JPH043503Y2 - - Google Patents
Info
- Publication number
- JPH043503Y2 JPH043503Y2 JP1985144495U JP14449585U JPH043503Y2 JP H043503 Y2 JPH043503 Y2 JP H043503Y2 JP 1985144495 U JP1985144495 U JP 1985144495U JP 14449585 U JP14449585 U JP 14449585U JP H043503 Y2 JPH043503 Y2 JP H043503Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- printed circuit
- circuit board
- mounting base
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
【考案の詳細な説明】
〔産業上の利用分野〕
この考案は、半導体集積回路（IC）チツプを
プリント基板に直接搭載するのに用いられるダイ
パツド兼ヒートシンクに関するものである。[Detailed Description of the Invention] [Industrial Field of Application] This invention relates to a die pad/heat sink used to directly mount a semiconductor integrated circuit (IC) chip onto a printed circuit board.
従来、ICチツプをプリント基板に直接搭載す
るには、プリント基板に貫通孔を設け、その片側
にICチツプを支持するための当て板（ダイパツ
ド）をはんだ付け等により固定するようになつて
おり、ダイパツドはICチツプが発する熱を逃が
すためのヒートシンクとしての役割をも有し、金
メツキ銅板等で形成されている。そして、ダイパ
ツド兼ヒートシンク（以下、単にヒートシンクと
する）を単にプリント基板の片側に当てるだけで
は、はんだ付けのためにリフロー炉へ移動させる
際の振動や、はんだの溶融によつてヒートシンク
が位置ずれを起こすことがあるため、第３図に示
すように、プリント基板１の穴２に座ぐり部３を
形成し、これにヒートシンク４をその外面がプリ
ント基板１の回路パターン５と反対側の面にほぼ
同一面となるよう嵌合し、座ぐり部３に対応する
ヒートシンク４の内面および外周面をはんだ付け
するというやり方も行なわれている。
Conventionally, in order to directly mount an IC chip on a printed circuit board, a through hole was created in the printed circuit board, and a backing plate (die pad) to support the IC chip was fixed to one side of the hole by soldering. The die pad also serves as a heat sink to dissipate the heat generated by the IC chip, and is made of a gold-plated copper plate or the like. If the die pad and heat sink (hereinafter referred to simply as the heat sink) is simply placed on one side of the printed circuit board, the heat sink may become misaligned due to vibrations when moving the board to the reflow oven for soldering or melting of the solder. To prevent this, as shown in FIG. 3, a counterbore 3 is formed in the hole 2 of the printed circuit board 1, and a heat sink 4 is placed in this with the outer surface of the heat sink 4 on the side opposite to the circuit pattern 5 of the printed circuit board 1. Another method is to fit the heat sinks so that they are flush with each other, and to solder the inner and outer circumferential surfaces of the heat sink 4 corresponding to the counterbore portions 3.
しかしながら、第３図のようなヒートシンクの
取付け方では、位置決めが簡単化され、防湿性も
向上するものの、ヒートシンク４の外周面がプリ
ント基板１中に完全に埋まるため、ヒートシンク
４の露出表面積が小さくなり、熱放散性が減殺さ
れるという欠点がある。
However, although the mounting method of the heat sink as shown in Fig. 3 simplifies positioning and improves moisture resistance, the outer peripheral surface of the heat sink 4 is completely buried in the printed circuit board 1, so the exposed surface area of the heat sink 4 is small. This has the disadvantage that heat dissipation performance is reduced.
この考案は上記の事情に鑑みなされたもので、
その目的は、位置決めが簡単で、熱放散性および
防湿性にすぐれたICチツプ用ヒートシンクを提
供することにある。 This idea was made in view of the above circumstances,
The purpose is to provide a heat sink for IC chips that is easy to position and has excellent heat dissipation and moisture resistance.
上記の課題を解決するために、この考案のIC
チツプ用ヒートシンクは、平板状のヒートシンク
本体７の片面中央部にICチツプ９の取付け台８
を一体に設け、上記取付け台８をプリント基板１
の取付け穴２に合致する大きさに形成し、上記取
付け台８の全周にわたる側面とその側面に直角に
接したヒートシンク本体７の面とによりプリント
基板１に対する位置決め固定部１１を形成し、上
記取付け台８の厚さを、ICチツプ９と当該取付
け台８の合計厚さが上記プリント基板１の内面の
厚さを越えない範囲に設定した構成としたもので
ある。
In order to solve the above problems, the IC of this invention
The chip heat sink has a mounting base 8 for the IC chip 9 in the center of one side of the flat heat sink body 7.
are integrally provided, and the mounting base 8 is attached to the printed circuit board 1.
A positioning and fixing part 11 for the printed circuit board 1 is formed by a side surface extending around the entire circumference of the mounting base 8 and a surface of the heat sink main body 7 that is in contact with the side surface at a right angle. The thickness of the mounting base 8 is set within a range in which the total thickness of the IC chip 9 and the mounting base 8 does not exceed the thickness of the inner surface of the printed circuit board 1.
上記のヒートシンク６は、プリント基板１の取
付け穴２に取付け台８を嵌合させた状態で位置決
め固定部１１をはんだ付けすることによりプリン
ト基板１に取付けられる。
The heat sink 6 described above is attached to the printed circuit board 1 by fitting the mounting base 8 into the mounting hole 2 of the printed circuit board 1 and soldering the positioning fixing part 11.
その後、取付け台８にICチツプ９が取付けら
れ、ICチツプ９とプリント回路５との間でワイ
ヤボンデイングが行われる。ヒートシンク６は
ICチツプ９の熱を放散し、その温度上昇を防ぐ。 Thereafter, the IC chip 9 is mounted on the mounting base 8, and wire bonding is performed between the IC chip 9 and the printed circuit 5. heat sink 6 is
Dissipates the heat of the IC chip 9 and prevents its temperature from rising.
第１図および第２図ａ，ｂは、この考案のIC
チツプ用ヒートシンクの一実施例を示す。この実
施例のヒートシンク６は、金メツキ銅等の熱の良
導体で形成され、四角形のヒートシンク本体７と
その中央部に一体に設けられた四角形の取付け台
８とにより構成される。
Figures 1 and 2 a and b are ICs of this invention.
An example of a heat sink for a chip is shown. The heat sink 6 of this embodiment is made of a good thermal conductor such as gold-plated copper, and is composed of a square heat sink body 7 and a square mounting base 8 integrally provided in the center thereof.
上記取付け台８は、プリント基板１に設けられ
た取付け穴２に合致し、その内側にすき間なく嵌
合する大きさである。取付け台８の各側面と、こ
れに直角に接するヒートシンク本体７の面とによ
り位置決め固定部１１を形成する。 The mounting base 8 has a size that matches the mounting hole 2 provided in the printed circuit board 1 and fits inside the mounting hole 2 without a gap. A positioning fixing portion 11 is formed by each side surface of the mounting base 8 and a surface of the heat sink body 7 that is in contact with the side surface at right angles thereto.
また、上記取付け台８の厚さは、その厚さと、
その面上に取付けられるICチツプ９の厚さとの
合計厚さが、プリント基板１の厚さを越えないよ
うに、即ちICチツプ９がプリント基板２の面か
ら突出しないように設定される。 Further, the thickness of the mounting base 8 is the same as that of the mounting base 8.
The total thickness including the thickness of the IC chip 9 mounted on that surface is set so as not to exceed the thickness of the printed circuit board 1, that is, so that the IC chip 9 does not protrude from the surface of the printed circuit board 2.
次に、上記の構成でなるヒートシンク６をプリ
ント基板１に取付ける方法について説明する。 Next, a method for attaching the heat sink 6 having the above configuration to the printed circuit board 1 will be explained.
プリント基板１の取付け穴２の周辺部において
は、ヒートシンク６の位置決め固定部１１と接触
する部分に銅箔が残され、その上にはんだ層が形
成されているので、取付け台８を取付け穴２に嵌
合してリフロー炉が装入すれば、はんだが溶融
し、ヒートシンク６がプリント基板１に固定され
る。 In the vicinity of the mounting hole 2 of the printed circuit board 1, copper foil is left in the area that contacts the positioning fixing part 11 of the heat sink 6, and a solder layer is formed on it, so that the mounting base 8 is attached to the mounting hole 2. When the heat sink 6 is fitted and inserted into a reflow oven, the solder melts and the heat sink 6 is fixed to the printed circuit board 1.
その後、ICチツプ９が取付け台８上に固定さ
れ、ボンデイングワイヤ１０によるICチツプ９
とプリント基板１の回路パターン５との接続作業
が行なわれる。 After that, the IC chip 9 is fixed on the mounting base 8, and the IC chip 9 is fixed by the bonding wire 10.
Connection work between the circuit pattern 5 and the circuit pattern 5 of the printed circuit board 1 is performed.
以上のようにして組立てられたICチツプ搭載
のプリント基板１は、ヒートシンク６の露出面か
ら熱放散が行われ、また位置決め固定部１１にお
いて、ICチツプ９側へ湿気が侵入することを阻
止する作用を行なう。 In the printed circuit board 1 mounted with the IC chip assembled in the manner described above, heat is dissipated from the exposed surface of the heat sink 6, and the positioning and fixing part 11 acts to prevent moisture from entering the IC chip 9 side. Do this.
以上のように、この考案はヒートシンク本体７
の中央部分に一体に設けた取付け台８を、プリン
ト基板１の取付け穴２に嵌合することにより容易
に位置決めされるので、自動実装が可能である。
また、ヒートシンク本体７はその外側面も外部に
露出されるので、熱放散性が改善されると共に、
位置決め固定部１１により湿気の侵入を阻止する
ので、ICチツプ９の性能の劣化を防ぐことがで
きる。
As mentioned above, this idea is based on the heat sink body 7.
The mounting base 8 integrally provided at the center of the printed circuit board 1 can be easily positioned by fitting into the mounting hole 2 of the printed circuit board 1, so that automatic mounting is possible.
In addition, since the outer surface of the heat sink body 7 is also exposed to the outside, heat dissipation is improved, and
Since the positioning and fixing part 11 prevents moisture from entering, the performance of the IC chip 9 can be prevented from deteriorating.
更に、ICチツプ９はプリント基板１の表面か
ら突出することがないので、全体の厚さを薄く形
成することができる。 Furthermore, since the IC chip 9 does not protrude from the surface of the printed circuit board 1, the overall thickness can be made thin.
第１図はこの考案のICチツプ用ヒートシンク
の一実施例をプリント基板に取付けた状態を示す
断面図、第２図ａおよびｂはそれぞれ上記実施例
の平面図および側面図、第３図は従来例の断面図
である。
１……プリント基板、２……取付け穴、５……
プリント回路、６……ヒートシンク、７……ヒー
トシンク本体、８……取付け台、９……ICチツ
プ、１０……ボンデイングワイヤ、１１……位置
決め固定部。
Fig. 1 is a sectional view showing an embodiment of the IC chip heat sink of this invention attached to a printed circuit board, Figs. 2a and b are a plan view and a side view of the above embodiment, respectively, and Fig. 3 is a conventional FIG. 3 is an example cross-sectional view. 1...Printed circuit board, 2...Mounting hole, 5...
Printed circuit, 6... Heat sink, 7... Heat sink body, 8... Mounting stand, 9... IC chip, 10... Bonding wire, 11... Positioning fixing part.
Claims (1)
ICチツプ９の取付け台８を一体に設け、上記取
付け台８をプリント基板１の取付け穴２に合致す
る大きさに形成し、上記取付け台８の全周にわた
る側面とその側面に直角に接したヒートシンク本
体７の面とによりプリント基板１に対する位置決
め固定部１１を形成し、上記取付け台８の厚さ
を、ICチツプ９と当該取付け台８の合計厚さが
上記プリント基板１の厚さを越えない範囲に設定
したことを特徴とする半導体集積回路チツプ用ヒ
ートシンク。 At the center of one side of the flat heat sink body 7
A mounting base 8 for the IC chip 9 is integrally provided, the mounting base 8 is formed to a size that matches the mounting hole 2 of the printed circuit board 1, and the mounting base 8 is formed in a size that matches the mounting hole 2 of the printed circuit board 1, and the mounting base 8 is formed to have a side surface extending around the entire circumference and in contact with the side surface at right angles. The surface of the heat sink body 7 forms a positioning and fixing part 11 for the printed circuit board 1, and the thickness of the mounting base 8 is such that the total thickness of the IC chip 9 and the mounting base 8 exceeds the thickness of the printed circuit board 1. A heat sink for a semiconductor integrated circuit chip, characterized in that the heat sink is set within a range in which there is no heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985144495U JPH043503Y2 (en) | 1985-09-20 | 1985-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985144495U JPH043503Y2 (en) | 1985-09-20 | 1985-09-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6252942U JPS6252942U (en) | 1987-04-02 |
| JPH043503Y2 true JPH043503Y2 (en) | 1992-02-04 |
Family
ID=31055152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985144495U Expired JPH043503Y2 (en) | 1985-09-20 | 1985-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH043503Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4818069B1 (en) * | 1968-09-28 | 1973-06-02 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4818069U (en) * | 1971-07-07 | 1973-03-01 | ||
| JPS5993170U (en) * | 1982-12-15 | 1984-06-25 | 三洋電機株式会社 | Mounting structure of flat package IC |
-
1985
- 1985-09-20 JP JP1985144495U patent/JPH043503Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4818069B1 (en) * | 1968-09-28 | 1973-06-02 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6252942U (en) | 1987-04-02 |
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