JPH04324920A - Mounting method for surface mounting part - Google Patents
Mounting method for surface mounting partInfo
- Publication number
- JPH04324920A JPH04324920A JP3095481A JP9548191A JPH04324920A JP H04324920 A JPH04324920 A JP H04324920A JP 3095481 A JP3095481 A JP 3095481A JP 9548191 A JP9548191 A JP 9548191A JP H04324920 A JPH04324920 A JP H04324920A
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- mounting
- pad
- mount component
- mounting method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】この発明は、プリント基板に表面
実装部品を実装する方法を改善し、高密度実装基板を実
現するものである。FIELD OF INDUSTRIAL APPLICATION This invention improves the method of mounting surface mount components on a printed circuit board and realizes a high-density mounting board.
【０００２】0002
【従来の技術】図５は実開平１−１０４７０１など従来
の実装方法を示す図であり、１は表面実装部品本体、２
は表面実装部品端子、３は表面実装部品取付け用パッド
、４は半田、５はプリント基板を示す。表面実装部品を
、プリント基板５に取り付ける場合、一般的にはプリン
ト基板上に表面実装部品取付け用パッド３の銅箔を設け
、表面実装部品を半田付けするようにしている。又、Ｃ
ＰＵボード等の場合、ＣＰＵとＲＡＭやＲＯＭとデータ
をやり取りするための、データバス、アドレスバス等の
バス信号が接続されていることが多い。これらのデータ
バス、アドレスバスのバス信号には、プルアップ（プル
ダウン）抵抗が必要である。例えば、１６ビットのデー
タバス、アドレスバスのバス信号のプルアップ（プルダ
ウン）抵抗は合計３２個とかなりの量となっている。
図６は上記のプルアップ（プルダウン）抵抗１個を実装
した時の、信号パターンの例を示す。６はＩＣ取付け用
パッド、７は信号パターン、８は表裏接続用ランドを示
す。[Prior Art] FIG. 5 is a diagram showing a conventional mounting method such as Utility Model Application Publication No. 1-104701, in which 1 is a surface mount component body, 2
3 is a surface mount component terminal, 3 is a pad for attaching a surface mount component, 4 is solder, and 5 is a printed circuit board. When attaching a surface mount component to the printed circuit board 5, generally a copper foil of the surface mount component attachment pad 3 is provided on the printed circuit board, and the surface mount component is soldered. Also, C
In the case of a PU board, etc., bus signals such as a data bus and an address bus are often connected for exchanging data between the CPU and RAM or ROM. The bus signals of these data buses and address buses require pull-up (pull-down) resistors. For example, the number of pull-up (pull-down) resistors for bus signals of a 16-bit data bus and address bus is 32 in total, which is quite large. FIG. 6 shows an example of a signal pattern when one of the above-mentioned pull-up (pull-down) resistors is mounted. Reference numeral 6 indicates a pad for mounting an IC, 7 indicates a signal pattern, and 8 indicates a land for connecting the front and back sides.
【０００３】次ぎに作用に付いて説明する。図５は従来
の表面実装部品の実装方法で、例えば縦１．６ｍｍ，横
３．２ｍｍの表面実装部品の取付け用パッドは、図４の
３のように横１．６ｍｍ，縦２．２ｍｍが２個必要とな
る。又、図６は従来の実装方法による信号パターンの例
である。この例のように表面実装部品取付け用パッド３
が１．６ｍｍ×２．２ｍｍ×２＝７．０４ｍｍ２ と大
きいため、信号パターン７を表裏接続用ランド８を使用
して一度半田面に迂回して引かなければならない。Next, the operation will be explained. Figure 5 shows a conventional mounting method for surface mount components. Two pieces are required. Further, FIG. 6 is an example of a signal pattern obtained by a conventional mounting method. Pad 3 for mounting surface mount components as shown in this example.
Since it is as large as 1.6 mm x 2.2 mm x 2 = 7.04 mm2, the signal pattern 7 must be drawn around the solder surface once using the front and back connection lands 8.
【０００４】0004
【発明が解決しようとする課題】従来の表面実装部品の
実装方法は、以上のように構成されているので、表面実
装部品取り付け用パッドの場合、基板上に占める面積は
、広くなり、部品面だけでパターンを引くことが出来ず
、一度半田面へ、迂回させなければならない。パターン
を迂回させるためには、表裏接続用ランド８が必要であ
るが、現在は、基板製造上の問題から、φ０．３ｍｍが
限度である。表裏接続用ランド８は電気的に接続してい
なければならないため、表裏接続用ランド８、およびス
ルーホール径に銅箔をメッキし、表裏接続用ランド８を
φ０．４ｍｍ、スルーホール径をφ０．３ｍｍとして使
用している。又、パッド間隔が１．５ｍｍしかないため
、０．１５ｍｍパターン（ピン間３本使用の場合）は、
３本しか通せない。以上のように高密度実装を妨げる問
題があった。[Problems to be Solved by the Invention] Since the conventional method for mounting surface mount components is configured as described above, in the case of pads for mounting surface mount components, the area occupied on the board is large, and the surface area of the component surface is large. It is not possible to draw a pattern with just the solder surface, and the pattern must be detoured once to the solder surface. In order to detour the pattern, front and back connection lands 8 are required, but currently, due to board manufacturing problems, the maximum diameter is 0.3 mm. Since the land 8 for connecting the front and back sides must be electrically connected, the land 8 for connecting the front and back sides and the diameter of the through hole are plated with copper foil, and the land 8 for front and back connection is φ0.4 mm, and the diameter of the through hole is φ0.4 mm. It is used as 3mm. Also, since the pad spacing is only 1.5mm, a 0.15mm pattern (when using 3 pins between pins) is
I can only pass three. As mentioned above, there are problems that hinder high-density packaging.
【０００５】この発明は上記のような問題点を解決する
ためになされたもので、表面実装部品の実装方法を改善
し、パターンを通しやすくして、高密度実装を可能とす
る実装方法を提供されることを目的とする。The present invention was made to solve the above-mentioned problems, and provides a mounting method that improves the mounting method of surface mount components, makes it easier to pass through the pattern, and enables high-density mounting. The purpose is to be
【０００６】[0006]
【課題を解決するための手段】この発明に係わる表面実
装部品の実装方法は、プリント基板上の表面実装部品取
り付け用パッド面積を小さくするために、表面実装部品
端子に補助端子を取り付けプリント基板に実装したもの
である。[Means for Solving the Problems] A surface mount component mounting method according to the present invention involves attaching auxiliary terminals to surface mount component terminals on the printed circuit board in order to reduce the surface mount component mounting pad area on the printed circuit board. It has been implemented.
【０００７】[0007]
【作用】この発明における表面実装部品の実装方法は、
表面実装部品の表面実装部品端子に補助端子を取り付け
プリント基板に実装可能にしたことにより、従来の実装
方法に比べ、表面実装部品取り付けが削減でき、表面実
装部品の高密度実装が可能になる。[Operation] The method for mounting surface mount components in this invention is as follows:
By attaching auxiliary terminals to the surface mount component terminals of surface mount components so that they can be mounted on printed circuit boards, the number of surface mount components mounted can be reduced compared to conventional mounting methods, and surface mount components can be mounted at high density.
【０００８】[0008]
【実施例】以下、この発明の一実施例を図について説明
する。図１において、１は表面実装部品本体、２は表面
実装部品端子、３は表面実装部品取り付け用パッド、５
はプリント基板、９は補助端子である。図２は、この発
明による信号パターンの引き方の例で、６はＩＣ取り付
け用パッド、７は信号パターン、８は表裏接続用ランド
、３は表面実装部品取付け用パッドを示す。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, 1 is a surface mount component main body, 2 is a surface mount component terminal, 3 is a surface mount component mounting pad, and 5 is a surface mount component main body.
is a printed circuit board, and 9 is an auxiliary terminal. FIG. 2 shows an example of how to draw a signal pattern according to the present invention, with reference numeral 6 indicating a pad for mounting an IC, 7 indicating a signal pattern, 8 indicating a land for front/back connection, and 3 indicating a pad for attaching a surface mount component.
【０００９】図１はこの発明による表面実装部品の実装
方法の説明図で、１の実装部品本体を５のプリント基板
に４の半田にて接続固定する場合、１の表面実装部品本
体に９の補助端子を半田にて接続固定してから５のプリ
ント基板に実装するため、９の補助端子幅のみで良く（
図３を参照）、３の表面実装部品取り付け用パッド面積
は０．６５ｍｍ×２．２ｍｍ×２＝２．８６ｍｍ２ で
済むことになる。本発明による表面実装部品の実装方法
と従来の実装方法での３の表面実装部品取り付け用パッ
ドと、この発明のパッド面積を比較してみると、この発
明のパッド面積２．８６ｍｍ２ ，従来の実装方法のパ
ッド面積１．６ｍｍ×２．２ｍｍ×２＝７．０４ｍｍ２
，この発明／従来の実装方法＝２．８６ｍｍ２ ／７
．０４ｍｍ２ ＝０．４０６２５，約４１％で済むこと
になる。FIG. 1 is an explanatory diagram of the surface mount component mounting method according to the present invention. When the mount component body 1 is connected and fixed to the printed circuit board 5 with the solder 4, the surface mount component body 1 is connected to the surface mount component body 9. Since the auxiliary terminals are connected and fixed with solder and then mounted on the printed circuit board 5, only the width of the auxiliary terminals 9 is sufficient (
(See FIG. 3), the area of the pad for attaching surface mount components in step 3 is 0.65 mm x 2.2 mm x 2 = 2.86 mm2. Comparing the surface mount component mounting method according to the present invention and the pad for mounting surface mount components in 3 of the conventional mounting method, and the pad area of the present invention, the pad area of the present invention is 2.86 mm2, and the pad area of the conventional mounting method is 2.86 mm2. Method pad area 1.6mm x 2.2mm x 2 = 7.04mm2
, this invention/conventional mounting method=2.86mm2/7
．． 04mm2 = 0.40625, which means about 41%.
【００１０】以上のように、この実施例は表面実装部品
取り付け用パッド３の面積が４１％で済むため、表裏接
続用ランド８を使用しての半田面への迂回パターンは、
この実施例は２本，従来の実装方法は６本（図６参照）
，又、表面実装部品取り付け用パッド３の間隔が従来の
実装方法に比べ０．９ｍｍ広くなっているため、０．１
５ｍｍ幅のパターンで４本も多く通せること、表裏接続
用ランド８が４個も少なくて済むため、同一サイズのプ
リント基板上に取り付ける表面実装部品，及び，表面実
装部品の取り付け用パッド，表裏接続用ランドを大幅に
削減できるため、高密度実装が可能になる。As described above, in this embodiment, the surface mount component mounting pad 3 only requires 41% of the area, so the detour pattern to the solder surface using the front and back connection lands 8 is as follows:
There are two in this example, and six in the conventional mounting method (see Figure 6).
, Also, since the spacing between pads 3 for mounting surface mount components is 0.9 mm wider than in the conventional mounting method,
As many as 4 wires can be passed through a 5 mm wide pattern, and 4 fewer lands 8 are required for connecting the front and back sides, surface mount components to be mounted on the same size printed circuit board, pads for mounting surface mount components, front and back surfaces, etc. Since the number of connecting lands can be significantly reduced, high-density mounting is possible.
【００１１】[0011]
【発明の効果】以上のようにこの発明によれば、パター
ンが通し易く、高密度実装を可能とする表面実装部品の
実装方法が得られる効果がある。As described above, according to the present invention, it is possible to obtain a surface mount component mounting method that allows a pattern to pass through easily and enables high-density mounting.
【図１】この発明による表面実装部品の実装方法を示す
図[Fig. 1] A diagram showing a method for mounting surface mount components according to the present invention.
【図２】この発明によるパターンの引き方の例を示す図
[Fig. 2] A diagram showing an example of how to draw a pattern according to the present invention.
【図３】この発明による表面実装部品取り付け用パッド
寸法参考図[Figure 3] Reference diagram of pad dimensions for mounting surface mount components according to the present invention
【図４】従来の表面実装部品取り付け用パッド寸法参考
図[Figure 4] Reference diagram of conventional pad dimensions for mounting surface mount components
【図５】従来の表面実装部品の実装方法を示す図[Figure 5] Diagram showing a conventional mounting method for surface mount components
【図６
】従来のパターンの引き方の例を示す図[Figure 6
] Diagram showing an example of how to draw a conventional pattern
１ 表面実装部品本体 ２ 表面実装部品端子 ３ 表面実装部品取り付け用パッド ４ 半田 ５ プリント基板 ６ ＩＣ取り付け用パッド ７ 信号パターン ８ 表裏接続用ランド ９ 補助端子 1 Surface mount component body 2 Surface mount component terminal 3 Pad for mounting surface mount components 4 Solder 5 Printed circuit board 6 IC mounting pad 7 Signal pattern 8 Land for connecting front and back sides 9 Auxiliary terminal
Claims (1)
基板に半田付けをするように構成したことを特徴とする
表面実装部品の実装方法。[Claim 1] Attaching an auxiliary terminal to a surface mount component,
A method for mounting a surface mount component, characterized in that it is configured to be soldered to a board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3095481A JPH04324920A (en) | 1991-04-25 | 1991-04-25 | Mounting method for surface mounting part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3095481A JPH04324920A (en) | 1991-04-25 | 1991-04-25 | Mounting method for surface mounting part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04324920A true JPH04324920A (en) | 1992-11-13 |
Family
ID=14138808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3095481A Pending JPH04324920A (en) | 1991-04-25 | 1991-04-25 | Mounting method for surface mounting part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04324920A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10303060A (en) * | 1997-04-25 | 1998-11-13 | Marcon Electron Co Ltd | Electronic component |
| JPH1145821A (en) * | 1997-07-25 | 1999-02-16 | Tdk Corp | Composite laminated ceramic capacitor having metal terminals |
| JPH11102837A (en) * | 1997-09-25 | 1999-04-13 | Marcon Electron Co Ltd | Electrode component |
| JP2019062042A (en) * | 2017-09-26 | 2019-04-18 | 太陽誘電株式会社 | Electronic component with metal terminal and electronic component mounted circuit board |
| US11410816B2 (en) * | 2018-06-27 | 2022-08-09 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component including metal terminals connected to outer electrodes |
-
1991
- 1991-04-25 JP JP3095481A patent/JPH04324920A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10303060A (en) * | 1997-04-25 | 1998-11-13 | Marcon Electron Co Ltd | Electronic component |
| JPH1145821A (en) * | 1997-07-25 | 1999-02-16 | Tdk Corp | Composite laminated ceramic capacitor having metal terminals |
| JPH11102837A (en) * | 1997-09-25 | 1999-04-13 | Marcon Electron Co Ltd | Electrode component |
| JP2019062042A (en) * | 2017-09-26 | 2019-04-18 | 太陽誘電株式会社 | Electronic component with metal terminal and electronic component mounted circuit board |
| US11410816B2 (en) * | 2018-06-27 | 2022-08-09 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component including metal terminals connected to outer electrodes |
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