JPH04252048A - Dicing apparatus - Google Patents

Dicing apparatus

Info

Publication number
JPH04252048A
JPH04252048A JP3001361A JP136191A JPH04252048A JP H04252048 A JPH04252048 A JP H04252048A JP 3001361 A JP3001361 A JP 3001361A JP 136191 A JP136191 A JP 136191A JP H04252048 A JPH04252048 A JP H04252048A
Authority
JP
Japan
Prior art keywords
cutting water
cutting
foil
blade
wheel mount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3001361A
Other languages
Japanese (ja)
Other versions
JP2637850B2 (en
Inventor
Katsuhiro Nishimura
勝博 西村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP136191A priority Critical patent/JP2637850B2/en
Publication of JPH04252048A publication Critical patent/JPH04252048A/en
Application granted granted Critical
Publication of JP2637850B2 publication Critical patent/JP2637850B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

PURPOSE:To jet cutting water under a high pressure by a method wherein the cutting water from a cutting-water nozzle is jetted, by means of a centrifugal force, along the face of a blade from a slit at the outer circumferential part of a wheel mount via a small hole which connects a hollow to a housing. CONSTITUTION:Cutting water which is pressure-fed is fed into a housing 9 inside a wheel mount through a cutting-water hole 8 made in the radial direction of a wheel shaft 3 and through a hole made in the wheel mount. The cutting water which has been pressure-fed to the housing 9 inside the wheel mount is pressurized further by the centrifugal force of the wheel mount, and is discharged along a blade 2 from a slit formed at the outer circumference of the wheel mount and to a position which is extremely close to the blade.

Description

【発明の詳細な説明】[Detailed description of the invention]

【０００１】0001

【産業上の利用分野】本発明は半導体ウェハーを個片に
切断するダイシング装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing apparatus for cutting semiconductor wafers into individual pieces.

【０００２】0002

【従来の技術】従来のダイシング装置のホイル部は、図
２の断面図に示す様に、ホイルシャフト３にホイルマウ
ント１をはめ込み、このホイルマウント１にブレード２
をはめ込み、それぞれをホイルナット６で固定して取り
付ける構造になっている。そして、切削水ノズル４から
切削水５を噴出させ、半導体ウェハー１０の切削を行な
ている。2. Description of the Related Art As shown in the cross-sectional view of FIG. 2, the foil section of a conventional dicing device has a foil mount 1 fitted into a foil shaft 3, and a blade 2 mounted on the foil mount 1.
The structure is such that the screws are fitted into each other, and each is fixed with a foil nut 6. Then, cutting water 5 is jetted out from the cutting water nozzle 4 to cut the semiconductor wafer 10.

【０００３】0003

【発明が解決しようとする課題】上述した従来のダイシ
ング装置は、切削水ノズルがブレードと一定距離を隔て
て設置されている。切削の際、高速でブレードが回転す
ると、半導体ウェハーの切削溝内で空気抵抗により空気
圧力が高くなり、この高圧空気の存在により、その外側
から切削水を噴射させても、切削構内のブレードと半導
体ウェハー間に切削水が入り込めないという問題があっ
た。In the conventional dicing apparatus described above, the cutting water nozzle is installed at a certain distance from the blade. When the blade rotates at high speed during cutting, air pressure increases due to air resistance within the cutting groove of the semiconductor wafer, and due to the presence of this high-pressure air, even if cutting water is injected from the outside, it will not reach the blade inside the cutting area. There was a problem that cutting water could not enter between the semiconductor wafers.

【０００４】0004

【課題を解決するための手段】本発明のダイシング装置
は、軸端面に開孔し内部に向けてテーパー状に広がる空
洞を有するホイルシャフトと、このホイルシャフトには
まりブレードとの間でハウジングを形成するホイルマウ
ントと、ホイルシャフトの開孔に向けて設置された切削
水ノズルとを備え、この切削水ノズルからの切削水が前
記空洞とハウジングとを接続する小孔を介してホイルマ
ウントの外周部のスリットからブレード面に沿って遠心
力で噴出する構造を有している。[Means for Solving the Problems] A dicing device of the present invention forms a housing between a foil shaft having a hole in the end face of the shaft and a cavity that tapers inwards, and a blade that fits into the foil shaft. and a cutting water nozzle installed toward the opening of the foil shaft, and the cutting water from the cutting water nozzle flows through the small hole connecting the cavity and the housing to the outer periphery of the foil mount. It has a structure in which it is ejected from the slit along the blade surface by centrifugal force.

【０００５】[0005]

【実施例】次に本発明について図面を参照して説明する
。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings.

【０００６】図１は本発明の一実施例のダイシング装置
のホイル部の断面図を示す。切削水５はホイルシャフト
３の端面に設置された切削水ノズル４から供給される。 ホイルシャフト３は、端面に切削水５を送り込む開孔を
有し、この開孔から内部に向けて広がるテーパー状の空
洞７を有する。ホイルシャフトは２〜３万ＲＰＭで回転
しており、ホイルシャフト３内に供給された切削水５は
、遠心力により空洞７のテーパーにそってホイルマウン
ト１側へ圧送される。FIG. 1 shows a sectional view of a foil portion of a dicing apparatus according to an embodiment of the present invention. Cutting water 5 is supplied from a cutting water nozzle 4 installed on the end face of the foil shaft 3. The wheel shaft 3 has an opening in its end surface through which cutting water 5 is sent, and a tapered cavity 7 that spreads inward from the opening. The wheel shaft rotates at 20,000 to 30,000 RPM, and the cutting water 5 supplied into the wheel shaft 3 is forced to the wheel mount 1 side along the taper of the cavity 7 by centrifugal force.

【０００７】圧送される切削水は、ホイルシャフト３の
径方向に開けられた切削水穴８およびホイルマウントに
開けられた穴を通じてホイルマウント内ハウジング９へ
送り込まれる。ホイルマウント内ハウジング９に圧送さ
れた切削水は、更にホイルマウントの遠心力により加圧
され、ホイルマウント外周に設けたスリットからブレー
ド２に沿って、かつ極めてブレードに近い位置に放出さ
れる。本実施例によれば、ホイル部周辺の切削水供給設
備を簡素化できるという効果がある。The pressurized cutting water is sent into the wheel mount inner housing 9 through a cutting water hole 8 formed in the radial direction of the wheel shaft 3 and a hole formed in the wheel mount. The cutting water forced into the wheel mount inner housing 9 is further pressurized by the centrifugal force of the wheel mount, and is discharged from a slit provided on the outer periphery of the wheel mount along the blade 2 and at a position extremely close to the blade. According to this embodiment, there is an effect that the cutting water supply equipment around the foil portion can be simplified.

【０００８】[0008]

【発明の効果】以上説明したように本発明は、切削水ホ
イルシャフト内を通して送り込む事により、ブレード面
に沿って遠心力による切削水の高圧噴射が可能となり、
その結果、高圧空気が発生しにくくなって切削部への切
削水補給が確実に行えるという効果を有する。[Effects of the Invention] As explained above, the present invention enables high-pressure injection of cutting water by centrifugal force along the blade surface by feeding the cutting water through the foil shaft.
As a result, high-pressure air is less likely to be generated, and cutting water can be reliably supplied to the cutting section.

【図面の簡単な説明】[Brief explanation of the drawing]

【図１】本発明の一実施例におけるホイル部の断面図で
ある。FIG. 1 is a sectional view of a foil portion in an embodiment of the present invention.

【図２】従来のダイシング装置におけるホイル部の断面
図である。FIG. 2 is a sectional view of a foil portion in a conventional dicing device.

【符号の説明】[Explanation of symbols]

１　　　　ホイルマウント ２　　　　ブレード ３　　　　ホイルシャフト ４　　　　切削水ノズル ５　　　　切削水 ６　　　　ホイルナット ７　　　　テーパー状空洞 ８　　　　切削水穴 ９　　　　ハウジング １０　　　　半導体ウェハー 1 Foil mount 2 Blade 3 Wheel shaft 4 Cutting water nozzle 5 Cutting water 6 Foil nut 7 Tapered cavity 8 Cutting water hole 9 Housing 10 Semiconductor wafer

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】　　半導体ウェハーを個片に切断するダイ
シング装置において、軸端面に開孔し内部に向けてテー
パー状に広がる空洞を有するホイルシャフトと、このホ
イルシャフトにはまりブレードとの間でハウジングを形
成するホイルマウントと、前記ホイルシャフトの開孔に
向けて設置された切削水ノズルとを備え、この切削水ノ
ズルからの切削水が前記空洞とハウジングとを接続する
小孔を介して前記ホイルマウントの外周部のスリットか
ら前記ブレード面に沿って遠心力で噴出することを特徴
とするダイシング装置。1. A dicing device for cutting a semiconductor wafer into individual pieces, in which a housing is inserted between a foil shaft having a hole in the end face of the shaft and a cavity that tapers inwards, and a blade that fits into the foil shaft. a cutting water nozzle installed toward the opening of the foil shaft, and the cutting water from the cutting water nozzle passes through the small hole connecting the cavity and the housing to the foil mount. A dicing device characterized in that the dicing device ejects the dicing material along the blade surface from a slit on the outer periphery of the dicing device using centrifugal force.
JP136191A 1991-01-10 1991-01-10 Dicing equipment Expired - Lifetime JP2637850B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP136191A JP2637850B2 (en) 1991-01-10 1991-01-10 Dicing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP136191A JP2637850B2 (en) 1991-01-10 1991-01-10 Dicing equipment

Publications (2)

Publication Number Publication Date
JPH04252048A true JPH04252048A (en) 1992-09-08
JP2637850B2 JP2637850B2 (en) 1997-08-06

Family

ID=11499355

Family Applications (1)

Application Number Title Priority Date Filing Date
JP136191A Expired - Lifetime JP2637850B2 (en) 1991-01-10 1991-01-10 Dicing equipment

Country Status (1)

Country Link
JP (1) JP2637850B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0724725A (en) * 1993-07-07 1995-01-27 Murata Mfg Co Ltd Dicing saw and dicing blade
JP2016043423A (en) * 2014-08-20 2016-04-04 株式会社ディスコ Cutting device
JP2016132046A (en) * 2015-01-16 2016-07-25 株式会社ディスコ Mount flange

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0724725A (en) * 1993-07-07 1995-01-27 Murata Mfg Co Ltd Dicing saw and dicing blade
JP2016043423A (en) * 2014-08-20 2016-04-04 株式会社ディスコ Cutting device
JP2016132046A (en) * 2015-01-16 2016-07-25 株式会社ディスコ Mount flange
CN105810577A (en) * 2015-01-16 2016-07-27 株式会社迪思科 Mount flange

Also Published As

Publication number Publication date
JP2637850B2 (en) 1997-08-06

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A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19970304