JPH04284654A - Heat dissipation structure of semiconductor device - Google Patents
Heat dissipation structure of semiconductor deviceInfo
- Publication number
- JPH04284654A JPH04284654A JP4930591A JP4930591A JPH04284654A JP H04284654 A JPH04284654 A JP H04284654A JP 4930591 A JP4930591 A JP 4930591A JP 4930591 A JP4930591 A JP 4930591A JP H04284654 A JPH04284654 A JP H04284654A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- semiconductor device
- stud
- liquid
- fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 44
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 21
- 239000007788 liquid Substances 0.000 claims abstract description 44
- 239000002184 metal Substances 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000003507 refrigerant Substances 0.000 claims abstract description 5
- 239000011347 resin Substances 0.000 claims abstract description 5
- 229920005989 resin Polymers 0.000 claims abstract description 5
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 3
- 238000005452 bending Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 230000035882 stress Effects 0.000 description 3
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001000 nickel titanium Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、回路基板に実装する半
導体装置の放熱構造に関する。電子機器の高機能化及び
高密度実装化がますます進展するに伴い、半導体素子は
高集積化されるとともにその使用電力が上昇し、半導体
装置の発熱量が増加してきている。そのため、半導体装
置の熱を効率良く放熱する構造が要望されている。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation structure for a semiconductor device mounted on a circuit board. 2. Description of the Related Art As electronic equipment becomes more sophisticated and more densely packaged, semiconductor elements become more highly integrated, their power consumption increases, and the amount of heat generated by semiconductor devices increases. Therefore, there is a need for a structure that efficiently radiates heat from a semiconductor device.
【０００２】0002
【従来の技術】従来は図９の組立側断面図に示すように
、回路基板１１に実装した半導体装置１２（図は正方形
のＬＳＩを示す）の上面に複数枚の円板形の放熱フィン
１３ｂ をスタッド１３ａ に周設した放熱体１３を熱
伝導性接着剤１４で固着して放熱するとか、図示はしな
いが、放熱体を固定する金具を用い、放熱体を半導体装
置上面に接触させ放熱していた。2. Description of the Related Art Conventionally, as shown in an assembly side cross-sectional view of FIG. Heat can be radiated by fixing the heat radiator 13 surrounding the stud 13a with a thermally conductive adhesive 14, or, although not shown, the heat radiator can be brought into contact with the top surface of the semiconductor device using metal fittings for fixing the heat radiator. was.
【０００３】0003
【発明が解決しようとする課題】しかしながら、このよ
うな上記構造によれば、前者の放熱構造では、半導体装
置への放熱体の固定に熱伝導性の接着剤を用いているた
め放熱効率が悪く、また放熱体と熱伝導性接着剤が熱膨
張係数が異なるため高温状態で熱応力が発生し、遂には
接着剤が破壊し放熱体が外れてしまうとか、回路基板を
鉛直に実装した場合、放熱体の重量が直接、半導体装置
のリード接合部に作用するため、リード接合部に常時、
ストレスが掛かる状態となり、遂にはリード接合部の接
合半田が破壊し半導体装置の電気的な接続が切断されて
しまう問題があった。また後者の放熱構造では、放熱体
と半導体装置の熱伝導は接触部のみで行っているため、
放熱体が少しでも傾いていると、接触面積が著しく低下
して熱伝導効率が悪くなる、そのため、例えば放熱体を
半導体装置に押し付ける構造を採ると、放熱体が半導体
装置に直接、接しているので半導体装置を破壊するとか
表面を損傷するといった問題があった。[Problem to be Solved by the Invention] However, according to the above-mentioned structure, the former heat dissipation structure has poor heat dissipation efficiency because a thermally conductive adhesive is used to fix the heat dissipation body to the semiconductor device. Also, because the heat sink and the thermally conductive adhesive have different coefficients of thermal expansion, thermal stress occurs at high temperatures, which can eventually cause the adhesive to break and the heat sink to come off, or when the circuit board is mounted vertically. Since the weight of the heat sink directly acts on the lead joints of the semiconductor device, the lead joints are constantly exposed to
There is a problem in that stress is applied, and the solder joint at the lead joint portion eventually breaks down, resulting in the electrical connection of the semiconductor device being severed. In addition, in the latter heat dissipation structure, heat conduction between the heat dissipation body and the semiconductor device is performed only at the contact area, so
If the heat radiator is even slightly tilted, the contact area will be significantly reduced and the heat conduction efficiency will deteriorate. Therefore, for example, if a structure is adopted in which the heat radiator is pressed against the semiconductor device, the heat radiator is in direct contact with the semiconductor device. Therefore, there were problems such as destroying the semiconductor device or damaging the surface.
【０００４】上記問題点に鑑み、本発明は半導体装置の
リード接合部及び表面にストレスを与えることなく、半
導体装置表面と放熱フィンを広範囲で接触させて放熱効
率を良くすることのできる半導体装置の放熱構造を提供
することを目的とする。In view of the above-mentioned problems, the present invention provides a semiconductor device in which heat dissipation efficiency can be improved by bringing the surface of the semiconductor device into contact with the heat dissipation fin over a wide range without applying stress to the lead joints and the surface of the semiconductor device. The purpose is to provide a heat dissipation structure.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
に、本発明の半導体装置の放熱構造においては、先端に
おねじを有するスタッドに複数の放熱フィンを周設して
なる放熱体と、樹脂フィルム製容器に冷媒液を封入して
なる液体ヒートシンクと、金属薄板を、回路基板に実装
された半導体装置を跨ぐように門形に折曲しその中央に
前記スタッドのおねじを螺入する取付孔を穿設し内側に
前記液体ヒートシンクを嵌着する支持部と裾縁端に回路
基板のスルーホールに挿入し接合する取付足を突設した
固定金具とで構成し、前記固定金具を回路基板に実装さ
れた半導体装置に被せ接合し、固定金具に液体ヒートシ
ンクを嵌着して半導体装置の上面に密着させ、固定金具
にスタッドを螺入しその先端面を液体ヒートシンクに密
着させ半導体装置の熱を液体ヒートシンクを介し放熱体
から放熱するように構成する。[Means for Solving the Problems] In order to achieve the above object, the heat dissipation structure for a semiconductor device of the present invention includes a heat dissipation body comprising a plurality of heat dissipation fins surrounding a stud having a thread at the tip; A liquid heat sink made by sealing a refrigerant liquid in a resin film container and a thin metal plate are bent into a gate shape so as to straddle the semiconductor device mounted on the circuit board, and the male thread of the stud is screwed into the center of the gate shape. It consists of a support part with a mounting hole and into which the liquid heat sink is fitted, and a fixing bracket with protruding mounting legs inserted into the through-holes of the circuit board and attached to the bottom edge, and the fixing bracket is connected to the circuit board. A semiconductor device mounted on a board is covered and bonded, a liquid heat sink is fitted into a fixing metal fitting and brought into close contact with the top surface of the semiconductor device, and a stud is screwed into the fixing metal fitting and its tip surface is brought into close contact with the liquid heat sink to bond the semiconductor device. Heat is dissipated from the heat sink through the liquid heat sink.
【０００６】[0006]
【作用】回路基板に実装された半導体装置の上面と放熱
体との間に液体ヒートシンクを介挿することにより、液
体ヒートシンクは柔軟性があることから密着した接触を
保ち、しかも液体ヒートシンクは対流により熱を伝導す
るため放熱効率を良くすることができる。[Function] By inserting a liquid heat sink between the top surface of the semiconductor device mounted on the circuit board and the heat sink, the liquid heat sink maintains close contact due to its flexibility, and the liquid heat sink uses convection to maintain close contact. Because it conducts heat, it can improve heat dissipation efficiency.
【０００７】[0007]
【実施例】以下、図面に示した実施例に基づいて本発明
の要旨を詳細に説明する。半導体装置の放熱構造（第１
の実施例）は図１の組立側断面図に示すように、回路基
板１に実装された長方形の半導体装置２（図は正方形の
ＬＳＩを示す）の熱を放熱する場合、放熱体３と、液体
ヒートシンク４と、固定金具５とで構成する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The gist of the present invention will be explained in detail below based on embodiments shown in the drawings. Heat dissipation structure of semiconductor device (first
As shown in the assembled side cross-sectional view of FIG. 1, in the embodiment), when radiating heat from a rectangular semiconductor device 2 (the figure shows a square LSI) mounted on a circuit board 1, a heat radiator 3, It is composed of a liquid heat sink 4 and a fixture 5.
【０００８】放熱体３は図２（ａ），（ｂ） の側面図
及びその平面図に示すように、先端におねじ３ａ−１を
有するスタッド３ａに複数の円板形の放熱フィン３ｂを
並設し構成する。
液体ヒートシンク４は図１に示すように、ＬＳＩ２の上
面を覆う大きさの正方形の樹脂フィルム製容器４ａに冷
媒液４ｂ、例えば液体フロンを封入し構成する。As shown in the side view and plan view of FIGS. 2(a) and 2(b), the heat sink 3 has a stud 3a having a screw 3a-1 at the tip and a plurality of disc-shaped heat sink fins 3b. Configure in parallel. As shown in FIG. 1, the liquid heat sink 4 is constructed by enclosing a refrigerant liquid 4b, such as liquid fluorocarbon, in a square resin film container 4a that is large enough to cover the top surface of the LSI 2.
【０００９】固定金具５は図３（ａ），（ｂ） の平面
図及びそのＡ−Ａ矢視側断面図に示すように、金属薄板
を、ＬＳＩを跨ぐように門形に折曲しその中央に放熱体
のスタッドをねじ込む取付孔５ａ、即ちねじ孔を穿設し
、内側に液体ヒートシンクを嵌着する枠状の支持部５ｂ
と裾縁端の四隅に回路基板のスルーホールに挿入し接合
する取付足５ｃを突設し構成する。As shown in the plan view of FIGS. 3(a) and 3(b) and the sectional view taken along arrow A-A, the fixing fitting 5 is made by bending a thin metal plate into a gate shape so as to straddle the LSI. A frame-shaped support part 5b having a mounting hole 5a, that is, a screw hole, in the center of which a stud of a heat sink is screwed, and a liquid heat sink fitted inside.
At the four corners of the hem edge, mounting feet 5c are provided protrudingly to be inserted into and connected to the through holes of the circuit board.
【００１０】これらの構成部品の組立は図１に示したよ
うに、先ず、固定金具５の支持部５ｂに液体ヒートシン
ク４を側方から挿入嵌着する。その固定金具５を回路基
板１に実装されたＬＳＩ２に被せ、液体ヒートシンク４
をＬＳＩ２の上面に密着させた状態で取付足５ｃをスル
ーホール１ａに挿入して半田付け接合する。As shown in FIG. 1, these components are assembled by first inserting and fitting the liquid heat sink 4 into the support portion 5b of the fixture 5 from the side. The fixing metal fitting 5 is placed over the LSI 2 mounted on the circuit board 1, and the liquid heat sink 4
With the mounting leg 5c in close contact with the top surface of the LSI 2, the mounting leg 5c is inserted into the through hole 1a and joined by soldering.
【００１１】そして、固定金具５のねじ孔５ａに放熱体
３のスタッド３ａを螺入し、その先端面が液体ヒートシ
ンク４に当接し密着するまでねじ込み完了する。ＬＳＩ
２の熱は、液体ヒートシンク４を介しスタッド３ａに熱
伝導し、放熱フィン３ｂから放熱される。[0011] Then, the stud 3a of the heat sink 3 is screwed into the screw hole 5a of the fixing metal fitting 5, and the screwing is completed until the tip end surface contacts the liquid heat sink 4 and is in close contact with the liquid heat sink 4. LSI
The heat of No. 2 is conducted to the stud 3a via the liquid heat sink 4, and is radiated from the heat radiation fins 3b.
【００１２】つぎの図４の平面図は固定金具の第２の実
施例であって、図に示すように、固定金具５、即ち５−
１ はとくにばね性を有する金属薄板、例えばばね用燐
青銅板で形成し、ねじ孔５ａの回りにねじ孔５ａを架橋
する形で打ち抜いたばね性付与孔５ａ−１（不連続な長
孔または放射状の長孔）を追設する。組立は図１と同様
にして行う。The following plan view of FIG. 4 shows a second embodiment of the fixture, and as shown in the figure, the fixture 5, ie, 5-
1 is made of a thin metal plate having spring properties, such as a phosphor bronze plate for springs, and is punched out around the screw hole 5a in such a way as to bridge the screw hole 5a (a discontinuous long hole or a radial shape). (long hole) is added. Assembly is performed in the same manner as in FIG.
【００１３】またつぎの図５（ａ），（ｂ） の平面図
及びそのＢ−Ｂ矢視側断面図は固定金具の第３の実施例
であって、固定金具５、即ち５−２ はその材料をとく
に形状記憶合金薄板、例えばニッケル・チタン合金で形
成し、ねじ孔の代わりに後述する図７の放熱体３−１
のスタッド３Ａを挿通するばか孔５Ａを穿設し、さらに
ばか孔５Ａの縁に孔心対称の切欠き５Ａ−１を穿設する
。そして更に、ばか孔５Ａの縁にこの一対の切欠き５Ａ
−１に直交しスリット５Ａ−３を入れ切り出した一対の
係着片５Ａ−２を備える。切欠き５Ａ−１は後述する図
７のスタッド３Ａの係合用突起３Ａ−１を挿通し、挿通
した係合用突起３Ａ−１は９０度回動し係着片５Ａ−２
に係合する。一対の係着片５Ａ−２は、常温時に図５（
ｂ） のように水平状態にあり、ＬＳＩが約４０度前後
に昇温すれば、図６の側断面図の矢印のように内側に曲
がる状態に記憶させておく。なお、この固定金具５−２
を用いる場合は、一方の放熱体３、即ち３−１ は図
７（ａ），（ｂ） の側面図及びその平面図に示すよう
にスタッド３Ａの先端外周面に羽根状の係合用突起３Ａ
−１を軸心対称に突設しておく。The following plan views and cross-sectional views taken along line B-B in FIGS. The material is formed of a shape memory alloy thin plate, for example, a nickel-titanium alloy, and the heat sink 3-1 of FIG. 7, which will be described later, is used instead of a screw hole.
A hole 5A is formed through which the stud 3A is inserted, and a notch 5A-1 symmetrical about the hole center is formed at the edge of the hole 5A. Furthermore, this pair of notches 5A are formed on the edge of the stupid hole 5A.
A pair of engaging pieces 5A-2 are provided which are perpendicular to -1 and cut out with slits 5A-3. The notch 5A-1 is inserted into the engagement protrusion 3A-1 of the stud 3A shown in FIG.
engage with. A pair of fastening pieces 5A-2 are attached to each other at room temperature (see FIG. 5).
b) When the LSI is in a horizontal state as shown in FIG. 6 and the temperature rises to around 40 degrees, it is stored in a state in which it bends inward as shown by the arrow in the side sectional view of FIG. In addition, this fixing metal fitting 5-2
When using one of the heat sinks 3, that is, 3-1, as shown in the side view and plan view of FIGS.
-1 is provided protrudingly symmetrically about the axis.
【００１４】組立は上記図１の第１の実施例と同様、図
８の組立側断面図に示すように、先ず、固定金具５−２
を、液体ヒートシンク４を嵌着した後、ＬＳＩ２に被
せスルーホール１ａに半田付け接合する。そして、放熱
体３−１ を、スタッド３Ａの係合用突起３Ａ−１をば
か孔５Ａ及び切欠き５Ａ−１に通過させて９０度回転し
係合用突起３Ａ−１を係着片５Ａ−２に合致させる。い
ま、ＬＳＩ２が発熱して形状記憶部分が約４０度前後に
昇温すれば、図示するように係着片５Ａ−２は形状記憶
された、即ち係合用突起３Ａ−１を押し付ける方向に曲
がり、放熱体３−１ のスタッド３Ａ先端面を液体ヒー
トシンク４に完全に密着し熱伝導する。As shown in the assembly side sectional view of FIG. 8, the assembly is similar to the first embodiment shown in FIG.
After fitting the liquid heat sink 4, it is placed over the LSI 2 and soldered to the through hole 1a. Then, the heat sink 3-1 is rotated 90 degrees by passing the engagement protrusion 3A-1 of the stud 3A through the hole 5A and the notch 5A-1, and the engagement protrusion 3A-1 is inserted into the engagement piece 5A-2. Match. Now, when the LSI 2 generates heat and the temperature of the shape memory portion rises to around 40 degrees, the engagement piece 5A-2 retains its shape, that is, bends in the direction of pressing the engagement protrusion 3A-1, as shown in the figure. The tip end surface of the stud 3A of the heat sink 3-1 is completely brought into close contact with the liquid heat sink 4 to conduct heat.
【００１５】このように、回路基板に実装された半導体
装置（ＬＳＩ）の上面と放熱体との間に液体ヒートシン
クを介挿することにより、液体ヒートシンクは柔軟性が
あることから相互に密着接触し半導体装置の熱を熱伝導
することができ、しかも液体ヒートシンクは対流により
熱を伝導するため放熱効率を良くすることができる。[0015] In this way, by inserting the liquid heat sink between the upper surface of the semiconductor device (LSI) mounted on the circuit board and the heat sink, the liquid heat sink is flexible and can come into close contact with each other. The heat of the semiconductor device can be conducted thermally, and since the liquid heat sink conducts the heat through convection, the heat dissipation efficiency can be improved.
【００１６】また、第２の実施例の固定金具の螺入孔の
回りにばね性付与孔を設けた場合は、放熱体のスタッド
をねじ込み、液体ヒートシンクに当接させることで、ば
ね反発しスタッド先端面と液体ヒートシンクとをばね密
着し熱伝導することができる。[0016] Furthermore, in the case where a spring property imparting hole is provided around the screw hole of the fixing fitting in the second embodiment, by screwing in the stud of the heat radiator and bringing it into contact with the liquid heat sink, the stud will rebound with a spring force. The tip surface and the liquid heat sink are brought into close contact with each other by a spring, and heat can be conducted.
【００１７】また、第３の実施例の固定金具を形状記憶
合金で形成した場合は、常温時では半導体装置に圧力を
与えることなく、昇温時にのみ係着片の形状復元力によ
り放熱体のスタッド先端面を液体ヒートシンクに押し付
けることでばね密着し熱伝導することができる。Furthermore, when the fixing fitting of the third embodiment is formed of a shape memory alloy, no pressure is applied to the semiconductor device at room temperature, but the shape restoring force of the fastening piece causes the heat dissipation body to move only when the temperature rises. By pressing the tip of the stud against the liquid heat sink, the spring comes into close contact with the liquid heat sink, allowing heat to be conducted.
【００１８】[0018]
【発明の効果】以上、詳述したように本発明によれば、
半導体装置と放熱体との間に液体ヒートシンクを介在す
ることにより、半導体装置表面と放熱フィンを広範囲で
接触させて放熱効率を良くすることができるとともに、
半導体装置のリード接合部及び表面にストレスを与える
こともなくなるため、信頼度の高い回路パッケージを提
供することができるといった産業上極めて有用な効果を
発揮する。[Effects of the Invention] As detailed above, according to the present invention,
By interposing a liquid heat sink between the semiconductor device and the heat sink, it is possible to bring the surface of the semiconductor device into contact with the heat radiation fins over a wide range, and improve heat radiation efficiency.
Since no stress is applied to the lead joints and the surface of the semiconductor device, a highly reliable circuit package can be provided, which is extremely useful in industry.
【図１】 本発明による第１の実施例の組立側断面図
FIG. 1: Assembly side sectional view of a first embodiment according to the present invention.
【図２】 図１の放熱体の側面図及びその平面図[Figure 2] Side view and plan view of the heat sink in Figure 1
【図
３】 図１の固定金具の平面図及びそのＡ−Ａ矢視側
断面図[Fig. 3] A plan view of the fixing fitting shown in Fig. 1 and a cross-sectional view taken along arrow A-A thereof.
【図４】 図１の固定金具の第２の実施例の平面図[Figure 4] Plan view of the second embodiment of the fixture in Figure 1
【
図５】 図１の固定金具の第３の実施例の平面図及び
そのＢ−Ｂ矢視側断面図[
FIG. 5 A plan view of the third embodiment of the fixing fitting in FIG. 1 and a sectional view taken along the line B-B
【図６】 図５の固定金具の形状記憶を示す側断面図
[Figure 6] Side cross-sectional view showing shape memory of the fixing fitting in Figure 5
【図７】 図５の固定金具と共に用いる放熱体の側面
図及びその平面図[Figure 7] A side view and a plan view of a heat sink used with the fixing fittings in Figure 5.
【図８】 図５の組立側断面図[Figure 8] Assembly side sectional view of Figure 5
【図９】 従来技術による組立側断面図[Figure 9] Side sectional view of assembly using conventional technology
【符号の説明
】
１は回路基板
１ａはスルーホール
２は半導体装置（ＬＳＩ）
３は放熱体
３ａはスタッド
３ｂは放熱フィン
４は液体ヒートシンク
４ａは樹脂フィルム製容器
４ｂは冷媒液（液体フロン）
５は固定金具
５ａはねじ孔
５ｂは支持部
５ｃは取付足[Explanation of symbols] 1 is a circuit board 1a, a through hole 2 is a semiconductor device (LSI), 3 is a heat sink 3a, a stud 3b is a heat radiation fin 4, a liquid heat sink 4a is a resin film container 4b is a refrigerant liquid (liquid fluorocarbon) 5 The fixing bracket 5a is the screw hole 5b, and the support part 5c is the mounting foot.
Claims (3)
）に複数の放熱フィン（３ｂ）を周設してなる放熱体（
３） と、樹脂フィルム製容器（４ａ）に冷媒液（４ｂ
）を封入してなる液体ヒートシンク（４） と、金属薄
板を、回路基板（１） に実装された半導体装置（２）
を跨ぐように門形に折曲しその中央に前記スタッド（
３ａ）のおねじを螺入する取付孔（５ａ）を穿設し内側
に前記液体ヒートシンク（４） を嵌着する支持部（５
ｂ）と裾縁端に回路基板（１） のスルーホール（１ａ
）に挿入し接合する取付足（５ｃ）を突設した固定金具
（５） とで構成し、該固定金具（５） を回路基板（
１） に実装された半導体装置（２） に被せ接合し、
固定金具（５） に液体ヒートシンク（４） を嵌着し
て半導体装置（２） の上面に密着させ、取付孔（５ａ
）にスタッド（３ａ）を螺入しその先端面を液体ヒート
シンク（４） に密着させ半導体装置（２） の熱を液
体ヒートシンク（４） を介し放熱体（３） から放熱
することを特徴とする半導体装置の放熱構造。[Claim 1] A stud (3a
) with a plurality of heat dissipating fins (3b) surrounding the heat sink (
3) and the refrigerant liquid (4b) in the resin film container (4a).
) and a semiconductor device (2) mounted on a circuit board (1) and a thin metal plate (4).
Bend it into a gate shape so as to straddle it, and attach the stud (
A support part (5) is provided with a mounting hole (5a) into which the male screw (3a) is screwed, and the liquid heat sink (4) is fitted inside the mounting hole (5a).
b) and the through hole (1a) of the circuit board (1) at the edge of the hem.
) and a fixing metal fitting (5) with protruding mounting feet (5c) that are inserted into and connected to the circuit board (
1) Cover and bond the semiconductor device (2) mounted on the
Fit the liquid heat sink (4) into the fixing bracket (5) and bring it into close contact with the top surface of the semiconductor device (2).
) is screwed into the stud (3a), and its tip surface is brought into close contact with the liquid heat sink (4), so that the heat of the semiconductor device (2) is radiated from the heat sink (3) via the liquid heat sink (4). Heat dissipation structure for semiconductor devices.
の取付孔（５ａ）の回りにばね性付与孔（５ａ−１）を
追設したことを特徴とする半導体装置の放熱構造。[Claim 2] The fixing fitting (5-1) according to Claim 1.
A heat dissipation structure for a semiconductor device, characterized in that a spring property imparting hole (5a-1) is additionally provided around the mounting hole (5a).
は形状記憶合金薄板からなり、放熱体（３） に係合す
る係着片（５Ａ−２）を備え、該係着片（５Ａ−２）は
半導体装置（２）の昇温時にのみ放熱体（３） のスタ
ッド（３ａ）先端面を形状復元力により液体ヒートシン
ク（４） に密着するように形状記憶したことを特徴と
する半導体装置の放熱構造。[Claim 3] The fixing metal fitting (5-2) according to claim 1.
is made of a shape-memory alloy thin plate and includes an engaging piece (5A-2) that engages with the heat sink (3), and the engaging piece (5A-2) engages with the heat sink only when the temperature of the semiconductor device (2) increases. (3) A heat dissipation structure for a semiconductor device, characterized in that the tip end face of the stud (3a) is shape-memorized so as to be in close contact with the liquid heat sink (4) due to shape restoring force.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4930591A JPH04284654A (en) | 1991-03-14 | 1991-03-14 | Heat dissipation structure of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4930591A JPH04284654A (en) | 1991-03-14 | 1991-03-14 | Heat dissipation structure of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04284654A true JPH04284654A (en) | 1992-10-09 |
Family
ID=12827233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4930591A Withdrawn JPH04284654A (en) | 1991-03-14 | 1991-03-14 | Heat dissipation structure of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04284654A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004061956A1 (en) * | 2002-12-27 | 2004-07-22 | Fujitsu Limited | Heat sink of electronic component |
| US7443683B2 (en) * | 2004-11-19 | 2008-10-28 | Hewlett-Packard Development Company, L.P. | Cooling apparatus for electronic devices |
| WO2024004024A1 (en) * | 2022-06-28 | 2024-01-04 | 三菱電機株式会社 | Power module and power conversion device |
-
1991
- 1991-03-14 JP JP4930591A patent/JPH04284654A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004061956A1 (en) * | 2002-12-27 | 2004-07-22 | Fujitsu Limited | Heat sink of electronic component |
| US7196905B2 (en) | 2002-12-27 | 2007-03-27 | Fujitsu Limited | Heat radiating apparatus of electronic component |
| US7443683B2 (en) * | 2004-11-19 | 2008-10-28 | Hewlett-Packard Development Company, L.P. | Cooling apparatus for electronic devices |
| WO2024004024A1 (en) * | 2022-06-28 | 2024-01-04 | 三菱電機株式会社 | Power module and power conversion device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980514 |