JPH07142665A - Electronic part provided with lead - Google Patents

Electronic part provided with lead

Info

Publication number
JPH07142665A
JPH07142665A JP5288021A JP28802193A JPH07142665A JP H07142665 A JPH07142665 A JP H07142665A JP 5288021 A JP5288021 A JP 5288021A JP 28802193 A JP28802193 A JP 28802193A JP H07142665 A JPH07142665 A JP H07142665A
Authority
JP
Japan
Prior art keywords
solder
lead
leads
electronic component
wettability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5288021A
Other languages
Japanese (ja)
Inventor
Seiichi Yoshinaga
誠一 吉永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP5288021A priority Critical patent/JPH07142665A/en
Publication of JPH07142665A publication Critical patent/JPH07142665A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To provide an electronic part provided with leads which are free from soldering failures caused by the excessive suck up of molten solder along leads when the leads of an electronic part provided with leads are brought into contact with solder provided to the electrodes of a printed board and soldered to them by heating solder. CONSTITUTION:An electronic part 1a is provided with leads 3 which extent out downward from the side face of its main body 2, wherein the lower end 3a of the lead 3 soldered to an electrode 5 provided to a printed board 4 is set better in wettability than the upper end 3b. Therefore, when solder 6 is fused by heating, the molten solder 6 is prevented from being excessively sucked up along the lead 3 crossing boundary point a between a part excellent in wettability and a part poor in wettability to cause defective soldering.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、本体から外部下方へ延
出するリードをプリント基板の電極に半田付けするリー
ド付電子部品に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a leaded electronic component for soldering a lead extending downward from a main body to an electrode of a printed circuit board.

【０００２】[0002]

【従来の技術】図２６は、プリント基板に半田付けされ
た従来のリード付電子部品の側面図である。リード付電
子部品１は、本体２の側面から外部下方へ延出するリー
ド３を有しており、このリード３の下端部３ａがプリン
ト基板４の電極５に半田６にて半田付けされている。こ
の半田付けは、スクリーン印刷手段やプリコート手段な
どにより電極５上に形成された半田６上にリード３の下
端部３ａを接地させた後、プリント基板４を加熱炉へ送
り、加熱炉で半田６を加熱して溶融させることにより行
われる。2. Description of the Related Art FIG. 26 is a side view of a conventional leaded electronic component soldered to a printed circuit board. The leaded electronic component 1 has a lead 3 extending downward from the side surface of the main body 2, and the lower end portion 3 a of the lead 3 is soldered to the electrode 5 of the printed board 4 by the solder 6. . In this soldering, the lower end portion 3a of the lead 3 is grounded on the solder 6 formed on the electrode 5 by screen printing means, precoating means, or the like, and then the printed board 4 is sent to a heating furnace and the solder 6 is applied in the heating furnace. Is heated and melted.

【０００３】半田６を加熱して溶融させた際に、溶融し
た半田６がリード３に十分に吸い寄せられて付着するよ
うに、一般に、リード３はその表面に半田メッキを施す
などして半田６のぬれ性を向上させている。When the solder 6 is heated and melted, the melted solder 6 is generally attracted to and attached to the leads 3 so that the surfaces of the leads 3 are generally solder-plated. It improves the wettability of.

【０００４】[0004]

【発明が解決しようとする課題】しかしながらリード３
に半田メッキを施すなどしてそのぬれ性を向上させる
と、図２６において符号６ａで示すように溶融した半田
はリード３の表面に過剰に吸い寄せられてリード３の上
端部３ｂまで吸い上がり、リード３の下端部３ａを電極
５に接着する電極５上の半田６が量不足になるなどして
半田付け状態が不良になりやすいという問題点があっ
た。However, the lead 3
When the wettability is improved by applying solder plating to the solder, the melted solder is excessively attracted to the surface of the lead 3 and sucked up to the upper end portion 3b of the lead 3 as shown by reference numeral 6a in FIG. There is a problem that the soldering state is apt to become defective due to insufficient amount of the solder 6 on the electrode 5 for adhering the lower end portion 3a of the electrode 3 to the electrode 5.

【０００５】そこで本発明は、半田付け中に、溶融した
半田がリードの上端部側へ過剰に吸い上げられて半田付
け状態が不良になるのを解消できるリード付電子部品を
提供することを目的とする。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic component with leads, which can prevent the molten solder from being excessively sucked up to the upper end side of the leads during soldering so that the soldering state becomes poor. To do.

【０００６】[0006]

【課題を解決するための手段】このために本発明のリー
ド付電子部品は、プリント基板の電極に半田付けされる
リードの下端部側のぬれ性を上端部側のぬれ性よりも良
くしたものである。For this reason, in the electronic component with leads of the present invention, the wettability on the lower end side of the leads soldered to the electrodes of the printed circuit board is better than the wettability on the upper end side. Is.

【０００７】[0007]

【作用】上記構成において、リードの下端部をプリント
基板の電極上に形成された半田に接地させ、半田を加熱
して溶融させると、溶融した半田はリードに吸い寄せら
れ、リードに沿って吸い上がろうとするが、リードの上
端部側のぬれ性は下端部側のぬれ性よりも悪いので、溶
融した半田の吸い上がりはぬれ性の良悪の境界で止ま
り、半田が上端部側まで過剰に吸い上げられるのを解消
できる。In the above structure, when the lower end of the lead is grounded to the solder formed on the electrode of the printed circuit board and the solder is heated and melted, the melted solder is attracted to the lead and sucked along the lead. However, since the wettability on the upper end side of the lead is worse than the wettability on the lower end side, sucking up of the melted solder stops at the boundary of good and bad wettability, and the solder becomes excessive up to the upper end side. Can be sucked up.

【０００８】[0008]

【実施例】次に、図面を参照しながら本発明の実施例を
説明する。図１は本発明の一実施例におけるリード付電
子部品をプリント基板に半田付けした状態の側面図であ
る。このリード付電子部品１ａは、本体２の側面から外
部下方へ延出するリード３を有しており、このリード３
の下端部３ａが、プリント基板４の電極５に半田６にて
半田付けされている。この半田付けは、スクリーン印刷
手段やプリコート手段などにより電極５上に形成された
半田６上にリード３の下端部３ａを接地させた後、プリ
ント基板４を加熱炉へ送り、加熱炉で半田６を加熱して
溶融させることにより行われる。Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a side view showing a state in which an electronic component with leads according to an embodiment of the present invention is soldered to a printed board. This leaded electronic component 1 a has a lead 3 extending downward from the side surface of the main body 2.
The lower end portion 3a of the above is soldered to the electrode 5 of the printed board 4 with the solder 6. In this soldering, after the lower end portion 3a of the lead 3 is grounded on the solder 6 formed on the electrode 5 by screen printing means or precoat means, the printed circuit board 4 is sent to a heating furnace, and the solder 6 is heated in the heating furnace. Is heated and melted.

【０００９】リード３の下端部３ａ側にはぬれ性を良く
するために半田メッキ１４が施されている。ａは半田メ
ッキ１４の境界すなわちぬれ性の良悪の境界であって、
この境界ａよりも下方の下端部側３ａの半田メッキ１４
が施された部分のぬれ性は、この境界ａよりも上方の上
端部３ｂ側のぬれ性よりも良い。従来の技術の項で述べ
たように、リード３を電極５に半田付けするために、プ
リント基板４を加熱炉へ送って半田６を加熱して溶融さ
せた際に、溶融した半田６はリード３に沿って上方へ吸
い上がろうとする。しかしながらこのものは、半田メッ
キ１４が施された下端部３ａ側のぬれ性は上端部３ｂ側
のぬれ性よりも良いので、半田６は下端部３ｂ側には十
分に吸い寄せられて付着するが、溶融した半田６の吸い
上がりは上記境界ａで止り、境界ａよりも上方までは吸
い上がらないので、図７に示す従来例のように上端部３
ｂ側には半田６は付着しない。したがって電極５上には
十分な半田量が確保され、図示するようにリード３の下
端部３ａは電極５に十分に半田付けされる。Solder plating 14 is applied to the lower end 3a side of the lead 3 in order to improve wettability. a is a boundary of the solder plating 14, that is, a boundary of good and bad wettability,
Solder plating 14 on the lower end side 3a below the boundary a
The wettability of the portion to which the mark is applied is better than the wettability of the upper end portion 3b side above the boundary a. As described in the section of the prior art, when the printed board 4 is sent to a heating furnace and the solder 6 is heated and melted in order to solder the lead 3 to the electrode 5, the melted solder 6 is Attempts to wick upwards along 3. However, in this case, the wettability on the lower end 3a side where the solder plating 14 is applied is better than the wettability on the upper end 3b side, so the solder 6 is sufficiently attracted and attached to the lower end 3b side. Since the sucked up of the melted solder 6 stops at the boundary a and does not suck up above the boundary a, as in the conventional example shown in FIG.
The solder 6 does not adhere to the b side. Therefore, a sufficient amount of solder is secured on the electrode 5, and the lower end portion 3a of the lead 3 is sufficiently soldered to the electrode 5 as illustrated.

【００１０】次に上記リード付電子部品１ａの製造方法
を図２を参照しながら説明する。図２〜図７は上記リー
ド付電子部品１ａの第１の製造方法を工程順に示してい
る。図２〜図７はリードフレーム１１の平面図であり、
その中央にはチップが搭載されるアイランド１２が形成
されている。アイランド１２の周囲には図１に示すリー
ド３の下端部３ａ及び上端部３ｂになるアウターリード
ＯＬと、本体２の内部に樹脂によって封止されるインナ
ーリードＩＬが打抜き手段やエッチング手段などにより
形成されている。このリードフレーム１１の素材は４．
２アロイであり、半田のぬれ性は悪い。Next, a method of manufacturing the electronic component with lead 1a will be described with reference to FIG. 2 to 7 show the first method of manufacturing the electronic component with lead 1a in the order of steps. 2 to 7 are plan views of the lead frame 11,
An island 12 on which chips are mounted is formed in the center. Around the island 12, outer leads OL which are the lower end portion 3a and the upper end portion 3b of the lead 3 shown in FIG. 1 and an inner lead IL which is sealed in the inside of the main body 2 with resin are formed by punching means or etching means. Has been done. The material of this lead frame 11 is 4.
It is a 2-alloy and the wettability of solder is poor.

【００１１】図３において、インナーリードＩＬの先端
部にメッキ１３が部分的に施される。このメッキ１３は
後で図５を参照しながら説明するワイヤボンディングの
際に、ワイヤのボンディング性を向上させるために施さ
れるものであり、一般にはＡｇ（銀）が多用されてい
る。In FIG. 3, plating 13 is partially applied to the tips of the inner leads IL. The plating 13 is applied to improve the wire bondability during wire bonding, which will be described later with reference to FIG. 5, and Ag (silver) is generally frequently used.

【００１２】次に図４に示すように、アウターリードＯ
Ｌの先端部に半田メッキ１４が部分的に施される。この
半田メッキ１４は、図１に示すようにリード３の下端部
３ａをプリント基板４の電極５に半田付けする際に、半
田６のぬれ性を良くするために施されるものであり、半
田メッキ１４の境界ａが図１に示す境界ａとなる。Next, as shown in FIG. 4, the outer lead O
Solder plating 14 is partially applied to the tip of L. The solder plating 14 is applied to improve the wettability of the solder 6 when the lower end portion 3a of the lead 3 is soldered to the electrode 5 of the printed board 4 as shown in FIG. The boundary a of the plating 14 becomes the boundary a shown in FIG.

【００１３】次に図５に示すように、アイランド１２に
チップ１５を搭載した後、ワイヤボンディングによりチ
ップ１５の電極とインナーリードＩＬをワイヤ１６で接
続する。この場合、ワイヤ１６がボンディングされるイ
ンナーリードＩＬの先端部にはＡｇのメッキ１３が施さ
れているので、ワイヤ１６を良好にボンディングでき
る。Next, as shown in FIG. 5, after mounting the chip 15 on the island 12, the electrode of the chip 15 and the inner lead IL are connected by the wire 16 by wire bonding. In this case, since the tip portion of the inner lead IL to which the wire 16 is bonded is plated with Ag 13, the wire 16 can be bonded well.

【００１４】次に図６に示すように、チップ１５とワイ
ヤ１６及びインナーリードＩＬの保護のために、樹脂成
形装置により本体２を形成する。次にリードフレーム１
１の所定箇所を金型により打抜き、打抜かれたリード３
を屈曲フォーミングすることにより、図７に示すように
上記リード付電子部品１ａが完成する。このようにして
製造されたリード付電子部品１ａのリード３の下端部３
ａ側には、ぬれ性を良くするための半田メッキ１４が施
されており、したがって図１や図２６を参照しながら説
明したように、溶融した半田６が上端部３ｂ側まで過剰
に吸い上げられて半田付け状態が不良になるのを解消
し、良好に半田付けできる。Next, as shown in FIG. 6, the main body 2 is formed by a resin molding device in order to protect the chip 15, the wire 16 and the inner lead IL. Next lead frame 1
Predetermined part of 1 is punched with a die, and the punched lead 3
By bending forming, the leaded electronic component 1a is completed as shown in FIG. The lower end portion 3 of the lead 3 of the electronic component with lead 1a manufactured in this manner
Solder plating 14 for improving the wettability is applied to the a side, and therefore, as described with reference to FIGS. 1 and 26, the melted solder 6 is excessively sucked up to the upper end 3b side. It is possible to solve the problem that the soldering state becomes poor and to perform good soldering.

【００１５】次に図８〜図１３を参照しながら、本発明
のリード付電子部品の第２の製造方法を説明する。図８
と図９は、図２と図３と同じであり、その説明は省略す
る。図１０に示すように、アイランド１２にチップ１５
を搭載し、ワイヤ１６でチップ１５の電極とインナーリ
ードＩＬの先端部を接続した後、図１１に示すように本
体２を形成する。この後で、図１２に示すようにアウタ
ーリードＯＬの先端部に半田メッキ１４を施した後、リ
ードフレーム１１を打抜いて図１３に示すリード付電子
部品１ｂを完成させる。Next, a second method of manufacturing the electronic component with leads of the present invention will be described with reference to FIGS. Figure 8
9 and FIG. 9 are the same as FIGS. 2 and 3, and the description thereof will be omitted. As shown in FIG. 10, chips 15 are formed on the island 12.
After mounting and connecting the electrode of the chip 15 and the tip of the inner lead IL with the wire 16, the main body 2 is formed as shown in FIG. Thereafter, as shown in FIG. 12, solder plating 14 is applied to the tips of the outer leads OL, and then the lead frame 11 is punched to complete the leaded electronic component 1b shown in FIG.

【００１６】次に図１４〜図１８を参照しながら本発明
のリード付電子部品の第３の製造方法を説明する。図１
４は図２と同じリードフレーム１１の平面図である。図
１５に示すようにアウターリードＯＬの先端部とインナ
ーリードＩＬの先端部にメッキ１３ａ，１４ａを同時に
施す。このメッキ１３ａ，１４ａの素材はＡｕ（金）や
Ｐｄ（パラジウム）である。Next, a third method of manufacturing an electronic component with leads of the present invention will be described with reference to FIGS. Figure 1
4 is a plan view of the same lead frame 11 as in FIG. As shown in FIG. 15, the outer leads OL and the inner leads IL are simultaneously plated with plating 13a and 14a. The material of the platings 13a and 14a is Au (gold) or Pd (palladium).

【００１７】次に図１６に示すようにアイランド１２に
チップ１５を搭載してワイヤ１６で接続した後、図１７
に示すように本体２を樹脂成形装置で形成し、リードフ
レーム１１を打抜くことにより、図１８に示すリード付
電子部品１ｂが完成する。リード３の下端部３ａ側には
ＡｕやＰｄのメッキ１４ａが施されており、第１実施例
のリード付電子部品１ａと同様の作用効果が得られる。Next, as shown in FIG. 16, the chip 15 is mounted on the island 12 and connected by the wire 16, and then, as shown in FIG.
As shown in FIG. 18, the main body 2 is formed by a resin molding apparatus, and the lead frame 11 is punched out to complete the leaded electronic component 1b shown in FIG. The lower end 3a side of the lead 3 is plated with Au or Pd 14a, and the same effect as the electronic component with lead 1a of the first embodiment can be obtained.

【００１８】次に図１９〜図２４を参照しながら、本発
明のリード付電子部品の第４の製造方法を説明する。図
１９に示すリードフレーム１１の素材は銅であり、上述
した４．２アロイのリードフレームに比較して、半田の
ぬれ性はきわめて良い。さて、図２０に示すようにイン
ナーリードＩＬの先端部にＡｇでメッキ１３を施した
後、図２１に示すようにアイランド１２にチップ１５を
搭載してワイヤ１６で接続する。Next, a fourth method of manufacturing the electronic component with leads of the present invention will be described with reference to FIGS. The material of the lead frame 11 shown in FIG. 19 is copper, and the wettability of the solder is very good as compared with the lead frame of 4.2 alloy described above. Now, as shown in FIG. 20, after plating 13 of Ag on the tip of the inner lead IL, a chip 15 is mounted on the island 12 and connected by wires 16 as shown in FIG.

【００１９】次に図２２に示すように本体２を形成した
後、図２３に示すように本体２の外側に露呈するアウタ
ーリードＯＬの本体２側に半田のぬれ性低下処理を施
す。本実施例では、耐熱性有機薄膜１７をコーティング
することにより、半田のぬれ性低下処理を施している。
但し、アウターリードＯＬの先端部には耐熱性有機薄膜
１７はコーティングされていない。この耐熱性有機薄膜
１７の素材としては、例えばポリイミドやテフロンなど
が使用される。勿論、ぬれ性低下処理の具体的手段は本
実施例に限定されない。次に図２４に示すようにリード
フレーム１１を打抜いてリード付電子部品１ｄを完成さ
せる。Next, after forming the main body 2 as shown in FIG. 22, a solder wettability reducing process is applied to the main body 2 side of the outer lead OL exposed to the outside of the main body 2 as shown in FIG. In this embodiment, the heat-resistant organic thin film 17 is coated to reduce the wettability of the solder.
However, the heat-resistant organic thin film 17 is not coated on the tip of the outer lead OL. As a material for the heat resistant organic thin film 17, for example, polyimide or Teflon is used. Of course, the specific means for the wettability reduction processing is not limited to this embodiment. Next, as shown in FIG. 24, the lead frame 11 is punched to complete the leaded electronic component 1d.

【００２０】図２５は上記のようにして製造されたリー
ド付電子部品１ｄをプリント基板４に半田付けした状態
を示している。リードフレーム１１の素材はぬれ性の良
い銅であり、リード３の下端部３ａには耐熱性有機薄膜
１７はコーティングされていないので、この先端部のぬ
れ性は良いが、リード３ｃの上端部には耐熱性有機薄膜
１７がコーティングされることによりぬれ性は低下して
いる。したがってこのものも、上記第１〜３実施例の場
合と同様の作用効果が得られる。以上の各実施例から明
らかなように、本発明のリード付電子部品は様々な方法
により製造できる。FIG. 25 shows a state in which the electronic component with lead 1d manufactured as described above is soldered to the printed board 4. Since the material of the lead frame 11 is copper having good wettability, and the lower end portion 3a of the lead 3 is not coated with the heat-resistant organic thin film 17, the tip end portion has good wettability, but the upper end portion of the lead 3c has The wettability is reduced by coating the heat-resistant organic thin film 17. Therefore, also in this case, the same operational effect as in the case of the first to third embodiments can be obtained. As is clear from each of the above embodiments, the leaded electronic component of the present invention can be manufactured by various methods.

【００２１】[0021]

【発明の効果】以上説明したように本発明のリード付電
子部品は、プリント基板の電極に半田付けされるリード
の下端部側のぬれ性を上端部側のぬれ性よりも良くして
いるので、半田付けのために半田を加熱して溶融した際
に、溶融した半田の吸い上がりはぬれ性の良悪の境界で
止まり、半田が上端部側まで過剰に吸い上げられるのを
解消して、良好に半田付けすることができる。As described above, in the electronic component with leads of the present invention, the wettability on the lower end side of the leads soldered to the electrodes of the printed circuit board is better than the wettability on the upper end side. , When the solder is heated and melted for soldering, sucking up of the melted solder stops at the boundary of good and bad wettability, eliminating excessive sucking up of the solder to the upper end side, which is good. Can be soldered to.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例におけるリード付電子部品を
プリント基板に半田付けした状態の側面図FIG. 1 is a side view showing a state in which an electronic component with leads according to an embodiment of the present invention is soldered to a printed circuit board.

【図２】本発明の一実施例におけるリード付電子部品の
製造方法の平面図FIG. 2 is a plan view of a method for manufacturing an electronic component with leads according to an embodiment of the present invention.

【図３】本発明の一実施例におけるリード付電子部品の
製造方法の平面図FIG. 3 is a plan view of a method for manufacturing an electronic component with leads according to an embodiment of the present invention.

【図４】本発明の一実施例におけるリード付電子部品の
製造方法の平面図FIG. 4 is a plan view of a method for manufacturing an electronic component with leads according to an embodiment of the present invention.

【図５】本発明の一実施例におけるリード付電子部品の
製造方法の平面図FIG. 5 is a plan view of a method for manufacturing an electronic component with leads according to an embodiment of the present invention.

【図６】本発明の一実施例におけるリード付電子部品の
製造方法の平面図FIG. 6 is a plan view of a method for manufacturing an electronic component with leads according to an embodiment of the present invention.

【図７】本発明の一実施例におけるリード付電子部品の
製造方法の斜視図FIG. 7 is a perspective view of a method for manufacturing an electronic component with leads according to an embodiment of the present invention.

【図８】本発明の一実施例におけるリード付電子部品の
製造方法の平面図FIG. 8 is a plan view of a method for manufacturing an electronic component with leads according to an embodiment of the present invention.

【図９】本発明の一実施例におけるリード付電子部品の
製造方法の平面図FIG. 9 is a plan view of a method for manufacturing an electronic component with leads according to an embodiment of the present invention.

【図１０】本発明の一実施例におけるリード付電子部品
の製造方法の平面図FIG. 10 is a plan view of a method for manufacturing an electronic component with leads according to an embodiment of the present invention.

【図１１】本発明の一実施例におけるリード付電子部品
の製造方法の平面図FIG. 11 is a plan view of a method for manufacturing an electronic component with leads according to an embodiment of the present invention.

【図１２】本発明の一実施例におけるリード付電子部品
の製造方法の平面図FIG. 12 is a plan view of a method for manufacturing an electronic component with leads according to an embodiment of the present invention.

【図１３】本発明の一実施例におけるリード付電子部品
の製造方法の斜視図FIG. 13 is a perspective view of a method for manufacturing a leaded electronic component according to an embodiment of the present invention.

【図１４】本発明の一実施例におけるリード付電子部品
の製造方法の平面図FIG. 14 is a plan view of a method for manufacturing an electronic component with leads according to an embodiment of the present invention.

【図１５】本発明の一実施例におけるリード付電子部品
の製造方法の平面図FIG. 15 is a plan view of a method for manufacturing an electronic component with leads according to an embodiment of the present invention.

【図１６】本発明の一実施例におけるリード付電子部品
の製造方法の平面図FIG. 16 is a plan view of a method for manufacturing an electronic component with leads according to an embodiment of the present invention.

【図１７】本発明の一実施例におけるリード付電子部品
の製造方法の平面図FIG. 17 is a plan view of a method for manufacturing an electronic component with leads according to an embodiment of the present invention.

【図１８】本発明の一実施例におけるリード付電子部品
の製造方法の斜視図FIG. 18 is a perspective view of a method for manufacturing an electronic component with leads according to an embodiment of the present invention.

【図１９】本発明の一実施例におけるリード付電子部品
の製造方法の平面図FIG. 19 is a plan view of the method for manufacturing the electronic component with leads according to the embodiment of the present invention.

【図２０】本発明の一実施例におけるリード付電子部品
の製造方法の平面図FIG. 20 is a plan view of a method for manufacturing an electronic component with leads according to an embodiment of the present invention.

【図２１】本発明の一実施例におけるリード付電子部品
の製造方法の平面図FIG. 21 is a plan view of a method for manufacturing an electronic component with leads according to an embodiment of the present invention.

【図２２】本発明の一実施例におけるリード付電子部品
の製造方法の平面図FIG. 22 is a plan view of the method for manufacturing the electronic component with leads according to the embodiment of the present invention.

【図２３】本発明の一実施例におけるリード付電子部品
の製造方法の平面図FIG. 23 is a plan view of the method for manufacturing the electronic component with leads according to the embodiment of the present invention.

【図２４】本発明の一実施例におけるリード付電子部品
の製造方法の斜視図FIG. 24 is a perspective view of a method for manufacturing an electronic component with leads according to an embodiment of the present invention.

【図２５】本発明の一実施例におけるリード付電子部品
をプリント基板に半田付けした状態の側面図FIG. 25 is a side view showing a state in which a leaded electronic component according to an embodiment of the present invention is soldered to a printed board.

【図２６】従来のリード付電子部品をプリント基板に半
田付けした状態の側面図FIG. 26 is a side view of a state in which a conventional electronic component with leads is soldered to a printed circuit board.

【符号の説明】[Explanation of symbols]

１ａ，１ｂ，１ｃ，１ｄ リード付電子部品 ２ 本体 ３ リード ３ａ リード３の下端部 ３ｂ リード３の上端部 1a, 1b, 1c, 1d electronic component with lead 2 main body 3 lead 3a lower end of lead 3 3b upper end of lead 3

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】本体の側面からリードが外部下方へ延出す
るリード付電子部品において、プリント基板の電極に半
田付けされる前記リードの下端部側の半田に対するぬれ
性を上端部側の半田に対するぬれ性よりも良くしたこと
を特徴とするリード付電子部品。1. In a leaded electronic component in which a lead extends downward from the side surface of a main body, the wettability of the solder on the lower end side of the lead soldered to an electrode of a printed circuit board to the solder on the upper end side. Electronic components with leads, which are characterized by better wettability.
JP5288021A 1993-11-17 1993-11-17 Electronic part provided with lead Pending JPH07142665A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5288021A JPH07142665A (en) 1993-11-17 1993-11-17 Electronic part provided with lead

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5288021A JPH07142665A (en) 1993-11-17 1993-11-17 Electronic part provided with lead

Publications (1)

Publication Number Publication Date
JPH07142665A true JPH07142665A (en) 1995-06-02

Family

ID=17724790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5288021A Pending JPH07142665A (en) 1993-11-17 1993-11-17 Electronic part provided with lead

Country Status (1)

Country Link
JP (1) JPH07142665A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000133845A (en) * 1998-10-23 2000-05-12 Rohm Co Ltd Semiconductor light-emitting element
JP2017045528A (en) * 2015-08-24 2017-03-02 ウシオ電機株式会社 Light source device and fluorescent plate assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000133845A (en) * 1998-10-23 2000-05-12 Rohm Co Ltd Semiconductor light-emitting element
JP2017045528A (en) * 2015-08-24 2017-03-02 ウシオ電機株式会社 Light source device and fluorescent plate assembly

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