JP2548957Y2 - Screen mask mask pattern - Google Patents
Screen mask mask patternInfo
- Publication number
- JP2548957Y2 JP2548957Y2 JP1990117449U JP11744990U JP2548957Y2 JP 2548957 Y2 JP2548957 Y2 JP 2548957Y2 JP 1990117449 U JP1990117449 U JP 1990117449U JP 11744990 U JP11744990 U JP 11744990U JP 2548957 Y2 JP2548957 Y2 JP 2548957Y2
- Authority
- JP
- Japan
- Prior art keywords
- mask
- mask pattern
- screen
- array
- lead pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Printing Plates And Materials Therefor (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、表面実装用プリント基板へのクリーム半田
のスクリーン印刷技術に関し、特に、スクリーン印刷時
に用いるスクリーンマスクのマスクパターンに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a screen printing technique of cream solder on a surface mount printed circuit board, and particularly to a mask pattern of a screen mask used in screen printing.
従来のスクリーンマスクのマスクパターンＰは、第２
図に示すように、プリント基板へ実装される部品のリー
ドピンの配列に従って全てａ×ｂの同じ形状・大きさで
作成された構成となっている。The mask pattern P of the conventional screen mask is
As shown in the figure, the components are all formed in the same shape and size of a × b in accordance with the arrangement of the lead pins of the components mounted on the printed circuit board.
このマスクパターンでは、パターン形状及び大きさ
が、どのリードピン位置に対しても同じであるので、ス
クリーン印刷した後の、プリント基板上の各リードピン
に対するランドパターン上のクリーム半田の量も均一と
なる。In this mask pattern, since the pattern shape and size are the same for every lead pin position, the amount of cream solder on the land pattern for each lead pin on the printed circuit board after screen printing becomes uniform.
〔考案が解決しようとする課題〕 この従来のスクリーンマスクのマスクパターンでは、
プリント基板上のランドパターンへ均一の量のクリーム
半田が供給されるが、リードピンピッチの狭いQFP等の
部品に関しては、リードピン配列の配列両端部で未半田
付が発生し、リードピン配列の配列中央部で半田ブリッ
ジが発生する等という相反する現象が同時に起きた。そ
のこめ、半田付け不良をなくすのが困難であった。[Problem to be solved by the invention] In the mask pattern of the conventional screen mask,
A uniform amount of cream solder is supplied to the land pattern on the printed circuit board.However, for parts such as QFP with a narrow lead pin pitch, unsoldering occurs at both ends of the lead pin arrangement, and the center of the lead pin arrangement Therefore, conflicting phenomena such as the occurrence of solder bridges occurred simultaneously. It was difficult to eliminate soldering defects.
本考案の目的は、半田付け不良をなくしたスクリーン
マスクのマスクパターンを提供することにある。An object of the present invention is to provide a mask pattern of a screen mask that eliminates soldering defects.
前記目的を達成するため、本考案に係るスクリーンマ
スクのマスクパターンは、表面実装用プリント基板へス
クリーン印刷により、クリーム半田を供給するスクリー
ンマスクにおいて、 半田付けされる部品の各辺のリードピン配列に相当す
るマスクパターン列での配列両端部の穴形状をリードピ
ンを延伸する方向に長くし、配列中央部の穴形状をリー
ドピンが延伸する方向に短くした。In order to achieve the above object, the mask pattern of the screen mask according to the present invention corresponds to a lead pin arrangement on each side of a component to be soldered in a screen mask for supplying cream solder by screen printing on a surface mounting printed circuit board. In the mask pattern row to be formed, the hole shape at both ends of the array was lengthened in the direction in which the lead pins were extended, and the hole shape at the center of the array was shortened in the direction in which the lead pins were extended.
また、前記マスクパターンの穴形状の、該穴のリード
ピンが延伸する方向の長さを配列両端部が長く、配列両
端部が短くなるように段階的に変えた。Further, the length of the hole shape of the mask pattern in the direction in which the lead pin extends of the hole was changed stepwise so that both ends of the array were long and both ends of the array were short.
スクリーンマスクのマスクパターンの形状を、リード
ピンの配列に対応して、その大きさを異ならせることに
より、適正な半田を供給し、半田付け不良をなくしたも
のである。By changing the size of the mask pattern of the screen mask in accordance with the arrangement of the lead pins, appropriate solder is supplied, and defective soldering is eliminated.
以下、本考案の一実施例を図により説明する。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
第１図は、本考案の一実施例を示すマスクパターン図
である。FIG. 1 is a mask pattern diagram showing one embodiment of the present invention.
図において、本考案のスクリーンマスクのマスクパタ
ーンは、プリント基板に実装される部品（特にQFP）の
リードピン配列に相当するマスクパターンの形状を、リ
ードピン位置毎に変化させ、配列両端部を大きなマスク
パターンとした未半田付対策部１と、配列中央部を小さ
なマスクパターンとした半田ブリッジ対策部２とを備え
ている。In the figure, the mask pattern of the screen mask of the present invention changes the shape of the mask pattern corresponding to the lead pin arrangement of the component (particularly QFP) mounted on the printed circuit board for each lead pin position, and the two ends of the arrangement are large mask patterns. And a solder bridge countermeasure 2 having a small mask pattern at the center of the array.
第１図は、本考案の一実施例の、等間隔にガルウィン
グ型のリードピンを持つQFP用スクリーンマスクに用い
たマスクパターンである。FIG. 1 shows a mask pattern used for a QFP screen mask having gull-wing type lead pins at equal intervals in one embodiment of the present invention.
QFPのリードピン配列に相当する各々のマスクパター
ンＰの形状を、パターン配列両端から配列中央に向けて
段々と小さくなるようにして、配列両端のマスクパター
ンを太く長くし、配列中央部のマスクパターンを細く短
くした。The shape of each mask pattern P corresponding to the lead pin array of the QFP is gradually reduced from both ends of the pattern array toward the center of the array, the mask patterns at both ends of the array are made thicker and longer, and the mask pattern at the center of the array is changed. Thin and short.
実施例において、マスクパターンＰの長さは、A"＞A'
＞Ａの関係に、また、マスクパターンＰの太さは、B"≧
B'≧Ｂの関係にある。In the embodiment, the length of the mask pattern P is A ″> A ′
> A, and the thickness of the mask pattern P is B ″ ≧
B ′ ≧ B.
以上説明したように本考案は、スクリーンマスクのマ
スクパターンの形状を、リードピン配列の配列両端部で
大きくし、配列中央部で小さくしたので、実際にプリン
ト基板へスクリーン印刷した際に、部品の両端のリード
ピンへはクリーム半田が多く供給され未半田付の防止が
でき、部品の中央部のリードピンではクリーム半田供給
量が適度に少なくなり、半田ブリッジを防止できるとい
う効果を有する。As described above, in the present invention, the shape of the mask pattern of the screen mask is increased at both ends of the arrangement of the lead pin arrangement and reduced at the center of the arrangement. A large amount of cream solder is supplied to the lead pin, and unsoldering can be prevented, and the amount of cream solder supplied to the lead pin at the center of the component is appropriately reduced, so that there is an effect that a solder bridge can be prevented.
第１図は、本考案の一実施例を示すマスクパターン図、
第２図は、従来のマスクパターン図である。 １……未半田付対策部、２……半田ブリッジ対策部 Ｐ……マスクパターンFIG. 1 is a mask pattern diagram showing one embodiment of the present invention,
FIG. 2 is a conventional mask pattern diagram. 1 ... non-soldering countermeasure part 2 ... solder bridge countermeasure part P ... mask pattern
Claims (2)
により、クリーム半田を供給するスクリーンマスクにお
いて、 半田付けされる部品の各辺のリードピン配列に相当する
マスクパターン列での配列両端部の穴形状をリードピン
が延伸する方向に長くし、配列中央部の穴形状をリード
ピンが延伸する方向に短くしたことを特徴とするスクリ
ーンマスクのマスクパターン。1. A screen mask for supplying cream solder by screen printing on a surface mounting printed circuit board, wherein holes at both ends of an array in a mask pattern row corresponding to lead pin arrangements on each side of a component to be soldered are formed. A mask pattern for a screen mask, wherein the length of the hole is longer in the direction in which the lead pins extend, and the hole shape in the center of the arrangement is shorter in the direction in which the lead pins extend.
ードピンが延伸する方向の長さを配列両端部が長く、配
列両端部が短くなるように段階的に変えたことを特徴と
する請求項１に記載のスクリーンマスクのマスクパター
ン。2. The method according to claim 1, wherein the length of the hole of the mask pattern in the direction in which the lead pin extends is changed stepwise so that both ends of the array are longer and both ends of the array are shorter. Item 2. A mask pattern of the screen mask according to Item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990117449U JP2548957Y2 (en) | 1990-11-08 | 1990-11-08 | Screen mask mask pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990117449U JP2548957Y2 (en) | 1990-11-08 | 1990-11-08 | Screen mask mask pattern |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0473576U JPH0473576U (en) | 1992-06-29 |
| JP2548957Y2 true JP2548957Y2 (en) | 1997-09-24 |
Family
ID=31865348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990117449U Expired - Lifetime JP2548957Y2 (en) | 1990-11-08 | 1990-11-08 | Screen mask mask pattern |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2548957Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0217369U (en) * | 1988-07-21 | 1990-02-05 |
-
1990
- 1990-11-08 JP JP1990117449U patent/JP2548957Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0473576U (en) | 1992-06-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |