JPH04239793A - Self-repairing laminate substrate - Google Patents
Self-repairing laminate substrateInfo
- Publication number
- JPH04239793A JPH04239793A JP2415291A JP2415291A JPH04239793A JP H04239793 A JPH04239793 A JP H04239793A JP 2415291 A JP2415291 A JP 2415291A JP 2415291 A JP2415291 A JP 2415291A JP H04239793 A JPH04239793 A JP H04239793A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- solder
- substrate
- board
- rectangular frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 18
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 7
- 238000005476 soldering Methods 0.000 abstract description 18
- 229910000679 solder Inorganic materials 0.000 abstract description 17
- 229910045601 alloy Inorganic materials 0.000 abstract description 3
- 239000000956 alloy Substances 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 238000010030 laminating Methods 0.000 abstract description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000007334 memory performance Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、抵抗、コンデンサ、ト
ランジスタ、ＩＣなどのチップ部品を半田付けして構成
する各種電気、電子機器のプリント配線用の基板に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board for printed wiring of various electrical and electronic devices, which is constructed by soldering chip components such as resistors, capacitors, transistors, and ICs.
【０００２】0002
【従来の技術】図４に示す従来の基板９は、合成樹脂板
に金属箔を張り付けて構成し、常温ではほぼ平坦状ある
いは少し反っている状態であるが、搭載する抵抗、コン
デンサー、トランジスタなどのチップ部品５を半田付け
加工の際、半田槽８内の高温熔融半田７の熱で図５に示
すように弧状に強く反りかえって両側など半田付けので
きない部分が生じる不都合があった。2. Description of the Related Art A conventional board 9 shown in FIG. 4 is constructed by pasting metal foil onto a synthetic resin plate, and is almost flat or slightly warped at room temperature, but it is not suitable for mounting resistors, capacitors, transistors, etc. When soldering the chip component 5, the heat of the high-temperature molten solder 7 in the solder bath 8 causes it to strongly warp in an arc shape as shown in FIG. 5, resulting in parts on both sides that cannot be soldered.
【０００３】そこで基板の両側縁を図４のような保持溝
１１，１１’を有する１対の治具１０，１０’によって
挟支し、該治具上端の各屈曲係支縁１２，１２’を移送
装置の所定部位に取付けて半田付装置６内を矢印の方向
に移動させて基板裏面での半田付けをした後、治具から
外すようにしていた。Therefore, both side edges of the board are held between a pair of jigs 10 and 10' having holding grooves 11 and 11' as shown in FIG. was attached to a predetermined location on the transfer device and moved in the direction of the arrow within the soldering device 6 to perform soldering on the back surface of the board, and then removed from the jig.
【０００４】0004
【発明が解決しようとする課題】従来の基板は、治具で
保持して半田付けするが、基板の全面を平坦状に保持す
るのではなく、しかも両側縁を治具の保持溝に挟支する
だけなので基板の厚さと溝の間隔が適切でなく隙間が多
いと基板は中央部で上方に反ることになり、治具を使用
するにもかかわらず、なお、反りを十分に防止すること
ができない欠点がある。そこで本発明は、治具を必要と
することなく、しかも完全に基板の反りを防止して基板
自体が平面状態を保持して良好な半田付けが期待できる
基板を提供しようとするものである。[Problems to be Solved by the Invention] Conventional boards are held and soldered using a jig, but instead of holding the entire surface of the board flat, both sides of the board are held between the holding grooves of the jig. Therefore, if the thickness of the board and the spacing between the grooves are not appropriate and there are many gaps, the board will warp upward at the center, so even if a jig is used, it is still necessary to sufficiently prevent warping. There is a drawback that it cannot be done. Therefore, the present invention aims to provide a board that does not require a jig, completely prevents the board from warping, maintains its flat state, and allows for good soldering.
【０００５】[0005]
【課題を解決するための手段】本発明は、所定温度に加
熱した時、予め記憶している平面形状に復元する形状記
憶合金（ニッケルとチタンの合金）を主材とするシート
状、枠状などの薄板を、従来基板と同様構成の複数の基
板間にサンドイッチ状に挟んで積層し、半田付時の反り
を防止することにより自己修復型の積層基板を構成する
。[Means for Solving the Problems] The present invention provides a sheet-like or frame-like material mainly made of a shape memory alloy (an alloy of nickel and titanium) that restores a pre-memorized planar shape when heated to a predetermined temperature. A self-repairing laminated board is constructed by sandwiching and stacking thin plates such as these between a plurality of boards having the same structure as conventional boards to prevent warping during soldering.
【０００６】[0006]
【作用】常温でほぼ平坦状あるいはやや反っている積層
基板を半田付装置内へ移送すると、入り口付近は常温で
あるから積層基板に変化は認められないが、熔融半田槽
周辺の高温雰囲気内に入ると、従来の基板のように反り
かえることなく、該積層基板内部の形状記憶合金製の薄
板の記憶性能により平面状に戻って半田面と平行な状態
で半田槽を通過し槽内の熔融半田によるチップ部品の半
田付けを完了して積層基板は出口付近の常温部分から元
の状態に復元して半田付装置を出る。[Function] When a laminated board that is almost flat or slightly warped at room temperature is transferred into a soldering device, there will be no change in the laminated board since the temperature near the entrance is at room temperature. Once inserted, the laminated board does not warp like a conventional board, but returns to a flat shape due to the memory performance of the shape memory alloy thin plate inside the laminated board, passes through the solder tank in a state parallel to the solder surface, and melts in the tank. After completing the soldering of the chip components using solder, the laminated board returns to its original state from the room temperature portion near the exit and exits the soldering device.
【０００７】[0007]
【実施例】本発明の自己修復型の積層基板Ａを図１、図
２、図３により詳細説明すると、図中、１，３，４は基
板、２は本発明の最も要旨とする形状記憶合金を主材と
する薄い方形枠で、加熱によって記憶している平面を復
元するように形成され、他の基板よりやや小形の前記基
板３の外周を該方形枠２で包囲し、図２のように基板１
と４の間に挟み、重ね合わせて積層基板Ａを構成する。
なお、形状記憶合金は図示の方形枠よりも幅広い方形枠
でもよいし、基板３と同大または小形の方形、円形のシ
ートに形成してもよく、基板の枚数も図例に限らない。[Example] The self-healing type laminated substrate A of the present invention will be explained in detail with reference to FIGS. The rectangular frame 2 is a thin rectangular frame mainly made of an alloy, and is formed so as to restore the memorized plane by heating. So board 1
and 4 and stacked on top of each other to form a laminated substrate A. Note that the shape memory alloy may be formed into a rectangular frame wider than the illustrated rectangular frame, or may be formed into a rectangular or circular sheet the same size or smaller than the substrate 3, and the number of substrates is not limited to the illustrated example.
【０００８】上記のように構成した本発明の積層基板Ａ
は、図３に示すように所定のチップ部品５，５…を搭載
し、常温ではほぼ平坦であるか、あるいは図示のように
やや反っている。そして、該チップ部品を半田付けする
ため半田付装置６内へ本発明の積層基板を移送すると、
入り口付近では該基板には変化はないが半田槽８の熔融
半田７の周辺の高温雰囲気中に達するとその熱で積層基
板内の形状記憶合金の薄い方形枠あるいは薄いシートは
その記憶性能により平面状に戻って従来の基板のように
反ることなく、全部のチップ部品は熔融半田７に接して
確実に半田付けされ、該基板の半田付けは完了し半田付
装置６の出口付近に至ると常温により基板は前記入り口
における時のように僅かに反った状態に復元する。Laminated substrate A of the present invention configured as described above
As shown in FIG. 3, predetermined chip components 5, 5, . Then, when the multilayer board of the present invention is transferred into the soldering device 6 to solder the chip components,
There is no change in the board near the entrance, but when it reaches the high temperature atmosphere around the molten solder 7 of the solder tank 8, the heat causes the thin rectangular frame or thin sheet of shape memory alloy in the laminated board to become flat due to its memory performance. All the chip components are firmly soldered in contact with the molten solder 7 without returning to the original shape and warping like a conventional board, and when the soldering of the board is completed and the board reaches the vicinity of the exit of the soldering device 6. At room temperature, the substrate returns to its slightly warped state as at the entrance.
【０００９】[0009]
【発明の効果】上記の構成、作用を有する本発明の反り
防止自己修復型の積層基板は、加熱により平面状態に戻
る記憶性能を有する形状記憶合金の薄い枠あるいはシー
トを基板間に挟んで積層しただけで製造が簡単である上
、従来の基板のように特殊な治具を使用して平面状態を
保持する必要なく半田付けをすることができるようにな
った。しかもその半田付けは積層基板自体の平面状態復
元で全部のチップ部品を確実に半田付けできて基板にと
って最も重要なチップ部品の半田付け工程、品質が向上
し、同時に熔融半田の温度設定やその管理も容易になり
労力も軽減できるようになった。[Effects of the Invention] The warpage-preventing self-repairing laminated substrate of the present invention having the above-described structure and operation is obtained by laminating a thin frame or sheet of a shape memory alloy having a memory property that returns to a flat state when heated between the substrates. Not only is it easy to manufacture, but it can also be soldered without the need for special jigs to maintain a flat surface like with conventional boards. What's more, the soldering process restores the planar state of the laminated board itself, making it possible to reliably solder all chip parts, improving the quality of the soldering process for chip parts, which is the most important part of the board, and at the same time setting the temperature of the molten solder and controlling it. It has also become easier and requires less labor.
【図１】本発明積層基板の分解斜視図である。FIG. 1 is an exploded perspective view of a multilayer substrate according to the present invention.
【図２】同上、積層状態の一部切欠拡大斜視図である。FIG. 2 is a partially cutaway enlarged perspective view of the same as above in a stacked state.
【図３】同上、チップ部品を搭載した積層基板の半田付
け状態を示す簡略断面図である。FIG. 3 is a simplified cross-sectional view showing a soldered state of the multilayer board on which chip components are mounted.
【図４】従来例の拡大斜視図である。FIG. 4 is an enlarged perspective view of a conventional example.
【図５】同上、半田付け状態の側面図である。FIG. 5 is a side view of the same as above in a soldered state.
Ａ 積層基板 １，３，４ 基板 ２ 形状記憶合金製の枠 ５ チップ部品 ６ 半田付装置 ７ 熔融半田 ８ 半田槽 A Laminated board 1, 3, 4 Board 2 Shape memory alloy frame 5 Chip parts 6 Soldering equipment 7. Molten solder 8 Solder tank
Claims (1)
記憶した平面状態に戻る形状記憶合金を主材とする枠状
あるいはシート状の薄板を基板間に挟んで積層してなる
ことを特徴とする自己修復型の積層基板。[Claim 1] It is characterized by a frame-shaped or sheet-shaped thin plate made of a shape memory alloy that returns to a pre-stored planar state when heated to a predetermined temperature, sandwiched between substrates and laminated. A self-healing multilayer substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2415291A JPH04239793A (en) | 1991-01-23 | 1991-01-23 | Self-repairing laminate substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2415291A JPH04239793A (en) | 1991-01-23 | 1991-01-23 | Self-repairing laminate substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04239793A true JPH04239793A (en) | 1992-08-27 |
Family
ID=12130370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2415291A Pending JPH04239793A (en) | 1991-01-23 | 1991-01-23 | Self-repairing laminate substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04239793A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996012588A1 (en) * | 1994-10-19 | 1996-05-02 | Dpd, Inc. | Shape-memory material repair system and method of use therefor |
| JP2010034390A (en) * | 2008-07-30 | 2010-02-12 | Fujikura Ltd | Multilayer printed wiring board |
| JP2016162797A (en) * | 2015-02-27 | 2016-09-05 | 日本電気株式会社 | Multilayered circuit board, package, manufacturing method of multilayered circuit board, soldering method, and manufacturing method of package |
-
1991
- 1991-01-23 JP JP2415291A patent/JPH04239793A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996012588A1 (en) * | 1994-10-19 | 1996-05-02 | Dpd, Inc. | Shape-memory material repair system and method of use therefor |
| JP2010034390A (en) * | 2008-07-30 | 2010-02-12 | Fujikura Ltd | Multilayer printed wiring board |
| JP2016162797A (en) * | 2015-02-27 | 2016-09-05 | 日本電気株式会社 | Multilayered circuit board, package, manufacturing method of multilayered circuit board, soldering method, and manufacturing method of package |
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