JPH0436262U - - Google Patents
Info
- Publication number
- JPH0436262U JPH0436262U JP1990078414U JP7841490U JPH0436262U JP H0436262 U JPH0436262 U JP H0436262U JP 1990078414 U JP1990078414 U JP 1990078414U JP 7841490 U JP7841490 U JP 7841490U JP H0436262 U JPH0436262 U JP H0436262U
- Authority
- JP
- Japan
- Prior art keywords
- light
- lead frame
- molded body
- primary
- primary molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 238000000465 moulding Methods 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
- H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Description
第1図は本考案の一実施例に係る表面実装型光
結合装置の斜視図、第2図は同じくその平面図、
第3図は第2図のX−X断面図、第4図は同じく
そのY−Y断面図、第5図は同じくその一次モー
ルド体を示す断面図、第6図は本考案の他の実施
例に係る表面実装型結合装置の斜視図、第7図は
従来の表面実装型光結合装置の平面図、第8図は
第7図のA−A断面図、第9図は同じくそのB−
B断面図、第10図は同じくその一次モールド体
を示す図であつて、同図aは正面図、同図bは平
面図、同図cは断面図である。 1……発光素子、2……受光素子、3……発光
側リードフレーム、4……受光側リードフレーム
、6……発光側一次モールド体、7……受光側一
次モールド体、8……二次モールド体。
結合装置の斜視図、第2図は同じくその平面図、
第3図は第2図のX−X断面図、第4図は同じく
そのY−Y断面図、第5図は同じくその一次モー
ルド体を示す断面図、第6図は本考案の他の実施
例に係る表面実装型結合装置の斜視図、第7図は
従来の表面実装型光結合装置の平面図、第8図は
第7図のA−A断面図、第9図は同じくそのB−
B断面図、第10図は同じくその一次モールド体
を示す図であつて、同図aは正面図、同図bは平
面図、同図cは断面図である。 1……発光素子、2……受光素子、3……発光
側リードフレーム、4……受光側リードフレーム
、6……発光側一次モールド体、7……受光側一
次モールド体、8……二次モールド体。
Claims (1)
- 発光素子と、該発光素子が搭載される発光側リ
ードフレームと、これらが透光性樹脂にて一次モ
ールドしてなる発光側一次モールド体と、受光素
子と、該受光素子が搭載される受光側リードフレ
ームと、これらが前記透光性樹脂にて一次モール
ドしてなる受光側一次モールド体と、前記発光側
一次モールド体および受光側一次モールド体を光
学的に結合するよう遮光性樹脂にて二次モールド
してなる二次モールド体とから構成され、前記発
光側リードフレームおよび受光側リードフレーム
は、表面実装できるよう前記二次モールド体内で
各一次モールド体の背面側に折曲して引き出され
たことを特徴とする表面実装型光結合装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990078414U JPH0749815Y2 (ja) | 1990-07-23 | 1990-07-23 | 表面実装型光結合装置 |
US07/731,780 US5214495A (en) | 1990-07-23 | 1991-07-18 | Photointerrupter and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990078414U JPH0749815Y2 (ja) | 1990-07-23 | 1990-07-23 | 表面実装型光結合装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0436262U true JPH0436262U (ja) | 1992-03-26 |
JPH0749815Y2 JPH0749815Y2 (ja) | 1995-11-13 |
Family
ID=13661382
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990078414U Expired - Lifetime JPH0749815Y2 (ja) | 1990-07-23 | 1990-07-23 | 表面実装型光結合装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US5214495A (ja) |
JP (1) | JPH0749815Y2 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5647034A (en) * | 1994-10-03 | 1997-07-08 | Matsushita Electric Works, Ltd. | Operation displaying semiconductor switch |
TW353236B (en) * | 1996-10-22 | 1999-02-21 | Rohm Co Ltd | Photo interruptor |
US6288492B1 (en) | 2000-06-14 | 2001-09-11 | Trw Inc. | Head lamp switch with twilight sentinel control |
JP4801243B2 (ja) * | 2000-08-08 | 2011-10-26 | ルネサスエレクトロニクス株式会社 | リードフレームおよびそれを用いて製造した半導体装置並びにその製造方法 |
JP2005026546A (ja) * | 2003-07-04 | 2005-01-27 | Toshiba Corp | フォトインタラプタとその製造方法及び光結合装置とその製造方法 |
JP2005064140A (ja) * | 2003-08-08 | 2005-03-10 | Toshiba Corp | フォトインタラプタ及びその製造方法 |
DE102004038422B3 (de) * | 2004-07-30 | 2006-01-12 | Schefenacker Vision Systems Germany Gmbh | Sensoreinrichtung, Verwendung einer Sensoreinrichtung sowie Fahrzeugleuchte |
KR100631901B1 (ko) * | 2005-01-31 | 2006-10-11 | 삼성전기주식회사 | Led 패키지 프레임 및 이를 채용하는 led 패키지 |
JP2006269777A (ja) * | 2005-03-24 | 2006-10-05 | Rohm Co Ltd | 面実装型フォトインタラプタとその製造方法 |
TWI373149B (en) * | 2005-03-24 | 2012-09-21 | Rohm Co Ltd | Surface mount type photo interrupter and method for manufacturing the same |
JP2007027621A (ja) * | 2005-07-21 | 2007-02-01 | Rohm Co Ltd | 面実装型フォトインタラプタとその製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6193682A (ja) * | 1984-10-15 | 1986-05-12 | Sharp Corp | ホトインタラプタの製造法 |
JPS6278887A (ja) * | 1985-10-01 | 1987-04-11 | Sharp Corp | ホトインタラプタ |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1789005A1 (de) * | 1968-09-20 | 1972-01-20 | Siemens Ag | Eingekapseltes Halbleiterbauelement mit wenigstens teilweise aus Sintermetall und Kunststoff bestehenden Bauteilen |
DE2806167C2 (de) * | 1978-02-14 | 1986-05-15 | Siemens AG, 1000 Berlin und 8000 München | Hochspannungsfester Optokoppler |
FR2436505A1 (fr) * | 1978-09-12 | 1980-04-11 | Radiotechnique Compelec | Dispositif optoelectronique a emetteur et recepteur couples |
US4694183A (en) * | 1985-06-25 | 1987-09-15 | Hewlett-Packard Company | Optical isolator fabricated upon a lead frame |
US4633582A (en) * | 1985-08-14 | 1987-01-06 | General Instrument Corporation | Method for assembling an optoisolator and leadframe therefor |
JPH0638514B2 (ja) * | 1985-11-21 | 1994-05-18 | 日本電気株式会社 | フオトインタラプタ |
JP3039651B2 (ja) * | 1988-07-13 | 2000-05-08 | キヤノン株式会社 | 強誘電性カイラルスメクチック液晶組成物及びこれを有する液晶素子 |
JPH0224387A (ja) * | 1988-07-13 | 1990-01-26 | Canon Inc | 液晶組成物およびこれを含む液晶素子 |
US5081520A (en) * | 1989-05-16 | 1992-01-14 | Minolta Camera Kabushiki Kaisha | Chip mounting substrate having an integral molded projection and conductive pattern |
-
1990
- 1990-07-23 JP JP1990078414U patent/JPH0749815Y2/ja not_active Expired - Lifetime
-
1991
- 1991-07-18 US US07/731,780 patent/US5214495A/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6193682A (ja) * | 1984-10-15 | 1986-05-12 | Sharp Corp | ホトインタラプタの製造法 |
JPS6278887A (ja) * | 1985-10-01 | 1987-04-11 | Sharp Corp | ホトインタラプタ |
Also Published As
Publication number | Publication date |
---|---|
JPH0749815Y2 (ja) | 1995-11-13 |
US5214495A (en) | 1993-05-25 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |