において、１００は、半導体装置の半導体チップを収
容するセラミックなどからなるパッケージ本体である。In the figure, 100 is a package body made of ceramic or the like that houses a semiconductor chip of a semiconductor device.
このパッケージ本体１００背面には、タングステン等か
らなる表面積の広いメタライズ層２００を広く一体に備
えている。このメタライズ層２００は、パッケージ本体
ｌＯＯに備えた内部回路（図示せず）を介して接地回路
または電源回路（図示せず）に接続されていて、グラン
ドブレーンまたは電源プレーンを構成している。A metallized layer 200 made of tungsten or the like and having a large surface area is widely and integrally provided on the back side of the package body 100. This metallized layer 200 is connected to a grounding circuit or a power supply circuit (not shown) via an internal circuit (not shown) provided in the package main body IOO, and constitutes a ground brain or a power supply plane.
メタライズ層２００表面の後述のリードを接続する部分
には、ろう材に濡れやすいニッケルめっき等の下地めっ
き４００を部分的に施している。The surface of the metallized layer 200 is partially coated with a base plating 400 such as nickel plating, which is easily wetted by the brazing material, at a portion where leads to be described later are to be connected.
この下地めっき４００を上記メタライズ層２００表面部
分に部分的に施すには、例えば第５図および第６図に示
したように、下地めっき４００を施すメタライズ層２０
０表面部分を除くメタライズ層２００表面を、樹脂膜等
のマスク７００で覆った後、そのマスク７００で覆われ
ていないメタライズが露出しているメタライズ層２００
表面部分に下地めっき４００を部分的に施している。そ
して、その後、上記マスク７００をメタライズ層２００
表面から剥離、除去している。To partially apply the base plating 400 to the surface of the metallized layer 200, for example, as shown in FIGS. 5 and 6, the metallized layer 200 to which the base plating 400 is applied is
After covering the surface of the metallized layer 200 except for the zero surface portion with a mask 700 such as a resin film, the metallized layer 200 has exposed metallization that is not covered by the mask 700.
Base plating 400 is partially applied to the surface portion. Then, the mask 700 is applied to the metallized layer 200.
Peeling off and removal from the surface.
下地めっき４００を施したメタライズ層、２００表面部
分には、第７図および第８図に示したように、外部回路
接続用の金属製のリード５００後端を、ろう材６００を
用いて接続している。そして、リード５００先端を、パ
ッケージ本体１００外方に水平に延出させている。As shown in FIGS. 7 and 8, the rear end of a metal lead 500 for external circuit connection is connected to the surface portion of the metallized layer 200 on which the base plating 400 has been applied using a brazing material 600. ing. The tips of the leads 500 extend horizontally to the outside of the package body 100.
第５図ないし第８図に示した第２のリード取り付け構造
は以上の構成からなり、リード５００を下地めっき４０
０を部分的に施したメタライズ層２００表面部分に接続
した際に、下地めっき４００を施したメタライズ層２０
０表面部分からその周辺のメタライズ層２００表面に流
れ出そうとするリード接続用のろう材６００か、下地め
っき４００を施したメタライズ層２００表面部分周囲の
メタライズが露出しているメタライズ層２００表面には
じき返されて、下地めっき４００が施されたメタライズ
層２００表面部分にくい止められる。The second lead attachment structure shown in FIGS. 5 to 8 has the above configuration, and the lead 500 is attached to the base plating
When connected to the surface portion of the metallized layer 200 partially coated with 0, the metallized layer 20 coated with base plating 400
The brazing filler metal 600 for lead connection that is about to flow out from the 0 surface portion to the surface of the metallized layer 200 around it, or the metallized layer 200 surface where the metallization around the surface portion of the metallized layer 200 on which the base plating 400 has been applied is repelled. It is turned over and fixed onto the surface portion of the metallized layer 200 on which the base plating 400 has been applied.
そして、そのくい止められたろう材６００が、リード５
００周囲表面とその周辺の下地めっき４００が施された
メタライズ層２００表面部分に亙って十分に付着する。Then, the held brazing filler metal 600 is connected to the lead 5.
The metallized layer 200 is sufficiently adhered to the 00 peripheral surface and the surrounding surface portion of the metallized layer 200 on which the base plating 400 is applied.
それと共に、リード５００とそれを接続したメタライズ
層２００表面に広く防錆用の金めつき等の表面めっきを
施した際に、それらリート５００とメタライズ層２００
表面に亙って途切れのない表面めっきが施されて、その
金めつき等の表面めっき層を介して、リード５００がメ
タライズ層２００に接続抵抗値低く接続される。At the same time, when the surface of the lead 500 and the metallized layer 200 connected thereto is extensively plated with gold plating for rust prevention, the lead 500 and the metallized layer 200 are
Uninterrupted surface plating is applied to the entire surface, and the lead 500 is connected to the metallized layer 200 with a low connection resistance via the surface plating layer such as gold plating.
なお、上述第１、第２のリード取り付け構造において、
リード５０，５００には、その周囲にろう材に濡れやす
いニッケルめっきなとの下地めっきを施しておくのが良
く、そうすれば、リード５０．５００周囲表面により的
確にろう材６０，６００を付着させることが可能となる
。In addition, in the above-mentioned first and second lead attachment structures,
It is best to apply base plating around the leads 50, 500, such as nickel plating, which is easily wetted by the brazing material, so that the brazing material 60, 600 can be more accurately adhered to the surface around the leads 50, 500. It becomes possible to do so.
また、本発明は、半導体装置のパッケージ本体やボード
等の種々の表面に備えた表面積の広い帯状をしたグラン
ド回路、電源回路、信号回路用等のメタライズ層表面の
一部に、細帯状のリードをろう材を用いて接続する場合
にも利用可能であることは言うまでもない。Further, the present invention provides a thin strip-shaped lead on a part of the surface of a metallized layer for ground circuits, power supply circuits, signal circuits, etc., which have a wide surface area and are provided on various surfaces of semiconductor device package bodies, boards, etc. Needless to say, it can also be used when connecting using a brazing material.
［発明の効果］
以上説明したように、本発明の第１、第２のリード取り
付け構造によれば、リード周囲表面とその周辺の下地め
っきを施したメタライズ層表面部分に亙って、リード接
続用のろう材を、的確にメニスカス形状等を描くように
、十分に付着させることができる。[Effects of the Invention] As explained above, according to the first and second lead attachment structures of the present invention, the lead connection can be made over the peripheral surface of the lead and the surface portion of the metallized layer coated with the base plating around the lead. The brazing filler metal can be sufficiently attached to accurately draw a meniscus shape, etc.
そして、リードを下地めっきを施した表面積の広いメタ
ライズ層表面の一部に常に安定して接続強度高（取り付
け可能となる。Then, the lead can always be stably attached to a part of the surface of the metallized layer, which has a large surface area and has a high surface area, with high connection strength.
それと共に、本発明の第２のリード取り付け構造によれ
ば、めっきが付きにくい等する流れ止め部材に邪魔され
ずに、リードとそれを接続したメタライズ層表面に亙っ
て途切れのない防錆用の金めつき等の表面めっきを施す
ことができ、リードをメタライズ層に接続抵抗値低く接
続可能となる。At the same time, according to the second lead attachment structure of the present invention, rust prevention can be carried out seamlessly over the surface of the lead and the metallized layer connecting it, without being obstructed by a flow prevention member to which plating is difficult to adhere. Surface plating such as gold plating can be applied to the metallized layer, making it possible to connect the leads to the metallized layer with low connection resistance.
第１図は本発明の第１の半導体装置のリード取り付け構
造の平面図、第２図は第１図のＡ−Ａ断面図、第３図と
第４図はそれぞれ本発明の第１の半導体装置のリード取
り付け構造の他の実施例を示す平面図、第５図は本発明
の第２の半導体装置のリード取り付け構造の途中工程を
示す平面図、第６図は第５図のＢ−Ｂ断面図、第７図は
本発明の第２のリード取り付け構造の平面図、第８図は
第７図のＣ−Ｃ断面図である。
１０．１００・・・バ、ケージ本体、
２０．２００・・・メタライズ層、
３０・・・流れ止め部材、
４０．４００・・・下地めっき、
５０．５００・・・リード、
６０．６００・・・ろう材、
７００・・・マスク。
特許出願人 新光電気工業株式会社FIG. 1 is a plan view of the lead attachment structure of the first semiconductor device of the present invention, FIG. 2 is a sectional view taken along line A-A in FIG. 1, and FIGS. A plan view showing another embodiment of the lead attachment structure of the device, FIG. 5 is a plan view showing an intermediate step of the lead attachment structure of the second semiconductor device of the present invention, and FIG. 6 is taken along the line B-B in FIG. 7 is a plan view of the second lead attachment structure of the present invention, and FIG. 8 is a sectional view taken along the line CC in FIG. 7. 10.100... Bar, cage body, 20.200... Metallized layer, 30... Stopper member, 40.400... Base plating, 50.500... Lead, 60.600...・Brazing metal, 700...Mask. Patent applicant Shinko Electric Industry Co., Ltd.
Claims (1)
ドを接続する部分周辺に、ろうま材に濡れにくくそれら
をはじく流れ止め部材を備えて、その流れ止め部材内側
のろう材に濡れやすい下地めっきを施したメタライズ層
表面部分に、リードをろう材を用いて接続したことを特
徴とする半導体装置のリード取り付け構造。 ２、半導体装置の表面積の広いメタライズ層表面のリー
ドを接続する部分に、ろう材に濡れやすい下地めっきを
部分的に施して、その下地めっきを施したメタライズ層
表面部分に、リードをろう材を用いて接続したことを特
徴とする半導体装置のリード取り付け構造。[Claims] 1. A flow stopper member that does not easily wet the solder metal and repels the solder metal is provided around the area where the leads are connected on the surface of the metallized layer with a large surface area of the semiconductor device, and the solder metal inside the flow stopper member A lead attachment structure for a semiconductor device, characterized in that a lead is connected using a brazing material to the surface of a metallized layer coated with a base plating that is easily wetted. 2. Partially apply base plating that is easily wetted by the brazing material to the part of the surface of the metallized layer with a large surface area of the semiconductor device where the lead is connected, and then apply the brazing material to the lead on the surface of the metallized layer that has been subjected to the base plating. 1. A lead attachment structure for a semiconductor device, characterized in that the lead attachment structure is connected using a semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16340890A JPH0456157A (en) | 1990-06-21 | 1990-06-21 | Lead mounting structure for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16340890A JPH0456157A (en) | 1990-06-21 | 1990-06-21 | Lead mounting structure for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0456157A true JPH0456157A (en) | 1992-02-24 |
Family
ID=15773328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16340890A Pending JPH0456157A (en) | 1990-06-21 | 1990-06-21 | Lead mounting structure for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0456157A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3490096B2 (en) * | 1997-08-01 | 2004-01-26 | シチズン時計株式会社 | LCD panel |
| WO2011004649A1 (en) * | 2009-07-10 | 2011-01-13 | ミツミ電機株式会社 | Antenna device |
| JP2018117057A (en) * | 2017-01-19 | 2018-07-26 | Ｎｇｋエレクトロデバイス株式会社 | Wiring board, package for storing electronic component, and electronic device |
-
1990
- 1990-06-21 JP JP16340890A patent/JPH0456157A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3490096B2 (en) * | 1997-08-01 | 2004-01-26 | シチズン時計株式会社 | LCD panel |
| WO2011004649A1 (en) * | 2009-07-10 | 2011-01-13 | ミツミ電機株式会社 | Antenna device |
| US8872726B2 (en) | 2009-07-10 | 2014-10-28 | Mitsumi Electric Co., Ltd. | Antenna device |
| JP2018117057A (en) * | 2017-01-19 | 2018-07-26 | Ｎｇｋエレクトロデバイス株式会社 | Wiring board, package for storing electronic component, and electronic device |
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