JPH0432543B2 - - Google Patents

Info

Publication number
JPH0432543B2
JPH0432543B2 JP11465183A JP11465183A JPH0432543B2 JP H0432543 B2 JPH0432543 B2 JP H0432543B2 JP 11465183 A JP11465183 A JP 11465183A JP 11465183 A JP11465183 A JP 11465183A JP H0432543 B2 JPH0432543 B2 JP H0432543B2
Authority
JP
Japan
Prior art keywords
collet
chip
ejection
sheet
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11465183A
Other languages
English (en)
Japanese (ja)
Other versions
JPS607144A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11465183A priority Critical patent/JPS607144A/ja
Publication of JPS607144A publication Critical patent/JPS607144A/ja
Publication of JPH0432543B2 publication Critical patent/JPH0432543B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP11465183A 1983-06-25 1983-06-25 ダイコレツトの位置調整方法 Granted JPS607144A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11465183A JPS607144A (ja) 1983-06-25 1983-06-25 ダイコレツトの位置調整方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11465183A JPS607144A (ja) 1983-06-25 1983-06-25 ダイコレツトの位置調整方法

Publications (2)

Publication Number Publication Date
JPS607144A JPS607144A (ja) 1985-01-14
JPH0432543B2 true JPH0432543B2 (zh) 1992-05-29

Family

ID=14643136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11465183A Granted JPS607144A (ja) 1983-06-25 1983-06-25 ダイコレツトの位置調整方法

Country Status (1)

Country Link
JP (1) JPS607144A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5825502B2 (ja) * 2013-02-27 2015-12-02 株式会社東京精密 プローブ装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5825502B2 (ja) * 2013-02-27 2015-12-02 株式会社東京精密 プローブ装置
JP2016036040A (ja) * 2013-02-27 2016-03-17 株式会社東京精密 プローブ装置
JP2016115945A (ja) * 2013-02-27 2016-06-23 株式会社東京精密 プローブ装置及びプローブ方法
US9664733B2 (en) 2013-02-27 2017-05-30 Tokyo Seimitsu Co., Ltd. Probe device for testing electrical characteristics of semiconductor element

Also Published As

Publication number Publication date
JPS607144A (ja) 1985-01-14

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