JPH04233260A - Surface treatment of lead frame in substrate for mounting electronic component - Google Patents
Surface treatment of lead frame in substrate for mounting electronic componentInfo
- Publication number
- JPH04233260A JPH04233260A JP40890990A JP40890990A JPH04233260A JP H04233260 A JPH04233260 A JP H04233260A JP 40890990 A JP40890990 A JP 40890990A JP 40890990 A JP40890990 A JP 40890990A JP H04233260 A JPH04233260 A JP H04233260A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- surface treatment
- base material
- electronic component
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004381 surface treatment Methods 0.000 title claims abstract description 40
- 239000000758 substrate Substances 0.000 title claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 28
- 239000000126 substance Substances 0.000 claims abstract description 27
- 238000005498 polishing Methods 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims description 27
- 238000011282 treatment Methods 0.000 description 23
- 239000004020 conductor Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011221 initial treatment Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は電子部品搭載用基板にお
けるリードフレームの表面処理方法に関し、特に黒化処
理が施されたリードフレームのうち、基材より突出する
部分の表面処理方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of surface treatment of a lead frame on a substrate for mounting electronic components, and more particularly to a method of surface treatment of a portion of a lead frame which has been subjected to a blackening treatment and protrudes from a base material.
【０００２】0002
【従来の技術】半導体チップ等の電子部品を外部と電気
的に接続するための電子部品搭載用基板は、従来より種
々のものが案出されてきている。例えば、本出願人が先
の出願（特開平１−１９９４９７号公報）において開示
した電子部品搭載用基板もその一つである。2. Description of the Related Art Various electronic component mounting boards for electrically connecting electronic components such as semiconductor chips to the outside have been devised. For example, the electronic component mounting board disclosed by the present applicant in a previous application (Japanese Patent Laid-Open No. 199497/1999) is one of them.
【０００３】この電子部品搭載用基板１０の構造は、図
２及び図３に示すように、アウターリード１２ａとイン
ナーリード１２ｂとからなるリード１２と電子部品搭載
部となるダイパッド１３等とを銅箔等により一体的に形
成したリードフレーム１１と、このリードフレーム１１
と一体化される絶縁樹脂よりなる基材１４と、この基材
１４上に形成された導体回路１５と、この導体回路１５
と前記リードフレーム１１のインナーリード１２ｂとを
電気的に接続するスルーホール１６等とから構成されて
いる。As shown in FIGS. 2 and 3, the structure of this electronic component mounting board 10 is such that the leads 12, which are composed of an outer lead 12a and an inner lead 12b, and a die pad 13, which serves as an electronic component mounting portion, are made of copper foil. A lead frame 11 integrally formed by, etc., and this lead frame 11
a base material 14 made of insulating resin that is integrated with a conductor circuit 15 formed on this base material 14;
and through holes 16 for electrically connecting the inner leads 12b of the lead frame 11.
【０００４】そして、一般に、この種の電子部品搭載用
基板１０におけるリードフレーム１１の両面には、基材
１４と一体化する際に当該リードフレーム１１の密着性
や防錆特性の向上を図るための黒化表面処理が施されて
いる。[0004] In general, both sides of the lead frame 11 in this type of electronic component mounting board 10 are coated to improve the adhesion and anti-rust properties of the lead frame 11 when integrated with the base material 14. Blackened surface treatment has been applied.
【０００５】ところが、前述の電子部品搭載用基板１０
にあっては、リードフレーム１１の一部であるアウター
リード１２ａ等の基材１４より突出する部分１１ａにも
黒化処理が施されているため、このままでは電気的信頼
性に欠けるばかりか外観上も問題がある。However, the above-mentioned electronic component mounting board 10
In this case, the parts 11a of the outer leads 12a, which are a part of the lead frame 11, that protrude from the base material 14 are also subjected to blackening treatment. There is also a problem.
【０００６】そこで、リードフレーム１１のうち、基材
１４より突出する部分１１ａの黒化処理を除去する表面
処理方法が従来より考えられている。その処理方法は、
図７に示すような工程による薬品による化学的な表面処
理である。即ち、リードフレーム１１のうち基材１４よ
り突出する部分１１ａに対して、脱脂→ソフトエッチ→
酸処理等の主工程を経て黒化処理を除去するのである。[0006] Therefore, a surface treatment method has conventionally been considered in which the blackening treatment is removed from the portion 11a of the lead frame 11 that protrudes from the base material 14. The processing method is
This is chemical surface treatment using chemicals through the steps shown in FIG. That is, the portion 11a of the lead frame 11 that protrudes from the base material 14 is degreased → soft etched →
The blackening treatment is removed through main steps such as acid treatment.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、このよ
うな従来の表面処理方法のみでは、次のような問題が生
じていた。即ち、基材１４より突出する部分１１ａのリ
ードフレーム１１の表面は、基材１４との密着性を高め
るために施された黒化処理によって、図８に示すように
激しい凹凸を有する粗面となっている。このため、この
状態のままで前述の化学的な表面処理を直接施すと、処
理が不均一になって、図９に示すようにその表面にムラ
が生じる。つまり、凹凸の激しいままでソフトエッチ等
の化学的な表面処理が施されるため、エッチング程度に
ばらつきを生じ、表面処理後にもムラが生じのである。[Problems to be Solved by the Invention] However, the following problems have occurred with only such conventional surface treatment methods. That is, the surface of the lead frame 11 of the portion 11a protruding from the base material 14 has a rough surface with severe unevenness as shown in FIG. It has become. Therefore, if the chemical surface treatment described above is directly applied in this state, the treatment will become non-uniform, resulting in unevenness on the surface as shown in FIG. In other words, chemical surface treatment such as soft etching is performed while the surface is still highly uneven, resulting in variations in the degree of etching and unevenness even after surface treatment.
【０００８】そして、このような表面のムラは、リード
フレーム１１の外観を悪くすると共に、電気的特性に大
きな影響を与えるのである。さらに、このムラをなくす
ためには前述の化学的な表面処理を繰り返し行う方法も
考えられるが、この場合だと必要以上にソフトエッチ等
がなされるため、リードフレーム１１の厚みを確保でき
ず、電気的特性の劣化をきたすばかりか強度的にも問題
があり、さらに何よりも処理に時間がかかりすぎるとい
う問題が残っていたのである。[0008] Such surface unevenness not only deteriorates the appearance of the lead frame 11 but also has a large effect on the electrical characteristics. Furthermore, in order to eliminate this unevenness, it is possible to repeat the chemical surface treatment described above, but in this case, soft etching etc. are performed more than necessary, making it impossible to ensure the thickness of the lead frame 11. Not only did this cause deterioration in electrical characteristics, but there were also problems with strength, and above all, there remained the problem that processing took too much time.
【０００９】そこで案出されたのが本発明であって、そ
の目的とするところは、電子部品搭載用基板におけるリ
ードフレームのうち、基材より突出する部分の外観の向
上と電気的信頼性の向上を図ることができると共に、処
理時間が短くてすむ電子部品搭載用基板におけるリード
フレームの表面処理方法を提供することにある。The present invention was devised in view of the above, and its purpose is to improve the appearance of the portion of the lead frame of the electronic component mounting board that protrudes from the base material and to improve the electrical reliability. It is an object of the present invention to provide a method for surface treatment of a lead frame on an electronic component mounting board, which can improve the performance and requires a short processing time.
【００１０】0010
【課題を解決するための手段】以上のような課題を解決
するために本発明が採った手段は、実施例に対応する図
面を参照して説明すると、「電子部品搭載用基板１０に
おける黒化処理が施されたリードフレーム１１のうち、
アウターリード１２ａ等の基材１４より突出する部分１
１ａの黒化処理を除去する表面処理方法であって、前記
基材１４より突出する部分１１ａを砥粒噴射研磨により
研磨した後、薬品による化学的な表面処理を行うことを
特徴とする電子部品搭載用基板１０におけるリードフレ
ーム１１の表面処理方法」をその要旨とするものである
。[Means for Solving the Problems] The means taken by the present invention to solve the above-mentioned problems will be explained with reference to the drawings corresponding to the embodiments. Among the processed lead frames 11,
Portion 1 protruding from the base material 14 such as the outer lead 12a
1a is a surface treatment method for removing the blackening treatment, and the electronic component is characterized in that the portion 11a protruding from the base material 14 is polished by abrasive jet polishing, and then chemical surface treatment is performed using chemicals. The gist thereof is ``Surface treatment method for lead frame 11 on mounting substrate 10''.
【００１１】つまり、図１及び図４〜図６に示すように
、従来の薬品による化学的な表面処理の前に、所謂ジェ
ットスクラブ研磨と呼ばれる砥粒噴射研磨によりリード
フレーム１１の表面を物理的に研磨して、化学的表面処
理がなされるべきリードフレーム１１の表面をある程度
平坦にしておくのである。That is, as shown in FIGS. 1 and 4 to 6, before chemical surface treatment using conventional chemicals, the surface of the lead frame 11 is physically polished by abrasive jet polishing called jet scrub polishing. The surface of the lead frame 11 to be subjected to chemical surface treatment is made flat to some extent by polishing.
【００１２】なお、この砥粒噴射研磨とは、酸化珪素等
の粒子を水に２０％程の濃度で攪拌し、これをノズル２
０より所定圧力で被研磨物に噴射して、当該被研磨物を
研磨する方法である[0012] This abrasive jet polishing involves stirring particles such as silicon oxide in water at a concentration of about 20%, and then pouring the particles into the nozzle 2.
This is a method of polishing an object to be polished by jetting it at a predetermined pressure from 0 to the object to be polished.
【００１３】[0013]
【発明の作用】そして、本発明は上記のような手段を採
ることによって、次のような作用がある。即ち、先ず、
図４に示すように、黒化処理が施されたリードフレーム
１１のうち、基材１４より突出する部分１１ａに対して
砥粒噴射研磨を施し、物理的にリードフレーム１１の表
面を研磨して黒化処理の一部を除去し、その表面を図５
に示すようなある程度平坦なものとする。Effects of the Invention By adopting the above-described measures, the present invention has the following effects. That is, first,
As shown in FIG. 4, the surface of the lead frame 11 is physically polished by applying abrasive jet polishing to the portion 11a of the lead frame 11 that has been subjected to the blackening treatment and protruding from the base material 14. After removing a part of the blackening treatment, the surface is shown in Figure 5.
It should be somewhat flat as shown in .
【００１４】次に、この表面に対して従来の薬品による
化学的な表面処理を施し、残りの黒化処理を除去して、
図６に示すような、さらに平坦なものとするのである。Next, this surface is subjected to chemical surface treatment using conventional chemicals to remove the remaining blackening treatment.
It is made even flatter as shown in FIG.
【００１５】つまり、この処理方法は、リードフレーム
１１の表面を物理的な砥粒噴射研磨により一次処理し、
次いで薬品による化学的な表面処理により二次処理する
ため、黒化処理を除去するための表面処理が均一に行わ
れ、ムラ等がなくなって外観が向上すると共に電気的信
頼性も向上するのである。That is, in this processing method, the surface of the lead frame 11 is primarily processed by physical abrasive jet polishing,
Since the surface is then subjected to secondary treatment using chemicals, the surface treatment to remove the blackening treatment is performed uniformly, eliminating unevenness, improving the appearance, and improving electrical reliability. .
【００１６】また、リードフレーム１１の表面は、砥粒
噴射研磨によりある程度平坦なものとなるため、その後
の化学的な処理が容易に行えると共に、その処理時間の
短縮を図ることが可能となるのである。Furthermore, since the surface of the lead frame 11 is made somewhat flat by the abrasive jet polishing, the subsequent chemical treatment can be easily performed and the processing time can be shortened. be.
【００１７】[0017]
【実施例】次に、本発明に係る表面処理方法の一実施例
について説明する。なお、表面処理を行う電子部品搭載
用基板１０として、図２及び図３に示した構造のものを
例に採って説明する。[Example] Next, an example of the surface treatment method according to the present invention will be described. The electronic component mounting substrate 10 to be subjected to surface treatment will be described by taking as an example the structure shown in FIGS. 2 and 3.
【００１８】先ず、この電子部品搭載用基板１０は、複
数のリード１２（アウターリード１２ａとインナーリー
ド１２ｂとからなる）とダイパッド１３等とを銅箔によ
り一体的に形成すると共にその両表面に黒化処理を施し
たリードフレーム１１と、このリードフレーム１１の両
面にプリプレグを熱圧着してリードフレーム１１と一体
化した基材１４と、この基材１４上に形成した銅材より
なる導体回路１５と、この導体回路１５と前記リード１
２のインナーリード１２ｂとの電気的接続を行うスルー
ホール１６等から構成されている。First, this electronic component mounting board 10 has a plurality of leads 12 (consisting of an outer lead 12a and an inner lead 12b), a die pad 13, etc., integrally formed with copper foil, and black on both surfaces. A lead frame 11 that has been subjected to a chemical treatment, a base material 14 that is integrated with the lead frame 11 by thermocompression bonding prepreg to both sides of this lead frame 11, and a conductor circuit 15 made of a copper material formed on this base material 14. , this conductor circuit 15 and the lead 1
It is composed of through holes 16 and the like for electrical connection with the inner leads 12b of No. 2.
【００１９】そして、この電子部品搭載用基板１０は、
その構造工程において、図３の点線で示す部分の基材１
４が切削され、リードフレーム１１のうちのアウターリ
ード１２ａ等が基材１４から突出させられるのである。
この基材１４から突出する部分１１ａは、黒化処理が施
されたままであるのでこれを除去する必要があり、その
処理方法が本実施例である。[0019] This electronic component mounting board 10 is
In the construction process, the base material 1 in the part indicated by the dotted line in FIG.
4 is cut, and the outer leads 12a and the like of the lead frame 11 are made to protrude from the base material 14. The portion 11a protruding from the base material 14 is still subjected to the blackening treatment, so it must be removed, and this embodiment is the treatment method for this purpose.
【００２０】図１には、その表面処理方法の工程図が示
してあり、先ず、基材１４より突出する部分１１ａ（ア
ウターリード１２ａ等）に対してジェットスクラブ研磨
と呼ばれる砥粒噴射研磨を施す。この基材１４より突出
する部分１１ａの表面は、図４に示すように激しい凹凸
を有しているが、この処理を施すとその一部が研磨され
て図５に示すようにある程度平坦になる。なお、ここで
使用した砥粒噴射研磨は、粒径２２０程の炭化珪素の粒
子を水に２０％程の濃度に攪拌し、これをノズル２０に
より２．０Ｋｇ／ｃｍ２の圧力で塗出して行った。FIG. 1 shows a process diagram of the surface treatment method. First, the portions 11a (outer leads 12a, etc.) protruding from the base material 14 are subjected to abrasive jet polishing called jet scrub polishing. . The surface of the portion 11a protruding from the base material 14 has severe unevenness as shown in FIG. 4, but when this treatment is applied, a part of it is polished and becomes flat to some extent as shown in FIG. . The abrasive jet polishing used here was carried out by stirring silicon carbide particles with a particle size of about 220 in water to a concentration of about 20%, and applying this with a nozzle 20 at a pressure of 2.0 kg/cm2. Ta.
【００２１】次に、この状態で従来の薬品による化学的
な表面処理を施す。その際、基材１４より突出する部分
１１ａの表面はある程度平坦になっているため、ソフト
エッチ等の化学処理が短時間でかつ均一に行われ、その
表面は図６に示すようにムラなく処理される。Next, in this state, chemical surface treatment using conventional chemicals is performed. At this time, since the surface of the portion 11a protruding from the base material 14 is flat to some extent, chemical treatment such as soft etching is performed uniformly in a short time, and the surface is evenly treated as shown in FIG. be done.
【００２２】このように、本実施例に係る表面処理方法
によれば、黒化処理の除去がムラなく短時間で行うこと
ができるのである。As described above, according to the surface treatment method according to this embodiment, the blackening treatment can be removed evenly and in a short time.
【００２３】[0023]
【発明の効果】以上詳述したように、本発明に係る電子
部品搭載用基板におけるリードフレームの表面処理方法
は、「電子部品搭載用基板における黒化処理が施された
リードフレームのうち、アウターリード等の基材より突
出する部分の黒化処理を除去する表面処理方法であって
、前記基材より突出する部分を砥粒噴射研磨により研磨
した後、薬品による化学的な表面処理を行うこと」をそ
の構成上の特徴としている。Effects of the Invention As described in detail above, the method for surface treatment of a lead frame in a board for mounting electronic components according to the present invention is applicable to A surface treatment method for removing blackening treatment from a portion of a lead or the like that protrudes from a base material, which involves polishing the portion protruding from the base material by abrasive jet polishing and then performing chemical surface treatment using chemicals. ' is its structural feature.
【００２４】従って、この表面処理方法によれば、リー
ドフレームのうち基材より突出する部分の表面を物理的
な砥粒噴射研磨により一次処理し、次いで薬品による化
学的な表面処理により二次処理するため、黒化処理を除
去するための表面処理が均一に行われ、ムラ等がなくな
って外観が向上すると共に電気的信頼性も向上する。Therefore, according to this surface treatment method, the surface of the portion of the lead frame that protrudes from the base material is subjected to primary treatment by physical abrasive jet polishing, and then secondary treatment is performed by chemical surface treatment using chemicals. Therefore, the surface treatment for removing the blackening treatment is performed uniformly, eliminating unevenness, improving the appearance, and improving electrical reliability.
【００２５】また、リードフレームのうち基材より突出
する部分の表面は、砥粒噴射研磨によりある程度平坦な
ものとなるため、その後の化学的な処理が容易に行える
と共に、その処理時間の短縮を図ることができる。Furthermore, the surface of the portion of the lead frame that protrudes from the base material is made somewhat flat by abrasive jet polishing, which facilitates subsequent chemical treatment and shortens the processing time. can be achieved.
【００２６】[0026]
【図１】本発明に係る表面処理方法の一実施例について
順を追って説明する工程図である。FIG. 1 is a step-by-step process diagram illustrating an embodiment of a surface treatment method according to the present invention.
【図２】本発明に係る表面処理方法によって表面処理さ
れる電子部品搭載用基板の一例を示す平面図である。FIG. 2 is a plan view showing an example of an electronic component mounting substrate whose surface is treated by the surface treatment method according to the present invention.
【図３】図２におけるＡ−Ａ断面図である。FIG. 3 is a sectional view taken along line AA in FIG. 2;
【図４】砥粒噴射研磨する前のリードフレームの表面状
態を示す部分拡大断面図である。FIG. 4 is a partially enlarged sectional view showing the surface condition of the lead frame before abrasive jet polishing.
【図５】砥粒噴射研磨した後のリードフレームの表面状
態を示す拡大断面図である。FIG. 5 is an enlarged sectional view showing the surface condition of the lead frame after abrasive jet polishing.
【図６】本発明に係る表面処理方法を実施した際のリー
ドフレームの表面状態を示す拡大断面図である。FIG. 6 is an enlarged cross-sectional view showing the surface condition of the lead frame when the surface treatment method according to the present invention is carried out.
【図７】従来の表面処理方法について順を追って説明す
る工程図である。FIG. 7 is a step-by-step process diagram illustrating a conventional surface treatment method.
【図８】従来の表面処理方法を実施する前のリードフレ
ームの表面状態を示す拡大断面図である。FIG. 8 is an enlarged cross-sectional view showing the surface state of a lead frame before a conventional surface treatment method is applied.
【図９】従来の表面処理方法を実施した後のリードフレ
ームの表面状態を示す拡大断面図である。FIG. 9 is an enlarged cross-sectional view showing the surface state of a lead frame after a conventional surface treatment method has been applied.
１０ 電子部品搭載用基板 １１ リードフレーム １１ａ 突出する部分 １２ リード １２ａ アウターリード １２ｂ インナーリード １３ ダイパッド １４ 基材 １５ 導体回路 １６ スルーホール ２０ ノズル 10 Substrate for mounting electronic components 11 Lead frame 11a Protruding part 12 Lead 12a Outer lead 12b Inner lead 13 Die pad 14 Base material 15 Conductor circuit 16 Through hole 20 Nozzle
Claims (1)
が施されたリードフレームのうち、アウターリード等の
基材より突出する部分の黒化処理を除去する表面処理方
法であって、前記基材より突出する部分を砥粒噴射研磨
により研磨した後、薬品による化学的な表面処理を行う
ことを特徴とする電子部品搭載用基板におけるリードフ
レームの表面処理方法。1. A surface treatment method for removing blackening from portions of a blackened lead frame of an electronic component mounting board that protrude from a base material such as outer leads, the method comprising: A method for surface treatment of a lead frame on a substrate for mounting electronic components, which comprises polishing the more protruding portions by abrasive jet polishing, and then performing chemical surface treatment using chemicals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40890990A JP2876092B2 (en) | 1990-12-28 | 1990-12-28 | Surface treatment method for lead frame on electronic component mounting board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40890990A JP2876092B2 (en) | 1990-12-28 | 1990-12-28 | Surface treatment method for lead frame on electronic component mounting board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04233260A true JPH04233260A (en) | 1992-08-21 |
| JP2876092B2 JP2876092B2 (en) | 1999-03-31 |
Family
ID=18518305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP40890990A Expired - Lifetime JP2876092B2 (en) | 1990-12-28 | 1990-12-28 | Surface treatment method for lead frame on electronic component mounting board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2876092B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010512665A (en) * | 2006-12-12 | 2010-04-22 | インタープレックス，キューエルピー，インコーポレイテッド | Plastic electronic device package |
-
1990
- 1990-12-28 JP JP40890990A patent/JP2876092B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010512665A (en) * | 2006-12-12 | 2010-04-22 | インタープレックス，キューエルピー，インコーポレイテッド | Plastic electronic device package |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2876092B2 (en) | 1999-03-31 |
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