JPH04206923A - Electric characteristic test of electronic component and forming and taping thereof - Google Patents
Electric characteristic test of electronic component and forming and taping thereofInfo
- Publication number
- JPH04206923A JPH04206923A JP2339255A JP33925590A JPH04206923A JP H04206923 A JPH04206923 A JP H04206923A JP 2339255 A JP2339255 A JP 2339255A JP 33925590 A JP33925590 A JP 33925590A JP H04206923 A JPH04206923 A JP H04206923A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- taping
- forming
- support
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012360 testing method Methods 0.000 title abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 22
- 230000002950 deficient Effects 0.000 claims abstract description 15
- 238000007789 sealing Methods 0.000 claims abstract description 10
- 238000003860 storage Methods 0.000 claims abstract description 10
- 238000007689 inspection Methods 0.000 claims description 16
- 230000004308 accommodation Effects 0.000 claims description 3
- 238000005452 bending Methods 0.000 abstract description 4
- 238000004049 embossing Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
本発明は例えばタンタル個体電解コンデンザ、或は他の
モ〜ルドチップコンデンザ等の電子部品の容量、損失等
の電気特性の検査、同電子部品の電極を折曲げるフォー
ミング、フォーミング後の電子部品の特性検査、検査済
の電子部品を良品と不良品部に判別する判別、判別され
た良品をエンボステープに一個づつ収納し更にテープを
被せてシールするテーピングの各作業を、自動的にしか
も一貫して連続的に行なうことができるようにした電子
部品の電気特性の検査、フォーミング、テーピング方法
に関するものである。The present invention is applicable to, for example, testing the electrical characteristics such as capacitance and loss of electronic components such as tantalum solid electrolytic capacitors or other molded chip capacitors, forming to bend the electrodes of electronic components, and testing of electronic components after forming. Automatically and consistently performs characteristic inspection, distinguishing inspected electronic parts into good and defective parts, and taping, which stores the judged good parts one by one on embossed tape and covers them with tape to seal them. The present invention relates to a method for inspecting electrical characteristics of electronic components, forming, and taping, which can be carried out continuously.
電子部品の電気特性の検査、電極のフォーミング、テー
ピングを行なう方法や装置は従来から各種あった。
しかし従来の電気特性の検査、電極のフォーミング、テ
ーピングの方法や装置はいずれもそれらの作業を別々に
行なうものであった。There have been various methods and devices for testing the electrical characteristics of electronic components, forming electrodes, and taping. However, conventional methods and devices for testing electrical properties, forming electrodes, and taping each involve performing these tasks separately.
従来の電気特性の検査、電極のフォーミング、テーピン
グの方法や装置ではような諸問題があった。
1、各作業が別々に行なわれるため、作業能率が悪い。
2.74−ミンク済の電子部品を保管してから改めてテ
ーピングの工程に移すことになるので、電子部品が落下
するとか、電子部品の十電極と一電極の向きが反転する
とか、異種類の電子部品が混入するといったことがあっ
た。しかも、電子部品を極性が反転したままテーピング
すると、その電子部品をプリント基板等へ実装したとき
に同電子部品の電極の向き(極性)が逆になるため、同
電子部品が実装されたプリント基板全体が不良品になる
という重大な問題に発展する。
3474−ミンク済の電子部品を保管してから改めてテ
ーピングの工程に移すので、その保管場所が必要になる
。Conventional methods and devices for testing electrical properties, forming electrodes, and taping have had the following problems. 1. Work efficiency is poor because each work is done separately. 2.74-Since electronic components that have been minced are stored and then transferred to the taping process again, there may be cases where electronic components fall, the orientation of the 10th electrode and 1st electrode of the electronic component is reversed, or different types of electronic components occur. There were cases where electronic parts were mixed in. Moreover, if you tape an electronic component with its polarity reversed, the direction (polarity) of the electrodes of the electronic component will be reversed when the electronic component is mounted on a printed circuit board, etc. This develops into a serious problem where the entire product becomes defective. 3474 - Minked electronic components are stored and then transferred to the taping process, so a storage space is required.
本発明の目的は電子部品の電気特性の検査、フォーミン
グ、テーピングの作業を一貫して連続的に行なうことが
できるようにして作業の合理化を図り、作業時間の短縮
、作業能率の向」二、製造コストの低減を実現し、しか
も作業中に電子部品が落下したり、極性が反転したりし
ないようにした電子部品の電気特性の検査、フォーミン
グ、テーピング方法を提供することにある。The purpose of the present invention is to streamline the work by making it possible to consistently and continuously perform the work of inspecting the electrical characteristics of electronic parts, forming, and taping, thereby shortening work time and improving work efficiency. To provide a method for inspecting electrical characteristics, forming, and taping electronic components, which reduces manufacturing costs and prevents electronic components from falling or reversing polarity during work.
本発明のうち請求項1の電子部品の電気特性の検査、フ
ォーミング、テーピング方法は、第2図のように適宜間
隔で一列に多数連接されている電子部品lの各モールド
部2を、第3図のように受凹部4がモールド部2の間隔
と同じ間隔で一列に多数形成されている細長の支持具3
の各受凹部4にのせて、同支持具3を間欠的に移動させ
て各電子部品1の電気特性を検査し、同受凹部4にのせ
てある電子部品1の十電極5と一電極6のいずれか一方
を第7図のように(同図では十電極5)を所定寸法に切
断してから、第6図〜第10図のように折曲げ、次に他
方の電極(この場合は一電極6)を所定寸法に切断して
から所定形状に折曲げてフォーミングし2次に、受凹部
4にのせてある電子部品1の電気特性を検査して良品と
不良品を判別し、良品を第6図のように一個づつ同受凹
部4から押出し具7により押出してエンボステープ8の
収容部9内に収容し、同収容部9を第6図のようにシー
ル用テープ10によりシールしてテーピングするもので
ある。
本発明のうち請求項2の電子部品の電気特性の検査、フ
ォーミング、テーピング方法は、第5図のように支持具
3の受凹部4にのせた電子部品1を、第7図に示す押え
具15により支持具3に押しつけるようにしたものであ
る。
本発明のうち請求項3の電子部品の電気特性の検査、フ
ォーミング、テーピング方法は、支持具3の受凹部4の
幅を第6図、第14図に示すように電子部品1のモール
ド部2の幅より狭くして、同モールド部2の幅方向両端
部16、]7を受凹部4より側方に突出させ、その突出
する両端部16.17を第6図、第14図に示すように
押出し具7により押して、同電子部品1をエンボステー
プ8の収容部9に一個づつ収容するようにしたものであ
る。
本発明のうち請求項4の電子部品の電気特性の検査、フ
ォーミング、テーピング方法は、電子部品lの電気特性
の検査、同電子部品1の十電極5及び−電極6のフォー
ミング、エンボステープ8の収容部9への電子部品1の
収容及びテーピングの各作業を、第1図のように二列以
上の作業ラインΔ、B、Cに分けて行ない、支持具3の
受凹部4にのせてある電子部品1を他のラインに移し替
えるときに、第1図の筒体18に第11図のように支持
具3ごと挿入し、その筒体18を移動するようにしたも
のである。The method of inspecting, forming, and taping the electrical characteristics of electronic components according to claim 1 of the present invention is such that each mold portion 2 of an electronic component 1, which is connected in a row at appropriate intervals as shown in FIG. As shown in the figure, an elongated support 3 in which a large number of receiving recesses 4 are formed in a row at the same intervals as the mold parts 2.
The electrical characteristics of each electronic component 1 are inspected by placing the electronic component 1 on each receiving recess 4 by intermittently moving the support 3. Cut one of the electrodes (10 electrodes 5 in this figure) to a predetermined size as shown in Figure 7, bend it as shown in Figures 6 to 10, and then cut the other electrode (in this case, One electrode 6) is cut to a predetermined size, then bent into a predetermined shape and formed.Secondly, the electrical characteristics of the electronic component 1 placed in the receiving recess 4 are inspected to distinguish between good and defective products. As shown in FIG. 6, the embossed tape is extruded one by one from the receiving recess 4 by the extruder 7 and stored in the housing part 9 of the embossed tape 8, and the housing part 9 is sealed with the sealing tape 10 as shown in FIG. This is done by taping. The method of inspecting, forming, and taping the electrical characteristics of an electronic component according to claim 2 of the present invention is to use a holding device shown in FIG. 15 to press against the support 3. In the method of inspecting, forming and taping the electrical characteristics of an electronic component according to claim 3 of the present invention, the width of the receiving recess 4 of the support 3 is adjusted to the width of the molded portion 2 of the electronic component 1 as shown in FIGS. 6 and 14. The width of both ends 16, 7 of the molded part 2 in the width direction is made to protrude laterally from the receiving recess 4, and the protruding ends 16, 17 are made narrower than the width of the mold part 2, as shown in FIGS. 6 and 14. The electronic components 1 are pushed by a pusher 7 to be accommodated one by one in the accommodating portion 9 of the embossed tape 8. The method of inspecting, forming and taping the electrical characteristics of an electronic component according to claim 4 of the present invention includes inspecting the electrical characteristics of the electronic component 1, forming the 10th electrode 5 and the 6th electrode of the electronic component 1, and forming the embossed tape 8. The work of accommodating and taping the electronic components 1 in the accommodating portion 9 is performed in two or more work lines Δ, B, and C as shown in FIG. When transferring the electronic component 1 to another line, the support 3 is inserted into the cylindrical body 18 of FIG. 1 as shown in FIG. 11, and the cylindrical body 18 is moved.
本件出願のうち請求項1の発明では、電子部品の電気特
性の検査、フォーミング、テーピングの各作業が一貫し
て自動且つ連続的に行なわれるので、それらの作業が合
理化され、作業能率が向−トする。
また、電子部品1が電気特性の検査から最終工程のテー
ピングまで、細長の支持具3の受凹部4にのせたまま行
なわれ、その間に一度も同受凹部4から他に移し替えな
いので、移し替えによる電子部品1の裏返し、−電極5
と十電極6の向きの反転、異種類型子部品の混入等が生
じない。
本件出願のうち請求項2の発明では、支持具3の受凹部
4にのせた電子部品lを押え具15により支持具3に押
しつけるので、電子部品1を支持具3にのせたまま移動
しても支持具3の」二で電子部品Iの極性が反転したり
、電子部品1が支持具3から落下したりすることがない
。
本件出願のうち請求項3の発明では、受凹部4の幅を電
子部品lのモールド部2の幅より狭くして、モールド部
2の幅方向両端部16.17が受凹部4より側方に突出
するようにしであるので、その突出する幅方向両端部1
6.17を押出し具7により押してエンボステープ8の
収容部9に一個づつ収容することができる。
本件出願のうち請求項4の発明では、電子部品1の電気
特性の検査、同電子部品1の一電極5及び十電極6のフ
ォーミング、テーピングの各作業をニガ以−にのライン
(例えば第1図のA、B、C)に分けて行なう場合、電
子部品Iを支持具3の受凹部4にのぜたまま筒体18に
入れて他の作業ラインに移し替えるので、その移動時に
支持具3の上で電子部品1の極性が反転したり、振動で
支持具3から落下したりすることがない。In the invention of claim 1 of the present application, each operation of inspecting the electrical characteristics of electronic components, forming, and taping is performed automatically and continuously, so these operations are streamlined and work efficiency is improved. to Furthermore, the electronic component 1 is carried out while being placed in the receiving recess 4 of the elongated support 3 from the inspection of electrical characteristics to the final taping process, and the electronic component 1 is never transferred from the receiving recess 4 to another during the process. Turning over the electronic component 1 due to replacement, -electrode 5
Therefore, reversal of the direction of the electrode 6, mixing of different types of mold parts, etc. do not occur. In the invention of claim 2 of the present application, since the electronic component 1 placed on the receiving recess 4 of the support 3 is pressed against the support 3 by the presser 15, the electronic component 1 can be moved while being placed on the support 3. Also, the polarity of the electronic component I will not be reversed or the electronic component 1 will not fall from the support 3. In the invention of claim 3 of the present application, the width of the receiving recess 4 is made narrower than the width of the molded part 2 of the electronic component l, so that both ends 16 and 17 in the width direction of the molded part 2 are located laterally than the receiving recessed part 4. Since it is made to protrude, both ends in the width direction that protrude 1
6.17 can be pushed by the pusher 7 and accommodated one by one in the accommodation section 9 of the embossed tape 8. In the invention of claim 4 of the present application, each operation of inspecting the electrical characteristics of the electronic component 1, forming and taping the one electrode 5 and ten electrodes 6 of the electronic component 1 is carried out on a later line (for example, the first When performing the work separately in A, B, and C in the figure, the electronic component I is placed in the receiving recess 4 of the support 3 and transferred to another work line, so the support The polarity of the electronic component 1 will not be reversed on the support 3 or the electronic component 1 will not fall off the support 3 due to vibration.
第2図に示ず1は本発明で電気特性の検査、フォーミン
グ、テーピングされる電子部品であり、これは例えばタ
ンタル個体電解コンデンザ、モールドヂップコンデンザ
等である。この電子部品1はモールド部2から十電極5
と一電極6とが互いに逆方向に突設され、しかも−電極
6が連接片21にJ:り一列に連接されて、各電子部品
1のモールド部2が均一間隔で配列されている。
第3図に示す3は本発明で使用される支持具てあり、そ
れには前記モールド部2の間隔と同一間隔で多数の受凹
部4が一列に形成されている。この受凹部4は前記モー
ルド部2を第5@のようにのせることができる広さにし
、また深さをモールド部2の厚さよりやや浅くしである
。
第4図の8は本発明で使用されるエンボステープであり
、これには電子部品1を第4図のように一個づつ収容で
きる大きさの収容部9が均一間隔で多数連接されている
。
本発明において前記電子部品1の電気特性、例えば短絡
試験、容量、損失等を検査するには次のようにする。
第2図のように電子部品1が多数連接されている電子部
品群25を、第1図の送りローラ22により同図の矢印
a方向に送り出して作業ラインAにのせる。
この送り出された電子部品1の前に、第1図の支持具搬
送ラインDを右側から左側に順次送られてくる支持具3
のうちか端の支持具3を送り出す(第1図の矢印す方向
に)。この状態で、前記電子部品1を第1図の矢印C方
向に押し倒して、第5図のように前記支持具3の受凹部
4の上にのせる。
この支持具3を第1図の右側に移動させて同図の一次特
性検査部26の位置で停止させる。この−次特性検査部
26において電子部品lの生電極5と一電極6に測定プ
ローブ(図示されていない)を押し当てて、電子部品1
の短絡試験、容量等の各種検査のうち必要とする検査を
行なう。
検査が終了しだら受凹部4に電子部品をのせたまま支持
具3を第1図の右側に移動して左側フォーミング部27
の位置で停止させる。この左側フォーミング部27にお
いて最初に、モールド部2の側方に突出している生電極
5を所定寸法に切断する。この切断は例えば第7図のよ
うに、固定刃28の上にのせた生電極5の上に可動刃2
9を降下させて行なう。
その後、電子部品1の生電極5を第8図〜第9図の各位
置に移動させて3段階に分けて折曲げる。
最初の折曲げは第8図のように第一受台310〕側方に
突出している生電極5の」二から第一回転輪32と押し
台33を降下させて、生電極5を第一受台31の上面及
び側面形状に合わせて折曲げる。
次に支持具3を第1図の右側に移動させて第9図の位置
で停止させ、支持具3にのせてある電子部品lの生電極
5を第9図のように第二受台34の上にのせ、同受台3
8の側方に突出している+電極5の上から第二回転輪3
7を降下させて、+電極5を第9図の形状に折曲げる。
更に、支持具3を第1図の右側に移動させて第10図の
位置で停止させ、同支持具3にのせてある電子部品1の
生電極5を第10図のように第三受台38の」二にのせ
、その生電極5を同図のようにプレス機39の押゛圧部
40により側方より押して折り曲げる。この場合、抑圧
部4oにはウレタンゴム等の軟質材を使用して、生電極
5及びモールド部2に加わる衝撃を緩和する。
このようにして左側フィーミンクが終了したら、電子部
品1を受凹部4にのせノ:−まま支持具3を更に第1図
の右側に移動して右側フォーミング部4Iの位置で停止
させる。この右側74−ミンク部41では、連接片21
により連接されている電子部品の一電極6を同連接片2
1から所定寸法に切断する。この切断は図示されていな
い固定刃の上にのせたー電極6の上に図示されていない
可動刃を降下させて行なう。
その後、生電極5の左側フォーミング時と同様に、電子
部品1をのせた支持具3を順次所定位置まで移動して停
止させながら、−電極6を3段階に分けて折曲げる。
このようにしてフォーミングが済んだ電子部品1は、連
接片2】から分離されてばらばらになって一個づつ受凹
部4にのっている。本発明ではこの電子部品1が受凹部
4から落下しないように、第7図〜第10図のように押
え具15により電子部品1を一個づつ支持具3に押しつ
ける。この押え具15はピアノ線をL字状に曲げて、そ
の下向き部15aを支持具3の上方に配置されている」
二蓋42を貫通させて電子部品lを下方に押しつけるこ
とができるようにし、同ピアノ線の根元側15b(第7
図〜第10図の左側端部)を前記」二蓋42の」二に、
図示されていない押し板で押さえて固定して、同ピアノ
線の横向き部15cに第7図の矢印X−Y方向に弾性を
持たせである。
この押え具15で電子部品lを支持具3に押しつけた状
態で、同支持具3を第1図の作業ラインAの右端まで移
動し、そこで同支持具3を電子部品1をのせたまま第1
1図のように筒体18内に押込む。この筒体18を第1
図の矢印d方向に移動して隣の作業ラインBの横まで移
動し、その位置で筒体18内から支持具3をラインBに
押出し、空になった筒体18を元の位置(作業ラインへ
の右端)に自動的に戻す。
次に、押出された支持具3を作業ラインBの上を第1図
の左側に移動させ、同作業うインB上の二次特性検査部
42の位置で停止させる。この二次特性検査部42にお
いて電子部品lの電気特性、例えばLCチエツク、オー
ブンの有無等を検査する。この二次特性検査により前記
フォーミング時に電子部品1に与えられた衝撃(ストレ
ス)により生じた新たな不良もチエツクされる。
電気特性の検査が終了したらその電子部品1をせたまま
支持具3をラインBの左端まで移動し、その左端にある
筒体18内に第11図のように支持具3を押込む。
この筒体18を第1図の矢印e方向に移動して隣の作業
ラインCの左横に停止させ、その位置で筒体18内から
支持具3を押出す。空になった筒体18は元の位置(作
業ラインBの左端)に自動的に戻す。
押出された支持具3を電子部品1をのせたまま作業ライ
ンC上の判別部43まで移動して停止させる。ここでは
前記−次検査、二次検査の結果に基づいて電子部品lを
良品と不良品に分けるとか、更に良品を二辺上のランク
に分ける等して判別する。
判別後、更に第1図の排出部44において不良品を支持
具3の受凹部4から排出して、支持具3に良品だけを残
す。この良品だけがのっている支持具3を第1図のテー
ピング部45まで移動して停止させる。ここでは第6図
のように電子部品1を一個づつエンボステープ8の収容
部9内に収容する。この場合、第6図、第13図のよう
に支持具3の受凹部4の幅を電子部品1のモールド部2
の幅より狭くして、同モールド部2の幅方向両端部16
.17が受凹部4より側方に突出するようにし、その突
出する両端部16.17を第6図、第13図のように前
記押出し具7により下から一個づつ突き上げて、エンボ
ステープ8の収容部9内に収容できるようにしである。
また、このとき、下から押し上げて収容部9内に収容し
た電子部品lが収容部9から落下しないようにするため
、第61q及び第12.13図に示すように、押出し具
7の手前1一方に、適宜周期でエンボステープ8の走行
方向にスライドする開閉体53を配置しである。この開
閉体53は電子部品1を収容部9内に入れるときは第1
2図の左側にスライドして同電子部品Iが通過する通路
54を開け、電子部品lを収容部9内に入れ終えて押し
具7を降下させると、第12図の右側にスライドして同
通路54を閉じて収容部9内に収容された電子部品1が
自重で落下しないようにしである。
なお、第6図イ、口及び、第12図、第13図の55.
56.57はガイド板であり、そのうちガイド板55を
前記開閉体54に対向させ、他の二つのガイド板56と
57を互いに対向させて、前記開閉体54及びガイド板
55の側方に配置して、前記通路54を形成するもので
ある。
収容部9内へ電子部品1が収容されたら、第1図のテー
ピング部45において、第6図のように同収容部9の開
口部10の外側にシール用テープ11を被せ、そのテー
プ11をヒーターにより加熱して熱シールしたり、接着
剤により接着したりして前記開口部10を密封封止する
。
本発明では良品と判定された電子部品を全てエンボステ
ープ8の収容部9に収容してもよいが、良品を二辺上の
ランクに分けたときは、その良品のうちグレードの高い
電子部品だけを収容部9に収容して、グレードの低い良
品は支持具3にそのまま残しておくとか、その逆tこす
る等するとかできる。
エンボステープ8の収容部9に収容されずに支持具3に
残された電子部品lは、支持具3にのせたままラインC
の右端に送り出し、そこに待機している第1図のストッ
カー51に送り込む。このストッカー51は第14図の
ように多数の細長収容部52に仕切られて、多数本の支
持具3を収容できるようにしである。多数本の支持具3
が収容されたストッカー51は第1図の支持具搬送ライ
ンDの横まで移動されて、同ラインDに送り出される。
以上の実施例は一電極5、十電極6を下方に折曲げてフ
ォーミングするものであるが、フォーミングは一電極5
、十電極6を1一方に折曲げて行なうようにしてもよい
。
また、第6図の実施例では下向きになっている収容部9
の下方からシール用テープ11を供給するようにしであ
るが、エンボステープ11の移送が進行して収容部9が
上向きになってから、同収容部9の」1方からシール用
テープ11を供給するようにしてもよい。Reference numeral 1, not shown in FIG. 2, is an electronic component whose electrical characteristics are tested, formed, and taped in the present invention, such as a tantalum solid electrolytic capacitor, a mold-dip capacitor, and the like. This electronic component 1 has ten electrodes 5 from a mold part 2.
and one electrode 6 are provided protruding in mutually opposite directions, and the negative electrode 6 is connected to the connecting piece 21 in a line, so that the mold parts 2 of each electronic component 1 are arranged at uniform intervals. Reference numeral 3 in FIG. 3 designates a support used in the present invention, in which a large number of receiving recesses 4 are formed in a line at the same intervals as the intervals between the mold parts 2. This receiving recess 4 is wide enough to allow the mold part 2 to be placed thereon as shown in the fifth part, and has a depth slightly shallower than the thickness of the mold part 2. Reference numeral 8 in FIG. 4 is an embossed tape used in the present invention, in which a large number of accommodating portions 9 each having a size capable of accommodating electronic components 1 one by one are connected at uniform intervals as shown in FIG. In the present invention, the electrical characteristics of the electronic component 1, such as short circuit test, capacity, loss, etc., are tested as follows. An electronic component group 25 in which a large number of electronic components 1 are connected as shown in FIG. 2 is sent out in the direction of arrow a in FIG. 1 by the feed roller 22 in FIG. 1 and placed on a work line A. In front of this sent-out electronic component 1, a support 3 is sequentially sent from the right side to the left side on the support conveyance line D in FIG.
Send out the support 3 at one end (in the direction of the arrow in FIG. 1). In this state, the electronic component 1 is pushed down in the direction of arrow C in FIG. 1 and placed on the receiving recess 4 of the support 3 as shown in FIG. This support 3 is moved to the right side in FIG. 1 and stopped at the position of the primary characteristic testing section 26 in the same figure. In this second-order characteristic testing section 26, a measurement probe (not shown) is pressed against the raw electrode 5 and one electrode 6 of the electronic component 1, and the electronic component 1 is
Performs necessary tests such as short-circuit tests and capacity tests. When the inspection is finished, move the support 3 to the right side in FIG.
Stop at the position. In this left forming section 27, first, the raw electrode 5 protruding laterally of the mold section 2 is cut into a predetermined size. This cutting is performed, for example, as shown in FIG.
Perform this by lowering 9. Thereafter, the raw electrode 5 of the electronic component 1 is moved to each position shown in FIGS. 8 to 9 and bent in three stages. For the first bending, as shown in FIG. It is bent to match the shape of the top and side surfaces of the pedestal 31. Next, the support 3 is moved to the right side in FIG. 1 and stopped at the position shown in FIG. Place it on the same pedestal 3.
The second rotating wheel 3 is placed above the + electrode 5 protruding to the side of 8.
7 and bend the + electrode 5 into the shape shown in FIG. Furthermore, the support 3 is moved to the right side in FIG. 1 and stopped at the position shown in FIG. 10, and the raw electrode 5 of the electronic component 1 placed on the support 3 is placed on the third pedestal as shown in FIG. 38, and the raw electrode 5 is pushed from the side by the pressing part 40 of the press 39 as shown in the same figure and bent. In this case, a soft material such as urethane rubber is used for the suppressing part 4o to reduce the impact applied to the raw electrode 5 and the mold part 2. When the left forming part 4 is completed in this manner, the electronic component 1 is placed on the receiving recess 4, and the support 3 is further moved to the right side in FIG. 1 and stopped at the position of the right forming part 4I. In this right side 74-mink part 41, the connecting piece 21
One electrode 6 of the electronic component connected to the same connecting piece 2
1 to the specified size. This cutting is performed by lowering a movable blade (not shown) onto the electrode 6 placed on a fixed blade (not shown). Thereafter, as in forming the left side of the raw electrode 5, the -electrode 6 is bent in three stages while the support 3 carrying the electronic component 1 is sequentially moved to a predetermined position and stopped. The electronic component 1 that has been formed in this manner is separated from the connecting piece 2 and placed in pieces in the receiving recess 4 one by one. In the present invention, in order to prevent the electronic components 1 from falling from the receiving recess 4, the electronic components 1 are pressed one by one against the support 3 using the presser 15 as shown in FIGS. 7 to 10. This holding tool 15 is made by bending piano wire into an L-shape, and its downward portion 15a is placed above the supporting tool 3.
The second lid 42 is penetrated so that the electronic component l can be pressed downward, and the base side 15b (seventh
10) to the "2" of the "2 lid 42",
It is pressed and fixed with a push plate (not shown), so that the horizontal portion 15c of the piano wire has elasticity in the direction of the arrow X-Y in FIG. 7. With the electronic component 1 pressed against the support 3 using the holding tool 15, move the support 3 to the right end of the work line A in FIG. 1
Push it into the cylindrical body 18 as shown in Figure 1. This cylindrical body 18 is
Move in the direction of arrow d in the figure to the side of the adjacent work line B, push out the support 3 from inside the cylinder 18 to line B, and return the empty cylinder 18 to its original position (work line B). automatically return to the right end of the line). Next, the extruded support 3 is moved to the left side in FIG. 1 on the work line B and stopped at the position of the secondary characteristic inspection section 42 on the work line B. This secondary characteristic testing section 42 tests the electrical characteristics of the electronic component 1, such as an LC check and the presence or absence of an oven. Through this secondary characteristic inspection, new defects caused by impact (stress) applied to the electronic component 1 during the forming are also checked. When the electrical characteristic test is completed, the support 3 is moved to the left end of the line B with the electronic component 1 placed thereon, and the support 3 is pushed into the cylindrical body 18 at the left end as shown in FIG. The cylindrical body 18 is moved in the direction of arrow e in FIG. 1 and stopped on the left side of the adjacent work line C, and the support 3 is pushed out from within the cylindrical body 18 at that position. The empty cylinder 18 is automatically returned to its original position (left end of work line B). The extruded support 3 with the electronic component 1 placed thereon is moved to the discrimination section 43 on the work line C and stopped. Here, based on the results of the above-mentioned secondary inspection and secondary inspection, the electronic components 1 are classified into non-defective products and defective products, and the non-defective products are further classified into ranks on two sides. After the discrimination, the defective products are further discharged from the receiving recess 4 of the support 3 in the discharge section 44 shown in FIG. 1, leaving only the good products in the support 3. The support 3 on which only the non-defective products are placed is moved to the taping portion 45 in FIG. 1 and stopped. Here, as shown in FIG. 6, the electronic components 1 are housed one by one in the housing section 9 of the embossed tape 8. In this case, as shown in FIGS. 6 and 13, the width of the receiving recess 4 of the support 3 is
Both ends 16 in the width direction of the mold part 2
.. 17 protrudes laterally from the receiving recess 4, and the protruding ends 16 and 17 are pushed up one by one from below with the pusher 7 as shown in FIGS. 6 and 13, and the embossed tape 8 is accommodated. It is designed so that it can be accommodated in the section 9. At this time, in order to prevent the electronic component l pushed up from below and stored in the housing part 9 from falling from the housing part 9, the front part 1 of the pushing tool 7 is On one side, an opening/closing body 53 is arranged which slides in the running direction of the embossed tape 8 at appropriate intervals. This opening/closing body 53 is the first
Slide to the left in Figure 2 to open the passage 54 through which the electronic component I passes, and when the electronic component I is placed into the housing section 9 and the push tool 7 is lowered, it slides to the right in Figure 12 to open the passage 54 through which the electronic component I passes. The passage 54 is closed to prevent the electronic component 1 housed in the housing section 9 from falling due to its own weight. In addition, the opening in Figure 6A and 55 in Figures 12 and 13.
56 and 57 are guide plates, of which guide plate 55 faces the opening/closing body 54, and the other two guide plates 56 and 57 face each other and are arranged on the sides of the opening/closing body 54 and the guide plate 55. Thus, the passage 54 is formed. Once the electronic component 1 is housed in the housing section 9, the sealing tape 11 is placed over the outside of the opening 10 of the housing section 9 at the taping section 45 in FIG. 1 as shown in FIG. The opening 10 is hermetically sealed by heat sealing by heating with a heater or bonding with an adhesive. In the present invention, all electronic components determined to be non-defective may be accommodated in the storage section 9 of the embossed tape 8, but when the non-defective products are divided into ranks on two sides, only electronic components of high grade among the non-defective products are stored. can be stored in the storage section 9, and low-grade non-defective products can be left as they are on the support 3, or vice versa. Electronic components l left on the support 3 without being accommodated in the accommodation portion 9 of the embossed tape 8 are transferred to the line C while being placed on the support 3.
The stocker 51 in FIG. 1 waits there. As shown in FIG. 14, this stocker 51 is partitioned into a large number of elongated accommodating parts 52, so that a large number of supports 3 can be accommodated therein. Multiple supports 3
The stocker 51 in which the is housed is moved to the side of the support conveyance line D in FIG. 1 and sent out to the same line D. In the above embodiment, forming is performed by bending one electrode 5 and ten electrodes 6 downward.
, the ten electrodes 6 may be bent to one side. In addition, in the embodiment shown in FIG.
The sealing tape 11 is supplied from below, but after the transfer of the embossed tape 11 progresses and the storage section 9 faces upward, the sealing tape 11 is supplied from one side of the storage section 9. You may also do so.
本発明の電子部品の電気特性の検査、フィーミンク、テ
ーピング方法は次のような効果がある。
1、検査、フォーミング、テーピングが一貫し、′て行
なわれるので、検査からテーピングまでの作業能率が著
しく向上する。
2、これまで、検査、フォーミング、テーピングの各工
程に必要であった作業者のうち、フォーミング、テーピ
ング時稈の作業者が不要になり、]9
大幅な省力化が可能になる。
3、電子部品1を支持具3にのせてからテーピングが完
了するまで、電子部品Iを支持具3から一切移し替えな
いので、作業中に電子部品の向きが変わって電子部品1
の電極の向きが逆転するようなことがない。また、電子
部品を次の工程に移し替えるときに生ずる異種類の電子
部品の混入等の人為的な作業ミスも生じない。
4、検査終了とほぼ同時にテーピングが完了するので、
テーピングまでの待ち時間が大幅に短縮される。
5、検査、フォーミング、テーピングの各工程を別々に
行なう場合は、各工程間で電子部品を保管しておく必要
があったが、その必要がないので保管スペースが削減さ
れる。
6、検査、フォーミング、テーピングの作業が一貫して
連続的に行なわれるので、それらの設備を個別に設置す
る場合よりも設備設置スペースが大幅に削減できる。ま
た、作業ラインを第1図のように複数本並設すれば、作
業ラインをコンバク1・にすることができる。
7、検査からテーピングまで作業が一貫して連続的に行
なわれるので計数管理が容易になる。The method of inspecting electrical characteristics of electronic components, feaming, and taping according to the present invention has the following effects. 1. Since inspection, forming, and taping are performed consistently, work efficiency from inspection to taping is significantly improved. 2. Among the workers who were previously required for each process of inspection, forming, and taping, the workers who handle the forming and taping processes are no longer necessary, allowing for significant labor savings. 3. Since the electronic component I is not transferred from the support 3 at all after the electronic component 1 is placed on the support 3 until the taping is completed, the orientation of the electronic component may change during work and the electronic component 1 may
The direction of the electrode will not be reversed. Further, human errors such as mixing of different types of electronic components that occur when electronic components are transferred to the next process do not occur. 4. Taping is completed almost at the same time as the inspection is completed, so
The waiting time for taping is greatly reduced. 5. When the inspection, forming, and taping processes were performed separately, it was necessary to store electronic components between each process, but since this is not necessary, storage space is reduced. 6. Since inspection, forming, and taping operations are performed consistently and continuously, the equipment installation space can be significantly reduced compared to when these equipments are installed individually. Furthermore, by arranging a plurality of work lines in parallel as shown in FIG. 1, the number of work lines can be reduced to one. 7. Since the work from inspection to taping is performed consistently and continuously, counting management becomes easier.
第1図は本発明の一実施例を示す概略平面図、第2図は
電子部品の説明図、第3図は同電子部品を支持する支持
しの一例を示す斜視図、第4図はエンボステープの一例
を示す斜視図、第5図は支持具に電子部品をのせた状態
の説明図、第6図イはエンボステープへ電子部品を収容
及びシールするテーピングの説明図、同図口は同図イの
部分平面図、第7図は電極の切断′説明図、第8図〜I
O図はフィーミンクの説明図、第11図は筒体の一例を
示す斜視図、第12図はテーピング時の側面説明、第1
3はテーピング時の正面図、第14図はストッカーの説
明図である。
1は電子部品
2はモールド部
3はヴ持5
4は受凹部
5は十電極
6は一電極
7は押出し具
8はエンボステープ
9は収容部
10は収容部の開口部
11はシール用テープ
15は押え見
16.17はモールド部の両端部
A、+3、CはラインFIG. 1 is a schematic plan view showing one embodiment of the present invention, FIG. 2 is an explanatory diagram of an electronic component, FIG. 3 is a perspective view showing an example of a support for supporting the electronic component, and FIG. 4 is an embossed A perspective view showing an example of the tape, FIG. 5 is an explanatory diagram of electronic components placed on a support, and FIG. Figure A is a partial plan view, Figure 7 is an explanatory diagram of electrode cutting, and Figures 8 to I.
Figure O is an explanatory diagram of Feemink, Figure 11 is a perspective view showing an example of the cylindrical body, Figure 12 is an explanation of the side surface during taping, and Figure 1
3 is a front view during taping, and FIG. 14 is an explanatory diagram of the stocker. 1 is an electronic component 2 is a mold part 3 is a holder 5 4 is a receiving recess 5 is a ten electrode 6 is one electrode 7 is an extrusion tool 8 is an embossing tape 9 is a housing part 10 is a sealing tape 15 for an opening 11 of the housing part 16.17 is both ends of the mold part A, +3, C are lines
Claims (4)
ールド部2を、支持具3の、モールド部2の間隔と同じ
間隔で一列に多数形成されている受凹部4にのせて、同
支持具3を間欠的に移動させて各電子部品1の電気特性
を検査し、次に受凹部4にのせてある電子部品1のモー
ルド部2の+電極5と−電極6のいずれか一方を所定寸
法に切断してから折曲げ、次に他方の電極を所定寸法に
切断してから折曲げてフォーミングし、次に受凹部4に
のせてある電子部品1の電気特性を検査して良品と不良
品に判別し、良品を押出し具7により一個づつ受凹部4
から押出してエンボステープ8の収容部9に収容し、同
収容部9の開口部10をシール用テープ11でシールし
てテーピングすることを特徴とする電子部品の電気特性
の検査、フォーミング、テーピング方法。1. Each mold part 2 of the electronic component 1, which is connected in a row at appropriate intervals, is placed in a receiving recess 4, which is formed in a number in a row at the same intervals as the intervals of the mold parts 2, of a support 3. Then, the electrical characteristics of each electronic component 1 are inspected by moving the support 3 intermittently, and then the + electrode 5 and the - electrode 6 of the mold part 2 of the electronic component 1 placed in the receiving recess 4 are inspected. One of the electrodes is cut to a predetermined size and then bent, then the other electrode is cut to a predetermined size and then bent and formed, and then the electrical characteristics of the electronic component 1 placed in the receiving recess 4 are inspected. to distinguish between good and defective products, and push out the non-defective products one by one into the receiving recess 4 using the pusher 7.
A method for inspecting electrical properties, forming, and taping electronic components, characterized by extruding the tape from the embossed tape 8, storing it in a storage part 9 of the embossed tape 8, and sealing the opening 10 of the storage part 9 with a sealing tape 11 for taping. .
5により支持具3に押しつけるようにしたことを特徴と
する請求項第1の電子部品の電気特性の検査、フォーミ
ング、テーピング方法。2. The holding tool 1 holds the electronic component 1 placed on the receiving recess 4 of the support tool 3.
5. A method for inspecting electrical characteristics of an electronic component, forming it, and taping it as claimed in claim 1, wherein the electronic component is pressed against the support member 3 by a holder.
部2の幅より狭くして、同モールド部2の幅方向両端部
16、17を受凹部4より側方に突出させ、その突出す
る両端部16、17を前記押出し具7により押して、同
電子部品1をエンボステープ8の収容部9に一個づつ収
容するようにしたことを特徴とする請求項1又は請求項
2の電子部品の電気特性の検査、フォーミング、テーピ
ング方法。3. The width of the receiving recess 4 of the support 3 is made narrower than the width of the molded part 2 of the electronic component 1, so that both ends 16 and 17 in the width direction of the molded part 2 are placed laterally than the receiving recessed part 4. The electronic parts 1 are made to protrude, and the protruding ends 16 and 17 are pushed by the pushing tool 7, so that the electronic parts 1 are accommodated one by one in the accommodation part 9 of the embossed tape 8. Inspection of electrical characteristics, forming, and taping methods for electronic components as described in Item 2.
及び−電極6のフォーミング、エンボステープ8の収容
部9への電子部品1の収容及びシールの各作業を、二列
以上の作業ラインに分けて行ない、支持具3の受凹部4
にのせてある電子部品1を他のラインに移し替えるとき
に、同支持具3ごと筒体18内に挿入し、その筒体18
を移動するようにしたことを特徴とする請求項1又は請
求項2の電子部品の電気特性の検査、フォーミング、テ
ーピング方法。4. Inspection of electrical characteristics of electronic component 1, positive electrode 5 of electronic component 1
and - The operations of forming the electrode 6, accommodating the electronic component 1 in the accommodating portion 9 of the embossed tape 8, and sealing are performed in two or more work lines, and
When transferring the electronic component 1 placed on the holder to another line, the support 3 is inserted into the cylindrical body 18 and the cylindrical body 18 is transferred to another line.
3. A method for inspecting electrical characteristics, forming, and taping an electronic component according to claim 1 or 2, characterized in that said electronic component is moved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2339255A JPH0727852B2 (en) | 1990-11-30 | 1990-11-30 | Electrical characteristics inspection, forming and taping method for electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2339255A JPH0727852B2 (en) | 1990-11-30 | 1990-11-30 | Electrical characteristics inspection, forming and taping method for electronic parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04206923A true JPH04206923A (en) | 1992-07-28 |
JPH0727852B2 JPH0727852B2 (en) | 1995-03-29 |
Family
ID=18325720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2339255A Expired - Lifetime JPH0727852B2 (en) | 1990-11-30 | 1990-11-30 | Electrical characteristics inspection, forming and taping method for electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0727852B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104399850A (en) * | 2014-12-03 | 2015-03-11 | 昆山微容电子企业有限公司 | Capacitor pin cutting device |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63293812A (en) * | 1987-05-27 | 1988-11-30 | Hitachi Electronics Eng Co Ltd | Inspection and taping device for electronic parts |
JPH03119798A (en) * | 1989-09-30 | 1991-05-22 | Haimeka Koki:Kk | Automatic taping machine, forming means and taping method for electronic component |
-
1990
- 1990-11-30 JP JP2339255A patent/JPH0727852B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63293812A (en) * | 1987-05-27 | 1988-11-30 | Hitachi Electronics Eng Co Ltd | Inspection and taping device for electronic parts |
JPH03119798A (en) * | 1989-09-30 | 1991-05-22 | Haimeka Koki:Kk | Automatic taping machine, forming means and taping method for electronic component |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104399850A (en) * | 2014-12-03 | 2015-03-11 | 昆山微容电子企业有限公司 | Capacitor pin cutting device |
Also Published As
Publication number | Publication date |
---|---|
JPH0727852B2 (en) | 1995-03-29 |
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