JPH0453628A - Grinding fluid for electrolytic dressing - Google Patents
Grinding fluid for electrolytic dressingInfo
- Publication number
- JPH0453628A JPH0453628A JP16391390A JP16391390A JPH0453628A JP H0453628 A JPH0453628 A JP H0453628A JP 16391390 A JP16391390 A JP 16391390A JP 16391390 A JP16391390 A JP 16391390A JP H0453628 A JPH0453628 A JP H0453628A
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- grinding fluid
- dressing
- electrolytic
- electrolytic dressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012530 fluid Substances 0.000 title claims abstract description 44
- 239000002184 metal Substances 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- -1 halide salt Chemical class 0.000 claims abstract description 19
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000004094 surface-active agent Substances 0.000 claims abstract description 11
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims abstract description 10
- 230000003449 preventive effect Effects 0.000 claims abstract description 10
- 239000003792 electrolyte Substances 0.000 claims abstract description 7
- 239000011780 sodium chloride Substances 0.000 claims abstract description 5
- 239000013522 chelant Substances 0.000 claims abstract 3
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 10
- 239000002518 antifoaming agent Substances 0.000 claims description 9
- 150000002500 ions Chemical class 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 abstract description 15
- 230000007797 corrosion Effects 0.000 abstract description 15
- 239000000463 material Substances 0.000 abstract description 5
- 238000002156 mixing Methods 0.000 abstract description 5
- 229910044991 metal oxide Inorganic materials 0.000 abstract description 3
- 239000006061 abrasive grain Substances 0.000 description 14
- 239000000243 solution Substances 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 8
- 229910052742 iron Inorganic materials 0.000 description 7
- 238000003754 machining Methods 0.000 description 7
- 239000011230 binding agent Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 229910001018 Cast iron Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010828 elution Methods 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000003755 preservative agent Substances 0.000 description 3
- 230000004580 weight loss Effects 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- IFQUWYZCAGRUJN-UHFFFAOYSA-N ethylenediaminediacetic acid Chemical compound OC(=O)CNCCNCC(O)=O IFQUWYZCAGRUJN-UHFFFAOYSA-N 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- 238000005461 lubrication Methods 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000000615 nonconductor Substances 0.000 description 2
- 229960003330 pentetic acid Drugs 0.000 description 2
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 2
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 239000005069 Extreme pressure additive Substances 0.000 description 1
- 108091006629 SLC13A2 Proteins 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
- 235000010344 sodium nitrate Nutrition 0.000 description 1
- 239000004317 sodium nitrate Substances 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は研削加工に用いる砥石に電解作用を与えて砥石
のドレッシング(目立て)を行う電解ドレッシングに用
いる水溶性の電解ドレッシング用研削液に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a water-soluble electrolytic dressing grinding fluid used for electrolytic dressing in which a grindstone used for grinding is dressed (sharpened) by applying an electrolytic action to the grindstone.
(従来の技術) 研削加工における砥石と工作物の潤滑、冷却。(Conventional technology) Lubrication and cooling of the grinding wheel and workpiece during grinding.
および洗浄のために研削液が用いられている。And grinding fluid is used for cleaning.
この研削液としては水溶性のものと不水溶性(油性)の
ものにわかれるが、近年は防災上、火災発生の危険性が
なく、作業環境の良い水溶性研削液が多用されている。This grinding fluid can be divided into water-soluble and water-insoluble (oil-based) types, but in recent years, water-soluble grinding fluids have been widely used for disaster prevention purposes as they do not pose a risk of fire and provide a good working environment.
しかして、水溶性研削液は油脂、金属防錆剤。However, water-soluble grinding fluid contains oil, fat, and metal rust inhibitors.
界面活性荊、消泡剤、極圧剤、防腐剤等を目的に応じて
所用の分量だけ適宜混合したものであり、通常、水溶性
研削液は水でlO〜100倍程度に希釈して用いられる
。It is a mixture of surfactant, antifoaming agent, extreme pressure agent, preservative, etc. in the required amount depending on the purpose, and the water-soluble grinding fluid is usually diluted with water to 10 to 100 times. It will be done.
また、研削液に必要な機能としては次の通りである。Further, the functions necessary for the grinding fluid are as follows.
■ 潤滑性、冷却性を持ち、研削性能を向上させ■ 機
械本体に使用される金属や工作物を腐食させない。■ Has lubrication and cooling properties to improve grinding performance ■ Will not corrode metals or workpieces used in the machine body.
■ 人体に有害な物質を含有しない。■ Contains no substances harmful to the human body.
しかるに、研削砥石はダイヤモンド、 CBHなどの砥
粒を樹脂系、窯業原料系、金属系などの結合剤で固めた
ものである。However, grinding wheels are made by hardening abrasive grains such as diamond or CBH with a binder such as resin, ceramic material, or metal.
このため、加工が進行してゆくと砥粒間に切屑が付着(
目づまり)したり、砥粒先端が摩耗して平らになったり
(目つぶれ)、砥粒が結合剤より脱落(目こぼれ)する
という現象が生じ、砥粒切れ味低下のため、研削抵抗の
増加、あるいは砥石と被剛材との焼き付きなどが発生す
る。For this reason, as machining progresses, chips adhere between the abrasive grains (
The abrasive grains become clogged (clogged), the tips of the abrasive grains wear out and become flat (clogged grains), and the abrasive grains fall off from the binder (spilled grains), which reduces the sharpness of the abrasive grains and increases grinding resistance. , or the grinding wheel and the rigid material may seize.
従って、ある一定期間ごとに機械を停止し、砥石の切れ
味を回復させる作業(ドレッシング)が必要となる。Therefore, it is necessary to stop the machine at regular intervals and perform dressing to restore the sharpness of the grindstone.
この場合、従来においては、結合度の低い−A。In this case, conventionally -A has a low degree of bonding.
GCなどの砥石を削ってドレッシングを行う方法が一般
的であり、−旦、加工を中断することが必要である。A common method is to perform dressing by grinding with a grindstone such as GC, and it is necessary to interrupt the processing once.
すなわち、第2図に示すように、導電性のあるメタルボ
ンド砥石を使用し、砥石側を+、砥石面に対抗して設け
た電極を−にして、その間に電解質を含んだ水溶性研削
液を流した上で、直流、あるいはパルス波形の電流を流
し、砥石結合剤のみを選択的に溶出させ、砥石のドレッ
シングを行う。In other words, as shown in Figure 2, a conductive metal bonded grinding wheel is used, the grinding wheel side is set to +, the electrode provided opposite to the grinding wheel is set to -, and a water-soluble grinding fluid containing an electrolyte is placed between them. is applied, and then a direct current or a pulsed current is applied to selectively elute only the grinding wheel binder, thereby dressing the grinding wheel.
この方法をとれば、加工中に常時ドレッシングができ、
電気条件を制御することにより、荒研削用砥石から鏡面
研削用砥石にまで適用することが可能で、電解ドレッシ
ングの作用として砥粒突出効果、切屑除去効果を得るこ
とができる。This method allows constant dressing during processing,
By controlling the electrical conditions, it is possible to apply it to anything from rough grinding wheels to mirror grinding wheels, and the effect of electrolytic dressing is to protrude abrasive grains and remove chips.
なお、図中1は砥石合金、1bは砥粒層、2は被削材、
3は加圧プレート、4は電源、5は十給電ブラシ、6は
一電極、7は研削液8を噴出するノズルである。In addition, in the figure, 1 is the grinding wheel alloy, 1b is the abrasive grain layer, 2 is the work material,
3 is a pressure plate, 4 is a power supply, 5 is a power supply brush, 6 is one electrode, and 7 is a nozzle for spouting the grinding fluid 8.
(発明が解決しようとする課題)
第2図のような構成で水溶性研削液を加工液として電解
ドレッシングを行った場合、本来、第3図(a)に示す
ように、表面にダイヤモンドaが突出したした良好な状
態となるのが望ましいが、陽極側分極作用により、Φ)
に示すように、砥石面上に金属酸化物などの不導体被膜
すが生成し、■ 電解電流値低下によるドレッシング効
率の低下。(Problems to be Solved by the Invention) When electrolytic dressing is performed using a water-soluble grinding fluid as a machining fluid with the configuration shown in Figure 2, diamond a is originally formed on the surface as shown in Figure 3 (a). It is desirable to have a good protruding state, but due to the polarization effect on the anode side, Φ)
As shown in Figure 2, a nonconducting film such as metal oxide is formed on the grinding wheel surface, and the dressing efficiency is decreased due to a decrease in the electrolytic current value.
■ 砥粒突き出し量減少による加工効率の低下、という
課題がある。■ There is a problem of a decrease in processing efficiency due to a decrease in the amount of abrasive grains protruding.
また、電解加工に用いられるような塩化ナトリウム、硝
酸ナトリウムなどを研削液として使用した場合にはドレ
ッシング効率は高くなるが、機械本体を腐食させてしま
うという課題がある。Furthermore, when sodium chloride, sodium nitrate, or the like used in electrolytic machining is used as a grinding fluid, the dressing efficiency is increased, but there is a problem in that it corrodes the machine body.
本発明はこのようなことに鑑み提案されたもので、その
目的とするところは、電解ドレッシング時に砥石表面に
金属酸化物(不導体皮膜)を析出させず、かつ機械本体
を腐食させることのない水溶性の電解ドレッシング用研
削液を提供することにある。The present invention was proposed in view of the above, and its purpose is to prevent metal oxides (nonconductor film) from being deposited on the surface of the grinding wheel during electrolytic dressing and to prevent corrosion of the machine body. An object of the present invention is to provide a water-soluble grinding fluid for electrolytic dressing.
(課題を解決するための手段)
本発明では、電解作用を用いてメタルボンド砥石のドレ
ッシングを行う電解ドレッシング研削加工に使用する研
削液において、
金属防錆剤、界面活性剤、消泡剤、微量電解質などを配
合した研削液に錯イオンあるいはキレートを生成する物
質を添加して構成したことにより、上記目的を達成して
いる。(Means for Solving the Problems) In the present invention, in the grinding fluid used for electrolytic dressing grinding processing in which a metal bond grindstone is dressed using electrolytic action, a metal rust preventive agent, a surfactant, an antifoaming agent, and a trace amount of The above object is achieved by adding a substance that generates complex ions or chelates to a grinding fluid containing an electrolyte and the like.
また、電解作用を用いてメタルボンド砥石のドレッシン
グを行う電解ドレッシング研削加工に使用する研削液に
おいて、
金属防錆剤、界面活性剤、消泡剤などを配合した研削液
にNaC1%MCIなどのハロゲン化物塩を添加して構
成したことにより、上記目的を達成している。In addition, in the grinding fluid used for electrolytic dressing grinding, which uses electrolytic action to dress the metal bond grinding wheel, halogens such as NaC1% MCI are added to the grinding fluid containing metal rust preventive agents, surfactants, antifoaming agents, etc. By adding a compound salt to the composition, the above object is achieved.
(作用)
本発明は上述のように構成し、従来の金属防錆剤、界面
活性剤、消泡剤、極圧剤、防腐剤、微量電解質等を含ん
だ水溶性研削液に、砥石結合剤より溶出する金属イオン
と錯体を生成する物質を混入することにより、砥石表面
に不導体皮膜を生成させず、かつ機械本体を腐食させる
ことがないようにしている。(Function) The present invention is configured as described above, and a grinding wheel binder is added to a water-soluble grinding fluid containing conventional metal rust preventive agents, surfactants, antifoaming agents, extreme pressure agents, preservatives, trace electrolytes, etc. By mixing a substance that forms a complex with metal ions that are eluted from the grinding wheel, a nonconducting film is not formed on the surface of the grinding wheel, and the main body of the machine is not corroded.
また、従来の金属防錆剤、界面活性剤、消泡剤、極圧剤
、防腐剤等を含んだ水溶性研削液に、重量濃度0.01
〜1%のNaC1,KClなどのハロゲン化合物塩を添
加することにより、砥石表面に不導体被膜を生成させず
、かつ機械本体に腐食させることのないようにしている
。In addition, a water-soluble grinding fluid containing conventional metal rust preventive agents, surfactants, antifoaming agents, extreme pressure agents, preservatives, etc., has a weight concentration of 0.01.
By adding ~1% of halogen compound salts such as NaCl and KCl, a nonconductive film is not formed on the surface of the grinding wheel, and the machine body is prevented from being corroded.
(実施例1)
この実施例の研削液に使用する錯体生成物質としては、
■ 水酸化物と金属イオンが反応する生成定数よりも大
きな生成定数を持つ。(Example 1) The complex-forming substance used in the grinding fluid of this example has: (1) a formation constant larger than that of the reaction between hydroxide and metal ions;
■ アルカリ性下で反応する。■ Reacts under alkaline conditions.
■ 人体に悪影響を及ぼさない。■ No negative effects on the human body.
■ 水溶性である。■ It is water soluble.
■ 機械本体に腐食性がない。■ The machine body is not corrosive.
■ 安価、容易に人手できる。■ Cheap and easy to handle.
ことが重要である。This is very important.
例えば砥石結合剤が鋳鉄の場合、
ジエチレントリアミン五酢酸(DTPA)エチレンジア
ミンニ酢M (EDDA)エチレンジアミン四酢酸(E
DTA)
■、10フエナントロリン
チオグリコール酸
2.2′−ビピリジン
などの物質が溶出する鉄イオンと安定な錯体を形成する
。For example, if the grinding wheel binder is cast iron, diethylenetriaminepentaacetic acid (DTPA), ethylenediamine diacetic acid M (EDDA), ethylenediaminetetraacetic acid (E
DTA) (1) Substances such as 10-phenanthrolinthioglycolic acid 2,2'-bipyridine form stable complexes with eluted iron ions.
第1図は本発明の模式図を示すもので、砥石結合剤が鋳
鉄で、錯体生成物質がEDTAの場合を例にとって説明
する。FIG. 1 shows a schematic diagram of the present invention, and will be explained using an example in which the grinding wheel binder is cast iron and the complex forming substance is EDTA.
すなわち、砥石表面にある鉄イオンが電解作用により、
イオンとなって液中に溶出する。In other words, the iron ions on the surface of the grinding wheel are electrolyzed,
It becomes ions and elutes into the liquid.
従来は、この鉄イオンに水酸化物イオンが反応し、Fe
(OR)zからFe(OR)s 、Fezes となっ
て砥石表面に不導体皮膜として付着し、電解作用を阻害
する原因となっていた。Conventionally, hydroxide ions react with these iron ions, and Fe
(OR)z turns into Fe(OR)s and Fezes and adheres to the surface of the grindstone as a nonconducting film, causing an obstruction to the electrolytic action.
EDTAは水酸化物よりも生成定数が大きいため、水酸
化物イオンよりも先に鉄イオンと配位結合し、安定な錯
イオンとなる。このEDTAと鉄との化合物はイオンで
あり、導電性をもっているため、砥石表面は不導体化し
ない。Since EDTA has a larger production constant than hydroxide, it coordinates with iron ions before hydroxide ions, forming a stable complex ion. This compound of EDTA and iron is an ion and has conductivity, so the surface of the grindstone does not become nonconductive.
また、EDTAは鉄イオンとtitのモル比で反応する
ため、予め溶出する鉄イオンの量を予測しておき、その
量よりも多くEDTAを混入しておけば良い。Furthermore, since EDTA reacts with the molar ratio of iron ions and tit, it is sufficient to predict the amount of iron ions to be eluted in advance and mix in more EDTA than that amount.
本実施例で使用した水溶性研削液の配合比率は次の通り
である。The blending ratio of the water-soluble grinding fluid used in this example is as follows.
防錆剤 アルカノールアミン 15 〜30%(wt%
)〃 炭酸塩 3〜10%ホウ酸塩
3〜10%
防蝕剤 トリアゾール系 0.1〜3%〃 ED
TA l〜〜10%消泡剤、極圧添加剤
微量
その他 水 37〜〜78%しかし、
上記の物質、混合範囲に本発明の趣旨を限定4するもの
ではない。Rust inhibitor Alkanolamine 15-30% (wt%
)〃 Carbonate 3-10% borate
3~10% Corrosion inhibitor Triazole type 0.1~3% ED
TA l~~10% antifoaming agent, extreme pressure additive
Trace amount Others Water 37~~78%However,
The spirit of the present invention is not limited to the above-mentioned substances and mixing ranges.
しかして、上記の原液を水で50倍に希釈し、腐食性、
電解ドレッシング性の評価を行った。However, the above stock solution was diluted 50 times with water, and the corrosive and
Electrolytic dressing properties were evaluated.
(1) 腐食実験
材料:鋳鉄FC20(o20xtlO)溶液:■上記溶
液 ■上記溶液よりEDTAを除いたもの ■電解加工
液 MCI(1χ−t)方法二上記3種類の溶液に鋳鉄
を浸せきし、ウォーターバス中の50°Cに保ち、10
0hr放置した。(1) Corrosion test material: Cast iron FC20 (o20xtlO) solution: ■ Above solution ■ EDTA removed from the above solution ■ Electrolytic machining fluid MCI (1χ-t) Method 2 Cast iron is immersed in the above three types of solutions, and water Keep at 50°C in the bath for 10
It was left for 0 hr.
試験前後の重量を測定し、腐食による 重量減少量を求めた。Measure the weight before and after the test to determine whether it is due to corrosion. The amount of weight loss was determined.
結果 :溶液■、■の重量減少量は共に3−g以下で良
好、溶液■は30mgの重量減少が見られた。Results: The amount of weight loss for solutions (1) and (2) was both 3-g or less, which was good, and for solution (2), a weight loss of 30 mg was observed.
(2)電解ドレッシング試験
砥石:鋳鉄ボンド砥石 501200 集中度5o
φ5゜溶液:腐食試験に用いたのと同じ3種類電極G
AP : 0.1閣
同点数: 300rpm
印加電圧=90v
設定電流:24A(短絡時)
オンタイム、オフタイム=4μsec 、4μ5ec(
パルス波)方法:15分間ドレッシングを行い、加工前
後の重量を測定し、ドレッシング量を求めた。(2) Electrolytic dressing test whetstone: Cast iron bond whetstone 501200 Concentration level 5o
φ5° solution: same three types of electrode G used in the corrosion test
AP: 0.1 Tie score: 300 rpm Applied voltage = 90v Setting current: 24A (at short circuit) On time, off time = 4μsec, 4μ5ec (
Pulse wave) Method: Dressing was performed for 15 minutes, the weight before and after processing was measured, and the amount of dressing was determined.
結果:
溶液■−5% 皮膜発生あり
溶液■−10% 皮膜発生なし
溶液■−100% 黒色スラッジ発生
電解ドレッシング効率に関しては本発明の研削液は電解
加工液に劣るが、ドレッシング時には砥粒の突き出し量
程度(1〜30μ−)の溶出量で良いため、電解効率は
100%でなくても支障はな(、皮膜が析出しなければ
良い。Results: Solution ■ -5% Solution with film formation ■ -10% Solution without film formation ■ -100% Black sludge generation The grinding fluid of the present invention is inferior to the electrolytic machining fluid in terms of electrolytic dressing efficiency, but the abrasive grains do not stick out during dressing. Since the elution amount may be approximately 1 to 30 .mu.m, there is no problem even if the electrolytic efficiency is not 100% (as long as no film is deposited).
以上の結果より、この実施例の研削液は機械の腐食を発
生させることなく、かつ電解ドレッシング時に不導体皮
膜を発生させないので、非常に有効であることが判明し
た。From the above results, it was found that the grinding fluid of this example is very effective because it does not cause corrosion of the machine and does not generate a nonconductive film during electrolytic dressing.
なお、他の錯体生成物質についても同様な結果が得られ
ることも判明した。It has also been found that similar results can be obtained with other complex-forming substances.
以上の実施例のものにおいては、不導体皮膜が発生しな
いため、ドレッシング効率が低下せず、安定した電解ド
レッシングが実現できる。また、砥粒突き出し量も減少
しないため、効率的な加工が実現できる。さらに、機械
腐食の心配がない。In the above embodiments, since no nonconductive film is generated, the dressing efficiency is not reduced and stable electrolytic dressing can be achieved. Furthermore, since the amount of abrasive grain protrusion does not decrease, efficient machining can be achieved. Furthermore, there is no need to worry about mechanical corrosion.
(実施例2)
この実施例の本研削液に使用するハロゲン化物塩として
はNaC1,KCI 、 NaF 、 Kl、 KBr
等が考えられるが、塩化物が最も一般的である。(Example 2) The halide salts used in the main grinding fluid of this example include NaCl, KCI, NaF, Kl, and KBr.
etc., but chloride is the most common.
一般に塩素イオンは不導体皮膜を破壊し、電解効率を低
下させないことが知られている。It is generally known that chlorine ions destroy nonconductor films and do not reduce electrolytic efficiency.
また、高濃度の塩素イオンを添加すると機械本体る腐食
は避けられない。Additionally, if high concentrations of chlorine ions are added, corrosion of the machine body is unavoidable.
塩化物を添加すると電流効率100%で金属の溶出が起
こるため、電流値を制御することにより、砥粒突き出し
量の制御が非常に容易となる。When chloride is added, metal elution occurs with a current efficiency of 100%, so by controlling the current value, it becomes very easy to control the amount of abrasive grain protrusion.
しかして、錯体反応物質添加の前記第1実施例で示した
水溶性研削液の成分より、EDTAを除いたものを水で
50倍に希釈した上で肛lを0.01〜1%―を添加し
た研削液で同様の確認試験を行った結果を示す。Therefore, from the components of the water-soluble grinding fluid shown in the first example of addition of complex reactants, excluding EDTA, diluted 50 times with water and adding 0.01 to 1% to the solution. The results of a similar confirmation test using the added grinding fluid are shown.
(1)腐食性
KCIを添加しない研削液の約2倍の腐食量であり、腐
食性はやや劣るが、この程度なら容認できる範囲である
。(1) Corrosion The amount of corrosion is about twice that of the grinding fluid without KCI added, and the corrosivity is slightly inferior, but this level is within an acceptable range.
(2) 電解性
電解効率は100%でファラデーの法則より得られる電
解溶出量に一致し、非常に良好である。(2) The electrolytic efficiency is 100%, which corresponds to the amount of electrolytic elution obtained from Faraday's law, which is very good.
以上の結果より、この実施例の研削液でも機械の腐食を
発生させることなく、かつ電解ドレッシング効率も良好
であるため、非常に有効であることが判明した。From the above results, it was found that the grinding fluid of this example is very effective because it does not cause corrosion of the machine and the electrolytic dressing efficiency is also good.
(発明の効果)
以上のように、本発明では、電解作用を用いてメタルボ
ンド砥石のドレッシングを行う電解ドレッシング研削加
工に使用する研削液において、金属防錆剤、界面活性剤
、消泡剤、微量電解質などを配合した研削液に錯イオン
あるいはキレートを生成する物質を添加して構成したた
め、(1)不導体皮膜が発生しないため、ドレッシング
効率が低下せず、安定した電解ドレッシングが実現でき
る。(Effects of the Invention) As described above, in the present invention, in the grinding fluid used for electrolytic dressing grinding processing in which a metal bond grinding wheel is dressed using electrolytic action, a metal rust preventive agent, a surfactant, an antifoaming agent, Since it is made by adding a complex ion or chelate-forming substance to the grinding fluid containing a small amount of electrolyte, (1) no nonconducting film is generated, so dressing efficiency does not decrease and stable electrolytic dressing can be achieved.
(2) 砥粒突き出し量も減少しないため、高効率な
加工が実現できる。(2) Since the amount of abrasive grain protrusion does not decrease, highly efficient machining can be achieved.
(3)機械腐食の心配がない。(3) There is no need to worry about mechanical corrosion.
また、電解作用を用いてメタルボンド砥石のドレッシン
グを行う電解ドレッシング研削加工に使用する研削液に
おいて、
金属防錆剤、界面活性剤、消泡剤などを配合した研削液
eNac1、にC1などのハロゲン化物塩を添加した本
発明によっても、同様に、
(1) 不導体皮膜が発生しないため、ドレッシング
効率が低下せず、安定した電解ドレッシングが実現でき
る。In addition, in the grinding fluid used for electrolytic dressing grinding processing, which uses electrolytic action to dress metal bonded grinding wheels, eNac1, a grinding fluid containing metal rust preventive agents, surfactants, antifoaming agents, etc., is mixed with halogens such as C1. Similarly, according to the present invention in which a compound salt is added, (1) Since no nonconducting film is generated, the dressing efficiency is not reduced and stable electrolytic dressing can be realized.
C) 機械腐食の心配がない。C) There is no need to worry about mechanical corrosion.
(3)電解効率100%で流出するため砥粒突き出し量
の制御が非常に容易である。(3) Since it flows out with 100% electrolytic efficiency, it is very easy to control the amount of abrasive grain protrusion.
といった効果がある。There is an effect like this.
第1図は本発明の第1実施例の模式図、第2図は電解ド
レッシングの状態を示す説明図、第3図(a)は電解ド
レッシングによる良好な砥石面を示す説明図、(ロ)は
表面が不導体皮膜に覆われた状態説引回を示す。
第1図Fig. 1 is a schematic diagram of the first embodiment of the present invention, Fig. 2 is an explanatory diagram showing the state of electrolytic dressing, Fig. 3 (a) is an explanatory diagram showing a good grinding wheel surface due to electrolytic dressing, (b) indicates a state in which the surface is covered with a nonconducting film. Figure 1
Claims (2)
グを行う電解ドレッシング研削加工に使用する研削液に
おいて、 金属防錆剤、界面活性剤、消泡剤、微量電解質などを配
合した研削液に錯イオンあるいはキレートを生成する物
質を添加して成ることを特徴とした電解ドレッシング用
研削液。(1) In the grinding fluid used in the electrolytic dressing grinding process, which uses electrolytic action to dress the metal bond grinding wheel, complex ions are added to the grinding fluid containing metal rust preventive agents, surfactants, antifoaming agents, trace electrolytes, etc. Alternatively, a grinding fluid for electrolytic dressing is characterized in that it contains a substance that generates chelate.
グを行う電解ドレッシング研削加工に使用する研削液に
おいて、 金属防錆剤、界面活性剤、消泡剤などを配合した研削液
にNaCl、KClなどのハロゲン化物塩を添加して成
ることを特徴とした電解ドレッシング用研削液。(2) In the grinding fluid used for electrolytic dressing grinding, which uses electrolytic action to dress the metal bond grinding wheel, NaCl, KCl, etc. A grinding fluid for electrolytic dressing characterized by containing a halide salt.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16391390A JPH0453628A (en) | 1990-06-21 | 1990-06-21 | Grinding fluid for electrolytic dressing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16391390A JPH0453628A (en) | 1990-06-21 | 1990-06-21 | Grinding fluid for electrolytic dressing |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0453628A true JPH0453628A (en) | 1992-02-21 |
Family
ID=15783209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16391390A Pending JPH0453628A (en) | 1990-06-21 | 1990-06-21 | Grinding fluid for electrolytic dressing |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0453628A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5750619A (en) * | 1980-09-12 | 1982-03-25 | Toshiba Corp | Monitoring apparatus of water level of nuclear reactor |
-
1990
- 1990-06-21 JP JP16391390A patent/JPH0453628A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5750619A (en) * | 1980-09-12 | 1982-03-25 | Toshiba Corp | Monitoring apparatus of water level of nuclear reactor |
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