JPH042754Y2 - - Google Patents
Info
- Publication number
- JPH042754Y2 JPH042754Y2 JP1984178079U JP17807984U JPH042754Y2 JP H042754 Y2 JPH042754 Y2 JP H042754Y2 JP 1984178079 U JP1984178079 U JP 1984178079U JP 17807984 U JP17807984 U JP 17807984U JP H042754 Y2 JPH042754 Y2 JP H042754Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- mounting surface
- holding
- preliminary
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 122
- 239000007788 liquid Substances 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000011521 glass Substances 0.000 description 31
- 210000000078 claw Anatomy 0.000 description 16
- 239000010408 film Substances 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
Landscapes
- Jigs For Machine Tools (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、透光性ガラス板に遮光性薄膜を被着
したフオトマスク基板や、半導体基板に半導体酸
化物を被着した基板にそれぞれレジスト等の処理
液を塗布する工程や、そのレジストを塗布した
後、そのレジストを所定のパターンで露光された
これら基板のパターン形成工程における現象工程
（処理液：現像液）、エツチング工程（処理液：エ
チング液）等に使用されるスピン装置の処理液塗
布用スピンチヤツクに関し、特に、吸引を使用し
て前記基板を吸着・保持する処理液塗布用スピン
チヤツク（以下、単にスピンチヤツクという）に
関するものである。[Detailed description of the invention] [Industrial application field] The present invention applies resists, etc. to photomask substrates in which a light-shielding thin film is coated on a transparent glass plate, and to substrates in which a semiconductor oxide is coated on a semiconductor substrate. After the resist is applied, the resist is exposed to light in a predetermined pattern to form a pattern on these substrates. The present invention relates to a spin chuck for applying a processing liquid of a spin device used for processing liquids, etc., and particularly to a spin chuck for applying a processing liquid (hereinafter simply referred to as a spin chuck) that uses suction to attract and hold the substrate.
従来、この種のスピンチヤツクは、第３図ａ，
ｂに示すものがあつた。なお、同図ａは平面図を
示し、同図ｂは同図ａのX3−X3拡大断面図を示
す。このスピンチヤツクは、基板を載置する環状
突起部１を一体成型した円板状の基板保持部２
と、この基板保持部２を回転させるための回転軸
（図示せず。）を嵌合させるための嵌合部３が設け
られた円筒状の回転軸受部４からなつている。そ
して、この基板保持部２の環状突起部１側の中央
近傍には、４個の穴５，５，５，５が設けられ、
一方、基板保持部２の回転軸受部４側にも中央穴
６が設けられ、この穴５と中央穴６とは、基板保
持部２の内部を通る通孔７によつて連結されてい
る。更に、回転軸受部４の上面（基板保持部２を
固設する面）には、前記中央穴６と実質的に同一
の大きさを有する上孔８が設けられており、基板
保持部２と回転軸受部４とは、中央穴６と上孔８
とを実質的に一致させるようにして固設する。
Conventionally, this type of spin chuck is shown in Fig. 3a,
The item shown in b was found. In addition, the same figure a shows a top view, and the same figure b shows the X3 - X3 enlarged sectional view of the same figure a. This spin chuck consists of a disk-shaped substrate holder 2 integrally molded with an annular protrusion 1 on which a substrate is placed.
and a cylindrical rotation bearing part 4 provided with a fitting part 3 into which a rotation shaft (not shown) for rotating the substrate holding part 2 is fitted. Four holes 5, 5, 5, 5 are provided near the center of the substrate holding portion 2 on the annular protrusion 1 side.
On the other hand, a center hole 6 is also provided on the rotation bearing section 4 side of the substrate holding section 2, and the hole 5 and the center hole 6 are connected by a through hole 7 passing through the inside of the substrate holding section 2. Furthermore, an upper hole 8 having substantially the same size as the center hole 6 is provided on the upper surface of the rotation bearing section 4 (the surface on which the substrate holding section 2 is fixed), and the upper hole 8 has substantially the same size as the center hole 6. The rotation bearing part 4 includes a central hole 6 and an upper hole 8.
be fixed so that they substantially coincide with each other.
次に、この従来のスピンチヤツクの使用につい
て、レジスト塗布工程を例にして以下に記す。 Next, the use of this conventional spin chuck will be described below using a resist coating process as an example.
先ず、遮光性薄膜（例えば、クロム膜。）を被
着したガラスウエハ１１（直径76.4mm、厚さ0.55
mm）（第３図ｃ）を基板保持部２の環状突起部１
（直径65mm、高さ0.5mm）上に載置し、次に、真空
吸引機（図示せず。）によつて、上孔８、中央穴
６、通孔７、穴５を通して、前記ガラスウエハ１
１を吸引し、保持する。次に、回転軸受部４に嵌
合した回転軸を回転しながら、レジスト液（処理
液）を滴下し、所望の膜厚のレジスト膜（処理
液）を形成する。 First, a glass wafer 11 (diameter 76.4 mm, thickness 0.55
mm) (Fig. 3c) to the annular protrusion 1 of the substrate holder 2.
(diameter 65 mm, height 0.5 mm), and then, using a vacuum suction machine (not shown), pass the glass wafer through the upper hole 8, the center hole 6, the through hole 7, and the hole 5. 1
Aspirate and hold 1. Next, while rotating the rotating shaft fitted in the rotary bearing part 4, a resist solution (processing solution) is dropped to form a resist film (processing solution) with a desired thickness.
しかしながら、従来のスピンチヤツクでは、環
状突起部１上に基板を載置し、基板を破保持部２
の中央近傍に設けられた穴５によつて吸引保持す
るため、厚さの薄い基板、例えば、第３図ｃのガ
ラスウエハ１１に示すような基板は、同図ｂで示
すように湾曲してしまい基板の中央近傍のレジス
ト膜の膜厚が他の部分と比して異なつてしまう欠
点があつた。極端な場合は、基板が破損してしま
う欠点があつた。また、このスピンチヤツクで
は、基板を単に載置しているにので、吸引前にス
ピンチヤツクガ多少動いても基板がずれてしま
い、基板が環状突起部１から落ちてしまう欠点も
あつた。
However, in the conventional spin chuck, the substrate is placed on the annular protrusion 1, and the substrate is broken into the holding part 2.
Since the hole 5 provided near the center of the substrate is suction-held, a thin substrate, such as the glass wafer 11 shown in FIG. 3c, is curved as shown in FIG. 3b. Finally, there was a drawback that the thickness of the resist film near the center of the substrate was different from that in other parts. In extreme cases, there was a drawback that the board could be damaged. Furthermore, since the spin chuck simply places the substrate on it, there is a drawback that even if the spin chuck moves a little before suction, the substrate will shift and fall off the annular protrusion 1.
本考案は、上記した事情を鑑みてなされたもの
で、その目的は、基板の装着時に基板を破損はも
とより湾曲すらさせることなく、真空吸着するこ
とによつて基板を堅固に保持することができ、基
板の離脱時には容易に基板を離脱できるスピンチ
ヤツクを提供することである。更に、レジスト等
の処理液塗布工程において、形成された処理膜の
膜厚が不均一になることを抑制することができる
スピンチヤツクを提供することである。 The present invention was developed in view of the above-mentioned circumstances, and its purpose is to firmly hold the board by vacuum suction without damaging or even bending the board when it is mounted. Another object of the present invention is to provide a spin chuck that allows the substrate to be easily removed when the substrate is removed. Furthermore, it is an object of the present invention to provide a spin chuck capable of suppressing non-uniformity in the thickness of a formed treatment film in a process of applying a treatment liquid for resist or the like.
本考案は上記目的を達成するためになされたも
のであり、基板保持部と回転軸受部とを備え、基
板保持部は基板を載置する基板載置面と、前記基
板載置面に該基板載置面の周辺に沿つてリング状
に設けられた溝と、前記溝の底面に設けられた吸
引穴と、前記基板載置面に対向する前記回転軸受
部を固設する固設面と、前記固設面に設けられた
中央穴と、前記吸引穴と前記中央穴とを連結する
通孔とを具備し、前記基板を前記基板載置面に真
空吸着させた状態で前記基板上に処理液を塗布す
る処理液塗布用スピンチヤツクにおいて、前期記
板載置面の外形を前記基板より小となるように選
定し、前記基板保持部から張り出した基板周縁部
の側面を予備保持面によつて保持する予備保持手
段を前記基板保持部に複数個設け、前記予備保持
手段は、前記固設面に沿つて前記回転軸受部に離
間又は接近するように滑動する滑動部と、前記予
備保持面が基板載置面より上方に位置するように
前記滑動部から基板載置面に向かつて延伸した予
備保持部とを備えていることを特徴とする処理液
塗布用スピンチヤツクである。
The present invention has been made to achieve the above object, and includes a substrate holding section and a rotation bearing section, and the substrate holding section has a substrate mounting surface on which a substrate is placed, and a substrate mounting surface on which the substrate is placed. a ring-shaped groove provided along the periphery of the mounting surface, a suction hole provided in the bottom surface of the groove, and a fixing surface facing the substrate mounting surface for fixing the rotary bearing part; The fixing surface includes a central hole provided on the fixed surface, and a through hole connecting the suction hole and the central hole, and the substrate is vacuum-adsorbed to the substrate mounting surface and processed on the substrate. In a spin chuck for coating a processing liquid, the outer shape of the plate mounting surface is selected to be smaller than the substrate, and the side surface of the peripheral edge of the substrate protruding from the substrate holding part is held by the preliminary holding surface. A plurality of preliminary holding means for holding the substrate are provided in the substrate holding part, and the preliminary holding means includes a sliding part that slides along the fixed surface so as to move away from or approach the rotation bearing part, and the preliminary holding surface is A spin chuck for applying a processing liquid, characterized in that it is provided with a preliminary holding part extending from the sliding part toward the substrate mounting surface so as to be located above the substrate mounting surface.
更に、前記溝は、基板載置面の周辺近傍に設け
られていることが望ましい。 Further, it is preferable that the groove is provided near the periphery of the substrate mounting surface.
ここで、基板とは、透光性ガラス板に遮光性薄
膜を被着したフオトマスク基板、Si等半導体基
板、Si等半導体基板にSiO2等半導体酸化物を被
着した基板、これらの基板上にレジストを塗布し
た基板及びレジストを塗布した後、所定のパター
ンでレジストが露光されたものが含まれる。 Here, the term "substrate" refers to a photomask substrate in which a light-shielding thin film is coated on a transparent glass plate, a semiconductor substrate such as Si, a substrate in which a semiconductor oxide such as SiO 2 is coated on a semiconductor substrate such as Si, and a substrate formed on these substrates. This includes a substrate coated with a resist and a resist coated with a resist that is exposed to light in a predetermined pattern.
また、スピンチヤツクは、レジスト塗布工程、
現像工程、エツチング工程又は洗浄工程等で使用
されるスピン装置に使用されるものを含む。 In addition, the spin chuck is used in the resist coating process,
This includes those used in spin devices used in developing processes, etching processes, cleaning processes, etc.
本考案の処理液塗布用スピンチヤツクによれ
ば、基板載置面の外形が基板より小さいため、基
板装着時には基板を湾曲させることなく保持でき
ると共に基板離脱時には載置面から基板を容易に
離脱させることができる。この作用は基板薄くな
ればなるほど顕著に現れる。ところで、このよう
に基板載置面の外形を基板がより小とした場合、
基板を基板載置面に載置するとき、基板載置面が
基板によつて視界から遮られてしまうので基板保
持部の回転中心と基板の幾何学中心とを一致させ
ることが困難になる。又、仮に載置時に双方の中
心点が接近していたとしても真空吸着するまでに
基板が移動してしまうこともある。これらが原因
となり処理膜の膜厚の不均一を招くことになる。
According to the spin chuck for applying processing liquid of the present invention, since the outer diameter of the substrate mounting surface is smaller than the substrate, the substrate can be held without curving when the substrate is mounted, and the substrate can be easily removed from the mounting surface when the substrate is removed. I can do it. This effect becomes more pronounced as the substrate becomes thinner. By the way, when the outer shape of the board mounting surface is made smaller,
When the substrate is placed on the substrate mounting surface, the substrate mounting surface is blocked from view by the substrate, making it difficult to align the rotation center of the substrate holder with the geometric center of the substrate. Furthermore, even if the center points of both substrates are close to each other when placed, the substrates may move before being vacuum-adsorbed. These factors lead to non-uniformity in the thickness of the treated film.
しかしながら、本考案においては、予備保持手
段によつて真空吸着前に予め上述した双方の中心
のズレを抑制しているので、双方の中心ズレを抑
制した状態で基板を真空吸着することができる。
又、真空吸着前の基板の移動も防止できる。この
結果、基板を回転させながら、基板上に処理液を
塗布したとき、基板上に形成された処理膜の膜厚
が不均一になることを抑制することができる。 However, in the present invention, since the above-mentioned deviation of both centers is suppressed in advance by the preliminary holding means before vacuum suction, the substrate can be vacuum suctioned with the deviation of both centers suppressed.
Further, movement of the substrate before vacuum suction can also be prevented. As a result, when the processing liquid is applied onto the substrate while rotating the substrate, it is possible to prevent the thickness of the processing film formed on the substrate from becoming non-uniform.
又、上述した予備保持手段は膜厚の均一化にの
み貢献することだけではなく、載置面を基板より
小としたことに起因する吸着力の低減を、基板周
側面に予備保持部を当接することにより補うこと
ができ、これにより堅固な基板保持が可能にな
る。 In addition, the above-mentioned pre-holding means not only contributes to uniformity of film thickness, but also reduces the suction force caused by making the mounting surface smaller than the substrate by providing a pre-holding portion on the peripheral side of the substrate. This can be compensated for by contact, which allows for firm substrate holding.
以下、本考案の一実施例を第１図及び第２図に
基づき詳細に説明する。
Hereinafter, one embodiment of the present invention will be described in detail with reference to FIGS. 1 and 2.
第１図は、本考案のスピンチヤツクを示す図で
あり、同図ａは斜視図、同図ｂは平面図、同図ｃ
は底面図、同図ｄは同図ｂのX1−X1拡大断面図
及び同図ｅは同図ｂのY1−Y1拡大断面図である。 Fig. 1 shows the spin chuck of the present invention; Fig. 1a is a perspective view, Fig. 1b is a plan view, and Fig. 1c is a top view.
is a bottom view, d is an enlarged cross-sectional view taken along X 1 -X 1 of figure b, and figure e is an enlarged sectional view taken along Y 1 -Y 1 of figure b.
本実施例のスピンチヤツクは、先ず、円板状の
基板保持部９と円筒状の回転軸受部４とを備えて
いる。 The spin chuck of this embodiment first includes a disk-shaped substrate holding section 9 and a cylindrical rotation bearing section 4. As shown in FIG.
基板保持部９は、第３図ｃで示すような円板状
のガラスウエハ１１（直径76.4mm、厚さ0.55mm、
材質ソーダライムガラス）を載置する円状基板載
置面９１（直径70mm）を備えている。そして、こ
の円状基板載置面９１には、この載置面９１とほ
ぼ同心円状にリング状に溝９３（幅0.5mm、深さ
１mmで溝の内側の直径が63mm。）が設けられ、こ
の溝９３の底面には、ほぼ90°の間隔で４個の吸
引穴９４（直径0.5mm）が設けられている。又、
基板保持部９の前記回転軸受部４を固設する固設
面９５（直径70mm）の中心には、中央穴９６（直
径２mm）が設けられ、前記吸引穴９４の４個のう
ちの対向する２個の前記吸引穴９４と前記中央穴
９６とを連結する、断面が円状の２個の通孔９７
（断面の直径２mm）が前記基板保持部９内に設け
られている。 The substrate holder 9 is a disk-shaped glass wafer 11 (diameter 76.4 mm, thickness 0.55 mm,
It has a circular substrate mounting surface 91 (diameter 70 mm) on which a substrate (made of soda lime glass) is placed. A ring-shaped groove 93 (width: 0.5 mm, depth: 1 mm, inner diameter of the groove is 63 mm) is provided on this circular substrate mounting surface 91, approximately concentrically with this mounting surface 91. Four suction holes 94 (diameter 0.5 mm) are provided on the bottom surface of this groove 93 at approximately 90° intervals. or,
A center hole 96 (diameter 2 mm) is provided at the center of a fixing surface 95 (diameter 70 mm) on which the rotary bearing section 4 of the substrate holding section 9 is fixed, and a central hole 96 (diameter 2 mm) is provided in the center of the fixing surface 95 (diameter 70 mm) on which the rotation bearing section 4 of the substrate holding section 9 is fixed. two through holes 97 with circular cross sections that connect the two suction holes 94 and the center hole 96;
(cross-sectional diameter of 2 mm) is provided in the substrate holding portion 9.
前記基板保持部９には、前記ガラスウエハ１１
の中心と前記円状基板載置面９１の中心とがほぼ
一致するように位置決めをするため、並びに前記
ガラスウエハ１１をこの中心位置から移動させな
いための予備保持手段たる爪９２が３個設けられ
ている。そして、各爪９２は、第１図に示すよう
に、断面Ｌ字状で、滑動部と予備保持部とから成
る。前記滑動部は回転軸受４から前記基板保持部
９の側面側に向かつて滑動させる（又は、その逆
方向）ための固設面９５側の一方の面９２１（以
下、「滑動面」という。）を有し、他方の予備保持
部は後記するように基板を予備的保持するため
に、基板載置面９１より約0.45mm突出し、基板保
持部９の側面側である、もう一方の面９２２（以
下、「予備保持面」という。）とを有するものであ
る。なお、この爪９２は、ネジ９８で固設面９５
に移動自在に止められ、また約120°の間隔で配置
されている。一方、回転軸受部４は、従来と同様
に、嵌合部３と上孔８（直径２mm）とを有し、前
記固設面９５の中央穴９６と、上孔８とをほぼ一
致させるように、前記固設面９５に前記回転軸受
部４を固設する。 The glass wafer 11 is held in the substrate holding section 9.
Three claws 92 are provided as preliminary holding means for positioning the glass wafer 11 so that the center thereof substantially coincides with the center of the circular substrate mounting surface 91 and for preventing the glass wafer 11 from moving from this central position. ing. As shown in FIG. 1, each claw 92 has an L-shaped cross section and consists of a sliding part and a preliminary holding part. The sliding part is one surface 921 (hereinafter referred to as "sliding surface") on the fixed surface 95 side for sliding from the rotary bearing 4 toward the side surface of the substrate holding part 9 (or in the opposite direction). The other preliminary holding part protrudes about 0.45 mm from the substrate mounting surface 91 in order to temporarily hold the substrate as will be described later. Hereinafter, it has a "preliminary holding surface"). Note that this claw 92 is attached to the fixed surface 95 with a screw 98.
They are movably stopped at , and are spaced at approximately 120° intervals. On the other hand, the rotary bearing part 4 has a fitting part 3 and an upper hole 8 (diameter 2 mm), as in the conventional case, and is arranged so that the center hole 96 of the fixed surface 95 and the upper hole 8 almost coincide with each other. Then, the rotary bearing portion 4 is fixed to the fixed surface 95.
次に、本実施例の使用例を第２図に基づき詳述
する。なお、同図ａは平面図、同図ｂは底面図及
び同図ｃは同図ａのY2−Y2拡大部分断面図であ
る。 Next, a usage example of this embodiment will be explained in detail based on FIG. 2. In addition, figure a is a plan view, figure b is a bottom view, and figure c is a Y2 - Y2 enlarged partial sectional view of figure a.
先ず、３個の爪９２のそれぞれのネジ９８を緩
めて、３個の爪９２を充分に外側に向かつて滑動
させ、次にこれらの爪９２を指標としてガラスウ
エハ１１を基板載置面９１上にガラスウエハ１１
の中心と基板載置面９１の中心とがほぼ一致する
ように載置する。次いで、充分に外側に向かつて
滑動させた３個の爪９２を内側に向かつて滑動さ
せ、爪９２の予備保持面９２２をガラスウエハ１
１の側面に当接し、ネジ９８により固定し、ガラ
スウエハ１１を予備的保持する。次に、回転軸受
部４に嵌合した回転軸１０（ネジ１０１によつて
固設されている。）中の中空部（図示せず。）、上
孔８、中央穴９６、通孔９７、吸引穴９４及び溝
９３を介して真空吸引機（図示せず。）によつて、
基板載置面９１上に予備的保持したガラスウエハ
１１を吸着する。このように、ガラスウエハ１１
を吸着した状態でスピンチヤツクを回転させなが
ら、ガラスウエハ１１上にレジスト（処理液）を
塗布すると、レジスト膜（処理膜）の膜厚差を抑
制できる。 First, loosen the screws 98 of each of the three claws 92, slide the three claws 92 fully outward, and then use these claws 92 as indicators to place the glass wafer 11 on the substrate mounting surface 91. glass wafer 11
and the center of the substrate mounting surface 91 substantially coincide with each other. Next, the three claws 92 that have been slid fully outward are slid inward, and the preliminary holding surfaces 922 of the claws 92 are held against the glass wafer 1.
1 and is fixed with screws 98 to temporarily hold the glass wafer 11. Next, a hollow part (not shown) in the rotating shaft 10 (fixed by a screw 101) fitted into the rotating bearing part 4, an upper hole 8, a central hole 96, a through hole 97, By a vacuum suction machine (not shown) through the suction hole 94 and the groove 93,
The glass wafer 11 preliminarily held on the substrate mounting surface 91 is attracted. In this way, the glass wafer 11
By applying the resist (processing liquid) onto the glass wafer 11 while rotating the spin chuck while adsorbing the resist film (processing liquid), it is possible to suppress the difference in film thickness of the resist film (processing film).
本実施例によれば、基板載置面９１にリング状
に溝９３を設けてあるので、単に吸引穴９４によ
つて、ガラスウエハ１１を吸着するよりも、溝９
３を介して吸着する方が、ガラスウエハ１１の平
面性をより保つことができる。また、爪９２によ
つて、ガラスウエハ１１が予備的保持されている
ので、吸引前に基板保持部９が多少動いても、ガ
ラスウエハ１１が移動することはなく、所望の位
置にガラスウエハ１１を保持することができる。
更に、本実施例では、爪９２によつてガラスウエ
ハ１１の幾何学中心と回転中心との不一致が抑え
られることから、レジストの膜厚の変動は、ガラ
スウエハ１１の周辺にのみ存在し、通常のパター
ン形成時において、要求されている規格を満足さ
せることができる。更に、本実施例においては、
溝９３が基板載置面９１の周辺に位置するため、
上述した膜厚均一効果が促進される。また、本実
施例では、爪９２の予備保持面９２２の突出量が
ガラスウエハ１１の厚さ以上でないので、爪９２
のガラスウエハ１１の側面の当接部近傍にもレジ
ストの膜厚の変動は生じない。 According to this embodiment, since the ring-shaped groove 93 is provided on the substrate mounting surface 91, the groove 93 is more effective than simply suctioning the glass wafer 11 using the suction hole 94.
3, the flatness of the glass wafer 11 can be better maintained. Further, since the glass wafer 11 is preliminarily held by the claws 92, even if the substrate holding part 9 moves slightly before suction, the glass wafer 11 will not move and the glass wafer 11 will not be moved to the desired position. can be retained.
Furthermore, in this embodiment, since the claws 92 suppress mismatch between the geometric center of the glass wafer 11 and the center of rotation, variations in the resist film thickness exist only around the glass wafer 11 and are normally It is possible to satisfy the required standards when forming a pattern. Furthermore, in this example,
Since the groove 93 is located around the substrate mounting surface 91,
The above-mentioned film thickness uniformity effect is promoted. Further, in this embodiment, since the amount of protrusion of the preliminary holding surface 922 of the claw 92 is not greater than the thickness of the glass wafer 11, the claw 92
There is no change in the resist film thickness near the contact portion on the side surface of the glass wafer 11.
更に、本実施例では、爪９２の予備保持面９２
２が、基板保持部９の側面から張り出したガラス
ウエハ１１の側面に当接することによつて、ガラ
スウエハ１１を予備的に保持するので、基板保持
部９の側面から張り出し、かつ予備保持面９２２
の当接しないガラスウエハ１１の側面部分を持つ
て、ガラスウエハ１１の離脱を容易に行い得る。
又ガラスウエハ１１は、真空吸着のみならず、そ
の側面部分を爪９２によつて保持されているの
で、回転中も堅固に保持されている。 Furthermore, in this embodiment, the preliminary holding surface 92 of the claw 92
2 preliminarily holds the glass wafer 11 by contacting the side surface of the glass wafer 11 that protrudes from the side surface of the substrate holding section 9 .
The glass wafer 11 can be easily removed by holding the side portions of the glass wafer 11 that are not in contact with each other.
In addition, the glass wafer 11 is not only held by vacuum suction, but also has its side portions held by the claws 92, so that it is held firmly even during rotation.
以上前記実施例において、基板保持部が円板状
であつたが、矩形状であつてもよく、また、爪の
数も３個ではなく、基板に形状に適するように適
宜決定すればよい。また、前記実施例では、吸引
穴の数が４個であつたが、１個であつてもよい。
望ましくは、基板が溝を介して吸着される力がよ
り均一になるために複数個がよい。更に望ましく
は、３個以上で、実質的に均等の位置に設けら
れ、吸引穴の断面積の総和が、中央穴の断面積以
上である。吸引穴の総断面積が、この中央穴の断
面積未満であると、基板を基板載置面に載置する
と、あたかも基板が吸着された状態となるので、
基板が真に吸着された、と誤認を生じ、この状態
でスピンチヤツクを回転すると、基板が基板載置
面から外れる危険がある。また、基板保持部と回
転軸受部とは、一体成型されたものであつてもよ
い。 In the above-mentioned embodiments, the substrate holder has a disk shape, but it may have a rectangular shape, and the number of claws is not limited to three, but may be determined as appropriate to suit the shape of the substrate. Further, in the above embodiment, the number of suction holes was four, but it may be one.
Preferably, there are more than one in order to make the force with which the substrate is attracted through the groove more uniform. More preferably, three or more suction holes are provided at substantially equal positions, and the sum of the cross-sectional areas of the suction holes is greater than or equal to the cross-sectional area of the central hole. If the total cross-sectional area of the suction holes is less than the cross-sectional area of the center hole, when the board is placed on the board mounting surface, it will be as if the board is being sucked.
If the spin chuck is rotated in this state due to a misunderstanding that the substrate is truly attracted, there is a risk that the substrate will come off the substrate mounting surface. Moreover, the substrate holding part and the rotation bearing part may be integrally molded.
本考案によれば、基板の装着時に湾曲を防止し
て基板を堅固に保持できると共に、基板の幾何学
中心と回転中心との不一致を抑制することができ
るので、基板上に形成された処理膜の膜厚が不均
一になることを抑制できる。又、基板の離脱時に
は容易に基板を取り外すことができる。
According to the present invention, it is possible to prevent the substrate from curving and firmly hold it when it is mounted, and it is also possible to suppress mismatch between the geometric center of the substrate and the center of rotation, so that the processed film formed on the substrate can be It is possible to prevent the film thickness from becoming non-uniform. Further, when the substrate is detached, it can be easily removed.
第１図は本考案のスピンチヤツクの一実施例を
示す図であり、同図ａは斜視図、同図ｂは平面
図、同図ｃは底面図、同図ｄは同図ｂのX1−X1
拡大断面図及び同図ｅは同図ｂのY1−Y1拡大断
面図である。第２図は本考案のスピンチヤツクの
使用例を示す図であり、同図ａは平面図、同図ｂ
は底面図及び同図ｃは同図ａのY2−Y2拡大部分
断面図である。第３図ａ及びｂは、それぞれ従来
のスピンチヤツクを示す平面図及び同図ａのX3
−X3拡大断面図であり、第３図ｃは基板の一例
を示す平面図である。
３……嵌合部、４……回転軸受部、８……上
孔、９……基盤保持部、１１……ガラスウエハ、
９１……基板載置面、９２……爪（予備保持手
段）、９３……溝、９４……吸引穴、９５……固
設面、９６……中央穴、９７……通孔、９８……
ネジ、９２１……滑動面、９２２……予備保持
面。
Fig. 1 shows an embodiment of the spin chuck of the present invention, in which Fig. 1a is a perspective view, Fig. 1b is a top view, Fig. 1c is a bottom view, and Fig. 1d is an X 1 - X1
The enlarged sectional view and the figure e are the Y1 - Y1 enlarged sectional views of the same figure b. Figure 2 shows an example of the use of the spin chuck of the present invention, in which figure a is a plan view and figure b is a plan view.
1 is a bottom view, and FIG . Figures 3a and 3b are a plan view showing a conventional spin chuck and an X 3
-X 3 is an enlarged sectional view, and FIG. 3c is a plan view showing an example of the substrate. 3... Fitting part, 4... Rotating bearing part, 8... Upper hole, 9... Base holding part, 11... Glass wafer,
91...Substrate placement surface, 92...Claw (preliminary holding means), 93...Groove, 94...Suction hole, 95...Fixed surface, 96...Center hole, 97...Through hole, 98... …
Screw, 921...Sliding surface, 922...Preliminary holding surface.
Claims (1)
は基板を載置する基板載置面と、前記基板載置面
に該基板載置面の周辺に沿つてリング状に設けら
れた溝と、前記溝の底面に設けられた吸引穴と、
前記基板載置面に対向する前記回転軸受部を固設
する固設面と、前記固設面に設けられた中央穴
と，前記吸引穴と前記中央穴とを連結する通孔と
を具備し、前記基板を前記基板載置面に真空吸着
させた状態で前記基板上に処理液を塗布する処理
液塗布用スピンチヤツクにおいて、 前記基板載置面の外形を前記基板より小となる
ように選定し、 前記基板保持部から張り出した基板周縁部の側
面を予備保持面によつて保持する予備保持手段を
前記基板保持部に複数個設け、 前記予備保持手段は、前記固設面に沿つて前記
回転軸受部に離間又は接近するように滑動する滑
動部と、前記予備保持面が基板載置面より上方に
位置するように前記滑動部から基板載置面に向か
つて延伸した予備保持部とを備えていることを特
徴とする処理液塗布用スピンチヤツク。[Claims for Utility Model Registration] The substrate holding section includes a substrate holding section and a rotation bearing section, and the substrate holding section has a substrate mounting surface on which a substrate is placed, and a substrate mounting surface along the periphery of the substrate mounting surface. a ring-shaped groove; a suction hole provided on the bottom of the groove;
The fixing surface includes a fixing surface facing the substrate mounting surface and fixing the rotary bearing part, a center hole provided in the fixing surface, and a through hole connecting the suction hole and the center hole. In a spin chuck for applying a processing liquid, which applies a processing liquid onto the substrate while the substrate is vacuum-adsorbed to the substrate mounting surface, the outer shape of the substrate mounting surface is selected to be smaller than the substrate. , a plurality of preliminary holding means are provided in the substrate holding section for holding a side surface of the peripheral edge of the substrate protruding from the substrate holding section with a preliminary holding surface, and the preliminary holding means holds the rotation along the fixed surface. A sliding part that slides away from or toward the bearing part, and a preliminary holding part that extends from the sliding part toward the substrate placement surface so that the preliminary holding surface is located above the substrate placement surface. A spin chuck for applying processing liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984178079U JPH042754Y2 (en) | 1984-11-22 | 1984-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984178079U JPH042754Y2 (en) | 1984-11-22 | 1984-11-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6192533U JPS6192533U (en) | 1986-06-16 |
| JPH042754Y2 true JPH042754Y2 (en) | 1992-01-30 |
Family
ID=30735646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984178079U Expired JPH042754Y2 (en) | 1984-11-22 | 1984-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH042754Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004327927A (en) * | 2003-04-28 | 2004-11-18 | Matsushita Electric Ind Co Ltd | Chemical solution processor and chemical solution processing method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58150402U (en) * | 1982-04-02 | 1983-10-08 | 三菱電機株式会社 | Check |
-
1984
- 1984-11-22 JP JP1984178079U patent/JPH042754Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6192533U (en) | 1986-06-16 |
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