JPH04313300A - Flexible printed wiring board - Google Patents
Flexible printed wiring boardInfo
- Publication number
- JPH04313300A JPH04313300A JP7794691A JP7794691A JPH04313300A JP H04313300 A JPH04313300 A JP H04313300A JP 7794691 A JP7794691 A JP 7794691A JP 7794691 A JP7794691 A JP 7794691A JP H04313300 A JPH04313300 A JP H04313300A
- Authority
- JP
- Japan
- Prior art keywords
- wires
- printed wiring
- wiring board
- flexible printed
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 abstract description 59
- 239000012790 adhesive layer Substances 0.000 abstract description 10
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- -1 polydimethylsiloxane Polymers 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920006294 polydialkylsiloxane Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
Abstract
Description
【０００１】0001
【産業上の利用分野】この発明は、フレキシブルプリン
ト配線板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to flexible printed wiring boards.
【０００２】0002
【従来の技術】従来より、電子機器では、絶縁基材の片
面または両面に導体回路を形成したプリント配線板に、
半導体素子等の電子部品を実装することが行われている
。また、電子部品が実装されたプリント配線板同士また
はプリント配線板と他の機器とを接続する場合には、誤
配線が無く、接続容易なフラットケーブルがよく用いら
れている。[Prior Art] Conventionally, in electronic equipment, printed wiring boards with conductor circuits formed on one or both sides of an insulating base material are used.
BACKGROUND ART Electronic components such as semiconductor devices are being mounted. Further, when connecting printed wiring boards on which electronic components are mounted or between printed wiring boards and other equipment, flat cables are often used because they are free from miswiring and are easy to connect.
【０００３】ところで、近年、電子機器から発生する電
磁ノイズが、他の電子機器に電波障害をもたらすことが
知られるようになり、プリント配線板等から発生する電
磁ノイズに関する規制が進んでいる。このため、銅、ニ
ッケル、アルミニウム等からなるシールド層を備えたプ
リント配線板が提案されている（例えば、日刊工業新聞
社刊行のプリント配線技術読本、５６〜６１ページ、「
電磁波シールドプリント配線板」参照）。また、フラッ
トケーブルでは、信号線が平行に配設されており、クロ
ストークが発生し易いため、信号線間にアース線を配置
して、クロストークの発生を防止することが提案されて
いる（前述のプリント配線技術読本、１２４〜１０５ペ
ージ、「フラットケーブルを用いた基板間の接続」参照
）。Incidentally, in recent years, it has become known that electromagnetic noise generated from electronic devices causes radio wave interference to other electronic devices, and regulations regarding electromagnetic noise generated from printed wiring boards and the like are progressing. For this reason, printed wiring boards equipped with a shield layer made of copper, nickel, aluminum, etc. have been proposed (for example, printed wiring technology reader published by Nikkan Kogyo Shimbun, pages 56-61, "
(See “Electromagnetic Shielding Printed Wiring Board”). In addition, in a flat cable, the signal lines are arranged in parallel, and crosstalk is likely to occur, so it has been proposed to place a ground wire between the signal lines to prevent the occurrence of crosstalk ( (See the aforementioned Printed Wiring Technology Handbook, pages 124-105, "Connection between boards using flat cables").
【０００４】また、近年、電子機器においては、電子部
品を高密度実装することが行われており、占有空間の小
さな配線板等が要求されている。[0004] Furthermore, in recent years, electronic components have been mounted in high density in electronic equipment, and wiring boards and the like that occupy a small amount of space are required.
【０００５】[0005]
【発明が解決しようとする課題】しかし、上記プリント
配線板とフラットケーブルとを用いた電子機器では、そ
れらの占有空間が大きいため、電子部品の高密度実装を
充分図ることができないという問題があった。このため
、可撓性を有する絶縁層上に導体回路および信号線を形
成し、配線板と接続ケーブルとを一体化したフレキシブ
ルプリント配線板が使用される場合がある。[Problem to be Solved by the Invention] However, electronic devices using the above-mentioned printed wiring board and flat cable have a problem in that the space occupied by them is large, making it impossible to achieve high-density mounting of electronic components. Ta. For this reason, a flexible printed wiring board is sometimes used in which a conductor circuit and a signal line are formed on a flexible insulating layer, and a wiring board and a connection cable are integrated.
【０００６】しかし、従来のフレキシブルプリント配線
板では、電磁ノイズおよびクロストークに対する対策が
不十分であったため、電磁ノイズによる誤作動が生じ易
いと共に、信号線間でクロストークが発生し易く、信頼
性に欠けるという問題があった。本発明は、上記問題に
鑑みてなされたものであって、電磁シールド性およびク
ロストーク防止性に優れ、高い信頼性を有すると共に、
電子機器の高密度化をすすめることができるフレキシブ
ルプリント配線板を提供することを目的とする。However, in conventional flexible printed wiring boards, countermeasures against electromagnetic noise and crosstalk have not been sufficient, so malfunctions due to electromagnetic noise are likely to occur, and crosstalk is likely to occur between signal lines, resulting in poor reliability. There was a problem that there was a lack of The present invention has been made in view of the above problems, and has excellent electromagnetic shielding properties and crosstalk prevention properties, high reliability, and
The purpose of the present invention is to provide a flexible printed wiring board that can promote high density electronic equipment.
【０００７】[0007]
【問題を解決するための手段】上記問題を解決するため
のこの発明のフレキシブルプリント配線板は、可撓性を
有する二つの絶縁層間に、信号線とアース線とが平行か
つ交互に配列されており、上記絶縁層の少なくとも一方
の外面にシールド層が形成されていることを特徴とする
。[Means for Solving the Problems] In order to solve the above problems, the flexible printed wiring board of the present invention has signal lines and ground lines arranged in parallel and alternately between two flexible insulating layers. A shield layer is formed on the outer surface of at least one of the insulating layers.
【０００８】また、この発明に係るフレキシブルプリン
ト配線板では、アース線のうちの任意のアース線をシー
ルド層に電気的に接続するための接続手段を備えていて
もよく、さらに全てのアース線が、シールド層に電気的
に接続するための接続手段を備えていてもよい。Further, the flexible printed wiring board according to the present invention may be provided with a connecting means for electrically connecting any of the ground wires to the shield layer, and all the ground wires may be connected electrically to the shield layer. , a connecting means for electrically connecting to the shield layer may be provided.
【０００９】[0009]
【作用】上記フレキシブルプリント配線板では、信号線
間に配列されたアース線により信号線間でクロストーク
が生じることを防止できると共に、シールド層により空
間電磁波が信号線を流れる信号に影響を与えることを防
止できるので、上記信号線は、流れる信号が外部からの
電気的影響を受けず、且つ外部に対して不要なノイズを
発することのない、いわゆる各芯シールド性を有してい
る。[Function] In the above flexible printed wiring board, the ground wires arranged between the signal lines can prevent crosstalk between the signal lines, and the shield layer can prevent spatial electromagnetic waves from affecting the signals flowing through the signal lines. Therefore, the signal line has a so-called core-shielding property, in which the flowing signal is not electrically influenced by the outside and does not emit unnecessary noise to the outside.
【００１０】特に、アース線のうち、任意のアース線を
上記接続手段により、シールド層に電気的に接続した場
合は、当該アース線のクロストーク防止性を高めること
ができる。さらに、全てのアース線が接続手段によりシ
ールド層に電気的に接続されている場合は、クロストー
クをより確実に防止できる。[0010] In particular, when any of the ground wires is electrically connected to the shield layer by the above connection means, the crosstalk prevention properties of the ground wire can be improved. Furthermore, if all the ground wires are electrically connected to the shield layer by connecting means, crosstalk can be more reliably prevented.
【００１１】[0011]
【実施例】以下、実施例に基づき、本発明をより詳細に
説明する。図１は、本発明に係るフレキシブルプリント
配線板Ａの一実施例を示す断面図である。このフレキシ
ブルプリント配線板Ａでは、絶縁層１上に、接着剤層２
ａを介して信号線３およびアース線４が交互に接着され
ている。また、信号線３およびアース線４上には、接着
剤層２ｂを介して第２絶縁層５が積層されている。さら
に、絶縁層１および第２絶縁層５の外側の面には、シー
ルド層６，６１が接着剤層２ｃを介して積層されている
。[Examples] The present invention will be explained in more detail below based on Examples. FIG. 1 is a sectional view showing an embodiment of a flexible printed wiring board A according to the present invention. In this flexible printed wiring board A, an adhesive layer 2 is formed on an insulating layer 1.
Signal wires 3 and ground wires 4 are alternately bonded via a. Further, a second insulating layer 5 is laminated on the signal line 3 and the ground line 4 with an adhesive layer 2b interposed therebetween. Furthermore, shield layers 6 and 61 are laminated on the outer surfaces of the insulating layer 1 and the second insulating layer 5 via the adhesive layer 2c.
【００１２】また、全てのアース線４は、貫通孔の内壁
面７１に金属層７２を形成したスルーホール７により、
シールド層６，６１と電気的に接続されている。このフ
レキシブルプリント配線板Ａでは、信号線３間に配置さ
れたアース線４により、信号線３間でクロストークが生
じることを防止できる。また、上記シールド層６，６１
により、空間電磁波を、信号線３から遮断できる。従っ
て、上記各信号線３は、流れる信号が外部からの電気的
影響を受けず、且つ外部に対して不要なノイズを発する
ことのない、いわゆる各心シールド性を有している。ま
た、全てのアース線４は、スルーホール７によりシール
ド層６，６１に電気的に接続されているので、信号線３
の各芯シールド性は高いものである。Furthermore, all the ground wires 4 are connected to each other through a through hole 7 in which a metal layer 72 is formed on an inner wall surface 71 of the through hole.
It is electrically connected to the shield layers 6 and 61. In this flexible printed wiring board A, the ground wire 4 disposed between the signal lines 3 can prevent crosstalk between the signal lines 3. In addition, the shield layers 6, 61
As a result, spatial electromagnetic waves can be blocked from the signal line 3. Therefore, each of the signal lines 3 has so-called core shielding properties, in which flowing signals are not electrically influenced by the outside and do not emit unnecessary noise to the outside. In addition, since all the ground wires 4 are electrically connected to the shield layers 6 and 61 through the through holes 7, the signal wires 4
The shielding properties of each core are high.
【００１３】上記シールド層６，６１およびスルーホー
ル７の金属層７２としては、銀、銅、アルミニウム、ニ
ッケルまたはこれら金属の複合系（例えば、積層体、合
金等）によって形成すればよい。また、シールド層６，
６１は、上記金属またはその複合系からなる導体薄膜を
接着剤層２ａ，２ｃを介して貼り付ける方法で形成して
もよいし、導電性塗料を塗布する方法、無電解メッキ法
、蒸着法、スパッタリング法またはイオンプレーティン
グ法により形成することもできる。The shield layers 6, 61 and the metal layer 72 of the through hole 7 may be formed of silver, copper, aluminum, nickel, or a composite system (eg, a laminate, an alloy, etc.) of these metals. In addition, the shield layer 6,
61 may be formed by pasting a conductive thin film made of the metal or a composite thereof via adhesive layers 2a and 2c, by applying a conductive paint, by electroless plating, by vapor deposition, It can also be formed by a sputtering method or an ion plating method.
【００１４】一方、スルーホール７の金属層７２は、貫
通孔内壁面７１に、導電性塗料を塗布する方法、無電解
メッキ法、蒸着法、スパッタリング法またはイオンプレ
ーティング法により形成することができる。絶縁層１お
よび第２絶縁層５としては、ポリエステル系、ポリイミ
ド系、ガラスエポキシ系、ガラステフロン系、ポリアミ
ドイミド系、ポリ塩化ビニル系等の可撓性を有する従来
公知のフィルムが利用できる。On the other hand, the metal layer 72 of the through hole 7 can be formed on the inner wall surface 71 of the through hole by applying a conductive paint, electroless plating, vapor deposition, sputtering, or ion plating. . As the insulating layer 1 and the second insulating layer 5, conventionally known flexible films such as polyester-based, polyimide-based, glass epoxy-based, glass Teflon-based, polyamide-imide-based, polyvinyl chloride-based, etc. can be used.
【００１５】接着剤層２ａ，２ｂ，２ｃとしては、上記
シールド層６，６１と、絶縁層１または第２絶縁層５と
の両方に対して高い接着性を有する化合物からなるもの
であればよく、エポキシ系、ウレタン系、ポリエステル
系、またはポリジメチルシロキサン、ポリジエチルシロ
キサン、ポリメチルエチルシロキサン等のポリジアルキ
ルシロキサンまたはポリアクリロニトリル等を成分とす
る従来公知の接着剤を用いることができる。The adhesive layers 2a, 2b, 2c may be made of a compound that has high adhesiveness to both the shield layers 6, 61 and the insulating layer 1 or the second insulating layer 5. , epoxy, urethane, polyester, or a conventionally known adhesive containing polydialkylsiloxane such as polydimethylsiloxane, polydiethylsiloxane, polymethylethylsiloxane, or polyacrylonitrile can be used.
【００１６】上記信号線３およびアース線４を構成する
金属材料としては、銅、銀、ニッケル、アルミニウム、
またはこれら金属の複合系が挙げられる。また、それら
の厚みは、通常、１８〜７５μｍの範囲内であることが
好ましい。信号線３およびアース線４の形成方法として
は、絶縁層１の表面に積層された上記金属材料からなる
薄膜の不要部分をエッチング除去するいわゆるサブスト
ラクティブ法、絶縁層１表面の信号線３およびアース線
４として必要な部分にのみ金属材料を堆積させるアディ
ティブ法、サブストラクティブ法とアディティブ法とを
組み合わせたセミストラクティブ法等の従来公知の方法
を適用することができる。Metal materials constituting the signal line 3 and the ground line 4 include copper, silver, nickel, aluminum,
Or a composite system of these metals may be mentioned. Moreover, it is preferable that those thicknesses are usually within the range of 18 to 75 μm. The signal line 3 and the ground line 4 can be formed using a so-called substructive method in which unnecessary parts of the thin film made of the metal material laminated on the surface of the insulating layer 1 are etched away, and the signal line 3 and the ground line 4 on the surface of the insulating layer 1 are Conventionally known methods can be applied, such as an additive method in which the metal material is deposited only on the portions necessary for the line 4, and a semistructural method in which a substructive method and an additive method are combined.
【００１７】この発明にかかるフレキシブルプリント配
線板は、上記実施例に限定されるものではない。例えば
、図２に示されるフレキシブルプリント配線板Ａ１のよ
うに、絶縁層５上にのみシールド層６を形成してもよく
、図３に示されるフレキシブルプリント配線板Ａ２のよ
うに、側面にもシールド層を形成して、その外周全体を
シールド層６で被覆したものとしてもよい。The flexible printed wiring board according to the present invention is not limited to the above embodiments. For example, as in the flexible printed wiring board A1 shown in FIG. 2, the shield layer 6 may be formed only on the insulating layer 5, and as in the flexible printed wiring board A2 shown in FIG. It is also possible to form a layer and cover the entire outer periphery with the shield layer 6.
【００１８】また、アース線４は、図２に示したフレキ
シブルプリント配線板Ａ１のように、その内の幾つかが
、上記スルーホール７によりシールド層６，６１と電気
的に接続されていても、シールド層６，６１と電気的に
接続されていなくてもよい。さらに、各アース線４とシ
ールド層６，６１との導通箇所は、単数でも複数でもよ
い。Further, even if some of the ground wires 4 are electrically connected to the shield layers 6, 61 through the through holes 7 as in the flexible printed wiring board A1 shown in FIG. , may not be electrically connected to the shield layers 6, 61. Furthermore, the number of electrically conductive locations between each ground wire 4 and the shield layers 6, 61 may be one or more.
【００１９】なお、信号線３とアース線４とは、どちら
が外側にあってもよい。
具体例１
厚さ２５μｍのポリイミドイフィルムの表面に、厚さ３
４μｍの銅箔を、ウレタン系接着剤からなる厚さ２５μ
ｍの接着剤層を介して接着した。次いで、この銅箔をエ
ッチングして、幅４００μｍの信号線１０本とアース線
１１本とを３００μｍの間隔で交互に形成した。Note that either the signal line 3 or the ground line 4 may be located on the outside. Specific example 1 On the surface of a 25 μm thick polyimide film, a layer with a thickness of 3
A 4μm copper foil is coated with a 25μ thick urethane adhesive.
It was bonded through an adhesive layer of m. Next, this copper foil was etched to form 10 signal lines and 11 ground lines each having a width of 400 μm alternately at intervals of 300 μm.
【００２０】そして、この信号線およびアース線上に、
ウレタン系接着剤からなる厚さ２５μｍの接着剤層を介
し、厚さ２５μｍのポリイミドフィルムを積層した。こ
の積層体の信号線が形成された部分に、エキシマレーザ
をもちいて、直径２００μｍの孔を形成したのち、その
両面に、蒸着法によりに厚さ５μｍの銅からなるシール
ド層を形成した。[0020] Then, on this signal line and ground line,
A 25 μm thick polyimide film was laminated via a 25 μm thick adhesive layer made of a urethane adhesive. A hole with a diameter of 200 μm was formed using an excimer laser in the portion of the laminate where the signal line was formed, and then a shield layer made of copper with a thickness of 5 μm was formed on both sides of the hole by vapor deposition.
【００２１】そして、上記シールド層上に、厚さ２５μ
ｍのウレタン系接着剤層を介して、厚さ２５μｍポリイ
ミドフィルムをプレス圧着することにより積層し、図１
に示す構造を有するフレキシブルプリント配線板を得た
。得られたフレキシブルプリント配線板は、厚さ２４５
μｍ、幅１５ｍｍであった。これを、各芯シールド性を
有する１０芯の細芯同軸フラットケーブルと比較すると
、当該フラットケーブルは、厚さ１．５ｍｍ、幅１５ｍ
ｍであるので、上記フレキシブルプリント配線板の厚み
は、フラットケーブルの１／６であった。[0021] Then, on the above shield layer, a layer with a thickness of 25 μm is applied.
A 25 μm thick polyimide film was laminated by press bonding through a urethane adhesive layer of
A flexible printed wiring board having the structure shown in was obtained. The obtained flexible printed wiring board has a thickness of 245 mm.
The width was 15 mm. Comparing this with a 10-core fine-core coaxial flat cable that has shielding properties for each core, the flat cable has a thickness of 1.5 mm and a width of 15 m.
m, the thickness of the flexible printed wiring board was 1/6 that of the flat cable.
【００２２】また、このフレキシブルプリント配線板に
ついて、スペクトラムアナライザを用いて１０ＭＨｚの
減衰率を調べたところ、その減衰率は１０ｄＢであった
。また、信号線間のクロストークは発生しなかった。
具体例２
実施例１と同様にして、厚さ５０μｍ、幅８００μｍの
信号線とアース線とを、４７０μｍの間隔で交互に形成
し、その上に実施例１と同様にして、ポリイミドフィル
ムを積層した。[0022] Furthermore, when the attenuation rate of this flexible printed wiring board at 10 MHz was examined using a spectrum analyzer, the attenuation rate was 10 dB. Further, no crosstalk between signal lines occurred. Specific Example 2 In the same manner as in Example 1, signal lines and ground lines each having a thickness of 50 μm and a width of 800 μm were alternately formed at intervals of 470 μm, and a polyimide film was laminated thereon in the same manner as in Example 1. did.
【００２３】ついで、該ポリイミドフィルム上に導電性
塗料として銅ペーストを塗布し、厚さ２５μｍのシール
ド層を形成し、図２に示した構造を有するフレキシブル
プリント配線板を得た。なお、この際、予め上記絶縁層
のアース線が形成されている部分に直径１ｍｍの孔を形
成しておき、シールド層とアース線との間の導通を確保
した。Next, copper paste was applied as a conductive paint onto the polyimide film to form a shield layer with a thickness of 25 μm, thereby obtaining a flexible printed wiring board having the structure shown in FIG. 2. At this time, a hole with a diameter of 1 mm was previously formed in the portion of the insulating layer where the ground wire was formed to ensure continuity between the shield layer and the ground wire.
【００２４】また、このフレキシブルプリント配線板に
ついて、スペクトラムアナライザを用いて１０ＭＨｚの
減衰率を調べたところ、その減衰率は８ｄＢであった。
また、信号線間のクロストークは発生しなかった。[0024] Further, when the attenuation rate of this flexible printed wiring board at 10 MHz was examined using a spectrum analyzer, the attenuation rate was 8 dB. Further, no crosstalk between signal lines occurred.
【００２５】[0025]
【発明の効果】以上のように、本発明に係るフレキシブ
ルプリント配線板によれば、信号線が各芯シールド性を
有しており、電磁シールド性とクロストーク防止性に優
れているので、高い信頼性を備えている。また、占有空
間が極めて小さいので、電子機器の高密度化を進めるこ
とができる。[Effects of the Invention] As described above, according to the flexible printed wiring board according to the present invention, the signal line has shielding properties for each core, and has excellent electromagnetic shielding properties and crosstalk prevention properties, so that it has high It has reliability. Furthermore, since the occupied space is extremely small, it is possible to increase the density of electronic devices.
【００２６】特に、アース線のうち、任意のアース線を
上記接続手段によりシールド層に電気的に接続した場合
は、当該アース線に隣接した信号線の各芯シールド性を
高め、信頼性をより高めることができる。さらに、全て
のアース線が接続手段によりシールド層に電気的に接続
されている場合は、全ての信号線が高い各芯シールド性
を有するので、信頼性の極めて高いものである。In particular, when any ground wire among the ground wires is electrically connected to the shield layer by the above connection means, the shielding performance of each core of the signal wire adjacent to the ground wire is improved, and the reliability is further improved. can be increased. Further, when all the ground wires are electrically connected to the shield layer by the connecting means, all the signal wires have high core shielding properties, so reliability is extremely high.
【図１】本発明にかかるフレキシブルプリント配線板の
一実施例を示す説明図である。FIG. 1 is an explanatory diagram showing one embodiment of a flexible printed wiring board according to the present invention.
【図２】本発明にかかる別のフレキシブルプリント配線
板を示す説明図である。FIG. 2 is an explanatory diagram showing another flexible printed wiring board according to the present invention.
【図３】本発明にかかるさらに別のフレキシブルプリン
ト配線板を示す説明図である。FIG. 3 is an explanatory diagram showing still another flexible printed wiring board according to the present invention.
１，５ 絶縁層 ３ 信号線 ４ アース線 ６，６１ シールド層 ７ スルーホール 1, 5 Insulating layer 3 Signal line 4 Ground wire 6,61 Shield layer 7 Through hole
Claims (3)
とアース線とが平行かつ交互に配列されており、上記絶
縁層の少なくとも一方の外面にシールド層が形成されて
いることを特徴とするフレキシブルプリント配線板。Claim 1: Signal lines and ground lines are arranged parallel and alternately between two flexible insulating layers, and a shield layer is formed on the outer surface of at least one of the insulating layers. Characteristic flexible printed wiring board.
ド層に電気的に接続するための接続手段が備えられてい
る請求項１記載のフレキシブルプリント配線板。2. The flexible printed wiring board according to claim 1, further comprising connecting means for electrically connecting any one of the earth wires to the shield layer.
続するための接続手段が備えられている請求項１記載の
フレキシブルプリント配線板。3. The flexible printed wiring board according to claim 1, further comprising connection means for electrically connecting all the ground wires to the shield layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7794691A JPH04313300A (en) | 1991-04-10 | 1991-04-10 | Flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7794691A JPH04313300A (en) | 1991-04-10 | 1991-04-10 | Flexible printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04313300A true JPH04313300A (en) | 1992-11-05 |
Family
ID=13648206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7794691A Pending JPH04313300A (en) | 1991-04-10 | 1991-04-10 | Flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04313300A (en) |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06274246A (en) * | 1993-03-05 | 1994-09-30 | Internatl Business Mach Corp <Ibm> | Operation and manufacture for computer and printed circuit board |
| JPH08316686A (en) * | 1995-05-11 | 1996-11-29 | Nec Corp | High-frequency circuit device |
| GB2346264A (en) * | 1998-11-24 | 2000-08-02 | Nec Corp | Flexible printed circuit board having electromagnetic radiation shielding |
| EP1335642A2 (en) * | 2002-02-08 | 2003-08-13 | Mitsumi Electric Co., Ltd. | Flexible printed circuit with EMI protection |
| US6898844B2 (en) * | 2001-09-28 | 2005-05-31 | Intel Corporation | Method for reducing multiline effects on a printed circuit board |
| US6951806B1 (en) * | 1999-11-30 | 2005-10-04 | Sun Microsystems, Inc. | Metal region for reduction of capacitive coupling between signal lines |
| JP2006210448A (en) * | 2005-01-26 | 2006-08-10 | Nec Corp | Flex rigid wiring board and its manufacturing method |
| JP2007005782A (en) * | 2005-05-27 | 2007-01-11 | Semiconductor Energy Lab Co Ltd | Semiconductor device and manufacturing method thereof |
| JP2007129087A (en) * | 2005-11-04 | 2007-05-24 | Nippon Mektron Ltd | Hybrid multilayer circuit board and method of manufacturing same |
| JP2008300803A (en) * | 2007-06-04 | 2008-12-11 | Toshiba Corp | Flexible board and electronic apparatus |
| WO2008152827A1 (en) * | 2007-06-12 | 2008-12-18 | Nippon Mektron, Ltd. | Printed-wiring board and method for manufacturing the same |
| WO2010029611A1 (en) * | 2008-09-09 | 2010-03-18 | 富士通株式会社 | Multilayer flexible printed wiring board and electronic device |
| US20100314164A1 (en) * | 2009-06-10 | 2010-12-16 | Wu Chung-Lun | Flexible printed circuit and fabrication method thereof |
| JP2011061059A (en) * | 2009-09-11 | 2011-03-24 | Murata Mfg Co Ltd | Method for manufacturing flexible wiring board |
| JP2014011528A (en) * | 2012-06-28 | 2014-01-20 | Murata Mfg Co Ltd | Transmission line |
| JP2014011605A (en) * | 2012-06-29 | 2014-01-20 | Murata Mfg Co Ltd | Transmission line |
| CN105578740A (en) * | 2016-02-25 | 2016-05-11 | 广东欧珀移动通信有限公司 | Single-sided rigid-flex board and mobile terminal |
| JP2019016790A (en) * | 2017-07-03 | 2019-01-31 | インクテック カンパニー， リミテッドＩｎｋｔｅｃ Ｃｏ．， Ｌｔｄ． | Circuit board having electromagnetic wave shielding function and method for manufacturing the same, and flat cable |
| JP2023039599A (en) * | 2021-09-09 | 2023-03-22 | 宏達國際電子股▲ふん▼有限公司 | circuit board |
| US11700689B2 (en) | 2021-08-31 | 2023-07-11 | Htc Corporation | Circuit board |
-
1991
- 1991-04-10 JP JP7794691A patent/JPH04313300A/en active Pending
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06274246A (en) * | 1993-03-05 | 1994-09-30 | Internatl Business Mach Corp <Ibm> | Operation and manufacture for computer and printed circuit board |
| JPH08316686A (en) * | 1995-05-11 | 1996-11-29 | Nec Corp | High-frequency circuit device |
| GB2346264A (en) * | 1998-11-24 | 2000-08-02 | Nec Corp | Flexible printed circuit board having electromagnetic radiation shielding |
| GB2346264B (en) * | 1998-11-24 | 2001-02-07 | Nec Corp | Flexible board and method of fabricating the same |
| US6882858B1 (en) * | 1998-11-24 | 2005-04-19 | Nec Corporation | Flexible board and method of fabricating the same |
| US6951806B1 (en) * | 1999-11-30 | 2005-10-04 | Sun Microsystems, Inc. | Metal region for reduction of capacitive coupling between signal lines |
| US6898844B2 (en) * | 2001-09-28 | 2005-05-31 | Intel Corporation | Method for reducing multiline effects on a printed circuit board |
| EP1335642A2 (en) * | 2002-02-08 | 2003-08-13 | Mitsumi Electric Co., Ltd. | Flexible printed circuit with EMI protection |
| EP1335642A3 (en) * | 2002-02-08 | 2004-07-14 | Mitsumi Electric Co., Ltd. | Flexible printed circuit with EMI protection |
| JP2006210448A (en) * | 2005-01-26 | 2006-08-10 | Nec Corp | Flex rigid wiring board and its manufacturing method |
| JP2007005782A (en) * | 2005-05-27 | 2007-01-11 | Semiconductor Energy Lab Co Ltd | Semiconductor device and manufacturing method thereof |
| JP2007129087A (en) * | 2005-11-04 | 2007-05-24 | Nippon Mektron Ltd | Hybrid multilayer circuit board and method of manufacturing same |
| JP2008300803A (en) * | 2007-06-04 | 2008-12-11 | Toshiba Corp | Flexible board and electronic apparatus |
| WO2008152827A1 (en) * | 2007-06-12 | 2008-12-18 | Nippon Mektron, Ltd. | Printed-wiring board and method for manufacturing the same |
| WO2010029611A1 (en) * | 2008-09-09 | 2010-03-18 | 富士通株式会社 | Multilayer flexible printed wiring board and electronic device |
| EP2326156A1 (en) * | 2008-09-09 | 2011-05-25 | Fujitsu Limited | Multilayer flexible printed wiring board and electronic device |
| EP2326156A4 (en) * | 2008-09-09 | 2012-08-08 | Fujitsu Ltd | Multilayer flexible printed wiring board and electronic device |
| US8344257B2 (en) * | 2009-06-10 | 2013-01-01 | Htc Corporation | Flexible printed circuit and fabrication method thereof |
| US20100314164A1 (en) * | 2009-06-10 | 2010-12-16 | Wu Chung-Lun | Flexible printed circuit and fabrication method thereof |
| JP2011061059A (en) * | 2009-09-11 | 2011-03-24 | Murata Mfg Co Ltd | Method for manufacturing flexible wiring board |
| JP2014011528A (en) * | 2012-06-28 | 2014-01-20 | Murata Mfg Co Ltd | Transmission line |
| JP2014011605A (en) * | 2012-06-29 | 2014-01-20 | Murata Mfg Co Ltd | Transmission line |
| CN105578740A (en) * | 2016-02-25 | 2016-05-11 | 广东欧珀移动通信有限公司 | Single-sided rigid-flex board and mobile terminal |
| JP2019016790A (en) * | 2017-07-03 | 2019-01-31 | インクテック カンパニー， リミテッドＩｎｋｔｅｃ Ｃｏ．， Ｌｔｄ． | Circuit board having electromagnetic wave shielding function and method for manufacturing the same, and flat cable |
| US11700689B2 (en) | 2021-08-31 | 2023-07-11 | Htc Corporation | Circuit board |
| JP2023039599A (en) * | 2021-09-09 | 2023-03-22 | 宏達國際電子股▲ふん▼有限公司 | circuit board |
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