JPH04364482A - Testing method of connecting part using anisotropic conductive tape - Google Patents
Testing method of connecting part using anisotropic conductive tapeInfo
- Publication number
- JPH04364482A JPH04364482A JP3140206A JP14020691A JPH04364482A JP H04364482 A JPH04364482 A JP H04364482A JP 3140206 A JP3140206 A JP 3140206A JP 14020691 A JP14020691 A JP 14020691A JP H04364482 A JPH04364482 A JP H04364482A
- Authority
- JP
- Japan
- Prior art keywords
- connecting part
- anisotropic conductive
- conductive tape
- base
- vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 26
- 230000035882 stress Effects 0.000 claims abstract description 6
- 230000008646 thermal stress Effects 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 9
- 238000010998 test method Methods 0.000 claims description 6
- 239000002245 particle Substances 0.000 abstract description 12
- 239000011521 glass Substances 0.000 abstract description 10
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 6
- 230000000644 propagated effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 15
- 238000010586 diagram Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は電子機器の試験方法に関
し、特に異方性導電テープにより電気接続された部分に
対する電気接続試験に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a testing method for electronic equipment, and more particularly to an electrical connection test for parts electrically connected by an anisotropic conductive tape.
【０００２】0002
【従来の技術】電子部品や配線基板に対する電気的な接
続方法として最も一般的なものは半田付けがあるが、接
続対象の部品または配線基板によっては半田付けを採用
できないものもある。例えばＬＣＤ（液晶ディスプレイ
）に用いられる透明電極（ＩＴＯ電極）は半田になじま
ないものであるので、半田付けを用いることはできない
。2. Description of the Related Art Soldering is the most common electrical connection method for electronic components and wiring boards, but soldering cannot be used depending on the parts or wiring boards to be connected. For example, transparent electrodes (ITO electrodes) used in LCDs (liquid crystal displays) are not compatible with solder, so soldering cannot be used.
【０００３】また、電子機器の小型化に伴い配線基板の
パターン間隔が狭くなり、また基板間隔も薄くする必要
が生じたことから、配線基板と他の配線基板または電子
部品との接続にリード線等を半田付けした構造は採用し
難い場合もある。[0003] Furthermore, as electronic devices become smaller, the spacing between patterns on wiring boards has become narrower, and it has become necessary to thin the spacing between boards, so lead wires are used to connect wiring boards to other wiring boards or electronic components. In some cases, it may be difficult to adopt a structure in which parts such as the like are soldered.
【０００４】このような背景から、導電粒子を含有する
異方性導電テープを二つの導電パターンの間に圧着させ
て接続する方法が用いられつつある。これはパターンが
形成された部分どうしでのみ導電粒子が双方のパターン
と接触して電気的接続がなされるものである。[0004] Against this background, a method is being used in which an anisotropic conductive tape containing conductive particles is pressed between two conductive patterns for connection. In this case, the conductive particles come into contact with both patterns only in the areas where the patterns are formed, and an electrical connection is established.
【０００５】[0005]
【発明が解決しようとする課題】ところで、このような
異方性導電テープによる接続部での接続不良が生じる原
因としては、機器を作動させたときに生じる発熱による
ものと、振動によるものがある。[Problem to be Solved by the Invention] By the way, the causes of poor connection at the connection section using such anisotropic conductive tape are due to the heat generated when the device is operated, and due to vibration. .
【０００６】異方性導電テープは製造上、若干の気泡の
混入は避けられず、この気泡が加熱により膨張すると、
導電粒子のパターンに対する接触が不良となる場合があ
る。また、高周波振動が異方性導電テープに加わると、
導電粒子が励振してしまい、このため接触不良が生じる
場合がある。[0006] Due to the manufacturing process of anisotropic conductive tape, it is unavoidable that some air bubbles are mixed in, and when these air bubbles expand due to heating,
Contact of the conductive particles to the pattern may be poor. Also, when high frequency vibration is applied to anisotropic conductive tape,
The conductive particles may be excited, resulting in poor contact.
【０００７】従来の熱試験方法としては恒温槽を用いた
方法があり、また振動試験方法としては機械的振動を被
試験物に与える振動試験機を用いて行っている。更に、
一般的な使用条件に近づけること、および／または試験
期間を短縮するために、恒温槽と振動試験機を一体型と
して試験を行うことも考えられる。[0007] Conventional thermal testing methods include methods using a constant temperature bath, and vibration testing methods use a vibration testing machine that applies mechanical vibrations to the test object. Furthermore,
In order to approximate the conditions of general use and/or shorten the test period, it may be possible to conduct the test using a constant temperature bath and a vibration tester as an integrated unit.
【０００８】しかし、恒温槽を用いた熱試験方法では、
温度勾配が小さいので、試験に長時間を要してしまう。
また、振動試験機による振動試験方法は、低周波振動（
最大２ｋＨｚ程度）しか与えられないため、導電粒子を
励振させるのに必要な高周波振動（２０ｋＨｚ〜３０ｋ
Ｈｚ程度）を与えられないという問題があった。However, in the thermal test method using a constant temperature bath,
Since the temperature gradient is small, the test takes a long time. In addition, the vibration test method using a vibration tester uses low frequency vibration (
The high frequency vibration (20kHz to 30kHz) required to excite conductive particles is
There was a problem in that it was not possible to provide a high frequency (about Hz).
【０００９】本発明は上記の問題点を解決するためにな
されたものであり、異方性導電テープによる接続部に対
して、熱試験と機械的振動試験を効率良く行う方法の提
供を目的とする。The present invention has been made to solve the above-mentioned problems, and its purpose is to provide a method for efficiently conducting thermal tests and mechanical vibration tests on connection parts using anisotropic conductive tape. do.
【００１０】0010
【課題を解決するための手段】本発明の異方性導電テー
プを用いた接続部に対する試験方法は、上記の問題点を
解決するためになされたものであって、配線基板と、他
方の配線基板または電子部品とを異方性導電テープによ
り接続する構造において、上記異方性導電テープによる
接続部、またはその近傍の配線基板に対して超音波振動
を印加することにより、上記異方性導電テープによる接
続部に対して熱ストレスと機械的ストレスを同時に印加
して接続部の導通を試験することを特徴とするものであ
る。[Means for Solving the Problems] A test method for connection parts using an anisotropic conductive tape according to the present invention has been developed to solve the above problems, and it In a structure in which a board or an electronic component is connected by an anisotropic conductive tape, the anisotropic conductive tape is connected by applying ultrasonic vibration to the wiring board at or near the connection part by the anisotropic conductive tape. This method is characterized by simultaneously applying thermal stress and mechanical stress to the tape connection to test the continuity of the connection.
【００１１】[0011]
【作用】上記に挙げた問題点を解決するためのポイント
は、接続部の瞬時の高温化と、高周波振動による不安定
接続を加速させることにある。[Operation] The key to solving the above-mentioned problems is to accelerate the instantaneous rise in temperature of the connection part and the unstable connection caused by high-frequency vibration.
【００１２】そこで、本願発明は高周波の振動エネルギ
ーを接続部に与えることにより、接続部が瞬時発熱する
とともに、導電粒子の励振を起こすものである。このよ
うに熱ストレスと機械的ストレスとを同時にまた効率的
に印加することにより、従来の試験方法に対して試験時
間を大幅に短縮することが可能となる。[0012] Accordingly, the present invention provides high-frequency vibrational energy to the connecting portion, thereby instantaneously generating heat in the connecting portion and causing excitation of the conductive particles. By applying thermal stress and mechanical stress simultaneously and efficiently in this way, it becomes possible to significantly shorten the test time compared to conventional testing methods.
【００１３】なお、接続部の導通の不良の検出は、測定
機器を用いて電気的に行っても良く、またＬＣＤディス
プレイの試験をする際等では画面を目視して異常を検出
するようにしても良い。[0013] Detection of poor conductivity at the connection part may be carried out electrically using a measuring device, or when testing an LCD display, abnormalities may be detected by visually observing the screen. Also good.
【００１４】[0014]
【実施例】以下本発明の一実施例を詳細に説明する。本
実施例は従来技術における説明と同様に、ＬＣＤに用い
るガラス基板とＴＡＢ基板との接続部に対する試験に本
発明の原理を適用したものであって、図１はこれを模式
的に説明する図である。[Embodiment] An embodiment of the present invention will be described in detail below. Similar to the explanation in the prior art, this example applies the principle of the present invention to a test on the connection between a glass substrate and a TAB substrate used in an LCD, and FIG. 1 is a diagram schematically illustrating this. It is.
【００１５】図中、１は高周波信号を作る発振器であり
、２は発振器から送出される高周波信号を機械的振動に
変換する振動子である。３はＬＣＤのガラス基板であり
、４はＴＡＢ基板である。このガラス基板３とＴＡＢ基
板４はそれぞれ図示しない配線パターンが形成されてい
る。５はガラス基板３とＴＡＢ基板４に形成された配線
パターンどうしを異方性導電テープにより接続した接続
部であり、５１は該接続部中の導電粒子である。In the figure, 1 is an oscillator that generates a high frequency signal, and 2 is a vibrator that converts the high frequency signal sent from the oscillator into mechanical vibration. 3 is an LCD glass substrate, and 4 is a TAB substrate. A wiring pattern (not shown) is formed on each of the glass substrate 3 and the TAB substrate 4. Reference numeral 5 denotes a connecting portion in which the wiring patterns formed on the glass substrate 3 and the TAB substrate 4 are connected to each other by an anisotropic conductive tape, and 51 denotes conductive particles in the connecting portion.
【００１６】この振動子２は機構的には一般的な振動子
と同じものを用いれば良い。但し、上記一般的な振動子
はプラスチック等の接着やワイヤボンデイング接続等に
用いるために被接触体に接触する部分が小さいものであ
るのに対し、本願では被試験体の一部分に過重な振動ス
トレスを加えることがないよう接触部を広くすると共に
、被試験体を損傷しないよう、接触部には鏡面研磨が施
される。The vibrator 2 may be mechanically the same as a general vibrator. However, the general vibrator mentioned above has a small part that comes into contact with the object to be contacted because it is used for adhesion of plastic etc. or wire bonding connection, whereas in this application, excessive vibration stress is applied to a part of the object to be tested. The contact area is widened to prevent damage to the test object, and the contact area is mirror-polished to prevent damage to the test object.
【００１７】本実施例はこの振動子２を直接ガラス基板
３上に当接させて、２８ＫＨｚ程度の高周波振動を印加
するものである。これにより、ガラス基板から高周波振
動が接続部に伝わって、接続部が発熱すると共に、導電
粒子が励振する。In this embodiment, the vibrator 2 is brought into direct contact with the glass substrate 3 to apply high frequency vibration of about 28 KHz. As a result, high-frequency vibrations are transmitted from the glass substrate to the connection portion, the connection portion generates heat, and the conductive particles are excited.
【００１８】これらの熱および振動が加わることにより
、ＬＣＤのガラス基板３とＴＡＢ基板４との接触不良が
生じると、図示しないＬＣＤの液晶表示画面で白／黒が
反転して表示される。このため接触不良は液晶表示画面
を目視することにより検出を行うことができる。If a contact failure occurs between the glass substrate 3 of the LCD and the TAB substrate 4 due to the application of heat and vibration, white/black will be displayed inverted on the liquid crystal display screen of the LCD (not shown). Therefore, contact failure can be detected by visually observing the liquid crystal display screen.
【００１９】次に本実施例を用いた試験結果を図２に示
す。図中、従来の恒温槽を用いた熱試験による接続部の
温度勾配を点線で示し、また本実施例による接続部の温
度勾配を実線で示す。Next, test results using this example are shown in FIG. In the figure, the dotted line indicates the temperature gradient of the connection part obtained by a conventional thermal test using a constant temperature oven, and the solid line indicates the temperature gradient of the connection part according to the present embodiment.
【００２０】図２のように、接続部の温度が摂氏５０度
に達するまでには、従来の試験方法では約２０分を要し
たのに対し、本実施例によれば３〜４分程度に短縮され
た。また、本実施例では導電粒子の励振も同時に加わる
。As shown in FIG. 2, it took about 20 minutes for the temperature of the connection to reach 50 degrees Celsius using the conventional test method, but according to this example, it took about 3 to 4 minutes. Shortened. Furthermore, in this embodiment, excitation of the conductive particles is also applied at the same time.
【００２１】この温度と振動との相乗効果により、本実
施例によれば試験開始から２分後程度から故障が検出可
能となった。なお、本発明は上記の実施例に限定される
ものではない。例えば基板と電子部品との接続部に対し
て適用しても良く、また超音波振動を印可する部分も適
宜変更し得るものである。さらに故障を検出する方法も
画面を目視する方法に限らず、電気的な導通の検出手段
等を用いても良く、要は異方性導電テープを用いた接続
部に超音波振動を印加して熱ストレスと振動ストレスと
を同時に与えるものであれば良い。[0021] Due to the synergistic effect of the temperature and vibration, according to this example, failures could be detected from about 2 minutes after the start of the test. Note that the present invention is not limited to the above embodiments. For example, it may be applied to a connecting portion between a substrate and an electronic component, and the portion to which ultrasonic vibration is applied may be changed as appropriate. Furthermore, the method for detecting a failure is not limited to visually observing the screen, but may also use electrical continuity detection means, etc. In short, applying ultrasonic vibration to the connection using anisotropic conductive tape. Any method that applies heat stress and vibration stress at the same time is fine.
【００２２】[0022]
【発明の効果】以上説明したように、本発明によれば、
異方性導電テープを用いた接続部が短時間で発熱すると
ともに導電粒子が励振するため、従来の試験方法に対し
て大幅に接続部の導通の試験時間を短縮することが可能
となり、実用上の効果が大きい。[Effects of the Invention] As explained above, according to the present invention,
Since the connection part using anisotropic conductive tape generates heat in a short time and the conductive particles are excited, it is possible to significantly shorten the time required to test the continuity of the connection part compared to the conventional test method, making it practical. The effect is large.
【図１】本発明の一実施例の説明図である。FIG. 1 is an explanatory diagram of an embodiment of the present invention.
【図２】本発明の一実施例による接続部の温度変化およ
び故障発生の時間を示す図である。FIG. 2 is a diagram illustrating temperature changes and failure occurrence times of a connection according to an embodiment of the present invention.
１ 発振器
２ 振動子
３ ＬＣＤ（液晶ディスプレイ）のガラス基板４
ＴＡＢ基板
５ 異方性導電テープによる接続部５１ 導電
粒子1 Oscillator 2 Oscillator 3 LCD (liquid crystal display) glass substrate 4
TAB substrate 5 Connection section 51 using anisotropic conductive tape Conductive particles
Claims (1)
品とを異方性導電テープにより接続する構造において、
上記異方性導電テープによる接続部、またはその近傍の
配線基板に対して超音波振動を印加することにより、上
記異方性導電テープによる接続部に対して熱ストレスと
機械的ストレスを同時に印加して接続部の導通を試験す
ることを特徴とする異方性導電テープに用いた接続部に
対する試験方法。Claim 1: A structure in which a wiring board and another wiring board or electronic component are connected by an anisotropic conductive tape, comprising:
By applying ultrasonic vibration to the connection part made of the anisotropic conductive tape or the wiring board in the vicinity thereof, thermal stress and mechanical stress are simultaneously applied to the connection part made of the anisotropic conductive tape. 1. A test method for a connection part used in an anisotropic conductive tape, the method comprising testing the continuity of the connection part by using the following method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3140206A JPH04364482A (en) | 1991-06-12 | 1991-06-12 | Testing method of connecting part using anisotropic conductive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3140206A JPH04364482A (en) | 1991-06-12 | 1991-06-12 | Testing method of connecting part using anisotropic conductive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04364482A true JPH04364482A (en) | 1992-12-16 |
Family
ID=15263391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3140206A Withdrawn JPH04364482A (en) | 1991-06-12 | 1991-06-12 | Testing method of connecting part using anisotropic conductive tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04364482A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008309518A (en) * | 2007-06-12 | 2008-12-25 | Omron Corp | Method and apparatus for inspecting ic part connecting part |
-
1991
- 1991-06-12 JP JP3140206A patent/JPH04364482A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008309518A (en) * | 2007-06-12 | 2008-12-25 | Omron Corp | Method and apparatus for inspecting ic part connecting part |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980903 |