JPH04332116A - Spin coater - Google Patents
Spin coaterInfo
- Publication number
- JPH04332116A JPH04332116A JP13043591A JP13043591A JPH04332116A JP H04332116 A JPH04332116 A JP H04332116A JP 13043591 A JP13043591 A JP 13043591A JP 13043591 A JP13043591 A JP 13043591A JP H04332116 A JPH04332116 A JP H04332116A
- Authority
- JP
- Japan
- Prior art keywords
- slit
- polyimide
- viscosity
- wafer
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920000642 polymer Polymers 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229920002521 macromolecule Polymers 0.000 abstract 3
- 229920001721 polyimide Polymers 0.000 description 23
- 239000004642 Polyimide Substances 0.000 description 20
- 238000004528 spin coating Methods 0.000 description 8
- 101150038956 cup-4 gene Proteins 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】この発明は、ウエハの表面上に高
粘度高分子を用いて膜を形成する際に用いる回転塗布装
置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spin coating apparatus used for forming a film of high viscosity polymer on the surface of a wafer.
【０００２】0002
【従来の技術】従来から半導体プロセスのポリイミド膜
形成工程においては、図４に示すような概略構成を有す
る回転塗布装置が一般的に用いられている。即ち、この
回転塗布装置は、水平状に載置されたウエハ１を吸着保
持する真空チャック２と、この真空チャック２を支持し
て縦軸周りに回転する回転ロッド３と、上記真空チャッ
ク及びウエハを取り囲んで配設されたスピンカップ４と
、ポリイミドＰを供給するポリイミド配管５とを備えて
いる。そしてレジスト供給配管５の下端部にはノズル６
が設けられており、このノズル６の開口６ａからはポリ
イミドＰが滴下されてウエハ２の表面上の回転中心位置
に供給されるようになっている。2. Description of the Related Art Conventionally, a spin coating apparatus having a schematic configuration as shown in FIG. 4 has been generally used in a polyimide film forming step of a semiconductor process. That is, this rotary coating apparatus includes a vacuum chuck 2 that attracts and holds a horizontally placed wafer 1, a rotary rod 3 that supports the vacuum chuck 2 and rotates around a vertical axis, and a vacuum chuck and a wafer. It includes a spin cup 4 disposed surrounding the spin cup 4, and a polyimide pipe 5 for supplying polyimide P. A nozzle 6 is installed at the lower end of the resist supply pipe 5.
is provided, and polyimide P is dropped from the opening 6a of the nozzle 6 and is supplied to the rotation center position on the surface of the wafer 2.
【０００３】即ち、この回転塗布装置を用いてウエハ１
の表面上にポリイミド膜を形成する際には、まず真空チ
ャック２の上面にウエハ１を吸着保持させ、ポリイミド
Ｐをノズル６から滴下させることによってウエハ表面上
の回転中心位置に供給し、そののち、真空チャック２を
支持するロッド３を高速回転させると、供給されたポリ
イミドＰは遠心力によってウエハ２の表面上に広がり膜
厚の薄いポリイミド膜が形成されることになる。That is, using this spin coating device, a wafer 1 is coated.
When forming a polyimide film on the surface of the wafer, first, the wafer 1 is held by suction on the upper surface of the vacuum chuck 2, and polyimide P is supplied to the center of rotation on the wafer surface by dropping it from the nozzle 6. When the rod 3 supporting the vacuum chuck 2 is rotated at high speed, the supplied polyimide P is spread over the surface of the wafer 2 by centrifugal force, forming a thin polyimide film.
【０００４】0004
【発明が解決しようとする課題】ところで、以上のよう
な従来の回転塗布装置においては、ポリイミドが高粘度
のため管内抵抗が大きく、必要量を滴下させるのにかな
りの時間を必要とした。However, in the conventional spin coating apparatus as described above, since the polyimide has a high viscosity, the resistance inside the pipe is large, and it takes a considerable amount of time to drip the required amount.
【０００５】この発明は以上のような問題点を解決する
ためになされたもので、滴下時間を短縮できる回転塗布
装置を得ることを目的とする。The present invention was made to solve the above-mentioned problems, and an object of the present invention is to provide a spin coating device that can shorten the dropping time.
【０００６】[0006]
【課題を解決するための手段】この発明に係る回転塗布
装置は、水平状態で載置されたウエハを吸着保持して回
転する真空チャックと、このチャックの上方に配置され
てポリイミドを供給するポリイミド供給配管と、その下
端部に連結されてポリイミドを溜めることのできるタン
クを有し、かつスリットより滴下できるような構造をも
つスリット型高粘度高分子滴下装置を備えたものである
。[Means for Solving the Problems] A rotary coating device according to the present invention includes a vacuum chuck that suctions and rotates a wafer placed in a horizontal state, and a polyimide disposed above the chuck for supplying polyimide. It is equipped with a slit-type high-viscosity polymer dropping device that has a supply pipe, a tank connected to the lower end of the supply pipe and capable of storing polyimide, and a structure that allows the polyimide to be dropped through a slit.
【０００７】[0007]
【作用】この発明においては、ポリイミドは一たんタン
クに溜められるため、滴下時間以外も必要量を供給する
ことができ、かつスリットにより滴下させるため、滴下
時間を短縮することができる。[Function] In this invention, since the polyimide is temporarily stored in the tank, the required amount can be supplied even during periods other than the dropping time, and since the polyimide is dropped through a slit, the dropping time can be shortened.
【０００８】[0008]
【実施例】図１はこの発明の一実施例による回転塗布装
置の概略構成を示す断面図、図２はその要部であるスリ
ット型高粘度高分子滴下装置を拡大して示す斜視図、図
３はそのスリットノズルの拡大断面図である。これらの
図において、１〜５は図４のものと同様であり、７はポ
リイミド供給管５の下端部に連結されたスリット型高粘
度高分子滴下装置で、タンク８の下端部にスリットノズ
ル９を備え、そのスリットからポリイミドＰが滴下され
供給されるようになっている。またこのスリット型高粘
度高分子滴下装置７の上部には、図２に示すように、ポ
リイミド供給管５のほか、バキューム管１０とＮ２加圧
管１１が接続され、内部にはスリットノズル９のスリッ
トをふさぐ可動弁１２が配置されている。また図３に示
すように、このスリットノズルは仕切壁９ａによりこま
かく仕切られている。[Embodiment] Fig. 1 is a sectional view showing a schematic configuration of a spin coating device according to an embodiment of the present invention, and Fig. 2 is an enlarged perspective view showing a slit-type high-viscosity polymer dropping device, which is the main part. 3 is an enlarged sectional view of the slit nozzle. In these figures, 1 to 5 are the same as those in FIG. The polyimide P is dripped and supplied from the slit. Furthermore, as shown in FIG. 2, the slit-type high-viscosity polymer dropping device 7 is connected to the top thereof with a polyimide supply pipe 5, a vacuum pipe 10, and an N2 pressure pipe 11. A movable valve 12 is arranged to block the. Further, as shown in FIG. 3, this slit nozzle is finely partitioned by partition walls 9a.
【０００９】次にその動作について説明する。まずスリ
ット可動弁１２をＤＯＷＮさせポリイミド供給配管５を
通じて供給されたポリイミドＰでタンク８内を満たす。
なおこの時バキューム管１０より内圧を抜いて供給を助
ける。そして回転ロッド３をゆっくり回転させながら、
スリット可動弁１２をＵＰさせ、Ｎ２加圧管１１よりＮ
２を加圧しポリイミドを滴下する。回転ロッドが一回転
した時点で、バキューム管１０より短時間引きサックバ
ックを行ない、スリット可動弁１２をＤＯＷＮさせる。
この後ロッドは膜厚形成のための高回転を始めるので、
直ちに、ポリイミド供給を開始する。Next, its operation will be explained. First, the slit movable valve 12 is turned down to fill the tank 8 with polyimide P supplied through the polyimide supply pipe 5. At this time, the internal pressure is released from the vacuum pipe 10 to aid the supply. Then, while slowly rotating the rotating rod 3,
UP the slit movable valve 12 and press N2 from the N2 pressure pipe 11.
2 is pressurized and polyimide is added dropwise. When the rotating rod rotates once, the vacuum pipe 10 is pulled back for a short time to cause the slit movable valve 12 to go down. After this, the rod starts rotating at high speed to form a thick film.
Polyimide supply will begin immediately.
【００１０】0010
【発明の効果】以上説明したように、この発明によれば
、従来に比し滴下時間が大幅に短縮され、装置としての
処理能力が向上するというすぐれた効果を奏する。As explained above, according to the present invention, the dropping time is significantly shortened compared to the conventional method, and the processing capacity of the apparatus is improved.
【図１】この発明の一実施例による回転塗布装置の概略
構成を示す断面図である。FIG. 1 is a sectional view showing a schematic configuration of a spin coating apparatus according to an embodiment of the present invention.
【図２】図１の要部であるスリット型ポリイミド滴下装
置の拡大図である。FIG. 2 is an enlarged view of the slit-type polyimide dropping device, which is the main part of FIG. 1;
【図３】図２の下端のスリットノズル部の断面図である
。FIG. 3 is a sectional view of the slit nozzle portion at the lower end of FIG. 2;
【図４】従来の回転塗布装置の概略構成を示す断面図で
ある。FIG. 4 is a sectional view showing a schematic configuration of a conventional spin coating device.
１ ウエハ
２ 真空チャック
３ 回転ロッド
５ ポリイミド供給管
７ スリット型高粘度高分子滴下装置８
タンク
９ スリットノズル1 Wafer 2 Vacuum chuck 3 Rotating rod 5 Polyimide supply pipe 7 Slit type high viscosity polymer dropping device 8
Tank 9 Slit nozzle
Claims (1)
して縦軸周りに回転する真空チャックと、その上方に配
置されて高粘度高分子を供給する供給配管と、この供給
配管の下端部に連結され、タンクの下部にスリットノズ
ルを有するスリット型高粘度高分子滴下装置を備えてお
り、このスリット型高粘度高分子滴下装置に高粘度高分
子を一たんタンク内に溜めて、上記スリットノズルより
ウエハ上に滴下するようにしたことを特徴とする回転塗
布装置。Claim 1: A vacuum chuck that sucks and holds a horizontally placed wafer and rotates around a vertical axis; a supply pipe arranged above the chuck for supplying a high-viscosity polymer; and a lower end of the supply pipe. A slit-type high-viscosity polymer dropping device is connected to the tank and has a slit nozzle at the bottom of the tank. A rotary coating device characterized in that a droplet is applied onto a wafer from a slit nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13043591A JPH04332116A (en) | 1991-05-02 | 1991-05-02 | Spin coater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13043591A JPH04332116A (en) | 1991-05-02 | 1991-05-02 | Spin coater |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04332116A true JPH04332116A (en) | 1992-11-19 |
Family
ID=15034169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13043591A Pending JPH04332116A (en) | 1991-05-02 | 1991-05-02 | Spin coater |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04332116A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5769946A (en) * | 1995-03-29 | 1998-06-23 | Tokyo Ohka Kogyo Co., Ltd. | Coating nozzle and coating device having coating nozzle |
| US5782978A (en) * | 1994-04-15 | 1998-07-21 | Sharp Kabushiki Kaisha | Coating device with movable fluid supply nozzle and rotatable substrate holder |
| WO1998057757A1 (en) * | 1997-06-16 | 1998-12-23 | Massachusetts Institute Of Technology | High efficiency photoresist coating |
| US6761930B2 (en) | 1994-11-29 | 2004-07-13 | Tokyo Ohka Kogyo Co., Ltd. | Method of coating solution on substrate surface using a slit nozzle |
| US6977098B2 (en) | 1994-10-27 | 2005-12-20 | Asml Holding N.V. | Method of uniformly coating a substrate |
| US7018943B2 (en) | 1994-10-27 | 2006-03-28 | Asml Holding N.V. | Method of uniformly coating a substrate |
| US7030039B2 (en) | 1994-10-27 | 2006-04-18 | Asml Holding N.V. | Method of uniformly coating a substrate |
| JP2008253937A (en) * | 2007-04-06 | 2008-10-23 | Disco Abrasive Syst Ltd | Coating method with liquid resin and device |
-
1991
- 1991-05-02 JP JP13043591A patent/JPH04332116A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5782978A (en) * | 1994-04-15 | 1998-07-21 | Sharp Kabushiki Kaisha | Coating device with movable fluid supply nozzle and rotatable substrate holder |
| US6977098B2 (en) | 1994-10-27 | 2005-12-20 | Asml Holding N.V. | Method of uniformly coating a substrate |
| US7018943B2 (en) | 1994-10-27 | 2006-03-28 | Asml Holding N.V. | Method of uniformly coating a substrate |
| US7030039B2 (en) | 1994-10-27 | 2006-04-18 | Asml Holding N.V. | Method of uniformly coating a substrate |
| US6761930B2 (en) | 1994-11-29 | 2004-07-13 | Tokyo Ohka Kogyo Co., Ltd. | Method of coating solution on substrate surface using a slit nozzle |
| US5769946A (en) * | 1995-03-29 | 1998-06-23 | Tokyo Ohka Kogyo Co., Ltd. | Coating nozzle and coating device having coating nozzle |
| US5972426A (en) * | 1995-03-29 | 1999-10-26 | Tokyo Ohka Kogyo Co., Ltd. | Method of coating substrate with coating nozzle |
| WO1998057757A1 (en) * | 1997-06-16 | 1998-12-23 | Massachusetts Institute Of Technology | High efficiency photoresist coating |
| US6191053B1 (en) | 1997-06-16 | 2001-02-20 | Silicon Valley Group, Inc. | High efficiency photoresist coating |
| JP2008253937A (en) * | 2007-04-06 | 2008-10-23 | Disco Abrasive Syst Ltd | Coating method with liquid resin and device |
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