JPH0435091A - Manufacture of multilayer curved printed board - Google Patents

Abstract

PURPOSE:To obtain a multilayer curved printed board where delamination, crack and spilling back due to aging are suppressed, by differentiating the expansion coefficient of printer wiring network between the opposite sides of a both side printed board by the use of upper and lower molds having temperature difference thereby contracting toward the printed wiring network side heated through the higher temperature mold and molding the both side board intentionally into a curved state. CONSTITUTION:Both side boards 1, 2 are thermally pressed through upper and lower molds 60A, 60B having different temperature. An upper face side copper coil 4 contacting with a high temperature upper mold 60A contracts continuously irrespective of the resistance of a prepreg 30. Both side boards 11, 12 molded into curved face and inserted with a layer insulation prepreg 5 are then thermally pressed 60 and a four layer printed wiring board 13 is then thermally pressed into a curved face thus obtaining a desired four layer curved printed wiring board.

Description

【発明の詳細な説明】 ［産業上の利用分野］ この発明は、ガラス布等の基材に樹脂組成物を塗布もし
くは含浸しＢステージ化して得たプリプレグを用いて曲
面形多層プリント配線板を製造する方法に関するもので
ある。[Detailed Description of the Invention] [Industrial Application Field] This invention is a method of manufacturing a curved multilayer printed wiring board using a prepreg obtained by coating or impregnating a resin composition on a base material such as glass cloth to form a B stage. It relates to a manufacturing method.

［従来の技術］ 従来、多層プリント配線板は、通常厚さ０．］、ｍｍ〜
１．６ｍｍ程度の両面銅張り積層板に公知の方法で、内
層用プリント配線網をエツチング等により凸部として形
成し、適宜接着用表面処理をして内層用プリント配線板
を形成する。つぎに、上記内層用プリント配線板１枚あ
るいは複数枚と、表面プリント配線板用の銅張り積層板
または銅箔等とを接着絶縁用のプリプレグを介して配置
し、積層成形により一体化した甲面状の多層銅張り積層
板を作製する。そして、このように作製した多層銅張り
積ＪＫ板にスルホールを形成し、このスルホールのめっ
き及びエツチングにより表面プリント配線板の表面にプ
リント配線網を形成して平面状の多層プリント配線板を
製造する方法が＝−船釣であった・った・ この種の技術は特公昭５７−１２９０００号公報等に記
載されている。[Prior Art] Conventionally, multilayer printed wiring boards usually have a thickness of 0. ], mm~
A printed wiring network for the inner layer is formed as a convex portion by etching or the like on a double-sided copper-clad laminate of about 1.6 mm by a known method, and the surface is appropriately treated for adhesion to form a printed wiring board for the inner layer. Next, one or more printed wiring boards for the inner layer and a copper-clad laminate or copper foil, etc. for the front printed wiring board are arranged via adhesive and insulating prepreg, and then integrated by laminated molding. A planar multilayer copper-clad laminate is produced. Then, through holes are formed in the multilayer copper-clad JK board produced in this way, and a printed wiring network is formed on the surface of the surface printed wiring board by plating and etching the through holes, thereby manufacturing a planar multilayer printed wiring board. The method was = - boat fishing. This type of technology is described in Japanese Patent Publication No. 129000/1983.

ところで近年、電子機器の進歩とニーズの拡大により、
多層プリント配線板の使用範囲も拡がりを見せ、１枚基
板としての大型化とともに、ドーム状の筐体内外に沿わ
せた状態で取付は使用する場合等の要求が多くなってき
ている。However, in recent years, due to the advancement of electronic devices and the expansion of needs,
The scope of use of multilayer printed wiring boards is expanding, and with the increase in the size of a single board, there is an increasing demand for mounting them along the inside and outside of a dome-shaped housing.

しかしながら、上記従来の方法では、多層プリント配線
板は平面状に形成されるので、面積の大型化に対しては
対応１＋Ｊ能であるが、１〜−ム状の筐体、すなわち天
井部分の部分球面壁、側面部の球面壁に対しては対応で
きず、筐体内外全体に対して密着数句けすることはその
構造から言って不可能であった。However, in the conventional method described above, since the multilayer printed wiring board is formed in a planar shape, it is possible to cope with an increase in the area of It cannot be applied to spherical walls or spherical walls on the side surfaces, and due to its structure, it is impossible to make close contact with the entire inside and outside of the casing.

そこで本発明者らは、上記問題点を解決するために以ド
に示すような提案をしているので、これを第９図に基づ
き説明する。Therefore, the present inventors have made the following proposal to solve the above problems, and this will be explained based on FIG. 9.

第９図（ａ）、（ｂ）は本提案の工程説明図であり、図
において、１０は平面状に成形された多層プリント配線
板、２０は曲面成形用加熱プレス金型、２０Ａは」―型
、２０Ｂは下型である。まず、平面成形用加熱プレス金
型によりプレス条件を１５０℃、４０　ｋｇ／　ｃｒｌ
で５０分間とし、」二連し一 た従来の方法を用いて平面状の多層プリント配線板１０
を得る。次に、この多層プリント配線板１０を上記曲面
成形用加熱プレス金型２０の上型２０Ａ、下型２０Ｂと
の間に位置させ、プレス条件を１８５℃、　４−　Ｏｋ
ｇ／　Ｃｒ＃で上型２ＯＡを微降下させて多層プリント
配線板１０を変形させて上下型２ＯＡ、２０Ｂで挟み込
み、上型２ＯＡが完全に降下を終えた時点から４０分間
加熱プレス成形を保持することにより、所望の曲面形多
層プリント配線板１０Ａを得る。（第９図（ｂ））。FIGS. 9(a) and 9(b) are explanatory diagrams of the process of this proposal. In the figures, 10 is a multilayer printed wiring board formed into a flat shape, 20 is a hot press mold for curved surface forming, and 20A is "-" The mold, 20B, is the lower mold. First, press conditions were set to 150°C and 40 kg/crl using a hot press mold for flat molding.
for 50 minutes, and the planar multilayer printed wiring board 10 was fabricated using a conventional method.
get. Next, this multilayer printed wiring board 10 was placed between the upper mold 20A and the lower mold 20B of the heat press mold 20 for curved surface molding, and the pressing conditions were set to 185° C., 4-Ok.
g/Cr# to slightly lower the upper mold 2OA to deform the multilayer printed wiring board 10 and sandwich it between the upper and lower molds 2OA and 20B, and hold hot press molding for 40 minutes from the time when the upper mold 2OA has finished lowering completely. In this way, a desired curved multilayer printed wiring board 10A is obtained. (Figure 9(b)).

このように製造される部分的面形多層プリント配線板あ
るいは曲面形多層プリント配線板は、ドーム状の筐体、
即ち天井部分の部分球面壁、側面部の球面壁に対して対
応でき、筐体内外全体に対して密着取付けが可能となる
。The partially surfaced multilayer printed wiring board or curved multilayer printed wiring board manufactured in this way has a dome-shaped casing,
That is, it can be applied to a partially spherical wall in the ceiling part and a spherical wall in the side part, and can be closely attached to the entire inside and outside of the casing.

［発明が解決しようとする課題］ しかしながら上記提案による曲面形多層プリント配線板
の製造方法では、従来の方法により加熱プレス成形され
た平面状の多層プリント配線板１０をそのまま曲面加熱
プレス成形しているので、加熱プレス成形条件を二段階
に設定して成形時の歪みを原因とする問題点に対処して
いるとはいえ、内層回路と層間あるいは他の層内におい
て、デラミネーションやクラックが発生しやすく、また
、経時変化によるスプリングバック現象を起こしやすい
ものとなってしまう等の問題点がある。[Problems to be Solved by the Invention] However, in the method for manufacturing a curved multilayer printed wiring board proposed above, the flat multilayer printed wiring board 10 that has been heat press molded by a conventional method is directly heat press molded into a curved surface. Therefore, although the hot press molding conditions are set in two stages to address the problems caused by distortion during molding, delamination and cracks may occur between the inner layer circuit and the layers or within other layers. Moreover, there are problems in that it tends to easily cause springback phenomenon due to changes over time.

この発明は、上記のような問題点を解消するためになさ
れたもので、ドーム状の筐体、即ち天井部分の部分球面
壁、側面部の球面壁等の筐体内外全体に対して密着取付
けが可能で、しかも内層回路と層間あるいは他の層内に
おいて、デラミネーションやクラックの発生を抑えるこ
とができ、かつ経時変化によるスプリングバック現象も
少ない曲面形多層プリント板を得ることができる曲面形
多層プリント配線板の製造方法を提供することを目的と
する。This invention was made in order to solve the above-mentioned problems, and it is possible to tightly mount the entire inside and outside of the casing, such as a dome-shaped casing, that is, a partially spherical wall on the ceiling, a spherical wall on the side part, etc. A curved multilayer printed board that can suppress the occurrence of delamination and cracks between inner layer circuits and layers or within other layers, and has less springback phenomenon due to changes over time. The purpose of the present invention is to provide a method for manufacturing a printed wiring board.

［課題を解決するための手段］ 本発明の曲面形多層プリン１へ配線板の製造方法による
第１の発明は、絶縁基板の両面に銅箔等の一 プリント配線網を設けて成る両面板を、温度差を与えた
一］二、下の型で加熱プレス成形した後、冷却して、上
記］二、下型の加熱温度の違いにもとづく各面側のプリ
ント配線網の膨張率の違いによって温度の高い方の型で
加熱された面側のプリント配線網を収縮させて上記両面
板を曲面状態に成形し、複数枚の当該各両面板の間にプ
リプレグを介在させて加熱プレス成形して積層した後、
この積層体を曲面加熱プレス成形するものである。[Means for Solving the Problems] The first invention according to the method of manufacturing a wiring board for a curved multilayer printed circuit board 1 of the present invention uses a double-sided board comprising a printed wiring network such as copper foil on both sides of an insulating board. , temperature difference was given 1] 2. After hot press molding with the lower mold, it was cooled. The double-sided board was formed into a curved state by shrinking the printed wiring network on the side heated in the higher-temperature mold, and the prepreg was interposed between the plurality of double-sided boards and laminated by hot press molding. rear,
This laminate is subjected to curved heat press molding.

また、本発明の第２の発明は、絶縁基板の一方の面に銅
箔等の）ｊＸ膜のプリントｌ１５１１！線網を設け、他
方の而に銅箔等の薄膜のプリント配線網を設けて成る両
面板を、加熱プレス成形した後、冷却して、各面側のプ
リント配線網の内部抗力の違いによって厚膜のプリント
配線網を収縮させて−に配置面板を曲面状態に成形する
ようにした。Further, the second aspect of the present invention is to print a jX film (such as copper foil) on one side of the insulating substrate. A double-sided board with a wiring network on one side and a printed wiring network of a thin film such as copper foil on the other side is heated and press-formed, then cooled and the thickness is changed depending on the internal resistance of the printed wiring network on each side. The printed wiring network of the membrane was shrunk to form a curved face plate.

さらに、本発明の第３の発明は、絶縁基板の一方の面に
伸び率の小さい銅箔等のプリント配線網を設け、他方の
面に伸び率の大きい銅箔等のプリント配線網を設けて成
る両面板を、加熱プレス成形した後、冷却して、各面側
のプリント配線網の伸び率の違いによって伸び率の小さ
い配線網を収縮させて上記両面板を曲面状態に成形する
ようにしたものである。Furthermore, the third aspect of the present invention is to provide a printed wiring network made of copper foil or the like with a low elongation rate on one side of the insulating substrate, and a printed wiring network made of copper foil or the like with a high elongation rate on the other side. After hot press forming the double-sided board, the double-sided board is cooled and the printed wiring network on each side has a different elongation rate, so that the wiring network with a smaller elongation rate is contracted to form the double-sided board into a curved state. It is something.

［作用］ 第１−の発明は、加熱成形プレス工程において、温度差
を与えた上、下の成形型を用いて両面板の各面側のプリ
ント配線網の膨張率を違わせ、温度の高い方の型で加熱
されたプリント配線網側に収縮させて両面板を意図的に
曲面状態に成形する。[Function] In the first invention, the expansion coefficient of the printed wiring network on each side of the double-sided board is made different by using upper and lower molds with a temperature difference in the hot molding press process. The double-sided board is intentionally formed into a curved surface by shrinking it toward the heated printed wiring network using one of the molds.

また、第２の発明においては、絶縁基板の一方の面に銅
箔等の厚膜のプリン１へ配線網を設け、他方の面に銅箔
等の薄膜のプリント配線網を設けて成る両面板を用いて
曲面状態に成形された両面板を得る。Further, in the second invention, a double-sided board is provided in which a printed wiring network made of a thick film such as copper foil is provided on one side of an insulating substrate, and a printed wiring network made of a thin film such as copper foil is provided on the other side of the insulating substrate. A double-sided board formed into a curved surface is obtained using the following method.

さらに、第３の発明においては、絶縁基板の一方の面に
伸び率の小さい銅箔等のプリン１へ配線網を設け、他方
の面に伸び率の大きい銅箔等のプリント配線網を設けて
成る両面板を用いて曲面状態に成形された両面板を得る
。Furthermore, in the third invention, a printed wiring network made of copper foil or the like having a low elongation rate is provided on one side of the insulating substrate, and a printed wiring network made of copper foil or the like having a high elongation rate is provided on the other side. A double-sided plate formed into a curved surface is obtained using the double-sided plate consisting of the following.

［発明の実施例］ 以下、この発明の第１の発明について例えば４／Ｗの曲
面形多層プリント配線板の製造方法を第１図ないし第６
図に基づいて説明する。[Embodiments of the Invention] Hereinafter, a method for manufacturing a 4/W curved multilayer printed wiring board according to the first invention of the present invention will be described with reference to FIGS. 1 to 6.
This will be explained based on the diagram.

各回において、１，２は両面板で、これはガラス布等の
基材に例えばエポキシ樹脂等の樹脂を含浸させＢステー
ジまで硬化させた絶縁基板としての絶縁接着用プリプレ
グ３の両面に銅箔４，４を接着して成るものである。５
は両面板１と両面板２との間に介在される層間絶縁接着
用プリプレグである。６０は平面成形用加熱プレス金型
で，上。In each round, 1 and 2 are double-sided boards, which are made by impregnating a base material such as glass cloth with resin such as epoxy resin and curing it to the B stage. , 4 are glued together. 5
is a prepreg for interlayer insulation adhesion interposed between the double-sided plate 1 and the double-sided plate 2. 60 is a hot press mold for flat molding, above.

１；の型６０Ａ，６０Ｂに温度差が与えられているもの
である。1; a temperature difference is given to molds 60A and 60B.

次に作用を説明する。Next, the effect will be explained.

まず、両面板１，２をそれぞれ第２図に示すように温度
の違う上，下型６０Δ，６０Ｂで加熱プレス成形する。First, the double-sided plates 1 and 2 are heated and press-molded using upper and lower molds 60Δ and 60B at different temperatures, respectively, as shown in FIG.

このとき、両面板１，２のプレス過程における内部状態
を見ると、温度が上がるにつれて銅箔４，４およびその
間に位置するプリプレグ３は膨張をはじめ長手方向に延
びを開始する。やがて、プリプレグ３のＢステージ状の
エポキシ樹脂が溶けだし、エポキシ樹脂が完全に溶融し
た段階でそれぞれの膨張は最大となるが、膨張が熱に依
存することから、加熱プレス金型６０の上型６０Ａ面に
接する銅箔４と下型６ｏＢ面に接する銅箔４との間に膨
張差が生ずる。次に、樹脂の硬化が始まり、硬化が完了
したら加熱プレスを終了して冷却に入る。冷却時の現象
として、より大きく膨張した＠ｆｉ′Ｊ４．４はより大
きく収縮する。At this time, looking at the internal state of the double-sided plates 1 and 2 during the pressing process, as the temperature rises, the copper foils 4 and 4 and the prepreg 3 located therebetween begin to expand and extend in the longitudinal direction. Eventually, the B-stage epoxy resin of the prepreg 3 begins to melt, and each expansion reaches its maximum when the epoxy resin is completely melted, but since the expansion depends on heat, the upper mold 60A of the hot press mold 60 An expansion difference occurs between the copper foil 4 in contact with the surface of the lower mold 6oB and the copper foil 4 in contact with the surface of the lower mold 6oB. Next, the resin begins to harden, and once the hardening is completed, heating press is terminated and cooling begins. As a phenomenon during cooling, @fi'J4.4, which expanded more, contracts more.

これに対してプリプレグ３は基材がガラスあるいはそれ
に近い無機物が中心であるため収縮は非常に小さい。ま
た、樹脂は高温域で硬化したため両面板１，２の銅箔４
，４に対して収縮は非常に小さい。ここで、銅箔４，４
は本来膨張率が同じであるため同じように収縮しようと
するが、プリプレグ３に阻まれる。しかし」−述したよ
うに、上型６０Ａ面に接する銅箔４と下型６　０　Ｉ３
而に接する銅箔４との間に型の温度差による膨張差が生
じているため、加熱温度の高い上型６０Ａに接していた
に面側の銅箔４はプリプレグ３の抵抗にも係ゎらず収縮
しつづける。この結果、加熱温度の高い」二型に接して
いた」二面側の銅箔４か縮んだ曲面状態もしくはそれに
近い内部応力を持つ両面板が得られる。（実際にはこの
段階では両面板１，２が薄いため意識できない程度のも
のではある。）次にこのように曲面状態に成形された各
両面板１１．１２の間に層間絶縁用プリプレグ５を介在
させて第３図のように加熱プレス金型６０で加熱プレス
成形を行ない、第４図に示すような曲面状態に成形され
た４層プリント配線板１３を得る。On the other hand, since the base material of the prepreg 3 is mainly glass or an inorganic material similar to glass, the shrinkage is very small. In addition, since the resin hardened in a high temperature range, the copper foil 4 of the double-sided boards 1 and 2
, 4, the shrinkage is very small. Here, copper foil 4, 4
Since they originally have the same expansion rate, they try to contract in the same way, but the prepreg 3 prevents this. However, as mentioned above, the copper foil 4 in contact with the upper mold 60A surface and the lower mold 60I3
However, since there is an expansion difference due to the temperature difference between the molds and the copper foil 4 that is in contact with it, the copper foil 4 on the side that is in contact with the upper mold 60A, which has a high heating temperature, is also affected by the resistance of the prepreg 3. It continues to shrink. As a result, a double-sided board is obtained in which the copper foil 4 on the second side, which is in contact with the second mold having a high heating temperature, has a shrunken curved state or an internal stress close to that state. (Actually, at this stage, the double-sided plates 1 and 2 are so thin that you cannot notice it.) Next, interlayer insulation prepreg 5 is placed between each double-sided plate 11 and 12 formed into a curved surface in this way. As shown in FIG. 3, hot press molding is performed using a hot press mold 60 to obtain a four-layer printed wiring board 13 having a curved surface as shown in FIG.

そして、この４Ｎプリント配線板］３を第５図に示すよ
うに曲面成形用加熱プレス金型２０で曲面加熱プレス成
形して所望の曲面形４層プリント配線板１４を得る。Then, as shown in FIG. 5, this 4N printed wiring board] 3 is heated and press-molded into a curved surface using a heated press mold 20 for forming a curved surface to obtain a desired curved four-layer printed wiring board 14.

；実施例」 エポキシ樹脂（エピコート１００］、シェル化学社製）
１０００ｇ、ジシアンジシアミド　３５ｇ、２−エチル
イミダゾール　３ｇ、ビス（・１−マレイミドフェニル
）メタン　２００ｇ、をメチルエチルケトンとＮ、Ｎ−
ジメチルホルムアミド混合溶剤に溶解させ、これをガラ
ス布　基材Ｉブさ０１ｍ（品番：　１−１．６　　旭シ
ェーベル）に含浸、乾燥させてＢステージのプリプレグ
を作製した。;Example'' Epoxy resin (Epicoat 100), manufactured by Shell Chemical Co., Ltd.
1000 g, dicyandicyamide 35 g, 2-ethylimidazole 3 g, bis(・1-maleimidophenyl)methane 200 g, and methyl ethyl ketone and N,N-
A B-stage prepreg was prepared by dissolving the mixture in a dimethylformamide mixed solvent, impregnating a glass cloth substrate I size 01 m (product number: 1-1.6, Asahi Schovel), and drying it.

次にガラス基材用表面処理銅箔、箔厚３５μｍＸ５００
ｍ＋ｎＸ５００ｍｍ　（ＣＦ−Ｔ８　　ＦＵＫＵＤＡ金
属社製）をプリプレグの両面に仕込んで両面板を作製し
た。そして加熱プレス成形用金型の上型の温度を１８０
℃、ｆ型の温度を１５０℃に設定し、４０ｋｇ／ｃｍ２
で５０分間プレス成形した両面板を２枚作製し、さらに
、試験用材料として、」：記加熱プレス成形用金型の上
、ドの型の温度を１８０℃にそろえて両面板を２枚作製
して、それぞれの銅箔部に公知の方法でテスト川回路（
プリント配線網）を作製し、それぞれプリプレグを介在
させて再び加熱プレス成形して積層し、−１〕下の加熱
温度の違う金型で得た両面板を用いた４層プリント配線
板と、Ｌ下の加熱温度が同じ金型で得た両面板を用いた
４層プリント配線板を作製した。Next, surface treated copper foil for glass substrate, foil thickness 35 μm x 500
m+nX500mm (CF-T8 manufactured by FUKUDA Metals Co., Ltd.) was placed on both sides of the prepreg to prepare a double-sided board. Then, the temperature of the upper die of the hot press molding mold was set to 180℃.
℃, the temperature of the f type is set to 150℃, 40kg/cm2
Two double-sided plates were prepared by press-molding for 50 minutes at Then, test the circuit (
-1] A four-layer printed wiring board using double-sided boards obtained using molds with different heating temperatures, and L A four-layer printed wiring board was produced using a double-sided board obtained using a mold with the same lower heating temperature.

作製後、−１−７下型の加熱温度が同じ両面板を用いた
４層プリント配線板の反り量は０ｎＩ１１、」−９丁型
＝１２− の加熱温度の違う両面板を用いた４層プリンＩ・配線板
の反り量は１２ｍｎであった。After fabrication, the amount of warpage of a 4-layer printed wiring board using double-sided boards heated at the same heating temperature for the lower mold is 0nI11, and 4 layers using double-sided boards heated at different heating temperatures for the lower mold 9 = 12- The amount of warpage of the Print I wiring board was 12 mm.

次いで製作した２種類の４層プリン１へ配線板をそれぞ
れ曲面成形用加熱プレス金型２０の上型２０Ａ、下型２
０Ｂとの間に位置させ、プレス条件を」８５℃、　４０
　ｋｇ／　ｒａで」二型２０Ａを微降下させて、４層プ
リント配線板を変形させて−に下型２０Ａ、２０Ｂで挟
み込み、」二型２ＯＡが完全に降下を終えた時点から４
０分間加熱プレス成形を保持して積層し、２種類の曲面
形４層プリント配線板を得た。曲面成形用金型２０は一
辺が／１−００ｍ、深さが３０＋ｎｍ曲面を有する金型
を使用した。Next, the wiring boards are placed in the two types of four-layer puddings 1 produced, respectively, using an upper mold 20A and a lower mold 2 of a hot press mold 20 for forming curved surfaces.
0B, press conditions were set to 85℃, 40℃.
kg/ra, slightly lower the second mold 20A, deform the four-layer printed wiring board, and sandwich it between the lower molds 20A and 20B.
The hot press molding was held for 0 minutes and laminated to obtain two types of curved four-layer printed wiring boards. The mold 20 for molding a curved surface had a curved surface with a side of /1-00 m and a depth of 30+ nm.

尚、曲面成形用加熱プレス金型２０を用いて行なう曲面
加熱プレス成形時においても上、下の型の加熱温度を変
えることによって著しい効果が得られることは自明であ
る。It is obvious that a remarkable effect can be obtained by changing the heating temperature of the upper and lower molds even during curved surface hot press molding using the curved surface molding hot press mold 20.

成形終了後、それぞれの耳の部分Ｓを除去し、オーブン
中に入れて６０℃で加速劣化させて恒温時の曲面形状の
経時変化を見た。測定はオーブンから出した後、自然冷
却させ２５℃時点で行なった。計測部位は凸部（プリン
ト配線網）の高さで表した。すなわち、曲面成形用加熱
プレス金型２０でいえば深さにあたり、初期値は３０１
Ｉｗ１１となる。After the molding was completed, each ear portion S was removed and placed in an oven for accelerated deterioration at 60° C., and changes in the curved surface shape over time at constant temperature were observed. The measurements were taken at 25°C after being taken out of the oven and allowed to cool naturally. The measurement location was expressed by the height of the protrusion (printed wiring network). In other words, in terms of the heated press mold 20 for curved surface forming, this corresponds to the depth, and the initial value is 301.
It becomes Iw11.

結果を第６図の表に示した。表からこの第１の発明によ
る製造方法で曲面成形したものは残留歪みの少ないこと
が判る。The results are shown in the table in FIG. It can be seen from the table that the curved surface molded by the manufacturing method according to the first invention has less residual distortion.

上述した第１の発明によれは、加熱プレス成形において
」；、下の型に温度差を与えた金型を使用し、２枚の両
面板を曲面状態に成形した後、この各両面板の間にプリ
プレグを介在させて加熱プレス成形して積層し、この積
層体を曲面加熱プレス成形するので、得られる曲面形４
Ｊ＠配線板は残留歪みの少ないものとなり、内層回路と
眉間あるいは他の層内において、デラミネーションやク
ラックの発生を抑えることができ、かつ経時変化による
スプリングバック現象も起きない曲面形４層プリント配
線板を製造することができる。According to the above-mentioned first invention, in hot press molding, after forming two double-sided plates into a curved state using a mold in which a temperature difference is given to the lower mold, a mold is formed between each double-sided plate. The prepreg is interposed and heat press molded and laminated, and this laminate is heat press molded into a curved surface, so the curved surface shape 4 obtained is
J@ wiring board has low residual distortion, suppresses the occurrence of delamination and cracks in the inner layer circuit and between the eyebrows or other layers, and is a curved 4-layer print that does not cause springback phenomenon due to aging. Wiring boards can be manufactured.

次に第７図に基づいて本発明の第２の発明を説明する。Next, the second invention of the present invention will be explained based on FIG.

この第２の発明は、プリプレグ３の一方の面に箔厚の厚
い銅箔４ａを接着し、他方の而に箔厚の薄い銅箔４ｂを
接着した両面板ＩＡ、２Ａをそれぞれ加熱プレス成形す
る。その後冷却を行なうことにより、箔厚の）７１い銅
箔４ａはプリプレグ３の抵抗にも係オ〕らず収縮しつづ
け、箔厚の薄い銅箔４　ｂはプリプレグ３の抵抗に耐え
きれず、自身が延びることによって応力を緩和しようと
する。この結果、箔厚の厚い銅箔４ａ側に縮んだ曲面状
態もしくはそれに近い内部応力を持つ両面板が得られる
。こうして得られた各両面板の間にプリプレグ５を介在
させて加熱プレス成形して積層し、この積層体を曲面加
熱プレス成形型２０により成形して所望の曲面形４層プ
リント配線板を得るものである。In this second invention, a thick copper foil 4a is adhered to one side of a prepreg 3, and a thin copper foil 4b is adhered to the other side, and double-sided plates IA and 2A are hot press-molded, respectively. . After that, by cooling, the copper foil 4a with a thickness of 71 mm continues to shrink regardless of the resistance of the prepreg 3, and the thinner copper foil 4b cannot withstand the resistance of the prepreg 3. It tries to relieve stress by stretching itself. As a result, a double-sided board having an internal stress in a contracted curved state or close to the curved state on the thicker copper foil 4a side is obtained. The prepreg 5 thus obtained is interposed between the double-sided boards and the boards are laminated by hot press molding, and this laminate is molded using a curved hot press mold 20 to obtain a desired curved four-layer printed wiring board. .

この第２の発明の場合、加熱プレス成形型は同じ温度に
揃えた上下の金型を使用し、厚い方の銅箔４ａの箔厚が
７０μｍ、薄い方の銅箔４ｂの箔厚が１８μｍのものを
使用した。In the case of this second invention, the upper and lower hot press molds are adjusted to the same temperature, and the thicker copper foil 4a has a thickness of 70 μm, and the thinner copper foil 4b has a foil thickness of 18 μm. I used something.

この第２の発明における成形後の曲面形４ｒＰＪプリン
Ｉ・配線板の経時変化は上記第１の発明の第６図に示し
た結果と同じになった。よって、この第２の発明による
製造方法で曲面成形したものも残留歪みの少ないことが
判り、上記第１の発明と同様な効果を有する曲面形４層
プリント配線板が得られる。The change over time of the curved 4rPJ pudding I/wiring board after molding in the second invention was the same as the result shown in FIG. 6 of the first invention. Therefore, it has been found that the curved surface molded by the manufacturing method according to the second invention also has less residual strain, and a curved four-layer printed wiring board having the same effects as the first invention can be obtained.

次に、本発明の第３の発明を第８図の基づいて説明する
。Next, the third aspect of the present invention will be explained based on FIG. 8.

この第３の発明は、プリプレグ３の一方の面に伸び率の
小さい銅箔４Ｇを接着し、他方の面に伸び率の大きい銅
箔４ｄを接着した両面板１１３゜２Ｂをそれぞれ加熱プ
レス成形する。その後冷却を行なうことにより、伸び率
の小さい銅箔４ｃはプリプレグ３の抵抗にも係わらず収
縮しつづけ、伸び率の大きい銅箔４ｄはプリプレグ３の
抵抗に負けて、自身が延びることによって応力を緩和し
ようとする。この結果、伸び率の小さい銅箔４ｃ側に縮
んだ曲面状態もしくはそれに近い内部応力を持つ両面板
が得られる。こうして得られた各両面板の間にプリプレ
グ５を介在させて加熱プレス＝１５ 成形して積層し、この積層体を曲面加熱プレス成形型２
０により成形して所望の曲面形４層プリント配線板を得
るものである。In this third invention, a double-sided board 113° 2B is formed by hot press forming a prepreg 3 with a copper foil 4G having a low elongation on one side and a copper foil 4d having a high elongation on the other side. . After that, by cooling, the copper foil 4c with a small elongation rate continues to contract despite the resistance of the prepreg 3, and the copper foil 4d with a high elongation rate overcomes the resistance of the prepreg 3 and expands to release stress. try to relax. As a result, a double-sided board having an internal stress that is in a curved state or close to a curved state on the side of the copper foil 4c having a small elongation rate is obtained. A prepreg 5 is interposed between each of the double-sided plates obtained in this way, heated press = 15 molded and laminated, and this laminate is placed in a curved hot press mold 2.
0 to obtain a desired curved four-layer printed wiring board.

この第３の発明の場合も、加熱プレス成形型は同じ温度
に揃えた上下の金型を使用し、伸び率の小さい銅箔４ｃ
は伸び率１．６％（熱間）、伸び率の大きい銅箔４ｄは
伸び率３８．５％（熱間）のものを使用した。In the case of this third invention as well, the upper and lower hot press molds are adjusted to the same temperature, and the copper foil 4c with a small elongation rate is used.
Copper foil 4d with a high elongation rate of 38.5% (hot) was used.

この第３の発明における成形後の曲面形４層プリント配
線板の経時変化も上記第１の発明の第６図に示した結果
と同じになった。よって、この第３の発明による製造方
法で曲面成形したものも残留歪みの少ないことが判り、
上記第１の発明と同様な効果を有する曲面形４層プリン
ト配線板が得られる。The change over time of the curved four-layer printed wiring board after molding in the third invention was also the same as the result shown in FIG. 6 of the first invention. Therefore, it was found that the curved surface molded by the manufacturing method according to the third invention also had less residual distortion,
A curved four-layer printed wiring board having the same effects as the first invention can be obtained.

尚、第２の発明における箔厚の厚い銅箔４ａあるいは第
３の発明における伸び率の小さい銅箔４ｃに接する型を
、箔厚の薄い銅箔４ｂあるいは伸び率の大きい銅箔４ｄ
に接する型に接する型の温度より高い温度に設定して加
熱プレス成形あるいは曲面加熱プレス成形を行なえはよ
り顕著な曲面が１！）られる。Note that the mold that contacts the thick copper foil 4a in the second invention or the copper foil 4c with a small elongation rate in the third invention is replaced by the thin copper foil 4b or the copper foil 4d with a large elongation rate.
If you perform hot press molding or curved surface hot press molding at a temperature higher than the temperature of the mold that is in contact with the mold, the curved surface will be more pronounced! ) can be done.

尚、第２の発明及び第３の発明において、とくに触れて
いない製造二Ｕ程については第１の発明と同様の］−程
を行なうものである。Incidentally, in the second invention and the third invention, the same steps as in the first invention are carried out regarding the manufacturing steps not particularly mentioned.

また、第１〜第３の発明において、プリント配線網を銅
箔で形成したものを示したが、金属めっきでプリント配
線網を形成したものであってもよく、特に第２．第３の
発明においては諸条件にあった金属めっきを施せはよい
。Further, in the first to third inventions, the printed wiring network is formed of copper foil, but the printed wiring network may be formed of metal plating, and especially in the second invention. In the third aspect of the invention, metal plating that meets various conditions may be applied.

［発明の効果］ 以−■−説明したように、本発明の曲面形４層プリント
配線板の製造方法における第１の発明は、絶縁基板の両
面に銅箔等のプリント配線網を設けて成る両面板を、温
度差を与えた−に、’ｌ：の型で加熱プレス成形した後
、冷却して、上記」二、下型の加熱温度の違いにもとづ
く各面側のプリント配線網の膨張率の違いによって温度
の高い方の型で加熱された面側のプリント配線網を収縮
させて」１記両面板を曲面状態に成形し、複数枚の当該
各両面板の間にプリプレグを介在させて加熱プレス成形
して積層した後、この積Ｊ１体を曲面加熱プレス成形し
、し、 本発明の第２の発明は、絶縁基板の一方の面に銅箔等の
厚膜のプリント配線網を設け、他方の面に銅箔等の薄膜
のプリント配線網を設けて成る両面板を、加熱プレス成
形した後、冷却して、各面側のプリント配線網の内部抗
力の違いによって厚膜のプリント配線網を収縮させて−
１ユ記両而板を曲面状態に成形するようにし、 さらに、本発明の第３の発明は、絶縁基板の一方の而に
伸び率の小さい銅箔等のプリント配線網を設け、他方の
面に伸び率の大きい銅箔等のプリント配線網を設けて成
る両面板を、加熱プレス成形した後、冷却して、各面側
のプリント配線網の伸び率の違いによって伸び率の小さ
い配線網を収縮させて−１−２両面板を曲面状態に成形
するようにしているので、ドーム状の筐体、即ち天井部
分の部分球面壁、側面部の球面壁等の筐体内外全体に対
して密着取付けが可能で、しかも内層回路と層間あるい
は他の層内において、デラミネーションやクラックの発
生を抑えることができ、かつ経時変化によるスプリング
バック現象も少ない曲面形多層プリント配線板を得るこ
とができる。[Effects of the Invention] As explained below, the first invention in the method for manufacturing a curved four-layer printed wiring board of the present invention is that a printed wiring network of copper foil or the like is provided on both sides of an insulating substrate. The double-sided board is heated and press-molded in a mold with a temperature difference of - and 'l:, then cooled and the printed wiring network on each side is expanded based on the difference in the heating temperature of the lower mold. Due to the difference in rate, the printed wiring network on the side heated by the mold with higher temperature is contracted, and the double-sided board described in 1. is formed into a curved state, and a prepreg is interposed between each of the plurality of double-sided boards and heated. After press molding and laminating, this product J1 body is heated and press molded into a curved surface, and the second invention of the present invention provides a thick film printed wiring network such as copper foil on one side of the insulating substrate, A double-sided board with a thin film printed wiring network such as copper foil on the other side is heated and press-molded, and then cooled to form a thick film printed wiring network due to the difference in internal resistance between the printed wiring networks on each side. Contract -
Further, in the third aspect of the present invention, a printed wiring network made of copper foil or the like having a small elongation rate is provided on one side of the insulating substrate, and a printed wiring network is provided on one side of the insulating substrate, and the other side is After hot press forming a double-sided board with a printed wiring network made of copper foil or other material that has a high elongation rate, it is cooled to create a wiring network that has a low elongation rate due to the difference in the elongation rate of the printed wiring network on each side. Since the -1-2 double-sided plate is shrunk and formed into a curved state, it adheres tightly to the entire interior and exterior of the housing, such as the dome-shaped housing, i.e., the partially spherical wall on the ceiling, the spherical wall on the side part, etc. It is possible to obtain a curved multilayer printed wiring board that can be mounted, can suppress the occurrence of delamination and cracks between inner layer circuits and layers or in other layers, and has little springback phenomenon due to aging.

【図面の簡単な説明】[Brief explanation of drawings]

第１図乃至第６図は本発明の曲面形多層プリント配線板
の製造方法の第１の発明を示し、第１図は４層プリン１
へ配線板の層構成を示す断面図、第２図及び第３図は加
熱プレス成形を示す説明図、第４図は加熱プレス成形後
の４層プリンｌ〜配線板を示す図、第５図は曲面加熱プ
レス成形の工程図、第６図は本発明で得た曲面形４層プ
リント配線板の経時変化の結果データを示す図、第７図
は本発明の第２の発明を示す４層プリント配線板の層構
成を示す断面図、第８図は本発明の第３の発明を示す４
層プリント配線板の層構成を示す断面図、第９図は本発
明者らの提案による曲面形多層プリント配線板の製造方
法における曲面加熱プレス成形の工程図である。 １．２．ｉ、１，１２．ＬＡ、２Ａ、ＩＢ、２Ｂ・・両
面板、３３・・絶縁接着用プリプレグ（絶縁基板）、４
・・・銅箔ｒ　４　ａ・・・箔厚の厚い銅箔、／Ｉｂ・
・・箔厚の薄い銅箔、４ｃ・・・伸び率の小さい銅箔。 ４ｄ・・・伸び率の大きい銅箔（プリント配線網）、５
・・・層間絶縁接着用プリプレグ、１３・・加熱プレス
成形後の４ｆｆ４プリント配線板、１４・・・曲面加熱
プレス成形後の曲面形４層プリント配線板、２０・・・
曲面成形用加熱プレス金型、６０・・・平面成形用加熱
ブ１ノス金型、６０Ａ・ｌ−型、６０　Ｂ・・・下型。1 to 6 show the first invention of the method for manufacturing a curved multilayer printed wiring board of the present invention, and FIG. 1 shows a four-layer printed wiring board 1.
2 and 3 are explanatory diagrams showing hot press molding, FIG. 4 is a diagram showing the 4-layer printed wiring board after hot press molding, and FIG. 5 is a cross-sectional view showing the layer structure of the wiring board. 6 is a diagram showing the process of curved surface hot press molding, FIG. 6 is a diagram showing data on the change over time of the curved 4-layer printed wiring board obtained by the present invention, and FIG. 7 is a 4-layer diagram showing the second invention of the present invention. FIG. 8 is a sectional view showing the layer structure of the printed wiring board, and FIG. 8 shows the third aspect of the present invention.
FIG. 9 is a cross-sectional view showing the layer structure of a layered printed wiring board, and is a process diagram of curved hot press molding in a method for manufacturing a curved multilayer printed wiring board proposed by the present inventors. 1.2. i, 1, 12. LA, 2A, IB, 2B... Double-sided board, 33... Insulating adhesive prepreg (insulating substrate), 4
...Copper foil r 4 a...Thick copper foil, /Ib・
... Copper foil with thin foil thickness, 4c... Copper foil with small elongation rate. 4d... Copper foil with high elongation rate (printed wiring network), 5
... Prepreg for interlayer insulation adhesion, 13... 4FF4 printed wiring board after hot press molding, 14... Curved 4-layer printed wiring board after curved surface hot press molding, 20...
Hot press mold for curved surface molding, 60...Heating press mold for flat surface molding, 60A/l-type, 60B...lower mold.

Claims (3)

【特許請求の範囲】[Claims] （１）絶縁基板の両面に銅箔等のプリント配線網を設け
て成る両面板を、温度差を与えた上，下の型で加熱プレ
ス成形した後、冷却して、上記上，下型の加熱温度の違
いにもとづく各面側のプリント配線網の膨張率の違いに
よって温度の高い方の型で加熱された面側のプリント配
線網を収縮させて上記両面板を曲面状態に成形し、複数
枚の当該各両面板の間にプリプレグを介在させて加熱プ
レス成形して積層した後、この積層体を曲面加熱プレス
成形したことを特徴とする曲面形多層プリント配線板の
製造方法。(1) A double-sided board consisting of a printed wiring network such as copper foil on both sides of an insulating substrate is heat press-molded using upper and lower molds that provide a temperature difference, and then cooled and molded into the upper and lower molds. Due to the difference in the expansion coefficient of the printed wiring network on each side based on the difference in heating temperature, the printed wiring network on the side heated by the mold with higher temperature is contracted, and the above-mentioned double-sided board is molded into a curved state. A method for manufacturing a curved multilayer printed wiring board, characterized in that the laminate is laminated by hot press molding with a prepreg interposed between each of the double-sided boards, and then the laminate is heat press molded into a curved surface. （２）絶縁基板の一方の面に銅箔等の厚膜のプリント配
線網を設け、他方の面に銅箔等の薄膜のプリント配線網
を設けて成る両面板を、加熱プレス成形した後、冷却し
て、各面側のプリント配線網の内部抗力の違いによって
厚膜のプリント配線網を収縮させて上記両面板を曲面状
態に成形し、複数枚の当該各両面板の間にプリプレグを
介在させて加熱プレス成形して積層し、この積層体を曲
面加熱プレス成形したことを特徴とする曲面形多層プリ
ント配線板の製造方法。(2) After hot press forming a double-sided board consisting of an insulating substrate with a printed wiring network made of a thick film such as copper foil on one side and a printed wiring network made of a thin film such as copper foil on the other side, After cooling, the thick film printed wiring network is contracted due to the difference in the internal resistance of the printed wiring networks on each side to form the double-sided board into a curved state, and a prepreg is interposed between the plurality of double-sided boards. 1. A method for producing a curved multilayer printed wiring board, characterized in that the laminates are laminated by hot press molding, and the laminate is heat press molded into a curved surface. （３）絶縁基板の一方の面に伸び率の小さい銅箔等のプ
リント配線網を設け、他方の面に伸び率の大きい銅箔等
のプリント配線網を設けて成る両面板を、加熱プレス成
形した後、冷却して、各面側のプリント配線網の伸び率
の違いによって伸び率の小さい配線網を収縮させて上記
両面板を曲面状態に成形し、複数枚の当該各両面板の間
にプリプレグを介在させて加熱プレス成形して積層し、
この積層体を曲面加熱プレス成形したことを特徴とする
曲面形多層プリント配線板の製造方法。(3) A double-sided board consisting of an insulating board with a printed wiring network made of copper foil, etc. with a low elongation rate on one side, and a printed wiring network made of copper foil, etc. with a high elongation rate on the other side, is heated and press formed. Then, the double-sided board is formed into a curved state by cooling and contracting the wiring network with a small elongation rate due to the difference in the elongation rate of the printed wiring network on each side, and prepreg is placed between the plurality of double-sided boards. Laminated by intervening hot press molding,
A method for manufacturing a curved multilayer printed wiring board, characterized in that this laminate is heated and press-molded into a curved surface.