JPH04371373A - Manufacture of spot welding electrode tip - Google Patents
Manufacture of spot welding electrode tipInfo
- Publication number
- JPH04371373A JPH04371373A JP3146062A JP14606291A JPH04371373A JP H04371373 A JPH04371373 A JP H04371373A JP 3146062 A JP3146062 A JP 3146062A JP 14606291 A JP14606291 A JP 14606291A JP H04371373 A JPH04371373 A JP H04371373A
- Authority
- JP
- Japan
- Prior art keywords
- spot welding
- particles
- electrode tip
- tip
- welding electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 title claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000002245 particle Substances 0.000 claims abstract description 47
- 239000000843 powder Substances 0.000 claims abstract description 24
- 239000002775 capsule Substances 0.000 claims abstract description 15
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000000919 ceramic Substances 0.000 claims abstract description 11
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 9
- 229910052790 beryllium Inorganic materials 0.000 claims abstract description 8
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 8
- 229910052593 corundum Inorganic materials 0.000 claims abstract description 3
- 229910001845 yogo sapphire Inorganic materials 0.000 claims abstract description 3
- 238000005245 sintering Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 abstract description 15
- 229910052721 tungsten Inorganic materials 0.000 abstract description 9
- 238000007747 plating Methods 0.000 description 12
- 239000010949 copper Substances 0.000 description 10
- 239000003094 microcapsule Substances 0.000 description 10
- 239000011651 chromium Substances 0.000 description 8
- 239000002131 composite material Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 5
- 239000010937 tungsten Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 3
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- ZTXONRUJVYXVTJ-UHFFFAOYSA-N chromium copper Chemical compound [Cr][Cu][Cr] ZTXONRUJVYXVTJ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910018404 Al2 O3 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000011195 cermet Substances 0.000 description 1
- 238000009770 conventional sintering Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/14—Treatment of metallic powder
- B22F1/148—Agglomerating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は自動車部品やエレクトロ
ニクス部品のスポット溶接を行うための電極チップの製
造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing electrode tips for spot welding automobile parts and electronic parts.
【０００２】0002
【従来の技術】従来、自動車部品やエレクトロニクス部
品のスポット溶接を行うための電極チップは被溶接物に
点接触しつつ、高電圧、高電流を通電してその抵抗熱に
よって被溶接物を溶接することから、その性質上、主に
耐摩耗性、導電性、耐熱性等が強く要求される。一般に
、この電極チップはクロム銅、ベリリウム銅合金等によ
って形成されているが、これらの合金では特に負担の大
きい電極チップ先端部の耐熱性、耐久性、耐摩耗性等の
点で不足していた。[Prior Art] Conventionally, electrode tips for spot welding automobile parts and electronic parts are in point contact with the workpiece, and high voltage and high current are applied to weld the workpiece using the resulting resistance heat. Therefore, due to its properties, wear resistance, electrical conductivity, heat resistance, etc. are strongly required. Generally, this electrode tip is made of chromium copper, beryllium copper alloy, etc., but these alloys lack heat resistance, durability, and abrasion resistance, especially at the tip of the electrode tip, which is a heavy load. .
【０００３】そのため、最近では、強度が要求される電
極チップ先端部に、アルミナなどの耐摩耗性材料をコー
ティングしたり、強化合金銅を埋め込んだり、電極チッ
プ本体を耐摩耗性複合材料で成形することで耐熱性およ
び耐摩耗性を向上させた電極チップが提案されている。
例えば、特開昭５８−１００９８６号公報で開示された
電極チップは粉末状のカーボンの表面に銅メッキを施し
た複合材料を焼結して形成したものであり、また、特開
昭６４−７８６８４号公報で開示された電極チップは粉
末状の銅粒子表面にモリブデンやチタン、アルミナ等の
耐熱性、耐摩耗性に優れた複合材料をメッキし、これを
所定の型に配置した後、冷間加圧し、さらに一時間、熱
間加圧して焼結したものである。[0003]Recently, therefore, the tip of the electrode tip, which requires strength, is coated with a wear-resistant material such as alumina, reinforced copper alloy is embedded, and the electrode tip body is molded with a wear-resistant composite material. Electrode tips with improved heat resistance and wear resistance have been proposed. For example, the electrode tip disclosed in JP-A-58-100986 is made by sintering a composite material in which the surface of powdered carbon is plated with copper; The electrode tip disclosed in the publication is made by plating the surface of powdered copper particles with a composite material with excellent heat resistance and wear resistance such as molybdenum, titanium, alumina, etc., placing it in a predetermined mold, and then cold-plating it. It was pressurized and sintered by hot pressing for an additional hour.
【０００４】また、この電極チップの形状は棒形状であ
り、その径、長さ、先端形状は、目的、用途により種々
選択されている。例えば、厚板の鋼板などをスポット溶
接するための電極チップの形状は先端の接触部分が半球
状に形成され、断面Ｕ字形をしたものが多く用いられ、
また、エレクトロニクス部品等の小部品をマイクロスポ
ット溶接するための電極チップの形状は、略ピン形状に
形成されたものが多く用いられることになる。[0004] The shape of this electrode tip is a rod, and its diameter, length, and tip shape are variously selected depending on the purpose and use. For example, the shape of the electrode tip used for spot welding thick steel plates, etc., has a hemispherical contact area at the tip and a U-shaped cross section.
Further, electrode tips for micro-spot welding small parts such as electronic parts are often formed into a substantially pin shape.
【０００５】[0005]
【発明が解決しようとする課題】ところで、上述したよ
うに特開昭５８−１００９８６号、特開昭６４−７８６
８４号公報で示した電極チップを形成する複合材料は、
メッキ法によって粉体表面に他の複合材を複合化してい
たため、湿式のメッキ設備や有害なメッキ液を取り扱う
必要であり、管理や処理設備が必要であった。また、こ
のメッキ法では複合層の材質やメッキ厚が制限されると
共に、複数材質の複合化が困難であるため、所望の特性
を有する電極チップの製造は困難であった。また、従来
の焼結方法では電極チップの本体部と先端部が異種材料
の場合は、本体部と先端部の接合がうまくいかない可能
性がある上に、これら複合材料を焼結した際に、粉末に
メッキされている成分が析出して材質が不均一となる問
題点があった。[Problems to be Solved by the Invention] By the way, as mentioned above, Japanese Patent Application Laid-Open Nos. 58-100986 and 64-786
The composite material forming the electrode tip shown in Publication No. 84 is
Because the plating method was used to combine other composite materials onto the powder surface, it was necessary to use wet plating equipment and handle harmful plating solutions, which required management and processing equipment. In addition, this plating method limits the material and plating thickness of the composite layer, and it is difficult to combine multiple materials, making it difficult to manufacture electrode chips with desired characteristics. In addition, with conventional sintering methods, if the main body and tip of the electrode tip are made of different materials, there is a possibility that the bonding between the main body and the tip may not be successful, and when these composite materials are sintered, powder There was a problem that the components plated on the plated material precipitated and the material became non-uniform.
【０００６】そこで、本発明はこれらの問題点を有効に
解決するために案出されたものであり、その目的は煩わ
しいメッキ方法を用いずに所望の特性を有すると共に、
製造方法が簡単で材質が均一なスポット溶接用電極チッ
プの製造方法を提供するものである。The present invention was devised to effectively solve these problems, and its purpose is to provide desired characteristics without using a troublesome plating method, and to
The present invention provides a method of manufacturing an electrode tip for spot welding that is simple and of uniform material.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に本発明は、被溶接物をスポット溶接するスポット溶接
用電極チップにおいて、Ｃｕの母粒子の表面をＷ、Ｃｒ
，Ｂｅ，Ｚｒ，Ａｌ ２ Ｏ３ 又はセラミック粒子
等の子粒子で被覆してマイクロカプセル化したカプセル
粉末を用いて所定の形状に成形した後、これをプラズマ
焼結して固形化したものである。[Means for Solving the Problems] In order to achieve the above object, the present invention provides a spot welding electrode tip for spot welding objects to be welded, in which the surface of Cu base particles is replaced by W, Cr.
, Be, Zr, Al 2 O 3 , or ceramic particles, and molded into a predetermined shape using capsule powder, which was then solidified by plasma sintering.
【０００８】[0008]
【作用】本発明は上述したように、Ｃｕの母粒子の表面
をＷ、Ｃｒ，Ｂｅ，Ｚｒ，Ａｌ２ Ｏ３ 又はセラミッ
ク粒子等の子粒子で被覆してマイクロカプセル化したカ
プセル粉末を用いて所定の形状に成形した後、これをプ
ラズマ焼結して固形化したものあるため、従来のような
メッキ法をする必要がなくなり、有害なメッキ液や処理
設備が不要となる。また、本発明のマイクロカプセル化
ではＣｕの母粒子の表面に付着させる子粒子の成分や付
着量を任意に制御できると共に、２層以上の複数材質の
複合化が容易に可能であるため、必要に応じて所望の特
性を得ることができる。また、本発明ではプラズマ焼結
法によってこれらを固形化するため、短時間で固形化す
ることができる。従って、製造時間が大巾に短縮される
と共に、Ｗ、Ｃｒ，Ｂｅ，Ｚｒ，Ａｌ２ Ｏ３又はセラ
ミック粒子等の子粒子成分が析出することがなくなり、
材質の均一化が容易に達成される。[Operation] As described above, the present invention uses capsule powder in which the surface of Cu mother particles is coated with child particles such as W, Cr, Be, Zr, Al2 O3 or ceramic particles to form a microcapsule. After being formed into a shape, it is solidified by plasma sintering, so there is no need for conventional plating methods, and harmful plating solutions and processing equipment are no longer necessary. In addition, with the microencapsulation of the present invention, it is possible to arbitrarily control the components and amount of the child particles attached to the surface of the Cu parent particles, and it is also possible to easily combine two or more layers of multiple materials. Desired characteristics can be obtained depending on the conditions. Furthermore, in the present invention, these are solidified by a plasma sintering method, so that they can be solidified in a short time. Therefore, the manufacturing time is greatly shortened, and the precipitation of child particle components such as W, Cr, Be, Zr, Al2O3 or ceramic particles is eliminated.
Uniformity of material is easily achieved.
【０００９】[0009]
【実施例】以下、本発明の一実施例を添付図面に基づい
て詳述する。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the accompanying drawings.
【００１０】図１（Ａ）は本実施例に係る電極チップ１
の斜視図である。この電極チップ１は、例えば自動車部
品等の比較的厚板の鋼板等をスポット溶接する際に用い
られるものであり、図示するように、半球面状に形成さ
れて被溶接物に点接触する先端部２と、この先端部２と
一体的に形成された棒状の本体３とから構成されている
。また、本体３の上端内部には先端部２とは反対方向に
テーパー状に開口した開口部４が形成されており、シャ
ンク（図示せず）が嵌合するようになっている。FIG. 1(A) shows an electrode chip 1 according to this embodiment.
FIG. This electrode tip 1 is used, for example, when spot welding relatively thick steel plates such as automobile parts, and as shown in the figure, the tip is formed in a hemispherical shape and makes point contact with the object to be welded. It consists of a section 2 and a rod-shaped main body 3 integrally formed with the tip section 2. Further, an opening 4 tapered in a direction opposite to the tip 2 is formed inside the upper end of the main body 3, into which a shank (not shown) is fitted.
【００１１】一方、図１（Ｂ）に示す電極チップ１ａは
例えばエレクトロニクス部品等の比較的薄板の鋼板等を
マイクロスポット溶接する際に用いられるものであり、
図示するように、略ピン状に形成されて被溶接物に点接
触する先端部２ａと、この先端部２ａの上端にこれと一
体的に形成された棒状の本体３ａとから構成されている
。On the other hand, the electrode tip 1a shown in FIG. 1(B) is used, for example, when micro-spot welding relatively thin steel plates such as electronic parts.
As shown in the figure, it is comprised of a tip 2a that is formed into a substantially pin shape and makes point contact with the workpiece to be welded, and a rod-shaped main body 3a that is integrally formed at the upper end of the tip 2a.
【００１２】そして、これら電極チップ１、１ａは、図
２に示すように、粉末状のカプセル粉末５を所定の形状
に成形した後、これをプラズマ焼結して固形化されて製
造されている。このカプセル粉末５は粉末状のＣｕ（銅
）の母粒子６の表面をＷ（タングステン）、Ｃｒ（クロ
ム），Ｂｅ（ベリリウム），Ｚｒ（ジルコニウム），Ａ
ｌ２ Ｏ３ （アルミナ）又はセラミック粒子等の子粒
子７のいずれか、或いは２種類以上で被覆してマイクロ
カプセル化したものである。そして、それぞれこの母粒
子６の平均粒子径は約４０μｍ程度であり、タングステ
ン、クロム、ベリリウム，ジルコニウム，アルミナ又は
セラミック粒子等の子粒子７の平均粒子径は約１μｍ以
下となっている。また、母粒子６に対する、これら子粒
子７の重量％は１％以下となっている。As shown in FIG. 2, these electrode chips 1 and 1a are manufactured by molding powdered capsule powder 5 into a predetermined shape and then solidifying it by plasma sintering. . This capsule powder 5 has the surface of powdered Cu (copper) mother particles 6 coated with W (tungsten), Cr (chromium), Be (beryllium), Zr (zirconium), A
It is coated with one or more of child particles 7 such as l2 O3 (alumina) or ceramic particles to form microcapsules. Each of the mother particles 6 has an average particle diameter of about 40 μm, and the child particles 7 such as tungsten, chromium, beryllium, zirconium, alumina, or ceramic particles have an average particle diameter of about 1 μm or less. Moreover, the weight percent of these child particles 7 to the mother particles 6 is 1% or less.
【００１３】そして、母粒子６の表面に付着されるこれ
ら子粒子７は所望の特性に応じて適宜、変化されること
になる。例えば、図１で示す電極チップ１，１ａの本体
３，３ａには銅粒子をクロムの子粒子７でマイクロカプ
セル化したクロム銅のカプセル粉末５で成形し、耐熱性
および耐摩耗性の要求される先端部２，２ａ部分には銅
粒子をアルミナやセラミック等の子粒子７でマイクロカ
プセル化したカプセル粉末５で成形している。また、特
開昭６４−７８６８４号公報で示したように溶接する鋼
板表面に亜鉛がメッキされている場合には先端部２，２
ａ部分が亜鉛との合金化するのを防止するために先端部
２，２ａ部分には亜鉛と親和性の小さなタングステンや
モリブデン等の子粒子７で母粒子６をマイクロカプセル
化したカプセル粉末５で成形しても良い。[0013] These child particles 7 attached to the surface of the mother particle 6 are changed as appropriate depending on desired characteristics. For example, the main bodies 3, 3a of the electrode tips 1, 1a shown in FIG. The tip portions 2 and 2a are molded with capsule powder 5 in which copper particles are microencapsulated with child particles 7 of alumina, ceramic, or the like. In addition, when the surface of the steel plate to be welded is plated with zinc as shown in Japanese Unexamined Patent Publication No. 64-78684, the tips 2, 2
In order to prevent the part a from being alloyed with zinc, the tip parts 2 and 2a are filled with capsule powder 5 in which the mother particles 6 are microencapsulated with child particles 7 of tungsten, molybdenum, etc., which have a small affinity for zinc. It may also be molded.
【００１４】次に、本発明の製造方法の具体的実施例を
説明する。Next, a specific example of the manufacturing method of the present invention will be described.
【００１５】先ず、アトマイズ法等によって銅の微粉末
である母粒子６を製造し、この母粒子６の表面に、必要
に応じてタングステン、クロム、ベリリウム，ジルコニ
ウム，アルミナ又はセラミック粒子等の子粒子７のいず
れか、あるいは複数種類を静電気法等によって付着させ
、図２に示すように、マイクロカプセル粉末５を製造す
る。First, mother particles 6, which are fine copper powder, are produced by an atomization method or the like, and child particles such as tungsten, chromium, beryllium, zirconium, alumina, or ceramic particles are coated on the surface of the mother particles 6, if necessary. Microcapsule powder 5 is produced as shown in FIG. 2 by attaching one or more of 7, using an electrostatic method or the like.
【００１６】次に、このマイクロカプセル粉末５を図３
及び図４に示すように、プラズマ焼結装置８によってプ
ラズマ焼結して固形化することになる。このプラズマ焼
結装置８は図示するように、油圧プレス機９に特種電源
１０が付いたものであり、制御機１１で電流、電圧、時
間、圧力などを自動あるいは手動で制御するようになっ
ている。マイクロカプセル粉末５をいれる型１２は電気
抵抗が高くて耐衝撃圧、耐衝撃熱を備えた材料、例えば
サーメットや黒鉛によって構成されている。また、型１
２の上下には導電性のある耐熱材、例えばタングステン
、モリブデン或いは黒鉛をパンチ１３として挿入し、パ
ンチ１３に接続された電極１４間に挟んで起動すれば自
動的に設定されたタイマー又は検出器（図示せず）によ
り放電、通電成形が行われるようになっている。Next, this microcapsule powder 5 is shown in FIG.
And as shown in FIG. 4, it is plasma sintered and solidified by a plasma sintering device 8. As shown in the figure, this plasma sintering device 8 is a hydraulic press machine 9 with a special power source 10 attached, and a controller 11 that automatically or manually controls current, voltage, time, pressure, etc. There is. The mold 12 into which the microcapsule powder 5 is placed is made of a material that has high electrical resistance and is resistant to impact pressure and heat, such as cermet or graphite. Also, type 1
A conductive heat-resistant material, such as tungsten, molybdenum, or graphite, is inserted as a punch 13 above and below the punch 13, and when activated by inserting it between the electrodes 14 connected to the punch 13, a timer or detector is automatically set. (not shown) performs discharge and current forming.
【００１７】すなわち、上述したマイクロカプセル粉末
５をプラズマ焼結装置８の型１２内に配置し、油圧プレ
ス機９によって冷間加圧しつつ電極１４間に数キロ程度
の低い圧力をかけてマイクロカプセル粉末５間を放電さ
せてマイクロカプセル粉末５を数分間プラズマ焼結し、
固形化することになる。That is, the above-mentioned microcapsule powder 5 is placed in a mold 12 of a plasma sintering device 8, and while cold pressurized by a hydraulic press 9, a low pressure of several kilograms is applied between electrodes 14 to form microcapsules. Plasma sinter the microcapsule powder 5 for several minutes by causing a discharge between the powders 5,
It will solidify.
【００１８】マイクロカプセル粉末５の子粒子７の成分
や付着量は所望とする電極チップ１、１ａの特性に応じ
て変化させることも可能となる。例えば、図５に示すよ
うに、本体部３は小粒子７を比較的安価なクロム銅のカ
プセル粉末５によって成形し、耐摩耗性や耐熱性の要求
される先端部２には小粒子７を比較的高価なアルミナや
セラミックスとしたカプセル粉末５で成形することでも
容易に達成できる。この場合の製造方法は先ず、型１２
内の底部にアルミナやセラミックスを小粒子７としたカ
プセル粉末５を配置し、このカプセル粒子５の上方にク
ロムを小粒子７としたカプセル粉末５を配置するだけで
従来、困難であった２層タイプの電極チップの製造が容
易に達成される。また、図６に示すように、マイクロス
ポット溶接用の電極チップ１ａの場合はプラズマ焼結装
置８の型１２及びパンチ１３の形状を変えることで容易
に成形できる。さらに、上述したように本体３ａと先端
部２ａとの材質を変化させることも容易にできる。It is also possible to change the components and the amount of attached particles of the child particles 7 of the microcapsule powder 5 depending on the desired characteristics of the electrode chips 1, 1a. For example, as shown in FIG. 5, the main body part 3 is formed by molding small particles 7 using relatively inexpensive chromium copper capsule powder 5, and the small particles 7 are formed in the tip part 2, which requires wear resistance and heat resistance. This can also be easily achieved by molding capsule powder 5 made of relatively expensive alumina or ceramics. In this case, the manufacturing method first begins with a mold 12.
By simply placing a capsule powder 5 with small particles 7 of alumina or ceramics at the bottom of the inner layer, and placing a capsule powder 5 with small particles 7 of chromium above the capsule particles 5, it is possible to create two layers, which was difficult to do in the past. The manufacture of electrode tips of this type is easily achieved. Further, as shown in FIG. 6, an electrode tip 1a for micro spot welding can be easily formed by changing the shapes of the mold 12 and punch 13 of the plasma sintering device 8. Further, as described above, the materials of the main body 3a and the tip portion 2a can be easily changed.
【００１９】また、このプラズマ焼結による焼結時間は
数分単位であるため、小粒子７成分の析出などが発生せ
ず、均一な電極チップを製造することができる。また、
先端部２と本体３との接合部分も強化され、分離するこ
とがなくなる。Further, since the sintering time of this plasma sintering is on the order of several minutes, precipitation of the seven components of small particles does not occur, and a uniform electrode chip can be manufactured. Also,
The joint between the tip 2 and the main body 3 is also strengthened, and separation will not occur.
【００２０】このように、本発明は電極チップの複合材
料をマイクロカプセル化したマイクロカプセル粉末で成
形すると共に、プラズマ焼結法によって固形化するよう
になっているため、従来のような煩わしいメッキ法を用
いずに所望の特性を有すると共に、製造方法が簡単でし
かも材質が均一なスポット溶接用電極チップを製造する
ことができる。As described above, in the present invention, the composite material of the electrode tip is molded using microcapsule powder, and is solidified by the plasma sintering method, thereby eliminating the need for the conventional cumbersome plating method. It is possible to manufacture a spot welding electrode tip that has desired characteristics, is simple to manufacture, and is made of uniform material without using.
【００２１】尚、本実施例では母粒子６をＣｕで説明し
たが、Ｃｕ以外にカーボンや導電率の高い白金や純銀又
は金等の貴金属でもよく、また、他の金属を使用しても
良い。[0021] In this embodiment, the base particles 6 are made of Cu, but other than Cu, carbon, noble metals such as platinum, pure silver, or gold with high conductivity may be used, or other metals may be used. .
【００２２】[0022]
【発明の効果】以上要するに本発明によれば、従来のよ
うな煩わしいメッキ法を用いずに所望の特性を有すると
共に、製造方法が簡単でしかも材質が均一なスポット溶
接用電極チップを製造することができるといった優れた
効果を発揮する。[Effects of the Invention] In summary, according to the present invention, it is possible to manufacture a spot welding electrode tip that has desired characteristics without using the conventional troublesome plating method, is simple to manufacture, and is made of uniform material. It exhibits excellent effects such as being able to.
【図１】本発明の電極チップの実施例を示す斜視図であ
る。FIG. 1 is a perspective view showing an embodiment of an electrode chip of the present invention.
【図２】カプセル粉末を示す概略図である。FIG. 2 is a schematic diagram showing a capsule powder.
【図３】プラズマ焼結装置を示す斜視図である。FIG. 3 is a perspective view showing a plasma sintering apparatus.
【図４】プラズマ焼結装置の型付近を示す断面図である
。FIG. 4 is a sectional view showing the vicinity of the mold of the plasma sintering apparatus.
【図５】プラズマ焼結装置の型付近を示す断面図である
。FIG. 5 is a sectional view showing the vicinity of the mold of the plasma sintering apparatus.
【図６】プラズマ焼結装置の型付近を示す断面図である
。FIG. 6 is a sectional view showing the vicinity of the mold of the plasma sintering apparatus.
１、１ａ 電極チップ ５ カプセル粉末 ６ 母粒子 ７ 子粒子 1, 1a Electrode tip 5 Capsule powder 6 Mother particle 7 Child particle
Claims (1)
溶接用電極チップにおいて、Ｃｕの母粒子の表面をＷ、
Ｃｒ，Ｂｅ，Ｚｒ，Ａｌ２ Ｏ３ 又はセラミック粒子
等の子粒子で被覆してマイクロカプセル化したカプセル
粉末を用いて所定の形状に成形した後、これをプラズマ
焼結して固形化したことを特徴とするスポット溶接用電
極チップの製造方法。Claim 1: In a spot welding electrode tip for spot welding objects to be welded, the surface of Cu base particles is coated with W,
The capsule powder is coated with sub-particles such as Cr, Be, Zr, Al2O3 or ceramic particles and micro-encapsulated, and then molded into a predetermined shape, which is then solidified by plasma sintering. A method for manufacturing an electrode tip for spot welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3146062A JPH04371373A (en) | 1991-06-18 | 1991-06-18 | Manufacture of spot welding electrode tip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3146062A JPH04371373A (en) | 1991-06-18 | 1991-06-18 | Manufacture of spot welding electrode tip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04371373A true JPH04371373A (en) | 1992-12-24 |
Family
ID=15399221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3146062A Pending JPH04371373A (en) | 1991-06-18 | 1991-06-18 | Manufacture of spot welding electrode tip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04371373A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0774315A3 (en) * | 1995-11-17 | 1998-07-08 | Osram Sylvania Inc. | Tungsten-copper composite powder |
| US6375708B1 (en) | 1994-12-22 | 2002-04-23 | Osram Sylvania Inc. | Alloy for electrical contacts and electrodes and method of making |
| US7045113B2 (en) | 2000-03-29 | 2006-05-16 | Osram Sylvania Inc. | Mo-Cu Composite powder |
| CN100431744C (en) * | 2000-03-29 | 2008-11-12 | 奥斯兰姆施尔凡尼亚公司 | Preparation method of Mo-Cu composite powder |
| CN105665692A (en) * | 2016-03-24 | 2016-06-15 | 洛阳理工学院 | Thermal shock resistant liner composite body for long nozzle and preparation process thereof |
| CN111112602A (en) * | 2019-12-26 | 2020-05-08 | 华侨大学 | Aluminum oxide-carbon composite coated copper powder, preparation method and application |
-
1991
- 1991-06-18 JP JP3146062A patent/JPH04371373A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5956560A (en) * | 1994-12-22 | 1999-09-21 | Osram Sylvania Inc. | Tungsten-copper composite powder |
| US6103392A (en) * | 1994-12-22 | 2000-08-15 | Osram Sylvania Inc. | Tungsten-copper composite powder |
| US6375708B1 (en) | 1994-12-22 | 2002-04-23 | Osram Sylvania Inc. | Alloy for electrical contacts and electrodes and method of making |
| EP0774315A3 (en) * | 1995-11-17 | 1998-07-08 | Osram Sylvania Inc. | Tungsten-copper composite powder |
| EP1118403A2 (en) * | 1995-11-17 | 2001-07-25 | Osram Sylvania Inc. | Tungsten-copper composite powder |
| EP1118403A3 (en) * | 1995-11-17 | 2005-01-05 | Osram Sylvania Inc. | Tungsten-copper composite powder |
| US7045113B2 (en) | 2000-03-29 | 2006-05-16 | Osram Sylvania Inc. | Mo-Cu Composite powder |
| US7122069B2 (en) | 2000-03-29 | 2006-10-17 | Osram Sylvania Inc. | Mo-Cu composite powder |
| CN100431744C (en) * | 2000-03-29 | 2008-11-12 | 奥斯兰姆施尔凡尼亚公司 | Preparation method of Mo-Cu composite powder |
| CN105665692A (en) * | 2016-03-24 | 2016-06-15 | 洛阳理工学院 | Thermal shock resistant liner composite body for long nozzle and preparation process thereof |
| CN105665692B (en) * | 2016-03-24 | 2018-05-11 | 洛阳理工学院 | A kind of long nozzle anti-thermal shock liner complex and its preparation process |
| CN111112602A (en) * | 2019-12-26 | 2020-05-08 | 华侨大学 | Aluminum oxide-carbon composite coated copper powder, preparation method and application |
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