JPS5874272A - Soldering method of high density wiring - Google Patents

Abstract

PURPOSE:To execute soldering with high accuracy, pressing a connecting part uniformly, by making an electrode terminal and a lead wire contact through solder, pinch-holding them by a strong magnet and a flexible metallic plate attracted by the magnet, and irradiating infrared rays. CONSTITUTION:On a strong magnet, desirably a permanent magnet 16, which has been embedded in a part of a rack 15 in advance, a connecting part of plural electrode terminals whose wiring has been executed with high density, of a warped ceramic substrate 9, and plural lead wires of a flexible printed cable 6 is made to contact through solder, on which plural hole 17 parts which have been etching-worked, of a flexible metallic plate 18 of 0.02-0.3mm. in thickness, attracted by a magnet of a stainless steel plate, etc. are placed, and as necessary the lead wire is corrected by a precise pincette through said hole 17. To the connecting part which has been press-fixed by the metallic plate 18 attracted by said magnet 16, heat energy such as infrared rays, etc. is irradiated, by which soldering is executed.

Description

【発明の詳細な説明】 本発明は蒸着または印刷などで形成した回路基板上の多
数個の電極端子にフレキシブル・プリンナツト・ケーブ
ル（以下公称ＦＰＣと略称）を接続する方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for connecting a flexible printed cable (hereinafter abbreviated as FPC) to a large number of electrode terminals on a circuit board formed by vapor deposition or printing.

近年、情報端末機器の開発が盛んで、その中で電極の配
続技術も当然重視され、ｐｐｃを用いて高密度・軽量化
の配線が急速に広まっている。このＦＰＣを用いての従
来の接続法の一例を第１図の斜視図、第２図の断面図に
従い説明する。In recent years, the development of information terminal equipment has been active, and as a result, electrode interconnection technology has naturally become important, and high-density and lightweight interconnects using PPC are rapidly becoming widespread. An example of a conventional connection method using this FPC will be explained with reference to a perspective view in FIG. 1 and a sectional view in FIG. 2.

第１図はガラス基板１上の端辺に蒸着などの方法で形成
した多数個の電極端子２上に一本の選定したはんだ線３
を交叉積載させ７ラツクスで固着後、その上にフレキシ
ブルな透明な樹脂フィルム４と銅箔をエツチング加工し
たリード線５（以下リードと略称）とから成るＦ’ＰＣ
６のリード５を多数個にわたシ各電極端子２と上・下位
置合せする。Figure 1 shows a selected solder wire 3 on a large number of electrode terminals 2 formed on the edge of a glass substrate 1 by a method such as vapor deposition.
After cross-loading and fixing with 7 lux, an F'PC consisting of a flexible transparent resin film 4 and a lead wire 5 (hereinafter abbreviated as "lead") etched with copper foil is placed on top of it.
A large number of leads 5 of No. 6 are aligned in upper and lower positions with each electrode terminal 2.

次に、第２図に示すように透明石英板７で任意の力で一
括して加圧しながら固定し、その上部から赤外線８を集
光させた熱エネルギーをはんだ線３がサンドイッチしで
ある接続部に照射させることによシ、はんだ３は溶融し
てぬれ易い各端子２と各リード５にぬれ拡がり、各接続
部以外に位置したはんだは各接続部にぬれ拡がるはんだ
の表面張力１毛細管現象により引き寄せられくびれて。Next, as shown in FIG. 2, the transparent quartz plate 7 is fixed while being pressurized all at once with arbitrary force, and the solder wire 3 is sandwiched to connect the solder wire 3 to heat energy that is focused by infrared rays 8 from above. By irradiating the area, the solder 3 melts and spreads to each terminal 2 and each lead 5, which are easy to wet, and the solder located outside each connection area spreads to each connection area. Surface tension of solder 1 Capillary phenomenon The body is drawn closer and constricted.

最後に分離してしまい、上・下位置合せした接続部が多
数個同時に一本のはんだ線で一括接続するものである。Finally, they are separated, and a large number of connected parts, whose top and bottom positions are aligned, are simultaneously connected together with a single solder wire.

この方法はｌｌ’Ｐｃのリード５に予めはんだメッキ）
施してから接続する方法に比べ、低コストで高密度化な
どが計れることを見い出し１本発明者等がすでに開発出
願（特開昭５１−２７４６１　）　したものである。In this method, lead 5 of ll'Pc is pre-plated with solder)
The inventors of the present invention have already filed a development application (Japanese Unexamined Patent Application Publication No. 51-27461) after discovering that higher density can be achieved at lower cost than the method of connecting after bonding.

しかしなかり−上記？接一方法では・接続部０面が均一
平坦でなければ、はんだ＃！３が各接続部に均一に加圧
されず、均一な□はんだ量が各接続部に分配されないな
どにより、目的とする多数個一括接続が不可能になるな
どの大きな欠点を有してい１６゜。。。工□３．．）ゎ
４ｊｌｌＥＪＶＣｙｐｆＬ、よ、ユ年、低コストで多層
の回路形成が可能なセラミック基板９が急速に出＠シ、
この基板に形成される電極端子１０が、セラミック自体
が粉末焼結体のため、製造工程中、そり（うねり）が生
じてしまい、平面度を失ってしまっていて多数個を一括
して接続するのには大きな問題を有していた。ちなみに
セラミックス板のそりは１００μｍ　／　２５Ｉ１ｍ口
とあると言われている。この解決法の試みとして、フレ
キシブルな抵抗発熱体を位置合したＦＰＣの上面に当て
かい伝熱エネルギーを接続部に与える方法もあるが、加
圧の均一化が基板のそシ状態により困難−なことや、接
続部の観察がはんだ材中にできないなどの欠点がある。But no - above? In the bonding method, if the 0 surface of the connection part is not uniformly flat, solder #! 3 is not applied uniformly to each connection part, and a uniform amount of □ solder is not distributed to each connection part, making it impossible to connect many pieces at once as desired. . . . Engineering□3. ．． )ゎ4jllEJVCypfL, yo, in 2018, ceramic substrates 9 that can form multilayer circuits at low cost rapidly appeared,
Since the ceramic itself is a powder sintered body, the electrode terminals 10 formed on this substrate warp (undulate) during the manufacturing process and lose flatness, so many terminals are connected at once. had a big problem. By the way, it is said that the warpage of a ceramic plate is 100μm/25I1m. One attempt to solve this problem is to apply heat transfer energy to the connection part by applying a flexible resistance heating element to the top surface of the aligned FPC, but it is difficult to apply pressure uniformly due to the bending condition of the board. There are also drawbacks such as the inability to observe the connection part inside the solder material.

また加圧を接続部に均一に与える方法を第４図の断面図
によシ説明する。Further, a method of uniformly applying pressure to the connecting portion will be explained with reference to the cross-sectional view of FIG. 4.

、１□′ 同図に於いてそりのある基板９上にある電極端子１０に
ＦＰＣのリード５を当てがい、その上からフレキシブル
な加圧用フィルム１１を当てがい、それをＮ２ガス１２
等を流しながら接続部に加圧用フィルムで多数個を同時
に均一加圧１３しながら基板の接続部の裏面１４に赤外
線８などの熱エネルギーを与えて接続する。, 1□' In the same figure, the FPC lead 5 is applied to the electrode terminal 10 on the curved substrate 9, the flexible pressure film 11 is applied from above, and the N2 gas 12 is applied to the lead 5 of the FPC.
A large number of boards are simultaneously and uniformly pressed 13 with a pressure film on the connection part while applying heat energy such as infrared rays 8 to the back surface 14 of the connection part of the board.

この接続方法では接続ピッチが１本／ｍと荒い場合、位
置合せの精度が低い場合、セット後に、隣接端子間が位
置ずれによりリードが接触し、短絡（ブリッジ）を生じ
る危険性が少ない場合あるいは位置修正の必要もなく接
続ができる場合に有効である。This connection method is used when the connection pitch is as rough as 1 wire/m, when the alignment accuracy is low, when there is a low risk of short circuits (bridging) due to lead contact due to misalignment between adjacent terminals after setting, or This is effective when connection can be made without the need for position correction.

しかし、基板９に直接熱エネルギーを与えるため、基板
の熱破損を生じ易く、そのためにステップ加熱などをし
て長時間加熱を要するなどの問題がある。さらに接続ピ
ッチが約１１５の５本／ｗａを必要とする高密度配線で
は加圧する前後の上下位置ずれがセット中に多発し易く
、その位置修正が前記の基板の裏面からでは不可能であ
る等の欠点を有している。However, since thermal energy is applied directly to the substrate 9, the substrate is likely to be thermally damaged, and therefore, step heating or the like is required for a long period of time. Furthermore, in high-density wiring that requires 5 wires/wa with a connection pitch of about 115, vertical positional deviations before and after pressurization tend to occur frequently during setting, and it is impossible to correct the position from the back side of the board. It has the following disadvantages.

本発明の目的は、上記欠点を除去し、多数個の接続部に
均一に加圧しながら、位置修正も容易にできる接続法を
提供するにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a connection method that eliminates the above-mentioned drawbacks and allows for easy position adjustment while applying pressure uniformly to a large number of connection parts.

上記目的を達成する本発明の特徴とするところは、基板
上に高密度に配線された複数個の電極端子と、複数個の
リード線とをはんだ付するものに於いて、上記電極端子
と上記リード線との接続部をはんだを介して接触させ、
強力磁石を設けた架台と、上記強力磁石に吸引され、か
つ可撓性を有する金属板とによって上記接続部を挾持し
、任意の熱エネルギーを与えて上記接続部をはんだ付す
ることにある。The present invention is characterized in that a plurality of electrode terminals wired at high density on a substrate and a plurality of lead wires are soldered together. Contact the connection part with the lead wire through solder,
The connecting portion is held between a stand provided with a strong magnet and a flexible metal plate that is attracted by the strong magnet, and the connecting portion is soldered by applying arbitrary thermal energy.

以下、具体的な実施例を第５図の断面図および第６図の
上面図に従って説明する。Hereinafter, specific examples will be described with reference to the cross-sectional view of FIG. 5 and the top view of FIG. 6.

第５図は予め架台１５の一部に埋込み固定された強力磁
石１６上に、そりのあるセラミック基板９にＦＰＣ６を
当がい、その上に磁石に吸引される例えばステンレス鋼
板０．１ｍ厚のフェライト系５Ｕ８４０５（またはＳＵ
Ｓ　４３０でも良い）材を接続部に赤外線の照射エネル
ギーが与えられるようにエツチング加工した穴１７を形
成した可撓性を有する金属板である押えマスク１８を積
載し、フレキシブルなＦＰＣ６を加圧固定する。なお。FIG. 5 shows an FPC 6 placed on a ceramic substrate 9 with a warp on a strong magnet 16 embedded and fixed in advance in a part of a pedestal 15, and a 0.1 m thick ferrite plate, for example, a stainless steel plate, attracted by the magnet. Series 5U8405 (or SU
A holding mask 18, which is a flexible metal plate with holes 17 etched to allow infrared irradiation energy to be applied to the connection part, is loaded, and the flexible FPC 6 is fixed under pressure. do. In addition.

用いる磁石は永久磁石でもよいし、あるいは電磁磁石で
もよく、作業性、装置などの点を考慮した場合、永久磁
石の方が望ましい。次にそりのある基板９上の端子とリ
ードの位置が上・下で合っているかを確認し、ずれてい
る場合は精密ピンセット等の先端が細い工具で押えマス
月８の呉１７から、ＦＰＣ６の移動を行う。′モの場合
弁えマスク１８で強固にＦＰＣ６が固定され、ＦＰＣ６
の移動が困難な時は、磁石１６のあ、る架台１５自体を
任意の方法で遠ざけることによシ押えマスク１８の吸引
力が弱まるのでＦＰＣ６の移動修正が容易になる。The magnet used may be a permanent magnet or an electromagnetic magnet, and in consideration of workability, equipment, etc., permanent magnets are more desirable. Next, check that the terminals and leads on the warped board 9 are aligned at the top and bottom, and if they are misaligned, use a tool with a fine tip, such as precision tweezers, to hold down the FPC 6 from Kure 17 on square 8. move. In the case of 'Mo, the FPC6 is firmly fixed with the valve mask 18, and the FPC6 is
When it is difficult to move the FPC 6, moving the mount 15 itself away from the magnet 16 using an arbitrary method weakens the suction force of the holding mask 18, making it easier to correct the movement of the FPC 6.

押えマスク１８の形状は第５図に示すように加工したも
のを用いたが穴１７の形状は充分接続部に照射エネルギ
ーが通過でき、しかも穴１７を通してＦＰＣの移動修正
が工具・でできるだけの穴の大きさがあれば良く、穴の
形状は多種多様に考えられる。The shape of the holding mask 18 was machined as shown in Fig. 5, and the shape of the hole 17 was such that sufficient irradiation energy could pass through the connection part, and the hole 17 could be used to correct the movement of the FPC with a tool. A wide variety of hole shapes are possible.

本実施例では、ＦＰＣのリードが各電極端子上にわたり
均一に加圧固定され、短絡（ブリッジ）の不良が少なく
なる。さらに、押えマスクに穴が設けられているので、
赤外線の照射熱エネルギーがマスクの穴から直接ＦＰＣ
を介してはんだ線に与えられ、熱効率が良くなる。また
、押えマスクの穴を通して加熱中に接続部を観察するこ
とができ、かつ、押えマスクの穴を通して接続部の位置
修正が可能となり、短絡の不良をさらに少なくすること
ができる。In this embodiment, the leads of the FPC are uniformly pressed and fixed over each electrode terminal, thereby reducing short-circuit (bridging) defects. Furthermore, since there is a hole in the presser mask,
Infrared irradiation thermal energy is directly transmitted to the FPC through the hole in the mask.
is applied to the solder wire through the heat exchanger, improving thermal efficiency. Further, the connection portion can be observed during heating through the hole in the presser mask, and the position of the connection portion can be corrected through the hole in the presser mask, so that short-circuit defects can be further reduced.

第７図は１本発明者等が荒さ計で第３図のセラミック基
板の電極端子３００本（５本／１ＭＩＬで全体幅約６０
ｍｍ）の平面度第７図（ａ）と、第６図の押えマスクを
用いＪ第５図のように具体的にセットした状態での押え
マスクの平面度第７図（ｂ）を測定した結果を示すもの
である。このように０．１　ｍｍ程度の厚さの押えマス
クならば基板のそ）に沿って押えマスクがそのそり、Ｖ
Ｃ充分追従していることを実証できた。　　　　・：″
、。Figure 7 shows that the inventors measured 300 electrode terminals on the ceramic substrate shown in Figure 3 using a roughness meter (5 terminals/1 MIL, and the overall width was approximately 60 mm).
The flatness of the presser mask (mm) in Figure 7 (a) and the flatness of the presser mask in the state shown in Figure 5 using the presser mask in Figure 6 were measured in Figure 7 (b). This shows the results. In this way, if the holding mask has a thickness of about 0.1 mm, the holding mask will bend along the edge of the substrate, and the V
C. We were able to demonstrate that it was tracking well.・：″
,.

０、３　ｍ＋以上の厚さの押えマスクを用いた場合は接
続実験ではＦＰＣの部分的な浮きが生じ３０本もの接続
不良個所が生じた。０．０２ｍｍ以下の薄い押えマスク
では、取扱い途中に曲げすぎたりすると曲げ跡が残り、
再使用ができないなど取扱いに注意を要することも判明
した。When a holding mask with a thickness of 0.3 m+ or more was used, the FPC partially lifted in connection experiments, resulting in as many as 30 connection failures. If a thin presser mask with a thickness of 0.02 mm or less is bent too much during handling, bending marks will remain.
It was also found that they must be handled with care, as they cannot be reused.

従って基板のそりに応じた押えマスクの板厚を選ぶこと
が不良の出ない接続部をつくる条件であることがわかる
。Therefore, it can be seen that selecting the thickness of the presser mask in accordance with the warpage of the substrate is a condition for creating a defect-free connection.

尚、本実施例に於いては、セラミック基板を例にして説
明したが、ガラス基板、プリント基板等のそりを有する
一般の基板にも本発明は適用できる。Although the present embodiment has been described using a ceramic substrate as an example, the present invention can also be applied to general substrates having warpage, such as glass substrates and printed circuit boards.

また、接続するリード線はＦＰＣに限らず、多心リード
線等の一般のリード線でも良い。Further, the lead wire to be connected is not limited to FPC, but may be a general lead wire such as a multi-core lead wire.

以上のよう顛本発明によれば、フレキシブルな押え板を
用いるため、リード線が各電極端子上にわたり均一に加
圧固定できるので短絡という不良が少なくできる。As described above, according to the present invention, since a flexible holding plate is used, the lead wire can be uniformly pressurized and fixed over each electrode terminal, thereby reducing defects such as short circuits.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の詳細な説明する従来法の斜視図、第２
図は第１図の具体的説明をする断面図、第３図は本発明
に用いた基板の斜視図、第４図は第３図での具体的実施
例を説明する従来法の断面図、第５図は本発明の具体的
実施例を説明する断面図、第６図は第５図に用いた本発
明の詳細な説明する平面図、第７甲は本発明の詳細な説
明するｖＪｊ図 ｉ／／３ ＋ＭｌｔＩ７／１Fig. 1 is a perspective view of a conventional method explaining the present invention in detail;
3 is a perspective view of the substrate used in the present invention; FIG. 4 is a sectional view of a conventional method explaining the specific embodiment shown in FIG. 3; FIG. 5 is a sectional view explaining a specific embodiment of the present invention, FIG. 6 is a plan view explaining in detail the present invention used in FIG. 5, and FIG. i//3 +MltI7/1

Claims (1)

【特許請求の範囲】 ｉ、基板上に高密度に配線された複数個の電極端子と、
複数個のリード線とをはんだ付するものに於いて、上記
電極端子と上記リード線との接続部をはんだを介して接
触させ、強力磁石を設けた架台と、上記強力磁石に吸引
され、かつ可撓性を有する金属板とによって上記接続部
を挾持し、任意の熱エネルギーを与えて上記接続部をは
んだ付することを特徴とする高密度配線のはんだ付方法
。 ２、特許請求の範囲第１項に於いて、金属板には少なく
とも１個の穴が設けられることを特徴とする高密度配線
のはんだ付方法。 ３、特許請求の範囲第１項または第２項に於いて。 金属板の板厚は０．０２寵〜０．３　ｗｇであることを
特徴とする高密度配線のはんだ付方法。 ４、特許請求の範囲第１項から第３項に於いて。 強力磁石は永久磁石であることを特徴とする高密度配線
のはんだ付方法。[Claims] i. A plurality of electrode terminals wired at high density on a substrate;
In the case where a plurality of lead wires are soldered, the connection portion between the electrode terminal and the lead wire is brought into contact with each other via solder, and a mount provided with a strong magnet is attracted to the strong magnet, and A method for soldering high-density wiring, characterized in that the connecting portion is held between flexible metal plates and the connecting portion is soldered by applying a desired amount of thermal energy. 2. A method for soldering high-density wiring according to claim 1, characterized in that at least one hole is provided in the metal plate. 3. In claim 1 or 2. A method for soldering high-density wiring, characterized in that the thickness of the metal plate is 0.02 wg to 0.3 wg. 4. In claims 1 to 3. A high-density wiring soldering method characterized in that the strong magnet is a permanent magnet.