JPH0432543B2 - - Google Patents
Info
- Publication number
- JPH0432543B2 JPH0432543B2 JP11465183A JP11465183A JPH0432543B2 JP H0432543 B2 JPH0432543 B2 JP H0432543B2 JP 11465183 A JP11465183 A JP 11465183A JP 11465183 A JP11465183 A JP 11465183A JP H0432543 B2 JPH0432543 B2 JP H0432543B2
- Authority
- JP
- Japan
- Prior art keywords
- collet
- chip
- ejection
- sheet
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 238000006073 displacement reaction Methods 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000003909 pattern recognition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11465183A JPS607144A (ja) | 1983-06-25 | 1983-06-25 | ダイコレツトの位置調整方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11465183A JPS607144A (ja) | 1983-06-25 | 1983-06-25 | ダイコレツトの位置調整方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS607144A JPS607144A (ja) | 1985-01-14 |
JPH0432543B2 true JPH0432543B2 (zh) | 1992-05-29 |
Family
ID=14643136
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11465183A Granted JPS607144A (ja) | 1983-06-25 | 1983-06-25 | ダイコレツトの位置調整方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS607144A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5825502B2 (ja) * | 2013-02-27 | 2015-12-02 | 株式会社東京精密 | プローブ装置 |
-
1983
- 1983-06-25 JP JP11465183A patent/JPS607144A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5825502B2 (ja) * | 2013-02-27 | 2015-12-02 | 株式会社東京精密 | プローブ装置 |
JP2016036040A (ja) * | 2013-02-27 | 2016-03-17 | 株式会社東京精密 | プローブ装置 |
JP2016115945A (ja) * | 2013-02-27 | 2016-06-23 | 株式会社東京精密 | プローブ装置及びプローブ方法 |
US9664733B2 (en) | 2013-02-27 | 2017-05-30 | Tokyo Seimitsu Co., Ltd. | Probe device for testing electrical characteristics of semiconductor element |
Also Published As
Publication number | Publication date |
---|---|
JPS607144A (ja) | 1985-01-14 |
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