JPH0430575B2 - - Google Patents
Info
- Publication number
- JPH0430575B2 JPH0430575B2 JP19246182A JP19246182A JPH0430575B2 JP H0430575 B2 JPH0430575 B2 JP H0430575B2 JP 19246182 A JP19246182 A JP 19246182A JP 19246182 A JP19246182 A JP 19246182A JP H0430575 B2 JPH0430575 B2 JP H0430575B2
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- substrate
- pellicle
- mounting frame
- optical system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001681 protective effect Effects 0.000 claims description 40
- 238000001514 detection method Methods 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 33
- 238000007689 inspection Methods 0.000 claims description 30
- 230000003287 optical effect Effects 0.000 claims description 26
- 238000005286 illumination Methods 0.000 claims description 11
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 7
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/02—Investigating particle size or size distribution
- G01N15/0205—Investigating particle size or size distribution by optical means
- G01N2015/0238—Single particle scatter
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N2021/4792—Polarisation of scatter light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/10—Scanning
- G01N2201/105—Purely optical scan
- G01N2201/1053—System of scan mirrors for composite motion of beam
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、取付枠上にペリクル保護膜を取付け
たペリクル保護膜体を、回路パターンを形成した
レチクル等の基板に装着することによつて形成さ
れたペリクル保護膜体装着基板に対して取付枠で
囲まれた基板表面に存在する異物を検出するため
のペリクル付基板の異物検査装置に関するもので
ある。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention provides a method for forming a pellicle protective film body by attaching a pellicle protective film body, in which a pellicle protective film is attached to a mounting frame, to a substrate such as a reticle on which a circuit pattern is formed. The present invention relates to a foreign matter inspection device for a substrate with a pellicle for detecting foreign matter present on the surface of a substrate with a pellicle protective film body surrounded by a mounting frame.
第１図は、投影露光する回路パターンを形成し
たレチクル等の基板への異物付着防止のために基
板に装着されたペリクル保護膜体を示す。このペ
リクル保護膜体はペリクル保護膜２とペリクル保
護膜２の取付枠３とから構成される。ところで、
通常、ブランクの状態の基板に、回路パターンを
描画によつて形成するため、回路パターンが形成
される位置に非常に大きなばらつきを有すること
になる。そして、ペリクル保護膜体の枠３と基板
１とは、上記回路パターンの位置に合わせて回路
パターンが枠内に入るように、接着剤又は、両面
接着テープ等により固定装着される。そのため、
ペリクル保護膜体が装着される基板上の位置も当
然、大幅にばらつくことになる。ここで領域５
は、基板上の回路パターン領域である。従つて基
板１にペリクル保護膜体を装着した状態で、枠３
に囲まれた基板上の異物検査を行なう場合、第２
図に示すように枠３の内側に回路パターン領域５
より大きな有効検査領域４を指定する必要があ
る。ところで、前記の如く、枠３と基板１との相
対的な取付位置関係には、ばらつきがあるため、
基板１を基準にして有効検査領域４を設定したの
では、有効検査領域４がずれてしまうと共に枠３
と干渉する場合が生じてしまうことになる。その
ため、従来の異物検査装置においては、基板毎に
取付枠の位置を人が測定し、領域を人が指定する
という手間を要することになると共に人が付く必
要があるという課題を有していた。また、取付の
ばらつきを無視できるように、回路パターン領域
５に比べて十分大きな枠を持つたペリクル保護膜
体を使用しなければならない。しかし、基板上の
枠の外側には、基板を露光装置に設置した際の位
置決め用のマークが形成されており、回路パター
ン領域５に比べて十分大きな枠を持つたペリクル
保護膜体を使用することは、実際上難しいという
課題を有していた。なお、６，７はレチクル等の
基板の中心線である。
FIG. 1 shows a pellicle protective film body attached to a substrate to prevent foreign matter from adhering to the substrate, such as a reticle on which a circuit pattern to be projected and exposed is formed. This pellicle protective film body is composed of a pellicle protective film 2 and a mounting frame 3 for the pellicle protective film 2. by the way,
Since a circuit pattern is usually formed on a blank substrate by drawing, there is a large variation in the position where the circuit pattern is formed. The frame 3 of the pellicle protective film body and the substrate 1 are fixedly attached using an adhesive, double-sided adhesive tape, etc. so that the circuit pattern fits within the frame in accordance with the position of the circuit pattern. Therefore,
Naturally, the position on the substrate where the pellicle protective film body is attached also varies widely. Here area 5
is the circuit pattern area on the board. Therefore, with the pellicle protective film body attached to the substrate 1, the frame 3
When inspecting foreign objects on a board surrounded by
As shown in the figure, a circuit pattern area 5 is placed inside the frame 3.
It is necessary to specify a larger effective inspection area 4. By the way, as mentioned above, since there are variations in the relative mounting positional relationship between the frame 3 and the board 1,
If the effective inspection area 4 is set based on the board 1, the effective inspection area 4 will shift and the frame 3
This may result in interference with the For this reason, conventional foreign object inspection equipment requires a person to manually measure the position of the mounting frame for each board and specify the area, which also requires a person to be present. . Furthermore, a pellicle protective film body must be used that has a frame that is sufficiently larger than the circuit pattern area 5 so that variations in mounting can be ignored. However, marks are formed on the outside of the frame on the substrate for positioning when the substrate is installed in an exposure device, so a pellicle protective film body with a frame sufficiently large compared to the circuit pattern area 5 is used. This poses a problem that is difficult in practice. Note that 6 and 7 are center lines of a substrate such as a reticle.
〔発明の目的〕
本発明の目的は、従来技術の課題を解決すべ
く、基板に対して固定装着されるペリクル保護膜
体の位置がばらついても、常に取付枠と干渉する
ことなく回路パターン領域より大きな有効検査領
域を安定して設定して、基板表面上の取付枠で囲
まれた有効検査領域において異物が存在するか否
かについて正確に検査できるようにしたペリクル
付基板の異物検査装置を提供することにある。[Object of the Invention] In order to solve the problems of the prior art, even if the position of the pellicle protective film body fixedly attached to the board varies, the circuit pattern area can be fixed without interfering with the mounting frame. A foreign matter inspection device for substrates with a pellicle that can stably set a larger effective inspection area and accurately inspect whether or not foreign substances exist in the effective inspection area surrounded by the mounting frame on the surface of the substrate. It is about providing.
本発明は、上記目的を達成するために、取付枠
上にペリクル保護膜を取付けたペリクル保護膜体
を、回路パターンを形成した基板に装着すること
によつて形成されたペリクル保護膜体装着基板を
載置するテーブルと、該テーブル上に載置された
ペリクル保護膜体装着基板に対して上記ペリクル
保護膜を通して基板表面に照明光を集光照射する
照明光学系、該照明光と上記テーブルとを相対的
に２次元方向に走査する走査手段及び基板の表面
に存在する異物から反射する散乱光を上記ペリク
ル保護膜を通して光電変換手段で受光して信号に
変換する検出光学系を有し、上記走査手段を作動
させて上記検出光学系の光電変換手段から得られ
る信号に基づいて回路パターン領域より大きな異
物検査有効領域内に存在する異物を検出する異物
検出手段と、上記テーブルを下げてペリクル保護
膜体装着基板の取付枠の上面を上記異物検出手段
の照明光学系の集光点にほぼ合わせた状態にし
て、上記走査手段を作動させて照明光と上記テー
ブルとを相対的に２次元方向に走査して取付枠の
上面からの反射散乱光を上記異物検出手段の検出
光学系で検出すると共に、該検出光学系の検出光
学系から検出される信号の内、取付枠を示す信号
を、ペリクル保護膜上に存在する異物信号から弁
別して検出する弁別手段を有し、該弁別手段から
得られる取付枠を示す信号に基づいて取付枠の位
置を検出する取付枠位置検出手段と、該取付枠位
置検出手段で検出された取付枠の位置の情報に基
づいて取付枠の内側に上記異物検出手段による異
物検査有効領域を設定する制御手段とを備えたこ
とを特徴とするペリクル付基板の異物検査装置で
ある。また、本発明は、上記ペリクル付基板の異
物検査装置において、上記異物検査手段の走査手
段として、照明光を基板表面に対して直線状に走
査するように構成し、上記テーブルは上記走査線
方向と直角方向に移動走査するように構成したこ
とを特徴とする。
In order to achieve the above object, the present invention provides a pellicle protective film body mounting board formed by mounting a pellicle protective film body, in which a pellicle protective film is attached on a mounting frame, to a substrate on which a circuit pattern is formed. a table on which the pellicle protective film body is mounted; an illumination optical system for condensing and irradiating illumination light onto the substrate surface through the pellicle protective film to a substrate mounted with a pellicle protective film body placed on the table; and a detection optical system that receives scattered light reflected from foreign matter present on the surface of the substrate by a photoelectric conversion means through the pellicle protective film and converts it into a signal, foreign object detection means for detecting foreign objects present in a foreign object inspection effective area larger than the circuit pattern area based on a signal obtained from the photoelectric conversion means of the detection optical system by operating the scanning means; and a foreign object detection means for lowering the table to protect the pellicle. With the upper surface of the mounting frame of the membrane mounting board substantially aligned with the condensing point of the illumination optical system of the foreign object detection means, the scanning means is operated to align the illumination light and the table in a two-dimensional direction relative to each other. The detection optical system of the foreign object detection means detects the reflected and scattered light from the top surface of the mounting frame, and among the signals detected from the detection optical system of the detection optical system, a signal indicating the mounting frame is detected. Mounting frame position detection means having a discrimination means for discriminating and detecting a foreign object signal present on the pellicle protective film, and detecting the position of the mounting frame based on a signal indicating the mounting frame obtained from the discrimination means; A foreign object on a board with a pellicle, comprising: a control means for setting an effective area for foreign object inspection by the foreign object detecting means inside the mounting frame based on information on the position of the mounting frame detected by the frame position detecting means. It is an inspection device. Further, the present invention provides the foreign matter inspection device for a substrate with a pellicle, in which the scanning means of the foreign matter inspection means is configured to scan illumination light linearly with respect to the substrate surface, and the table is arranged in the scanning line direction. It is characterized by being configured to move and scan in a direction perpendicular to the .
以下、本発明の実施例をいくつか説明する。第
３図は、偏光レーザを用いた異物検査装置の光学
系の原理を示したものである。
Some embodiments of the present invention will be described below. FIG. 3 shows the principle of an optical system of a foreign matter inspection device using a polarized laser.
fθレンズ１１を介して、レーザ発振器８より出
力され、Ｓ偏光子９で変換されたＳ偏光レーザ１
０を基板１に対し、入射角αを22.5°±15°で斜め
から照射しスポツト１２を作る。パターン及び異
物からの散乱光を直角（90°±10°）に置いた光電
子増倍管１８でうけるが、Ｓ偏光のみ透過させる
偏光板１５を介すると、異物からの散乱光のみを
抽出できる。集光レンズ１６とスリツト１７によ
り、スポツト１２以外からの散乱光は遮光する。
この時、光電子増倍管１８は、角度βを22.5°±
15°に傾けて設け、ペリクル保護膜２の枠３によ
る干渉を避けている。この検出光学系１９を第４
図及び第５図１９ａ，１９ｂのように配置し、レ
ーザ１０ａ，１０ｂ及び光電子増倍管１９ａ，１
９ｂを切替えれば、ペリクル保護膜を装着した状
態でも枠による干渉をうけない。 S-polarized laser 1 outputted from laser oscillator 8 via fθ lens 11 and converted by S-polarizer 9
A spot 12 is created by irradiating the substrate 1 with 0 at an angle of incidence α of 22.5°±15°. Scattered light from the pattern and foreign matter is received by a photomultiplier tube 18 placed at right angles (90°±10°), but only the scattered light from the foreign matter can be extracted through a polarizing plate 15 that transmits only S-polarized light. The condensing lens 16 and the slit 17 block scattered light from sources other than the spot 12.
At this time, the photomultiplier tube 18 adjusts the angle β to 22.5°±
It is provided at an angle of 15° to avoid interference with the frame 3 of the pellicle protective film 2. This detection optical system 19 is
The lasers 10a, 10b and the photomultiplier tubes 19a, 1 are arranged as shown in FIGS.
If 9b is switched, there will be no interference from the frame even when a pellicle protective film is attached.
１０，１０ａ，１０ｂはＳ偏光レーザ、２０，
２０ａ，２０ｂは偏向ミラー、１１，１１ａ，１
１ｂはfθレンズ、１９ａ，１９ｂは検出光学系で
ある。回路パターンを形成したフオトマスクやレ
チクル等の基板１は、Ｘ方向をステージにより駆
動し、Ｙ方向は、偏向ミラー２０，２０ａ，２０
ｂによるレーザスポツトの走査により全面の検査
を行なう。 10, 10a, 10b are S-polarized lasers, 20,
20a, 20b are deflection mirrors, 11, 11a, 1
1b is an fθ lens, and 19a and 19b are detection optical systems. A substrate 1 such as a photomask or reticle on which a circuit pattern is formed is driven by a stage in the X direction, and by deflection mirrors 20, 20a, 20 in the Y direction.
The entire surface is inspected by scanning the laser spot using b.
第５図の場合、１３ａ，１３ｂは対称的に配置
されたミラーである。 In the case of FIG. 5, 13a and 13b are mirrors arranged symmetrically.
レーザ１０ａ，１０ｂ及び検出光学系１９ａ，
１９ｂの切替え方法は次の通りである。第５図の
場合１４は切替え用ミラーである。 Lasers 10a, 10b and detection optical system 19a,
The switching method of 19b is as follows. In the case of FIG. 5, 14 is a switching mirror.
基板１上の領域Ａは、レーザ１１ｂ，検出光学
系１９ｂにより検査され、以下同様に、領域Ｂは
レーザ１１ｂ、検出光学系１９ａ、領域Ｃは、レ
ーザ１１ａ、検出光学系１９ｂ、領域Ｄは、レー
ザ１１ａ、検出光学系１９ａにより、各々検査さ
れる。 Area A on the substrate 1 is inspected by the laser 11b and the detection optical system 19b, and similarly, area B is inspected by the laser 11b and the detection optical system 19a, area C is inspected by the laser 11a and the detection optical system 19b, and area D is inspected by the laser 11b and the detection optical system 19b. Each is inspected by the laser 11a and the detection optical system 19a.
第６図は、検出回路の概略、第７図は、タイミ
ングを示す。光電子増倍管１８ａ，１８ｂの後に
増幅回路２１ａ，２１ｂを設け、偏向ミラー２０
ａ，２０ｂの駆動信号４１（第７図Ｂに示す。）
により発生するタイミングパルス４２（第７図Ｃ
に示す。）に同期させた切替パルス４３（第７図
Ｄに示す。）を用い、アナログスイツチ２２を切
替え、Ａ，Ｃ領域の場合は、光電子増倍管１８ｂ
を信号４４（第７図Ｅに示す。）のように、又、
Ｂ，Ｄ領域の場合は光電子増倍管１８ａを信号４
５（第７図Ｆに示す。）のように選択する。増倍
回路２３を通つた信号は、閾値２４と比較器２５
により比較され、異物等により、散乱光レベルが
閾値を越えた時レーザ光の走査座標２６，２７
を、ゲート２８ａ，２８ｂを介してメモリー回路
２９及び表示回路３０に送る。 FIG. 6 shows an outline of the detection circuit, and FIG. 7 shows the timing. Amplifying circuits 21a and 21b are provided after the photomultiplier tubes 18a and 18b, and a deflection mirror 20
Drive signal 41 for a and 20b (shown in FIG. 7B)
Timing pulse 42 (Fig. 7C) generated by
Shown below. ) is used to switch the analog switch 22 using the switching pulse 43 (shown in FIG. 7D) synchronized with the photomultiplier tube 18b.
as signal 44 (shown in FIG. 7E), and
In the case of regions B and D, the photomultiplier tube 18a is set to signal 4.
5 (shown in FIG. 7F). The signal passed through the multiplication circuit 23 is sent to a threshold value 24 and a comparator 25.
When the scattered light level exceeds the threshold due to foreign matter etc., the scanning coordinates 26 and 27 of the laser beam are compared.
is sent to the memory circuit 29 and display circuit 30 via gates 28a and 28b.
なお、この時、Ｘ方向は第７図Ｃに示す信号４
２を積算したテーブルの駆動、Ｙ方向は第７図Ａ
に示すクロツク信号４０を用いた偏向ミラーの駆
動により、各々走査される。 At this time, the X direction is signal 4 shown in FIG. 7C.
Driving the table by integrating 2, the Y direction is shown in Figure 7A.
Each scan is performed by driving a deflection mirror using a clock signal 40 shown in FIG.
この異物検査装置の散乱光検出機能を用いてペ
リクル保護膜の枠の位置を求める一実施例をまず
説明する。 An embodiment in which the position of the frame of the pellicle protective film is determined using the scattered light detection function of this foreign matter inspection device will first be described.
第８図は、検査光学系をＹ方向から見た図であ
る。ｆ・θレンズ１１ａ又は１１ｂからのレーザ
スポツト１２は、基板１上で形成される。この基
板１をＺ方向に動かし、第９図のようにすると、
ペリクル保護膜２上にスポツト１２が形成され
る。この状態で、異物検査のときと同様に偏光ミ
ラー２０，２０ａ，２０ｂの走査及びテーブルの
走査によりＸ方向及び、Ｙ方向にレーザスポツト
１２を走査すると、スポツト１２が枠３の上に来
た時、枠での散乱により、第１０図Ａに対応して
第１０図Ｂに示すような光電子増倍管１８の出力
４６を得る。第１０図Ｂにおいて、２４は閾値、
４７は枠によるピーク、４８は異物４９によるピ
ークである。 FIG. 8 is a diagram of the inspection optical system viewed from the Y direction. A laser spot 12 from the f/theta lens 11a or 11b is formed on the substrate 1. If this board 1 is moved in the Z direction as shown in Fig. 9,
A spot 12 is formed on the pellicle protective film 2. In this state, when the laser spot 12 is scanned in the X direction and the Y direction by scanning the polarizing mirrors 20, 20a, 20b and scanning the table in the same way as in the foreign object inspection, when the spot 12 comes above the frame 3, , due to the scattering in the frame, an output 46 of the photomultiplier tube 18 as shown in FIG. 10B corresponding to FIG. 10A is obtained. In FIG. 10B, 24 is a threshold;
47 is a peak due to the frame, and 48 is a peak due to foreign matter 49.
第１１図は、枠３によるピーク４７とペリクル
膜上の異物４９によるピーク４８を弁別する回路
を示したものである。第１０図において光電子増
倍管１８の出力レベルが閾値２４を越えているこ
とを示す信号５０がONになつている期間をクロ
ツク４０を用いて、カウンタ５２により測定す
る。閾値以下になり信号５０がOFFとなると、
信号５０の立ち上がりをシユミツトトリガ回路５
３で検出し、それまでのカウンタ出力を、前もつ
て設定した値ｗと比較器５６により比較し、信号
５７を発生する。設定値（クロツク数）ｗよりも
カウンタ５２の値が大きければ枠とみなし、小さ
ければ異物とする。このような操作をレチクル中
央線６，７に沿つて行ない、Ｘ，Ｙ軸方向の枠の
位置を検出し、該検出された枠の位置情報に基づ
いて、前記異物検査時に枠と干渉することなく、
枠の内側に一定の距離をおいた有効検査領域４を
定める。 FIG. 11 shows a circuit that discriminates between a peak 47 caused by the frame 3 and a peak 48 caused by a foreign substance 49 on the pellicle membrane. In FIG. 10, the period during which a signal 50 indicating that the output level of the photomultiplier tube 18 exceeds the threshold value 24 is ON is measured by a counter 52 using a clock 40. When it becomes below the threshold and the signal 50 turns OFF,
The trigger circuit 5 detects the rising edge of the signal 50.
3, the counter output up to that point is compared with a previously set value w by a comparator 56, and a signal 57 is generated. If the value of the counter 52 is larger than the set value (number of clocks) w, it is regarded as a frame, and if it is smaller, it is regarded as a foreign object. Performing such an operation along the reticle center lines 6 and 7 to detect the position of the frame in the X and Y axis directions, and based on the detected position information of the frame, interfere with the frame during the foreign object inspection. Without,
An effective inspection area 4 is defined at a certain distance inside the frame.
次に第１２図に、反射光強度を用いて枠の取付
位置を求める例を示す。レーザ６０等のビーム状
の光６１をペリクル保護膜２上に斜方から照射
し、反射光をスリツト６２を介して受光素子６３
に受けるもので、ビーム状の光６１が下に枠３の
無いペリクル保護膜２上に照射されると、光は透
過されるため受光レベルが低いが、下に枠３があ
ると、正反射光が受光素子６３に受光され、受光
レベルが上昇し、枠取付位置が検出できる。この
ようなセンサを異物検査装置内の一部に取付け
る。 Next, FIG. 12 shows an example in which the mounting position of the frame is determined using the reflected light intensity. A beam-shaped light 61 from a laser 60 or the like is irradiated obliquely onto the pellicle protective film 2, and the reflected light is transmitted through a slit 62 to a light receiving element 63.
When the beam-shaped light 61 is irradiated onto the pellicle protective film 2 without the frame 3 below, the light is transmitted and the light reception level is low. The light is received by the light receiving element 63, the light receiving level increases, and the frame attachment position can be detected. Such a sensor is installed in a part of the foreign object inspection device.
第１３図は機械的な接触センサを用いた場合を
示した図である。枠３にピン７１を押しあて、ピ
ンの移動量を位置検出センサ７０で読取り、枠位
置を算出するものである。 FIG. 13 is a diagram showing a case where a mechanical contact sensor is used. A pin 71 is pressed against the frame 3, the amount of movement of the pin is read by a position detection sensor 70, and the frame position is calculated.
また、第１４図は、ペリクル保護膜の枠３が誘
磁性体でできている場合に、非接触電磁センサ７
２を用いて枠位置を検出する例を示している。 In addition, FIG. 14 shows a non-contact electromagnetic sensor 7 when the frame 3 of the pellicle protective film is made of a dimagnetic material.
2 is used to detect the frame position.
なお、基板の表裏面検査を行なう必要がある場
合には、枠位置の検出機構を表裏２組設ければよ
い。 Note that if it is necessary to inspect the front and back sides of the board, two sets of frame position detection mechanisms may be provided on the front and back sides.
〔発明の効果〕
以上説明したように、本発明によれば、ペリク
ル保護膜体装着基板を異物検査手段に設置した状
態で、異物検出光学系と同一の光学系を用いて取
付枠の位置を検出して取付枠内に回路パターン領
域より大きな異物の有効検査領域を設定できるよ
うに構成したので、ペリクル保護膜体の基板への
取付位置にばらつきがあつても取付枠に干渉する
ことなく、しかも取付枠の位置測定系に対する較
正を不要とすると共に異物検出手段に対する取付
枠の位置測定系の影響をなくして安定して基板表
面に存在する異物を正確に検出でき、その結果異
物が付着していない状態で露光することができ、
良品の半導体等の製品を歩留まり良く製造するこ
とができる効果を奏する。[Effects of the Invention] As explained above, according to the present invention, the position of the mounting frame can be determined using the same optical system as the foreign object detection optical system while the pellicle protective film mounting board is installed in the foreign object inspection means. It is configured to detect foreign objects and set an effective inspection area within the mounting frame that is larger than the circuit pattern area, so even if there are variations in the mounting position of the pellicle protective film body to the board, it will not interfere with the mounting frame. Moreover, it does not require calibration for the position measurement system of the mounting frame, and eliminates the influence of the position measurement system of the mounting frame on the foreign object detection means, allowing stable and accurate detection of foreign objects present on the board surface. Can be exposed without exposure,
It is possible to produce products such as semiconductors of good quality with a high yield.
第１図はペリクル保護膜装着状態の斜視図、第
２図は基板の正面図、第３図は異物検査原理を示
す斜視図、第４図は走査系を示す上面図、第５図
は第３図及び第４図に示す原理を用いた異物検査
装置を示す図、第６図は回路構成図、第７図はそ
のタイミング図、第８図及び第９図は基板側断面
図、第１０図は出力信号図、第１１図は枠、異物
弁別回路図、第１２図は他の一例を示す装置側面
図、第１３図は更に他の一例を示す装置上面図、
第１４図は更に他の一例を示す装置側面図でる。
１……基板、２……ペリクル保護膜、３……
枠、４……有効検査領域、１１，fθ……レンズ、
１２……レーザスポツト、１８……光電子増倍
管。
Figure 1 is a perspective view of the pellicle protective film attached, Figure 2 is a front view of the board, Figure 3 is a perspective view of the foreign object inspection principle, Figure 4 is a top view of the scanning system, and Figure 5 is the front view of the board. A diagram showing a foreign matter inspection device using the principle shown in FIGS. 3 and 4, FIG. 6 is a circuit configuration diagram, FIG. 7 is a timing diagram, FIGS. 8 and 9 are cross-sectional views of the board side, and FIG. The figure is an output signal diagram, FIG. 11 is a frame and foreign matter discrimination circuit diagram, FIG. 12 is a side view of the device showing another example, and FIG. 13 is a top view of the device showing yet another example.
FIG. 14 is a side view of the device showing yet another example. 1... Substrate, 2... Pellicle protective film, 3...
Frame, 4... Effective inspection area, 11, fθ... Lens,
12... Laser spot, 18... Photomultiplier tube.
Claims (1)
ル保護膜体を、回路パターンを形成した基板に装
着することによつて形成されたペリクル保護膜体
装着基板を載置するテーブルと、該テーブル上に
載置されたペリクル保護膜体装着基板に対して上
記ペリクル保護膜を通して基板表面に照明光を集
光照射する照明光学系、該照明光と上記テーブル
とを相対的に２次元方向に走査する走査手段及び
基板の表面に存在する異物から反射する散乱光を
上記ペリクル保護膜を通して光電変換手段で受光
して信号に変換する検出光学系を有し、上記走査
手段を作動させて上記検出光学系の光電変換手段
から得られる信号に基づいて回路パターン領域よ
り大きな異物検査有効領域内に存在する異物を検
出する異物検出手段と、上記テーブルを下げてペ
リクル保護膜体装着基板の取付枠の上面を上記異
物検出手段の照明光学系の集光点にほぼ合わせた
状態にして、上記走査手段を作動させて照明光と
上記テーブルとを相対的に２次元方向に走査して
取付枠の上面からの反射散乱光を上記異物検出手
段の検出光学系で検出すると共に、該検出光学系
の検出光学系から検出される信号の内、取付枠を
示す信号を、ペリクル保護膜上に存在する異物信
号から弁別して検出する弁別手段を有し、該弁別
手段から得られる取付枠を示す信号に基づいて取
付枠の位置を検出する取付枠位置検出手段と、該
取付枠位置検出手段で検出された取付枠の位置の
情報に基づいて取付枠の内側に上記異物検出手段
による異物検査有効領域を設定する制御手段とを
備えたことを特徴とするペリクル付基板の異物検
査装置。 ２ 上記異物検査手段の走査手段として、照明光
を基板表面に対して直線状に走査するように構成
し、上記テーブルは上記走査線方向とほぼ直角方
向に移動走査するように構成したことを特徴とす
る特許請求の範囲第１項記載のペリクル付基板の
異物検査装置。[Scope of Claims] 1. A table on which a pellicle protective film body-mounted substrate formed by mounting a pellicle protective film body with a pellicle protective film attached on a mounting frame on a circuit pattern-formed substrate is placed. and an illumination optical system that condenses and irradiates illumination light onto the substrate surface through the pellicle protective film with respect to a substrate mounted with a pellicle protective film body placed on the table, and a system that directs the illumination light and the table relative to each other. It has a scanning means that scans in the dimensional direction and a detection optical system that receives scattered light reflected from foreign matter present on the surface of the substrate by a photoelectric conversion means through the pellicle protective film and converts it into a signal, and operates the scanning means. a foreign object detection means for detecting a foreign object existing in a foreign object inspection effective area larger than the circuit pattern area based on the signal obtained from the photoelectric conversion means of the detection optical system; With the top surface of the mounting frame substantially aligned with the condensing point of the illumination optical system of the foreign object detection means, the scanning means is operated to relatively scan the illumination light and the table in a two-dimensional direction for installation. The reflected and scattered light from the top surface of the frame is detected by the detection optical system of the foreign object detection means, and among the signals detected from the detection optical system of the detection optical system, a signal indicating the mounting frame is transferred onto the pellicle protective film. Mounting frame position detecting means having discriminating means for discriminating and detecting an existing foreign object signal, and detecting the position of the mounting frame based on a signal indicating the mounting frame obtained from the discriminating means; A foreign matter inspection device for a substrate with a pellicle, comprising: a control means for setting an effective region for foreign matter inspection by the foreign matter detection means inside the mounting frame based on information about the detected position of the mounting frame. 2. The scanning means of the foreign substance inspection means is configured to scan the illumination light linearly with respect to the substrate surface, and the table is configured to move and scan in a direction substantially perpendicular to the scanning line direction. A foreign matter inspection device for a substrate with a pellicle according to claim 1.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57192461A JPS5982726A (en) | 1982-11-04 | 1982-11-04 | Detecting method of foreign matter |
| US06/548,516 US4669875A (en) | 1982-11-04 | 1983-11-03 | Foreign particle detecting method and apparatus |
| US07/360,971 USRE33991E (en) | 1982-11-04 | 1989-06-02 | Foreign particle detecting method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57192461A JPS5982726A (en) | 1982-11-04 | 1982-11-04 | Detecting method of foreign matter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5982726A JPS5982726A (en) | 1984-05-12 |
| JPH0430575B2 true JPH0430575B2 (en) | 1992-05-22 |
Family
ID=16291678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57192461A Granted JPS5982726A (en) | 1982-11-04 | 1982-11-04 | Detecting method of foreign matter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5982726A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4519832B2 (en) * | 2006-12-28 | 2010-08-04 | 株式会社堀場製作所 | Defect inspection equipment |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2559470B2 (en) * | 1988-08-12 | 1996-12-04 | 株式会社日立製作所 | Appearance inspection method |
| JP2538338B2 (en) * | 1989-05-30 | 1996-09-25 | キヤノン株式会社 | Foreign matter inspection device |
| JPH09204038A (en) * | 1996-09-24 | 1997-08-05 | Hitachi Ltd | Production of mask |
| WO2005052687A1 (en) * | 2003-11-25 | 2005-06-09 | Nikon Corporation | Foreign object inspection device and method, and exposure device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4942051A (en) * | 1972-08-28 | 1974-04-20 |
-
1982
- 1982-11-04 JP JP57192461A patent/JPS5982726A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4942051A (en) * | 1972-08-28 | 1974-04-20 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4519832B2 (en) * | 2006-12-28 | 2010-08-04 | 株式会社堀場製作所 | Defect inspection equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5982726A (en) | 1984-05-12 |
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