JPH04321227A - Cleaning bench - Google Patents
Cleaning benchInfo
- Publication number
- JPH04321227A JPH04321227A JP9033291A JP9033291A JPH04321227A JP H04321227 A JPH04321227 A JP H04321227A JP 9033291 A JP9033291 A JP 9033291A JP 9033291 A JP9033291 A JP 9033291A JP H04321227 A JPH04321227 A JP H04321227A
- Authority
- JP
- Japan
- Prior art keywords
- partition plate
- hole
- cleaning
- liquid
- opening area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 33
- 238000005192 partition Methods 0.000 claims abstract description 29
- 239000007788 liquid Substances 0.000 abstract description 23
- 239000000126 substance Substances 0.000 abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 2
- 230000001681 protective effect Effects 0.000 abstract 1
- 230000009191 jumping Effects 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、水もしくは酸、アルカ
リ等の薬品を用いる洗浄用設備、いわゆる洗浄ベンチに
係り、特に、洗浄操作の際に水、薬品等の液体の跳上り
現象の発生の少ない洗浄ベンチに関する。[Industrial Application Field] The present invention relates to cleaning equipment that uses water or chemicals such as acids and alkalis, so-called cleaning benches, and in particular, the occurrence of a phenomenon in which liquids such as water and chemicals jump up during cleaning operations. Regarding less cleaning benches.
【０００２】0002
【従来の技術】図７は、これまで半導体製造などの工程
で用いられてきている洗浄ベンチの構造の一例を示す図
で、水もしくは薬品の供給管１、洗浄用の治具や被洗浄
物を載置して洗浄作業を行うための仕切板２、仕切板２
に設けた排液用の貫通孔３、排液収集口４などからなる
ことを示す。また、図８は上記仕切板２の構造例を示す
平面図（ａ）及び断面図（ｂ）で、例えば、厚さ数ｍｍ
程度の塩化ビニル板に直径数ｍｍの貫通孔３を開けたパ
ンチングボード形式のものがよく用いられる。なお、仕
切板２を構成する材料としては、洗浄やエッチング加工
に用いられる硫酸、塩酸、リン酸等に代表される酸や、
アンモニア水、水酸化カリウム等のアルカリに対する耐
薬品性、および、加工性、低コスト性などの理由によっ
て、一般に塩化ビニルが選ばれることが多い。[Prior Art] Fig. 7 is a diagram showing an example of the structure of a cleaning bench that has been used in processes such as semiconductor manufacturing. Partition plate 2 for carrying out cleaning work by placing the partition plate 2
It is shown that it consists of a through hole 3 for drainage provided in the drain, a drainage collection port 4, etc. FIG. 8 is a plan view (a) and a cross-sectional view (b) showing an example of the structure of the partition plate 2. For example, the partition plate 2 has a thickness of several mm.
A punching board type material is often used, in which a through hole 3 with a diameter of several mm is made in a vinyl chloride plate of about 100 mL. Note that the materials constituting the partition plate 2 include acids such as sulfuric acid, hydrochloric acid, and phosphoric acid used for cleaning and etching,
Vinyl chloride is generally selected because of its chemical resistance to alkalis such as aqueous ammonia and potassium hydroxide, processability, and low cost.
【０００３】0003
【発明が解決しようとする課題】しかしながら、上記の
ような従来構造の洗浄ベンチにおいては、水や薬品等の
液体をパンチングボード形式の仕切板２の上方から流し
た場合に、液体が跳上がるという問題があった。[Problems to be Solved by the Invention] However, in the conventional cleaning bench as described above, when liquid such as water or chemicals is poured from above the punching board type partition plate 2, the liquid jumps up. There was a problem.
【０００４】図９は液体の跳上り現象を説明するための
図で、水もしくは薬品の供給管１から流出させた液体５
はまず仕切板の上面（２‐ａ）に衝突し、仕切板２と平
行の方向に向きを変え、該液体５が貫通孔３に達すると
、やや下方に向きを変えて貫通孔３の側壁（３‐ａ）に
衝突し、その一部が上方に向きを変える。この上方に向
きを替えた液体（５‐ａ）が跳上り液を形成することに
なる。FIG. 9 is a diagram for explaining the liquid jumping phenomenon, in which the liquid 5 flowing out from the water or chemical supply pipe 1
The liquid 5 first collides with the upper surface (2-a) of the partition plate, changes its direction in a direction parallel to the partition plate 2, and when the liquid 5 reaches the through hole 3, changes its direction slightly downward and hits the side wall of the through hole 3. It collides with (3-a), and part of it turns upward. This upwardly directed liquid (5-a) forms a jumping liquid.
【０００５】このようにして跳上った液体は仕切板２の
上に置いた洗浄治具や被洗浄物に付着してこれらを汚染
する原因となる。このため、洗浄操作時に液体の跳上り
現象の発生の少ない仕切板構造を有する洗浄ベンチの出
現が要望されていた。[0005] The liquid that has jumped up in this way adheres to the cleaning jig placed on the partition plate 2 and the objects to be cleaned, causing contamination thereof. For this reason, there has been a demand for a cleaning bench having a partition plate structure that reduces the occurrence of liquid splashing during cleaning operations.
【０００６】本発明の目的は、上記従来技術の有してい
た課題を解決して、洗浄操作に際して水、薬品等の液体
の跳上り現象の発生の少ない洗浄ベンチを提供すること
にある。SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art and to provide a cleaning bench in which splashing of water, chemicals, and other liquids is less likely to occur during cleaning operations.
【０００７】[0007]
【課題を解決するための手段】上記目的は、排水用の貫
通孔を設けた仕切板を有する洗浄用設備において、上記
貫通孔の開口面積が上部に比べ下部が大きい仕切板を有
する構成の洗浄ベンチとすることによって達成すること
ができる。[Means for Solving the Problems] The above object is to provide a cleaning equipment having a partition plate with a through hole for drainage, which has a partition plate in which the opening area of the through hole is larger in the lower part than in the upper part. This can be achieved by benching.
【０００８】[0008]
【作用】上記構成とすることによる液体の跳上り防止の
作用は、貫通孔の側壁に達した水もしくは薬品等の液体
が貫通孔側壁に衝突した時に、大半が下向きに反射され
て、上方に跳上がる成分が極めて少なくなることによる
ものである。[Function] The above structure prevents liquid from jumping up. When water or liquid such as chemicals that reaches the side wall of the through hole collides with the side wall of the through hole, most of it is reflected downward and upward. This is because the amount of components that jump up becomes extremely small.
【０００９】[0009]
【実施例】本発明洗浄ベンチの構成について、以下、実
施例によって具体的に説明する。[Example] The structure of the cleaning bench of the present invention will be specifically explained below by referring to an example.
【００１０】0010
【実施例１】図１は本発明洗浄ベンチの一実施例の構成
を示す局部断面図で、仕切板２に設けた貫通孔３付近の
拡大断面を示した図である。ここで、貫通孔側壁（３‐
ａ）は仕切板２の上面から下面にかけて開口面積が大き
くなる方向に逆テーパー状になっており、これによって
、図２に示すように、貫通孔側壁（３‐ａ）に衝突した
水もしくは薬品等の液体５の大部分は下方に方向を変え
、仕切板２の上部方向への跳上りが極めて少なくなる。Embodiment 1 FIG. 1 is a partial sectional view showing the structure of an embodiment of the cleaning bench of the present invention, and is an enlarged sectional view of the vicinity of a through hole 3 provided in a partition plate 2. Here, the side wall of the through hole (3-
a) has a reverse tapered shape in the direction in which the opening area increases from the top surface to the bottom surface of the partition plate 2, so that water or chemicals that collide with the through-hole side wall (3-a), as shown in FIG. Most of the liquid 5 changes its direction downward, and the amount of the liquid 5 jumping up toward the top of the partition plate 2 is extremely reduced.
【００１１】なお、仕切板上面（２‐ａ）と貫通孔側壁
（３‐ａ）とがなす角度θは、９０°未満でかつ可能な
範囲で小さければ小さいほど跳上り抑制効果は大きくな
る。[0011] The angle θ between the top surface of the partition plate (2-a) and the side wall of the through hole (3-a) is less than 90° and as small as possible, the greater the effect of suppressing jumping.
【００１２】0012
【実施例２】図３は本発明洗浄ベンチの他の実施例の構
成を示す局部断面図で、この図は、実施例１の場合貫通
孔の径が下方に向かって直線的に広がっているのに対し
て、曲線状に広がっていることを示す。[Embodiment 2] Fig. 3 is a partial sectional view showing the configuration of another embodiment of the cleaning bench of the present invention, and this figure shows that in the case of Embodiment 1, the diameter of the through hole expands linearly downward. In contrast, it shows that it spreads out in a curved manner.
【００１３】この場合も、実施例１と同様な効果が得ら
れる。[0013] In this case as well, the same effects as in the first embodiment can be obtained.
【００１４】[0014]
【実施例３、４】図４及び図５は本発明洗浄ベンチのさ
らに他の実施例の構成を示す局部断面図で、これらは、
下方に向かって広がっている貫通孔の断面形状が途中で
屈曲していることを示したものである。[Embodiments 3 and 4] FIGS. 4 and 5 are local sectional views showing the configuration of still other embodiments of the cleaning bench of the present invention, and these are:
This figure shows that the cross-sectional shape of the through hole, which is expanding downward, is bent in the middle.
【００１５】この場合も実施例１及び２と同様な効果が
得られる。[0015] In this case as well, the same effects as in Examples 1 and 2 can be obtained.
【００１６】なお、これらの場合には、跳上り防止に寄
与する効果が最も大きい側壁上部のみを集中的に逆テー
パー状としているため、貫通孔下部の開口面積が必要以
上に大きくなることが避けられ、これによって、仕切板
の強度保持や貫通孔の高密度配置などが可能となる。[0016] In these cases, since only the upper part of the side wall, which has the greatest effect in preventing jump-up, is invertedly tapered, the opening area at the lower part of the through hole is prevented from becoming larger than necessary. This makes it possible to maintain the strength of the partition plate and arrange the through holes at a high density.
【００１７】[0017]
【実施例５】図６は本発明洗浄ベンチのさらに他の実施
例の構成を示す局部断面図で、この場合は、厚さ Ｔ
でかつ開口面積 Ｓ１を有する貫通孔（３‐１）を持つ
仕切板上に、Ｔよりも十分に薄い厚さ ｔ でかつ開口
面積 Ｓ１よりも小さな開口面積 Ｓ２を有する貫通孔
（３‐２）を持つ仕切板を重ね合わせた構成からなるこ
とを示す。[Embodiment 5] FIG. 6 is a local sectional view showing the structure of still another embodiment of the cleaning bench of the present invention, in which the thickness T
On a partition plate having a through hole (3-1) which is large and has an opening area S1, a through hole (3-2) which has a thickness t sufficiently thinner than T and has an opening area S2 smaller than the opening area S1. This indicates that the structure consists of overlapping partition plates with .
【００１８】この場合、厚さ ｔ が可能な範囲で薄い
ほど跳上り抑制効果が高い。このときに、厚さ Ｔ は
、液体の跳上りに関係なく、機械的強度保持の面のみか
ら厚さを設定することができる。なお、この構造は、単
一の部材で形成しても良いし、厚さの異なる２種の仕切
板を重ね合わせた構造であっても良い。[0018] In this case, the thinner the thickness t is within the possible range, the higher the jump suppression effect is. At this time, the thickness T can be set only from the viewpoint of maintaining mechanical strength, regardless of the splashing of the liquid. Note that this structure may be formed from a single member, or may be a structure in which two types of partition plates having different thicknesses are stacked one on top of the other.
【００１９】なお、貫通孔開口面の平面形状は、本発明
で示した断面形状を満足する限り、特に限定されるもの
ではなく、円、楕円、長方形等どのような形状でも良い
。The planar shape of the opening surface of the through hole is not particularly limited as long as it satisfies the cross-sectional shape shown in the present invention, and may be any shape such as a circle, an ellipse, or a rectangle.
【００２０】[0020]
【発明の効果】以上述べてきたように、半導体製造など
に用いる洗浄ベンチを本発明構成の洗浄ベンチとするこ
とによって、従来技術の有していた課題を解決して、洗
浄操作の際に水もしくは薬品等の液体の跳上り現象の発
生の少ない、従って被洗浄物の再汚染の恐れの少ない洗
浄ベンチを提供することができた。[Effects of the Invention] As described above, by using a cleaning bench configured according to the present invention as a cleaning bench used in semiconductor manufacturing, etc., the problems of the prior art can be solved, and water can be removed during cleaning operations. Alternatively, it is possible to provide a cleaning bench in which splashing of chemicals and other liquids is less likely to occur, and therefore, there is less risk of re-contamination of objects to be cleaned.
【図１】本発明洗浄ベンチの一実施例の構成を示す局部
断面図。FIG. 1 is a partial sectional view showing the configuration of an embodiment of the cleaning bench of the present invention.
【図２】液体の跳上りの防止を説明するための断面図。FIG. 2 is a sectional view for explaining prevention of liquid splashing.
【図３】本発明洗浄ベンチの他の実施例の構成を示す局
部断面図。FIG. 3 is a partial sectional view showing the configuration of another embodiment of the cleaning bench of the present invention.
【図４】本発明洗浄ベンチのさらに他の実施例の構成を
示す断面図。FIG. 4 is a sectional view showing the configuration of still another embodiment of the cleaning bench of the present invention.
【図５】本発明洗浄ベンチのさらに他の実施例の構成を
示す断面図。FIG. 5 is a sectional view showing the configuration of still another embodiment of the cleaning bench of the present invention.
【図６】本発明洗浄ベンチのさらに他の実施例の構成を
示す断面図。FIG. 6 is a sectional view showing the configuration of still another embodiment of the cleaning bench of the present invention.
【図７】従来技術の洗浄ベンチの構成を示す断面図。FIG. 7 is a sectional view showing the configuration of a conventional cleaning bench.
【図８】図７の仕切板の構造例を示す平面図（ａ）及び
断面図（ｂ）。8A and 8B are a plan view (a) and a cross-sectional view (b) showing a structural example of the partition plate shown in FIG. 7;
【図９】液体の跳上り現象を説明するための断面図。FIG. 9 is a cross-sectional view for explaining the phenomenon of liquid jumping up.
１…水もしくは薬品の供給管、２…仕切板、２‐ａ…仕
切板上面、３、３‐１、３‐２…貫通孔、３‐ａ…貫通
孔側壁、４…排液収集口、 ５、５‐ａ…液体。1... Water or chemical supply pipe, 2... Partition plate, 2-a... Upper surface of partition plate, 3, 3-1, 3-2... Through hole, 3-a... Through hole side wall, 4... Drainage collection port, 5,5-a...Liquid.
Claims (1)
浄用設備において、上記貫通孔の開口面積が上部に比べ
下部が大きいことを特徴とする洗浄ベンチ。1. A cleaning bench comprising a partition plate provided with a through-hole for drainage, wherein the opening area of the through-hole is larger at the lower part than at the upper part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9033291A JPH04321227A (en) | 1991-04-22 | 1991-04-22 | Cleaning bench |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9033291A JPH04321227A (en) | 1991-04-22 | 1991-04-22 | Cleaning bench |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04321227A true JPH04321227A (en) | 1992-11-11 |
Family
ID=13995566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9033291A Pending JPH04321227A (en) | 1991-04-22 | 1991-04-22 | Cleaning bench |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04321227A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005268572A (en) * | 2004-03-19 | 2005-09-29 | Dainippon Screen Mfg Co Ltd | Substrate treating device |
-
1991
- 1991-04-22 JP JP9033291A patent/JPH04321227A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005268572A (en) * | 2004-03-19 | 2005-09-29 | Dainippon Screen Mfg Co Ltd | Substrate treating device |
| JP4509613B2 (en) * | 2004-03-19 | 2010-07-21 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20090101285A1 (en) | Wafer spin chuck and an etcher using the same | |
| JPH04321227A (en) | Cleaning bench | |
| EP3363535A1 (en) | Float and evaporation suppressing method | |
| CN211743108U (en) | Wafer basket tool | |
| JPH0864667A (en) | Cassette for semiconductor wafer | |
| JP2006272053A (en) | Water treatment device | |
| US6732749B2 (en) | Particle barrier drain | |
| CN210474916U (en) | Micro-lens cleaning clamp and micro-lens cleaning device | |
| WO2023287399A1 (en) | Sink accessory railing system | |
| CN217289499U (en) | Quick-draining flushing tank | |
| JP4073685B2 (en) | Rolling seismic isolation device | |
| CN212292765U (en) | Liquid feeding auxiliary device, cleaning machine and etching machine | |
| KR102388646B1 (en) | substrate processing equipment | |
| JPH0254528A (en) | Manufacturing device for semiconductor device | |
| JP3154262B2 (en) | Structure of current plate in cleaning tank and method of manufacturing substrate | |
| JP2604243Y2 (en) | Liquid storage tank with rectification wall | |
| JP4537236B2 (en) | Electronic component storage tray | |
| JP3001423U (en) | Storage battery foot cover | |
| JPH0642333Y2 (en) | Processing tank for semiconductor materials | |
| JP2006237032A (en) | Capacitor | |
| JPH10144645A (en) | Cleaning tank | |
| KR20200117207A (en) | Boat jig for semiconductor package manufacturing process | |
| JPH0653197A (en) | Semiconductor substrate treatment device | |
| CN201859845U (en) | Leakage receiving disc and wafer etching system | |
| JPS6212471Y2 (en) |