JP2004327927A - Chemical solution processor and chemical solution processing method - Google Patents

Chemical solution processor and chemical solution processing method Download PDF

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Publication number
JP2004327927A
JP2004327927A JP2003124107A JP2003124107A JP2004327927A JP 2004327927 A JP2004327927 A JP 2004327927A JP 2003124107 A JP2003124107 A JP 2003124107A JP 2003124107 A JP2003124107 A JP 2003124107A JP 2004327927 A JP2004327927 A JP 2004327927A
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Japan
Prior art keywords
peripheral portion
flexible substrate
sample stage
chemical
outer peripheral
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JP2003124107A
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Japanese (ja)
Inventor
Yukinori Takamoto
幸典 高本
Toru Uchida
徹 内田
Toshiya Nitta
敏也 新田
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Priority to JP2003124107A priority Critical patent/JP2004327927A/en
Publication of JP2004327927A publication Critical patent/JP2004327927A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a chemical solution processor and a chemical solution processing method, in which it is possible to uniformly carry out a chemical solution processing to flexible substrate periphery portions by a paddle system and a flexible substrate rear face is not contaminated by a chemical solution. <P>SOLUTION: An O ring 30 is provided at periphery portions of a flexible substrate mounting face 21 of a sample board 20, and an absorption hole 70 is made in a region surrounded by the O ring. Periphery portions of a polyimide film 10 are raised by the O ring, and consequently the polyimide film 10 becomes such a status as to maintain developer 80 as a chemical. As a result, the developer 80 can uniformly develop the periphery portions without coming into a rear face of the polyimide film 10. The chemical solution processing method by the paddle system can solve such a problem that in a method of immersing a substrate in the chemical solution, there should be required such a device and a process as to drain and clean a coming-in chemical solution, because the chemical solution comes into a rear face of the substrate and consequently contaminates devices after chemical solution processing processes. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は、薬液処理装置と薬液処理方法に関し、特に可撓性基板に薬液を供給した後、静止状態(パドル方式)で薬液処理する薬液処理装置と薬液処理方法に関する。
【0002】
【従来の技術】
従来のパドル方式での薬液処理装置と薬液処理方法として、パドル方式の現像装置と現像方法を例に説明する。真空吸着により保持された基板に、現像液を滴下するとその表面張力により現像液が液盛りされ、そのまま基板を静止させた状態、あるいは低速で基板を回転させて現像反応を進行させる。しかしながら、このようなパドル方式の現像装置では、現像液の表面張力によって基板上に液盛りしているため、基板の外周部は基板の内周部に比べ現像液の量が少なくなって現像速度が低下し、基板外周部に現像不良が生じていた。
【0003】
これに対して、基板を囲むカップを設け現像液をカップ内に注入し、現像液に浸漬させて、基板外周部まで均一に現像する方法が提案されている(例えば特許文献1参照)。
【0004】
【特許文献1】
特開平4−167517号公報(第2−3頁)
【0005】
【発明が解決しようとする課題】
しかしながら、このような基板を現像液に浸漬させる方法では、現像液が基板裏面に回り込み、現像工程以後の装置を汚染するため、回り込んだ現像液を排液し洗浄する装置ならびに工程が必要になるという課題があった。
【0006】
本発明はこのような問題に鑑みてなされたものであり、パドル方式で可撓性基板外周部まで均一に薬液処理できるとともに、可撓性基板裏面を薬液で汚染させることがない薬液処理装置と薬液処理方法を提供することを目的とする。
【0007】
【課題を解決するための手段】
本発明の薬液処理装置は、可撓性基板を載置し吸着固定する試料台と、試料台を回転させる回転手段と、可撓性基板に薬液を供給する薬液供給手段と、回転手段と薬液供給手段とを制御する制御手段とを備え、試料台は可撓性基板を試料台に載置した時に可撓性基板の外周部を内周部に比べて高くする可撓性基板載置面を有するものである。
【0008】
このような薬液処理装置とすることにより、可撓性基板は外周部が持ち上げられた状態となり、薬液がその外周部まで液盛りされるので、可撓性基板の外周部まで均一に薬液処理できる。そして、薬液は回転手段で振り切り、排出されるので、可撓性基板裏面を薬液で汚染させることがない。
【0009】
また、本発明の薬液処理装置の試料台の可撓性基板載置面は、その外周部にリングが設けられているものである。
【0010】
また、本発明の薬液処理装置の試料台の可撓性基板載置面は、その外周部に固定されたピンが複数個設けられているものである。
【0011】
また、本発明の薬液処理装置の試料台の可撓性基板載置面の形状は、その外周部から内周部に向けて凹形の円弧状である。
【0012】
このような試料台の可撓性基板載置面および可撓性基板載置面の形状を有する薬液処理装置とすることにより、可撓性基板は薬液処理時に確実にその内周部が低く外周部が高くなった形状とできる。
【0013】
また、本発明の薬液処理装置は、可撓性基板を載置し吸着固定する試料台と、試料台を回転させる回転手段と、可撓性基板に薬液を供給する薬液供給手段と、可撓性基板の外周部または内周部の高さを調節するための高さ調節手段と、回転手段と薬液供給手段と高さ調節手段とを制御する制御手段とを備えたものである。
【0014】
また、本発明の薬液処理装置の高さ調節手段は、試料台を試料台内周部と試料台外周部とに分離し、試料台外周部を鉛直方向に可動な構成としたものである。
【0015】
また、本発明の薬液処理装置の高さ調節手段は、試料台の外周部に設けた複数の貫通孔に挿入されたピンと、複数のピンを鉛直方向に可動な構成としたものである。
【0016】
このような高さ調節手段を設けた薬液処理装置とすることにより、薬液処理時に持ち上げられた可撓性基板の外周部は、薬液排出時に元の高さに戻され平坦となるので、薬液排出がより確実に行われる。その結果、薬液残りによる次工程以降への悪影響をなくすことができる。なお薬液排出時、可撓性基板の外周部を内周部より下げて、薬液をより排出させやすくしてもよい。
【0017】
また、本発明の薬液処理方法は、可撓性基板を試料台に載置し吸着固定する載置工程と、可撓性基板の外周部を内周部より高くする高さ設定工程と、高さ設定工程以後に可撓性基板に第1の薬液を供給する第1薬液供給工程と、可撓性基板を静止状態で所定時間保持する静止保持工程と、可撓性基板の外周部を内周部と少なくとも同じ高さにする高さ除去工程と、高さ除去工程以後に試料台を回転させ第1の薬液を排出する第1薬液排出工程と、試料台を回転させながら第2の薬液を供給し排出する第2薬液供給排出工程とを有するものである。
【0018】
このような薬液処理方法とすることにより薬液処理時、可撓性基板は外周部が持ち上げられ、その基板の外周部まで薬液が液盛りされるので、その基板外周部まで均一に薬液処理できる。また薬液排出時、可撓性基板は平坦になるので薬液が排出されやすくなり、可撓性基板裏面を薬液で汚染させることがなくなる。
【0019】
【発明の実施の形態】
以下、本発明の実施の形態の薬液処理装置の一例である現像装置について図面を参照しながら詳細に説明する。
【0020】
(第1の実施の形態)
まず、本発明の第1の実施の形態の現像装置を示す図1を用いて説明する。試料台20の可撓性基板を載置する可撓性基板載置面21の外周部には、可撓性基板の外周部の高さを内周部の高さより高くするためのリングとしてOリング30が、取り付けられている。また、試料台20を回転させる回転手段として回転ユニット40が試料台20の下方に位置している。そして、可撓性基板に薬液を供給する薬液供給手段として第1薬液供給管50、第2薬液供給管52が試料台20の上方に位置し、第1薬液供給管50、第2薬液供給管52にはそれぞれ電磁弁54、電磁弁56が取り付けられている。さらに、回転ユニット40と電磁弁54、電磁弁56を制御する制御手段として制御装置60が備えられ、制御装置60と回転ユニット40は信号線62が、電磁弁54、電磁弁56には信号線64がつながっている。
【0021】
次に、第1の実施の形態の現像装置の動作を説明すると、可撓性基板載置面21に可撓性基板が載置されると、真空吸着で固定され、Oリング30により可撓性基板の外周部が持ち上げられた状態となる。そして、現像制御プログラムが格納された制御装置60が信号線64を介して電磁弁54を開け、第1薬液供給管50から現像液を供給する。所定時間後、制御装置60が信号線62を介してモータを有する回転ユニット40で、試料台20を回転させる。その後は、必要に応じて電磁弁56を開け、第2薬液供給管52からリンス液や純水を供給する場合もある。
【0022】
図2は本発明の第1の実施の形態の現像装置の試料台を示す図であり、図2(A)は、試料台の斜視図である。試料台20の可撓性基板載置面21の外周部にOリング30が備えられ、Oリング30に囲まれた領域には、吸着穴70が開けられている。
【0023】
図2(B)は、試料台での現像状態を示す断面図である。可撓性基板載置面21に載置された可撓性基板であるポリイミドフィルム10は、Oリング30により外周部が高くなり、薬液として現像液80を保持した状態となる。この結果、可撓性基板は外周部まで均一に現像できるとともに、現像液80はポリイミドフィルム10の裏面に回り込むことがない。
【0024】
なお、リングとしてはOリング等の可撓性基板との密着性に優れた弾性体に限定されるものでなく、可撓性基板外周部の持ち上げ高さを均一としやすいステンレス鋼等の金属でもよい。
【0025】
また、Oリング等の弾性体を使用する時は、可撓性基板載置面21に溝状の穴を形成し、その穴にOリング30を挿入することにより、Oリング30の位置が固定され、可撓性基板の現像される範囲がより均一となる。
【0026】
また可撓性基板としては、厚さが0.1mm程度で、ポリイミドフィルム以外にポリアミド、ポリエーテルエーテルケトン、エポキシ樹脂、ポリベンズチアゾールを使用できる。
【0027】
また、試料台20はアルカリ現像液に耐性があり、表面平滑性のあるステンレス鋼等の金属が適している。
【0028】
(第2の実施の形態)
次に本発明の現像装置の他の構成例について説明するが、第1の実施の形態と異なるのは試料台の構成のみであるので、試料台について説明する。
【0029】
図3は、本発明の第2の実施の形態の現像装置の試料台を示す図である。図3(A)は試料台の斜視図であり、試料台20の可撓性基板載置面21の外周部に複数個のピン32を設けた場合である。ピン32は可撓性基板載置面21の外周部にほぼ均等な間隔で設けられ、可撓性基板載置面21のピン32に囲まれた領域には、可撓性基板を吸着固定する吸着穴70が開けられている。
【0030】
図3(B)は試料台での現像状態を示す断面図である。ポリイミドフィルム10を可撓性基板載置面21に載置し、真空吸着するとピン32により、ポリイミドフィルム10の外周部が内周部より高くなり、現像液80を保持した状態となる。この結果、現像液80はポリイミドフィルム10の裏面に回り込むことなく、外周部まで均一に現像できる。
【0031】
なお、本実施の形態では、ピン32を0.3mm〜0.5mm程度の均等な高さとしたが、この高さは可撓性基板の大きさ、種類により適宜選択すればよい。また、ピン32の材料としては加工が容易なプラスチックや金属がよい。
【0032】
(第3の実施の形態)
さらに本発明の現像装置の他の構成例について説明するが、本実施の形態も第1の実施の形態と異なるのは試料台の構成のみであるので、試料台について説明する。
【0033】
図4は本発明の第3の実施の形態の現像装置の試料台を示す図である。図4(A)は試料台の斜視図で、試料台22の可撓性基板載置面21の形状はその外周部から内周部に向けて凹形の円弧状に切削してある。そして、円弧状の切削面には吸着穴70が形成されている。
【0034】
図4(B)は試料台での現像状態を示す断面図である。ポリイミドフィルム10を試料台22の可撓性基板載置面21に載置し、真空吸着すると、可撓性基板載置面21の円弧状の切削面に沿って吸着されるため、ポリイミドフィルム10の内周部が低く、その外周部が高い状態となる。従って現像液80が滴下されても、現像液80はポリイミドフィルム10の外周部まで液盛りされた状態となる。従って、本実施の形態でもポリイミドフィルム10の外周部まで均一に現像でき、現像液80が裏面に回り込むことがない。
【0035】
なお、試料台22はアルカリ現像液に耐性があり、加工しやすいステンレス鋼等の金属が適している。本実施の形態では、試料台22の中心部切削深さを0.3mm〜0.5mm程度にしたが、この値も可撓性基板の大きさ、種類により適宜選択すればよい。
【0036】
また、第1の実施の形態〜第3の実施の形態で、吸着穴70を可撓性基板載置面21の外周部より内周部に多く形成すると、可撓性基板の内周部を低く、外周部を高くするのに効果的である。
【0037】
(第4の実施の形態)
さらに本発明の現像装置の他の構成例について、本発明の第4の実施の形態の現像装置を示す図5を用いて説明する。第4の実施の形態では、高さ調節手段は試料台を試料台内周部と試料台外周部とに分離し、試料台外周部を鉛直方向に可動な構成とするものである。
【0038】
図5(A)は現像装置の全体図で、可撓性基板を載置する試料台24は試料台内周部25と、断面形状が逆L字形の凹部を有する試料台外周部26とに分離されている。そして試料台外周部26に近接してカムフォロア90があり、カムフォロア90にピロボール92、ターンバックル94、シリンダー96が順次接続されている。スプリング98が試料台外周部26の凹部に、また試料台24を回転させる回転ユニット40が試料台24下方に設置されている。また、可撓性基板に薬液を供給する薬液供給手段として第1薬液供給管50、第2薬液供給管52が試料台24の上方に位置し、第1薬液供給管50、第2薬液供給管52にはそれぞれ電磁弁54、電磁弁56が取り付けられている。さらに、回転ユニット40と電磁弁54、電磁弁56とシリンダー96を制御する制御手段として制御装置60が備えられ、制御装置60と回転ユニット40は信号線62が、電磁弁54、電磁弁56には信号線64が、シリンダー96には信号線66がつながっている。
【0039】
次に第4の実施の形態の動作を説明する。図5(B)(C)は試料台外周部26の動作状態を説明する図で、シリンダー96が加圧していない状態では、図5(B)に示すように、カムフォロア90は試料台外周部26から離れている。シリンダー96が加圧されると、試料台24方向への押圧力がターンバックル94で強化され、ピロボール92で回転運動に変えられ、カムフォロア90は鉛直上方に回転し、試料台外周部26を押し上げる。このように、高さ調節手段は試料台外周部26を鉛直方向に押し上げる押圧手段を備えている。これを、図5(C)に示す。
【0040】
また、試料台外周部26がカムフォロア90で押し上げられ試料台内周部25より高い状態から、シリンダー96への加圧がなくなると、カムフォロア90が試料台外周部26から離れる。この時、試料台外周部26の自重で試料台外周部26はいくらか下降するが、試料台内周部25との摩擦により試料台内周部25と同じ高さまで下降しない場合がある。この時スプリング98は、試料台外周部26を引張し、試料台外周部26を試料台内周部25と同じ高さにする。このように、高さ調節手段は試料台外周部を鉛直方向に引き下げる引張手段を備えている。
【0041】
(第5の実施の形態)
さらに本発明の現像装置の他の構成例について、本発明の第5の実施の形態の現像装置を示す図6を用いて説明する。第5の実施の形態が、第4の実施の形態と異なる点は高さ調節手段の押圧手段のみであるので、押圧手段を中心に説明する。
【0042】
図6(A)は試料台近傍の図で、試料台24を構成する試料台内周部25と、試料台外周部26の分離された形状および回転ユニット40の位置は第4の実施の形態と同じである。試料台外周部26に近接してミニチュアシリンダー100が位置し、ミニチュアシリンダー100はシリンダーステージ102に固定され、シリンダーステージ102にはステージ固定用支柱104が接続されている。また、ミニチュアシリンダー100には、エアチューブ106が接続されている。図6(B)は押圧手段の斜視図で、ミニチュアシリンダー100は均等な間隔で、ドーナツ状に加工したシリンダーステージ102に設置されている。
【0043】
図6(C)(D)は試料台外周部26の動作状態を説明する図で、エアチューブ106に圧縮気体が送られていない状態では、図6(C)に示すように、ミニチュアシリンダー100は試料台外周部26から離れた状態である。エアチューブ106に圧縮気体を送りミニチュアシリンダー100が加圧されると、ミニチュアシリンダー100は膨張し、図6(D)に示すように試料台外周部26を押し上げる。試料台外周部26を鉛直方向に引き下げる引張手段は第4の実施の形態と同様である。
【0044】
(第6の実施の形態)
さらに本発明の現像装置の他の構成例について、本発明の第6の実施の形態の現像装置を示す図7を用いて説明する。第6の実施の形態も、第4の実施の形態と異なる点は高さ調節手段の押圧手段であるので、押圧手段を中心に説明する。
【0045】
図7(A)は全体図で、試料台24を構成する試料台内周部25と、試料台外周部26の分離されている点は図5と同じであるが、試料台外周部26の側面に円周形に楔状の切れ込み27がある点のみ異なる。楔状の切れ込み27に近接して楔110が位置し、楔110はシリンダー96に接続されている。回転ユニット40の形状、作用は第4の実施の形態と同じである。シリンダー96が加圧されていない状態では、図7(B)に示すように、楔110は試料台外周部26から離れた状態である。シリンダー96が加圧されると、図7(C)に示すように楔110は試料台外周部26方向に押し出され、楔状の切れ込み27に入り込み、試料台外周部26を押し上げる。また、試料台外周部26を鉛直方向に引き下げる場合は、シリンダー96の加圧を弱め楔110を楔状の切れ込み27からはずし、第4の実施の形態と同様の引張手段を使用する。
【0046】
次に、本発明の第4の実施の形態〜第6の実施の形態における薬液処理方法を示す工程図である図8を用いて説明する。図8(A)は、可撓性基板であるポリイミドフィルム10を試料台24に載置すると、真空吸着され固定する載置工程を示す。次に図8(B)は、試料台外周部26が押圧手段で押し上げられ、ポリイミドフィルム10の外周部の高さを内周部の高さより高くする高さ設定工程を示す。高さ設定工程以後に図8(C)では、ポリイミドフィルム10に第1の薬液として第1薬液供給管50から現像液80が供給される、第1薬液供給工程を示す。図8(D)は現像液80が所定量滴下され、静止状態で所定時間保持している静止保持工程を示す。図8(E)は試料台外周部26を引き下げて、ポリイミドフィルム10の外周部と内周部の高さを少なくとも同じ高さにする高さ除去工程を示す。高さ除去工程以後に図8(F)は、試料台24を回転させて現像液80を排出する第1薬液排出工程を示す。図8(G)は、試料台24を回転させながら第2の薬液としてリンス液を第2薬液供給管52から供給し、排出する第2薬液供給排出工程を示す。
【0047】
このような薬液処理装置と薬液処理方法とした結果、薬液処理時、可撓性基板は外周部が持ち上げられ、その基板の外周部まで薬液が液盛りされるので、その基板外周部まで均一に薬液処理できる。また薬液排出時、可撓性基板は平坦になるので薬液が排出されやすくなり、可撓性基板裏面を薬液で汚染させることがなくなる。ポリイミドフィルム10の現像時もその端部まで均一な現像ができ、現像液80がポリイミドフィルム10の裏面に回り込むことはない。
【0048】
なお本実施の形態では、試料台外周部26を鉛直方向に引き下げる引張手段として、スプリングのバネの力を利用する例で説明したが、磁石の引張力やゴムの収縮力を利用するものでもよい。
【0049】
また本実施の形態では、試料台外周部26を可動させ試料台内周部25より高くする方法を説明したが、試料台内周部25を可動させ試料台外周部26より低くしてもよい。
【0050】
(第7の実施の形態)
さらに本発明の現像装置の他の構成例について説明するが、第7の実施の形態が第4の実施の形態と異なるのは試料台の構成のみであるので、試料台について説明する。
【0051】
図9は本発明の第7の実施の形態の現像装置の試料台を示す図である。第7の実施の形態では高さ調節手段として、試料台の外周部に設けた複数の貫通孔に挿入されたピンと、複数のピンを鉛直方向に可動な構成としたものであり、ピンとして使用した突上げピンの上昇により可撓性基板の外周部を持ち上げる。
【0052】
図9(A)は突上げピン120が上昇した状態で、ポリイミドフィルム10の外周部が持ち上がり、現像液80がポリイミドフィルム10の外周部まで液盛りされた状態となる。突上げピン120は、試料台23の外周部を貫通して、取り付けられている。ここで突上げピン120を上昇させるには、第4の実施の形態〜第6の実施の形態での押圧手段を用いることができる。
【0053】
図9(B)は突上げピン120が下降し、試料台23が回転しながら現像液80を排出している状態を示す。ここで突上げピン120の下降は、必要に応じて、第4の実施の形態〜第6の実施の形態の引張手段を利用すればよい。
【0054】
この結果、可撓性基板は外周部まで均一に現像できるとともに、現像液80はポリイミドフィルム10の裏面に回り込むことがない。
【0055】
なお、本発明の第1の実施の形態〜第7の実施の形態では薬液処理装置と薬液処理方法として、現像装置と現像方法を例として示したが、エッチング液を使ったエッチングの場合も同様の装置と方法とすることができる。
【0056】
【発明の効果】
以上説明したように、本発明の薬液処理装置は可撓性基板を載置し吸着固定する試料台と、試料台を回転させる回転手段と、可撓性基板に薬液を供給する薬液供給手段と、可撓性基板の外周部または内周部の高さを調節するための高さ調節手段と、回転手段と薬液供給手段と高さ調節手段とを制御する制御手段とを備えたものである。また本発明の薬液処理方法は、可撓性基板を試料台に載置し吸着固定する載置工程と、可撓性基板の外周部を内周部より高くする高さ設定工程と、高さ設定工程以後に可撓性基板に第1の薬液を供給する第1薬液供給工程と、可撓性基板を静止状態で所定時間保持する静止保持工程と、可撓性基板の外周部を内周部と少なくとも同じ高さにする高さ除去工程と、高さ除去工程以後に試料台を回転させ第1の薬液を排出する第1薬液排出工程と、試料台を回転させながら第2の薬液を供給し排出する第2薬液供給排出工程とを有するものである。このような薬液処理装置と薬液処理方法とにすることで、パドル方式で可撓性基板外周部まで均一に薬液処理できるとともに、可撓性基板裏面を薬液で汚染させることがないという大きな効果を有する。
【図面の簡単な説明】
【図1】本発明の第1の実施の形態の現像装置を示す図
【図2】本発明の第1の実施の形態の現像装置の試料台を示す図
【図3】本発明の第2の実施の形態の現像装置の試料台を示す図
【図4】本発明の第3の実施の形態の現像装置の試料台を示す図
【図5】本発明の第4の実施の形態の現像装置を示す図
【図6】本発明の第5の実施の形態の現像装置を示す図
【図7】本発明の第6の実施の形態の現像装置を示す図
【図8】本発明の第4の実施の形態〜第6の実施の形態における薬液処理方法を示す工程図
【図9】本発明の第7の実施の形態の現像装置の試料台を示す図
【符号の説明】
10 ポリイミドフィルム
20,22,23,24 試料台
21 可撓性基板載置面
25 試料台内周部
26 試料台外周部
27 楔状の切れ込み
30 Oリング
32 ピン
40 回転ユニット
50 第1薬液供給管
52 第2薬液供給管
54,56 電磁弁
60 制御装置
62,64,66 信号線
70 吸着穴
80 現像液
90 カムフォロア
92 ピロボール
94 ターンバックル
96 シリンダー
98 スプリング
100 ミニチュアシリンダー
102 シリンダーステージ
104 ステージ固定用支柱
106 エアチューブ
110 楔
120 突上げピン
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a chemical processing apparatus and a chemical processing method, and more particularly to a chemical processing apparatus and a chemical processing method for performing a chemical processing in a stationary state (paddle system) after supplying a chemical to a flexible substrate.
[0002]
[Prior art]
As a conventional chemical processing apparatus and a chemical processing method using a paddle system, a paddle developing apparatus and a developing method will be described as an example. When the developing solution is dropped onto the substrate held by vacuum suction, the developing solution is filled by the surface tension, and the developing reaction proceeds while the substrate is kept stationary or the substrate is rotated at a low speed. However, in such a paddle type developing device, since the liquid is pooled on the substrate by the surface tension of the developing solution, the amount of the developing solution is smaller at the outer periphery of the substrate than at the inner periphery of the substrate, and the developing speed is reduced. And development failure occurred on the outer peripheral portion of the substrate.
[0003]
On the other hand, there has been proposed a method of providing a cup surrounding a substrate, injecting a developing solution into the cup, immersing the developing solution in the developing solution, and uniformly developing the outer periphery of the substrate (for example, see Patent Document 1).
[0004]
[Patent Document 1]
JP-A-4-167517 (pages 2-3)
[0005]
[Problems to be solved by the invention]
However, in such a method of immersing the substrate in the developing solution, since the developing solution goes around the back surface of the substrate and contaminates the device after the developing process, an apparatus and a process for draining and washing the developing solution are required. There was a problem of becoming.
[0006]
The present invention has been made in view of such a problem, and provides a chemical processing apparatus that can uniformly perform a chemical processing up to the outer peripheral portion of a flexible substrate by a paddle method and that does not contaminate the back surface of the flexible substrate with a chemical. It is an object of the present invention to provide a chemical solution treatment method.
[0007]
[Means for Solving the Problems]
A chemical processing apparatus according to the present invention includes a sample stage on which a flexible substrate is placed and suction-fixed, a rotating unit that rotates the sample stage, a chemical solution supplying unit that supplies a chemical solution to the flexible substrate, a rotating unit, and a chemical solution. Control means for controlling the supply means, and the sample stage has a flexible substrate mounting surface that makes the outer periphery of the flexible substrate higher than the inner periphery when the flexible substrate is placed on the sample stage. It has.
[0008]
With such a chemical processing apparatus, the flexible substrate is in a state where the outer peripheral portion is lifted, and the chemical liquid is filled up to the outer peripheral portion, so that the chemical liquid can be uniformly processed to the outer peripheral portion of the flexible substrate. . Since the chemical is shaken off by the rotating means and discharged, the back surface of the flexible substrate is not contaminated with the chemical.
[0009]
The flexible substrate mounting surface of the sample stage of the chemical liquid treatment apparatus of the present invention has a ring provided on the outer peripheral portion thereof.
[0010]
Further, the flexible substrate mounting surface of the sample stage of the chemical solution processing apparatus of the present invention is provided with a plurality of pins fixed to the outer peripheral portion thereof.
[0011]
Further, the shape of the flexible substrate mounting surface of the sample stage of the chemical solution processing apparatus of the present invention is a concave arc shape from the outer peripheral portion toward the inner peripheral portion.
[0012]
By using the flexible substrate mounting surface having the shape of the flexible substrate mounting surface of the sample stage and the shape of the flexible substrate mounting surface, the flexible substrate surely has a lower inner peripheral portion and a lower outer peripheral portion during the chemical liquid processing. The shape can be increased.
[0013]
In addition, the chemical processing apparatus of the present invention includes a sample stage on which a flexible substrate is placed and fixed by suction, a rotation unit for rotating the sample stage, a chemical solution supply unit for supplying a chemical solution to the flexible substrate, A height adjusting means for adjusting the height of the outer peripheral portion or the inner peripheral portion of the flexible substrate; and a control means for controlling the rotating device, the chemical solution supplying device and the height adjusting device.
[0014]
Further, the height adjusting means of the chemical solution treatment apparatus of the present invention is configured such that the sample stage is separated into an inner peripheral portion of the sample stage and an outer peripheral portion of the sample stage, and the outer peripheral portion of the sample stage is movable in a vertical direction.
[0015]
Further, the height adjusting means of the chemical liquid treatment apparatus of the present invention has a configuration in which pins inserted into a plurality of through holes provided in the outer peripheral portion of the sample table and the plurality of pins are movable in a vertical direction.
[0016]
With the chemical processing apparatus provided with such a height adjusting means, the outer peripheral portion of the flexible substrate lifted at the time of chemical processing returns to its original height when the chemical is discharged, and becomes flat. Is performed more reliably. As a result, it is possible to eliminate the adverse effect of the remaining chemical solution on the subsequent steps. When discharging the chemical, the outer peripheral portion of the flexible substrate may be lowered from the inner peripheral portion to make it easier to discharge the chemical.
[0017]
In addition, the chemical solution processing method of the present invention includes a mounting step of mounting the flexible substrate on the sample table and fixing it by suction, a height setting step of making the outer peripheral portion of the flexible substrate higher than the inner peripheral portion, A first chemical liquid supply step of supplying the first chemical liquid to the flexible substrate after the setting step; a stationary holding step of holding the flexible substrate in a stationary state for a predetermined time; A height removing step of at least the same height as the peripheral portion, a first chemical liquid discharging step of rotating the sample table to discharge the first chemical liquid after the height removing step, and a second chemical liquid while rotating the sample table. And a second chemical liquid supply / discharge step of supplying and discharging the liquid.
[0018]
With such a chemical processing method, the outer periphery of the flexible substrate is lifted during the chemical processing, and the chemical is filled up to the outer peripheral part of the substrate, so that the chemical processing can be performed uniformly to the outer peripheral part of the substrate. Further, at the time of discharging the liquid chemical, the flexible substrate becomes flat, so that the liquid chemical is easily discharged, and the back surface of the flexible substrate is not contaminated with the liquid chemical.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a developing device, which is an example of a chemical processing apparatus according to an embodiment of the present invention, will be described in detail with reference to the drawings.
[0020]
(First Embodiment)
First, a developing device according to a first embodiment of the present invention will be described with reference to FIG. On the outer peripheral portion of the flexible substrate mounting surface 21 on which the flexible substrate of the sample table 20 is mounted, a ring is provided as a ring for making the height of the outer peripheral portion of the flexible substrate higher than the inner peripheral portion. A ring 30 is mounted. In addition, a rotation unit 40 is located below the sample table 20 as a rotation unit for rotating the sample table 20. Then, a first chemical liquid supply pipe 50 and a second chemical liquid supply pipe 52 are positioned above the sample table 20 as chemical liquid supply means for supplying a chemical liquid to the flexible substrate, and the first chemical liquid supply pipe 50 and the second chemical liquid supply pipe are provided. A solenoid valve 54 and a solenoid valve 56 are attached to 52, respectively. Further, a control device 60 is provided as control means for controlling the rotation unit 40, the solenoid valve 54, and the solenoid valve 56. The control device 60 and the rotation unit 40 have a signal line 62, and the solenoid valve 54 and the solenoid valve 56 have a signal line. 64 are connected.
[0021]
Next, the operation of the developing device according to the first embodiment will be described. When the flexible substrate is mounted on the flexible substrate mounting surface 21, the flexible substrate is fixed by vacuum suction and is The outer peripheral portion of the conductive substrate is in a state of being lifted. Then, the control device 60 in which the development control program is stored opens the electromagnetic valve 54 via the signal line 64 and supplies the developer from the first chemical solution supply pipe 50. After a predetermined time, the control device 60 rotates the sample stage 20 via the signal line 62 by the rotation unit 40 having a motor. Thereafter, the electromagnetic valve 56 is opened as necessary, and a rinse liquid or pure water may be supplied from the second chemical liquid supply pipe 52 in some cases.
[0022]
FIG. 2 is a diagram showing a sample stage of the developing device according to the first embodiment of the present invention, and FIG. 2A is a perspective view of the sample stage. An O-ring 30 is provided on the outer periphery of the flexible substrate mounting surface 21 of the sample stage 20, and a suction hole 70 is formed in a region surrounded by the O-ring 30.
[0023]
FIG. 2B is a cross-sectional view showing a developed state on the sample stage. The outer periphery of the polyimide film 10, which is a flexible substrate placed on the flexible substrate placement surface 21, is raised by the O-ring 30, and is in a state of holding the developer 80 as a chemical. As a result, the flexible substrate can be uniformly developed up to the outer peripheral portion, and the developing solution 80 does not go around the back surface of the polyimide film 10.
[0024]
Note that the ring is not limited to an elastic body having excellent adhesion to a flexible substrate such as an O-ring, and may be a metal such as stainless steel which is easy to make the lifting height of the outer periphery of the flexible substrate uniform. Good.
[0025]
When an elastic body such as an O-ring is used, a groove-like hole is formed in the flexible substrate mounting surface 21, and the O-ring 30 is inserted into the hole to fix the position of the O-ring 30. As a result, the developed area of the flexible substrate becomes more uniform.
[0026]
The flexible substrate has a thickness of about 0.1 mm and may be made of polyamide, polyetheretherketone, epoxy resin, or polybenzthiazole in addition to the polyimide film.
[0027]
The sample stage 20 is preferably made of a metal such as stainless steel which has resistance to an alkali developing solution and has a smooth surface.
[0028]
(Second embodiment)
Next, another configuration example of the developing device of the present invention will be described. However, the only difference from the first embodiment is the configuration of the sample stage. Therefore, the sample stage will be described.
[0029]
FIG. 3 is a diagram illustrating a sample stage of the developing device according to the second embodiment of the present invention. FIG. 3A is a perspective view of the sample stage, in which a plurality of pins 32 are provided on the outer peripheral portion of the flexible substrate mounting surface 21 of the sample stage 20. The pins 32 are provided at substantially equal intervals on the outer peripheral portion of the flexible substrate mounting surface 21, and the flexible substrate is suction-fixed to a region of the flexible substrate mounting surface 21 surrounded by the pins 32. The suction hole 70 is opened.
[0030]
FIG. 3B is a cross-sectional view showing a developed state on the sample stage. When the polyimide film 10 is mounted on the flexible substrate mounting surface 21 and vacuum-adsorbed, the outer peripheral portion of the polyimide film 10 is higher than the inner peripheral portion by the pins 32, and a state in which the developer 80 is held. As a result, the developer 80 can be uniformly developed to the outer peripheral portion without going around the back surface of the polyimide film 10.
[0031]
In the present embodiment, the pins 32 have a uniform height of about 0.3 mm to 0.5 mm, but this height may be appropriately selected depending on the size and type of the flexible substrate. The material of the pin 32 is preferably plastic or metal which can be easily processed.
[0032]
(Third embodiment)
Furthermore, another configuration example of the developing device of the present invention will be described. However, the present embodiment is different from the first embodiment only in the configuration of the sample stage. Therefore, the sample stage will be described.
[0033]
FIG. 4 is a view showing a sample stage of the developing device according to the third embodiment of the present invention. FIG. 4A is a perspective view of the sample stage, and the shape of the flexible substrate mounting surface 21 of the sample stage 22 is cut in a concave arc shape from the outer peripheral portion toward the inner peripheral portion. And the suction hole 70 is formed in the arc-shaped cutting surface.
[0034]
FIG. 4B is a cross-sectional view showing a developed state on the sample stage. When the polyimide film 10 is mounted on the flexible substrate mounting surface 21 of the sample stage 22 and is vacuum-sucked, the polyimide film 10 is suctioned along the arcuate cut surface of the flexible substrate mounting surface 21, so that the polyimide film 10 Is low and the outer circumference is high. Therefore, even if the developer 80 is dropped, the developer 80 is in a state of being filled up to the outer peripheral portion of the polyimide film 10. Therefore, also in the present embodiment, it is possible to uniformly develop up to the outer peripheral portion of the polyimide film 10, and the developer 80 does not flow to the back surface.
[0035]
The sample stage 22 is preferably made of a metal such as stainless steel which is resistant to an alkali developing solution and is easily processed. In the present embodiment, the center portion cutting depth of the sample stage 22 is set to about 0.3 mm to 0.5 mm, but this value may be appropriately selected depending on the size and type of the flexible substrate.
[0036]
In the first to third embodiments, when the suction holes 70 are formed more in the inner peripheral portion than the outer peripheral portion of the flexible substrate mounting surface 21, the inner peripheral portion of the flexible substrate is It is effective to lower the height and increase the outer circumference.
[0037]
(Fourth embodiment)
Further, another configuration example of the developing device of the present invention will be described with reference to FIG. 5 showing the developing device of the fourth embodiment of the present invention. In the fourth embodiment, the height adjusting means divides the sample stage into an inner peripheral portion of the sample stage and an outer peripheral portion of the sample stage so that the outer peripheral portion of the sample stage is vertically movable.
[0038]
FIG. 5A is an overall view of the developing device, in which a sample stage 24 on which a flexible substrate is mounted is provided on an inner periphery 25 of the sample stage and an outer periphery 26 of a sample stage having a concave portion having an inverted L-shaped cross section. Are separated. A cam follower 90 is provided near the outer periphery 26 of the sample table, and a pillow ball 92, a turnbuckle 94, and a cylinder 96 are sequentially connected to the cam follower 90. A spring 98 is provided in a concave portion of the sample table outer peripheral portion 26, and a rotation unit 40 for rotating the sample table 24 is provided below the sample table 24. Further, a first chemical liquid supply pipe 50 and a second chemical liquid supply pipe 52 are positioned above the sample table 24 as chemical liquid supply means for supplying a chemical liquid to the flexible substrate, and the first chemical liquid supply pipe 50 and the second chemical liquid supply pipe are provided. A solenoid valve 54 and a solenoid valve 56 are attached to 52, respectively. Further, a control device 60 is provided as control means for controlling the rotation unit 40 and the electromagnetic valve 54, and the electromagnetic valve 56 and the cylinder 96. The control device 60 and the rotation unit 40 connect the signal line 62 to the electromagnetic valve 54 and the electromagnetic valve 56. Is connected to the signal line 64, and the cylinder 96 is connected to the signal line 66.
[0039]
Next, the operation of the fourth embodiment will be described. FIGS. 5B and 5C are views for explaining the operating state of the outer peripheral portion 26 of the sample stage. When the cylinder 96 is not pressurized, as shown in FIG. 26 away. When the cylinder 96 is pressurized, the pressing force in the direction of the sample stage 24 is strengthened by the turnbuckle 94 and changed into a rotating motion by the pillow ball 92, and the cam follower 90 rotates vertically upward to push up the sample stage outer peripheral portion 26. . As described above, the height adjusting means is provided with the pressing means for pushing up the sample stage outer peripheral portion 26 in the vertical direction. This is shown in FIG.
[0040]
When the outer periphery 26 of the sample stage is pushed up by the cam follower 90 and is higher than the inner periphery 25 of the sample stage, when the cylinder 96 is no longer pressurized, the cam follower 90 separates from the outer periphery 26 of the sample stage. At this time, the sample stage outer peripheral portion 26 slightly descends due to the weight of the sample stage outer peripheral portion 26, but may not descend to the same height as the sample stage inner peripheral portion 25 due to friction with the sample stage inner peripheral portion 25. At this time, the spring 98 pulls the outer peripheral portion 26 of the sample stage to make the outer peripheral portion 26 of the sample stage the same height as the inner peripheral portion 25 of the sample stage. As described above, the height adjusting means includes the pulling means for pulling down the outer peripheral portion of the sample table in the vertical direction.
[0041]
(Fifth embodiment)
Further, another configuration example of the developing device of the present invention will be described with reference to FIG. 6 showing the developing device of the fifth embodiment of the present invention. The fifth embodiment is different from the fourth embodiment only in the pressing means of the height adjusting means. Therefore, the description will be focused on the pressing means.
[0042]
FIG. 6A is a view of the vicinity of the sample stage. The separated shape of the sample stage inner peripheral portion 25 and the sample stage outer peripheral portion 26 constituting the sample stage 24 and the position of the rotary unit 40 are shown in the fourth embodiment. Is the same as The miniature cylinder 100 is located near the sample stage outer peripheral portion 26, and the miniature cylinder 100 is fixed to a cylinder stage 102, and a stage fixing column 104 is connected to the cylinder stage 102. An air tube 106 is connected to the miniature cylinder 100. FIG. 6B is a perspective view of the pressing means, in which the miniature cylinders 100 are installed at equal intervals on a donut-shaped cylinder stage 102.
[0043]
FIGS. 6C and 6D are views for explaining the operating state of the sample stage outer peripheral portion 26. In a state where compressed gas is not sent to the air tube 106, as shown in FIG. Is a state separated from the outer periphery 26 of the sample table. When the compressed gas is sent to the air tube 106 and the miniature cylinder 100 is pressurized, the miniature cylinder 100 expands and pushes up the sample stage outer peripheral portion 26 as shown in FIG. The pulling means for pulling down the sample stage outer peripheral portion 26 in the vertical direction is the same as in the fourth embodiment.
[0044]
(Sixth embodiment)
Further, another configuration example of the developing device of the present invention will be described with reference to FIG. 7 showing the developing device of the sixth embodiment of the present invention. The sixth embodiment also differs from the fourth embodiment in that the pressing means of the height adjusting means is described. Therefore, the description will be focused on the pressing means.
[0045]
FIG. 7A is an overall view, which is the same as FIG. 5 in that a sample stage inner peripheral portion 25 constituting a sample stage 24 and a sample stage outer peripheral portion 26 are separated from each other. The only difference is that there is a circumferentially wedge-shaped cut 27 on the side. The wedge 110 is located close to the wedge-shaped cut 27, and the wedge 110 is connected to the cylinder 96. The shape and operation of the rotation unit 40 are the same as in the fourth embodiment. When the cylinder 96 is not pressurized, the wedge 110 is separated from the sample stage outer peripheral portion 26 as shown in FIG. When the cylinder 96 is pressurized, the wedge 110 is pushed in the direction of the outer peripheral portion 26 of the sample stage, enters the cut 27 in a wedge shape, and pushes up the outer peripheral portion 26 of the sample stage as shown in FIG. When the outer peripheral portion 26 of the sample table is to be pulled down in the vertical direction, the pressurization of the cylinder 96 is weakened, the wedge 110 is removed from the wedge-shaped cut 27, and the same pulling means as in the fourth embodiment is used.
[0046]
Next, a description will be given with reference to FIG. 8 which is a process chart showing a chemical solution treatment method according to the fourth to sixth embodiments of the present invention. FIG. 8A shows a mounting step in which, when the polyimide film 10 as a flexible substrate is mounted on the sample stage 24, it is vacuum-adsorbed and fixed. Next, FIG. 8B shows a height setting step in which the outer peripheral portion 26 of the sample table is pushed up by the pressing means, and the height of the outer peripheral portion of the polyimide film 10 is made higher than the height of the inner peripheral portion. FIG. 8C shows a first chemical liquid supply step in which the developer 80 is supplied from the first chemical liquid supply pipe 50 to the polyimide film 10 as a first chemical liquid after the height setting step. FIG. 8D shows a stationary holding step in which a predetermined amount of the developer 80 is dropped and held in a stationary state for a predetermined time. FIG. 8E shows a height removing step of lowering the outer peripheral portion 26 of the sample table to make the height of the outer peripheral portion and the inner peripheral portion of the polyimide film 10 at least the same. FIG. 8F shows a first chemical liquid discharging step of rotating the sample table 24 and discharging the developer 80 after the height removing step. FIG. 8G shows a second chemical liquid supply / discharge step of supplying and discharging a rinse liquid as a second chemical liquid from the second chemical liquid supply pipe 52 while rotating the sample stage 24.
[0047]
As a result of using such a chemical processing apparatus and a chemical processing method, at the time of chemical processing, the outer peripheral portion of the flexible substrate is lifted, and the chemical liquid is filled up to the outer peripheral portion of the substrate, so that the flexible substrate is evenly spread to the outer peripheral portion of the substrate. Can be treated with chemicals. Further, at the time of discharging the liquid chemical, the flexible substrate becomes flat, so that the liquid chemical is easily discharged, and the back surface of the flexible substrate is not contaminated with the liquid chemical. Even when the polyimide film 10 is developed, uniform development can be performed up to the end, and the developing solution 80 does not flow around the back surface of the polyimide film 10.
[0048]
In the present embodiment, an example is described in which the force of the spring is used as the pulling means for pulling down the sample stage outer peripheral portion 26 in the vertical direction. However, the pulling force of the magnet or the contraction force of rubber may be used. .
[0049]
Further, in the present embodiment, a method has been described in which the outer periphery 26 of the sample stage is moved to be higher than the inner periphery 25 of the sample stage. However, the inner periphery 25 of the sample stage may be moved to lower the outer periphery 26 of the sample stage. .
[0050]
(Seventh embodiment)
Further, another configuration example of the developing device of the present invention will be described. However, the seventh embodiment is different from the fourth embodiment only in the configuration of the sample stage, and thus the sample stage will be described.
[0051]
FIG. 9 is a view showing a sample stage of the developing device according to the seventh embodiment of the present invention. In the seventh embodiment, as the height adjusting means, a pin inserted into a plurality of through holes provided on the outer peripheral portion of the sample table and the plurality of pins are configured to be movable in a vertical direction, and are used as pins. The outer peripheral portion of the flexible substrate is lifted by the lift of the push-up pin.
[0052]
FIG. 9A shows a state in which the outer peripheral portion of the polyimide film 10 is lifted with the push-up pin 120 raised, and the developer 80 is filled up to the outer peripheral portion of the polyimide film 10. The push-up pin 120 penetrates the outer peripheral portion of the sample table 23 and is attached. Here, in order to raise the push-up pin 120, the pressing means according to the fourth to sixth embodiments can be used.
[0053]
FIG. 9B shows a state in which the push-up pin 120 is lowered, and the developing solution 80 is being discharged while the sample stage 23 is rotating. Here, the push-up pin 120 may be lowered by using the pulling means of the fourth to sixth embodiments as necessary.
[0054]
As a result, the flexible substrate can be uniformly developed up to the outer peripheral portion, and the developing solution 80 does not go around the back surface of the polyimide film 10.
[0055]
In the first to seventh embodiments of the present invention, the developing device and the developing method are described as examples of the chemical processing device and the chemical processing method. However, the same applies to the case of etching using an etchant. Apparatus and method.
[0056]
【The invention's effect】
As described above, the chemical processing apparatus of the present invention includes a sample stage on which a flexible substrate is placed and fixed by suction, a rotating unit for rotating the sample stage, and a chemical solution supply unit for supplying a chemical solution to the flexible substrate. A height adjusting means for adjusting the height of the outer peripheral portion or the inner peripheral portion of the flexible substrate, and a control means for controlling the rotating means, the chemical solution supplying means and the height adjusting means. . Further, in the chemical solution treatment method of the present invention, a placing step of placing a flexible substrate on a sample table and fixing it by suction, a height setting step of making the outer peripheral portion of the flexible substrate higher than the inner peripheral portion, A first chemical liquid supply step of supplying a first chemical liquid to the flexible substrate after the setting step; a stationary holding step of holding the flexible substrate in a stationary state for a predetermined time; Removing the first chemical solution by rotating the sample stage and discharging the first chemical solution after the height removing process, and removing the second chemical solution while rotating the sample stage. And a second chemical liquid supply and discharge step of supplying and discharging. By using such a chemical processing apparatus and a chemical processing method, it is possible to uniformly perform the chemical processing up to the outer peripheral portion of the flexible substrate by the paddle method, and to have a great effect that the back surface of the flexible substrate is not contaminated with the chemical. Have.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating a developing device according to a first embodiment of the present invention; FIG. 2 is a diagram illustrating a sample stage of the developing device according to the first embodiment of the present invention; FIG. FIG. 4 is a view showing a sample stage of the developing device according to the third embodiment of the present invention. FIG. 4 is a diagram showing a sample stage of the developing device according to the third embodiment of the present invention. FIG. 6 is a diagram illustrating a developing device according to a fifth embodiment of the present invention. FIG. 7 is a diagram illustrating a developing device according to a sixth embodiment of the present invention. FIG. 9 is a process chart showing a chemical solution processing method according to the fourth to sixth embodiments. FIG. 9 is a view showing a sample stage of a developing device according to a seventh embodiment of the present invention.
Reference Signs List 10 polyimide film 20, 22, 23, 24 sample table 21 flexible substrate mounting surface 25 sample table inner peripheral part 26 sample table outer peripheral part 27 wedge-shaped notch 30 O-ring 32 pin 40 rotation unit 50 first chemical liquid supply pipe 52 Second chemical supply pipes 54, 56 Solenoid valve 60 Control device 62, 64, 66 Signal line 70 Suction hole 80 Developer 90 Cam follower 92 Pillow ball 94 Turnbuckle 96 Cylinder 98 Spring 100 Miniature cylinder 102 Cylinder stage 104 Stage fixing column 106 Air Tube 110 Wedge 120 Push-up pin

Claims (8)

可撓性基板を載置し吸着固定する試料台と、
前記試料台を回転させる回転手段と、
前記可撓性基板に薬液を供給する薬液供給手段と、
前記回転手段と前記薬液供給手段とを制御する制御手段とを備え、
前記試料台は前記可撓性基板を前記試料台に載置した時に前記可撓性基板の外周部を内周部に比べて高くする可撓性基板載置面を有することを特徴とする薬液処理装置。
A sample stage on which a flexible substrate is placed and fixed by suction,
Rotating means for rotating the sample stage,
A chemical liquid supply unit for supplying a chemical liquid to the flexible substrate,
Control means for controlling the rotation means and the chemical solution supply means,
Wherein the sample stage has a flexible substrate mounting surface that makes an outer peripheral portion of the flexible substrate higher than an inner peripheral portion when the flexible substrate is mounted on the sample stage. Processing equipment.
前記可撓性基板載置面はその外周部にリングが設けられていることを特徴とする請求項1記載の薬液処理装置。2. The chemical processing apparatus according to claim 1, wherein a ring is provided on an outer peripheral portion of the flexible substrate mounting surface. 前記可撓性基板載置面はその外周部に固定されたピンが複数個設けられていることを特徴とする請求項1記載の薬液処理装置。2. The chemical processing apparatus according to claim 1, wherein the flexible substrate mounting surface is provided with a plurality of pins fixed to an outer peripheral portion thereof. 前記可撓性基板載置面の形状はその外周部から内周部に向けて凹形の円弧状であることを特徴とする請求項1記載の薬液処理装置。2. The chemical liquid treatment apparatus according to claim 1, wherein the flexible substrate mounting surface has a concave arc shape from an outer peripheral portion toward an inner peripheral portion. 可撓性基板を載置し吸着固定する試料台と、
前記試料台を回転させる回転手段と、
前記可撓性基板に薬液を供給する薬液供給手段と、
前記可撓性基板の外周部または内周部の高さを調節するための高さ調節手段と、
前記回転手段と前記薬液供給手段と前記高さ調節手段とを制御する制御手段とを備えたことを特徴とする薬液処理装置。
A sample stage on which a flexible substrate is placed and fixed by suction,
Rotating means for rotating the sample stage,
A chemical liquid supply unit for supplying a chemical liquid to the flexible substrate,
Height adjusting means for adjusting the height of the outer peripheral portion or the inner peripheral portion of the flexible substrate,
A chemical processing apparatus comprising: a control unit for controlling the rotating unit, the chemical supply unit, and the height adjusting unit.
前記試料台を試料台内周部と試料台外周部とに分離し、前記高さ調節手段は前記試料台外周部を鉛直方向に可動な構成としたことを特徴とする請求項5記載の薬液処理装置。6. The chemical solution according to claim 5, wherein the sample stage is separated into an inner peripheral portion of the sample stage and an outer peripheral portion of the sample stage, and the height adjusting means is configured to move the outer peripheral portion of the sample stage in a vertical direction. Processing equipment. 前記高さ調節手段は前記試料台の外周部に設けた複数の貫通孔に挿入されたピンと、複数の前記ピンを鉛直方向に可動な構成としたことを特徴とする請求項5記載の薬液処理装置。6. The chemical liquid treatment according to claim 5, wherein the height adjusting means is configured to have a plurality of pins inserted into a plurality of through holes provided in an outer peripheral portion of the sample table and the plurality of the pins movable in a vertical direction. apparatus. 可撓性基板を試料台に載置し吸着固定する載置工程と、
前記可撓性基板の外周部を内周部より高くする高さ設定工程と、
前記高さ設定工程以後に前記可撓性基板に第1の薬液を供給する第1薬液供給工程と、
前記可撓性基板を静止状態で所定時間保持する静止保持工程と、
前記可撓性基板の外周部を内周部と少なくとも同じ高さにする高さ除去工程と、
前記高さ除去工程以後に前記試料台を回転させ前記第1の薬液を排出する第1薬液排出工程と、
前記試料台を回転させながら第2の薬液を供給し排出する第2薬液供給排出工程と
を有する薬液処理方法。
A mounting step of mounting the flexible substrate on the sample table and fixing it by suction,
A height setting step of making the outer peripheral portion of the flexible substrate higher than the inner peripheral portion,
A first chemical liquid supply step of supplying a first chemical liquid to the flexible substrate after the height setting step;
A stationary holding step of holding the flexible substrate in a stationary state for a predetermined time,
A height removing step of making the outer peripheral portion of the flexible substrate at least as high as the inner peripheral portion,
A first chemical liquid discharging step of rotating the sample stage after the height removing step and discharging the first chemical liquid;
A second chemical supply and discharge step of supplying and discharging a second chemical while rotating the sample stage.
JP2003124107A 2003-04-28 2003-04-28 Chemical solution processor and chemical solution processing method Pending JP2004327927A (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6077425A (en) * 1983-10-04 1985-05-02 Seiko Epson Corp Equipment for manufacturing semiconductor
JPS6192533U (en) * 1984-11-22 1986-06-16
JPH02310912A (en) * 1989-05-26 1990-12-26 Hitachi Ltd Method and apparatus for exposure
JPH1064982A (en) * 1996-08-14 1998-03-06 Dainippon Screen Mfg Co Ltd Substrate support mechanism and substrate treatment unit
JP2002246450A (en) * 2001-02-20 2002-08-30 Nikon Corp Substrate-holding device and substrate-transfer method
JP2002319563A (en) * 2001-04-20 2002-10-31 Tokyo Electron Ltd Device and method for processing substrate
JP2002353110A (en) * 2001-05-25 2002-12-06 Tokyo Electron Ltd Heating processor

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6077425A (en) * 1983-10-04 1985-05-02 Seiko Epson Corp Equipment for manufacturing semiconductor
JPS6192533U (en) * 1984-11-22 1986-06-16
JPH02310912A (en) * 1989-05-26 1990-12-26 Hitachi Ltd Method and apparatus for exposure
JPH1064982A (en) * 1996-08-14 1998-03-06 Dainippon Screen Mfg Co Ltd Substrate support mechanism and substrate treatment unit
JP2002246450A (en) * 2001-02-20 2002-08-30 Nikon Corp Substrate-holding device and substrate-transfer method
JP2002319563A (en) * 2001-04-20 2002-10-31 Tokyo Electron Ltd Device and method for processing substrate
JP2002353110A (en) * 2001-05-25 2002-12-06 Tokyo Electron Ltd Heating processor

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