JPH0448680A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPH0448680A JPH0448680A JP15609090A JP15609090A JPH0448680A JP H0448680 A JPH0448680 A JP H0448680A JP 15609090 A JP15609090 A JP 15609090A JP 15609090 A JP15609090 A JP 15609090A JP H0448680 A JPH0448680 A JP H0448680A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- lands
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 8
- 230000002093 peripheral effect Effects 0.000 claims abstract description 8
- 238000007747 plating Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 10
- 238000005476 soldering Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Combinations Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、プリント配線板同士を接合するのに適した
プリント配線板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed wiring board suitable for bonding printed wiring boards together.
第５図は従来のプリント配線板の斜視図、第６図はその
接合状態を示す断面図、第７図はそのＡ−Ａ断面図であ
り、図において、（１）はプリント配線板、（２）はプ
リント配線板（１）の表面に形成された導体パターン、
（３）はプリント配線板（１）の周辺部に位置する導体
パターン（２）の端部に形成されたパッド、（４）はパ
ッド（３）をはさみ込む端子、（ｌａ）はプリント配線
板（１）と接続する他のプリント配線板、（３ａ）はプ
リント配線板（１ａ）上に形成されたパッド、（５）は
パッド（３）と（３ａ）を接合するはんだである。Fig. 5 is a perspective view of a conventional printed wiring board, Fig. 6 is a cross-sectional view showing its bonded state, and Fig. 7 is a cross-sectional view taken along line A-A. 2) is a conductor pattern formed on the surface of the printed wiring board (1);
(3) is a pad formed at the end of the conductor pattern (2) located on the periphery of the printed wiring board (1), (4) is a terminal that sandwiches the pad (3), and (la) is the printed wiring board Another printed wiring board is connected to (1), (3a) is a pad formed on printed wiring board (1a), and (5) is a solder that joins pads (3) and (3a).
次に、プリント配線板（１）、（ｌａ）の接合方法につ
いて説明する。まずプリント配線板（１）のパッド（３
）を端子（４）ではさんで、他のプリント配線板（１ａ
）に実装できるようにし、他のプリント配線板（１ａ）
のバット（３ａ）の上に、端子（４）を載せる。次いで
、はんだ（５）を溶融して、端子（４）とプリント配線
板（１）および（１ａ）のパッド（３）および（３ａ）
とを接合する。Next, a method for joining printed wiring boards (1) and (la) will be explained. First, pad (3) of printed wiring board (1)
) between the terminals (4) and connect it to another printed wiring board (1a
) and other printed wiring boards (1a)
Place the terminal (4) on top of the bat (3a). Next, the solder (5) is melted to connect the terminal (4) and the pads (3) and (3a) of the printed wiring board (1) and (1a).
to join.
従来のプリント配線板は以上のように構成されているの
で、端子（４）をプリント配線板（１）に取付けてはん
だ付けし、さらに他のプリント配線板（１ａ）にはんだ
付けする必要があり、はんだ付は点数が多く１作業性が
悪いとともに、信頼性も劣る。Since the conventional printed wiring board is constructed as described above, it is necessary to attach and solder the terminal (4) to the printed wiring board (1), and then solder it to another printed wiring board (1a). 1. Soldering requires many points, which results in poor workability and poor reliability.
また、端子（４）の形状が複雑であるので、製造にコス
トがかかり、特に少量生産の時にはコスト高になるなど
の問題があった。Further, since the shape of the terminal (4) is complicated, there is a problem in that manufacturing costs are high, especially when producing in small quantities.
この発明は上記のような問題点を解消するためになされ
たもので、端子をなくすことができ、これにより、はん
だ付は点数を減らしてコストを低減するとともに、信頼
性を高くすることができるプリント配線板を得ることを
目的とする。This invention was made to solve the above problems, and it is possible to eliminate terminals, thereby reducing the number of soldering points and reducing costs, as well as increasing reliability. The purpose is to obtain printed wiring boards.
この発明に係るプリント配線板は、プリント配線板の他
のプリント配線板との接合部となる周辺部の両面に形成
されかつ導体パターンに接続するランド部と１両面のラ
ンド部を貫くように前記周辺部に形成された凹部と、こ
の凹部の内周面に前記両面のランド部を接続するように
形成されためっき部とを備えたものである。The printed wiring board according to the present invention has land portions formed on both sides of a peripheral portion of the printed wiring board that is a joint portion with another printed wiring board and connected to a conductor pattern, and a land portion on one both sides of the printed wiring board. The device includes a recess formed in the peripheral portion and a plating portion formed to connect the land portions on both sides to the inner circumferential surface of the recess.
この発明のプリント配線板は、めっき部を形成した凹部
を他のプリント配線板のパッド上に載置するように実装
し、ランド部と他のプリント配線板のパッドとをハンダ
付けすると、凹部の内壁面にはんだが充填された後、ラ
ンド部とバットの間で、はんだがフィレット状の曲線を
形成するようにはんだがたまり、両方のプリント配線板
が機械的および電気的に接合される。The printed wiring board of the present invention is mounted so that the recessed part formed with the plating part is placed on the pad of another printed wiring board, and when the land part and the pad of the other printed wiring board are soldered, the recessed part is mounted. After the inner wall surface is filled with solder, the solder accumulates between the land portion and the bat so as to form a fillet-like curve, and both printed wiring boards are mechanically and electrically bonded.
以下、この発明の一実施例を図について説明する。第１
図は実施例のプリント配線板の斜視図、第２図はその一
部の拡大図、第３図は接合状態を示す断面図、第４図は
そのＢ−Ｂ断面図であり。An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure is a perspective view of the printed wiring board of the embodiment, FIG. 2 is an enlarged view of a part thereof, FIG. 3 is a sectional view showing a bonded state, and FIG. 4 is a BB sectional view thereof.
図において、第５図ないし第７図と同一符号は同一また
は相当部分を示す。（１１）はプリント配線板（１）の
周辺部に形成されたランド部で、導体ノ（ターン（２）
と接続している。（１２）は両面のランド部（１１）を
貫くようにプリント配線板（１）の周辺部に形成された
半円状の凹部で、その内周面には両面のランド部（１１
）に接続するようにめっき部（１３）力へ形成されてい
る。In the figures, the same reference numerals as in FIGS. 5 to 7 indicate the same or corresponding parts. (11) is a land formed on the periphery of the printed wiring board (1), where the conductor (turn (2))
is connected to. (12) is a semicircular recess formed on the periphery of the printed wiring board (1) so as to penetrate through the land portions (11) on both sides, and the inner peripheral surface thereof is
) is formed to connect to the plated portion (13).
プリント配線板（１）、 （ｌａ）の接合は、プリント
配線板（１）を凹部（１２）が他のプリント配線板（ｌ
ａ）のパッド（３ａ）上に載置されるように垂直に実装
する。次いで、はんだ（５）を溶融してパッド（３ａ）
に付着させると、はんだ（５）はめっき部（１３）を形
成した凹部（１２）に充填され、バット（３ａ）とラン
ド部（１１）の間にはんだ（５）がたまり、プリント配
線板（１）、（ｌａ）は機械的および電気的に接合され
る。The printed wiring boards (1) and (la) are joined together when the recess (12) of the printed wiring board (1) is connected to the other printed wiring board (l).
It is mounted vertically so as to be placed on the pad (3a) of a). Next, the solder (5) is melted to form the pad (3a).
When the solder (5) is attached to the printed wiring board ( 1), (la) are mechanically and electrically connected.
なお、上記実施例では、半円状の凹部（１２）を形成す
る例を示したが、凹部であれば他の形状でもよい。In addition, in the above embodiment, an example was shown in which a semicircular recess (12) was formed, but other shapes may be used as long as the recess is formed.
以上のように、この発明によれば、プリント配線板の周
辺部に凹部およびめっき部を形成してランド部と接続す
るようにしたので、複雑な形状の端子をなくすことがで
きるとともに、はんだ付けの点数を減らすことができ、
このためはんだ付は時間の短縮とコストの低減ならびに
信頼性の向上をはかることができる。As described above, according to the present invention, since the concave portion and the plated portion are formed in the peripheral portion of the printed wiring board and connected to the land portion, it is possible to eliminate terminals with complicated shapes, and also to prevent soldering. You can reduce the score of
Therefore, soldering can shorten time, reduce costs, and improve reliability.
第１図はこの発明の一実施例によるプリント配線板を示
す斜視図、第２図はその一部の拡大図、第３図はその接
合状態を示す斜視図、第４図はそのＢ−Ｂ断面図、第５
図は従来のプリント配線板の斜視図、第６図はその接合
状態を示す断面図、第７図はそのＡ−Ａ断面図である。
各図中、同一符号は同一または相当部分を示し、（１）
、（１ａ）はプリント配線板、（２）は導体パターン。
（３）、（３ａ）はパッド、（５）ははんだ、 （１１
）はランド部、 （１２）は凹部、 （１３）はめっき
部である。Fig. 1 is a perspective view showing a printed wiring board according to an embodiment of the present invention, Fig. 2 is an enlarged view of a part thereof, Fig. 3 is a perspective view showing the bonded state thereof, and Fig. 4 is a B-B thereof. Cross section, 5th
The figure is a perspective view of a conventional printed wiring board, FIG. 6 is a cross-sectional view showing its bonded state, and FIG. 7 is a cross-sectional view taken along line A-A. In each figure, the same reference numerals indicate the same or corresponding parts, (1)
, (1a) is a printed wiring board, and (2) is a conductor pattern. (3), (3a) are pads, (5) are solder, (11
) is the land portion, (12) is the recessed portion, and (13) is the plated portion.
Claims (1)
となる周辺部の両面に形成されかつ導体パターンに接続
するランド部と、両面のランド部を貫くように前記周辺
部に形成された凹部と、この凹部の内周面に前記両面の
ランド部を接続するように形成されためっき部とを備え
たことを特徴とするプリント配線板。(1) A land portion formed on both sides of the peripheral portion of the printed wiring board that is a joint portion with another printed wiring board and connected to the conductor pattern, and a land portion formed on the peripheral portion so as to penetrate through the land portions on both sides. 1. A printed wiring board comprising: a recess; and a plating portion formed to connect the land portions on both surfaces to the inner circumferential surface of the recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15609090A JPH0448680A (en) | 1990-06-14 | 1990-06-14 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15609090A JPH0448680A (en) | 1990-06-14 | 1990-06-14 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0448680A true JPH0448680A (en) | 1992-02-18 |
Family
ID=15620091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15609090A Pending JPH0448680A (en) | 1990-06-14 | 1990-06-14 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0448680A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05267811A (en) * | 1992-03-17 | 1993-10-15 | Fujitsu Denso Ltd | Manufacture of printed circuit board connecting structure and connecting land |
| JPH05315723A (en) * | 1992-05-11 | 1993-11-26 | Mitsubishi Electric Corp | Combinational board |
| JP2013026401A (en) * | 2011-07-20 | 2013-02-04 | Kyocera Corp | Multi-piece wiring board |
| JP2017058542A (en) * | 2015-09-17 | 2017-03-23 | 富士通オプティカルコンポーネンツ株式会社 | Optical communication device, optical module, and connection method |
-
1990
- 1990-06-14 JP JP15609090A patent/JPH0448680A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05267811A (en) * | 1992-03-17 | 1993-10-15 | Fujitsu Denso Ltd | Manufacture of printed circuit board connecting structure and connecting land |
| JPH05315723A (en) * | 1992-05-11 | 1993-11-26 | Mitsubishi Electric Corp | Combinational board |
| JP2013026401A (en) * | 2011-07-20 | 2013-02-04 | Kyocera Corp | Multi-piece wiring board |
| JP2017058542A (en) * | 2015-09-17 | 2017-03-23 | 富士通オプティカルコンポーネンツ株式会社 | Optical communication device, optical module, and connection method |
| US10001693B2 (en) | 2015-09-17 | 2018-06-19 | Fujitsu Optical Components Limited | Light communication device, light module, and method for coupling |
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