JPH04206923A - Electric characteristic test of electronic component and forming and taping thereof - Google Patents
Electric characteristic test of electronic component and forming and taping thereofInfo
- Publication number
- JPH04206923A JPH04206923A JP2339255A JP33925590A JPH04206923A JP H04206923 A JPH04206923 A JP H04206923A JP 2339255 A JP2339255 A JP 2339255A JP 33925590 A JP33925590 A JP 33925590A JP H04206923 A JPH04206923 A JP H04206923A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- taping
- forming
- support
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012360 testing method Methods 0.000 title abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 22
- 230000002950 deficient Effects 0.000 claims abstract description 15
- 238000007789 sealing Methods 0.000 claims abstract description 10
- 238000003860 storage Methods 0.000 claims abstract description 10
- 238000007689 inspection Methods 0.000 claims description 16
- 230000004308 accommodation Effects 0.000 claims description 3
- 238000005452 bending Methods 0.000 abstract description 4
- 238000004049 embossing Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
本発明は例えばタンタル個体電解コンデンザ、或は他の
モ〜ルドチップコンデンザ等の電子部品の容量、損失等
の電気特性の検査、同電子部品の電極を折曲げるフォー
ミング、フォーミング後の電子部品の特性検査、検査済
の電子部品を良品と不良品部に判別する判別、判別され
た良品をエンボステープに一個づつ収納し更にテープを
被せてシールするテーピングの各作業を、自動的にしか
も一貫して連続的に行なうことができるようにした電子
部品の電気特性の検査、フォーミング、テーピング方法
に関するものである。The present invention is applicable to, for example, testing the electrical characteristics such as capacitance and loss of electronic components such as tantalum solid electrolytic capacitors or other molded chip capacitors, forming to bend the electrodes of electronic components, and testing of electronic components after forming. Automatically and consistently performs characteristic inspection, distinguishing inspected electronic parts into good and defective parts, and taping, which stores the judged good parts one by one on embossed tape and covers them with tape to seal them. The present invention relates to a method for inspecting electrical characteristics of electronic components, forming, and taping, which can be carried out continuously.
電子部品の電気特性の検査、電極のフォーミング、テー
ピングを行なう方法や装置は従来から各種あった。
しかし従来の電気特性の検査、電極のフォーミング、テ
ーピングの方法や装置はいずれもそれらの作業を別々に
行なうものであった。There have been various methods and devices for testing the electrical characteristics of electronic components, forming electrodes, and taping. However, conventional methods and devices for testing electrical properties, forming electrodes, and taping each involve performing these tasks separately.
従来の電気特性の検査、電極のフォーミング、テーピン
グの方法や装置ではような諸問題があった。
１、各作業が別々に行なわれるため、作業能率が悪い。
２．７４−ミンク済の電子部品を保管してから改めてテ
ーピングの工程に移すことになるので、電子部品が落下
するとか、電子部品の十電極と一電極の向きが反転する
とか、異種類の電子部品が混入するといったことがあっ
た。しかも、電子部品を極性が反転したままテーピング
すると、その電子部品をプリント基板等へ実装したとき
に同電子部品の電極の向き（極性）が逆になるため、同
電子部品が実装されたプリント基板全体が不良品になる
という重大な問題に発展する。
３４７４−ミンク済の電子部品を保管してから改めてテ
ーピングの工程に移すので、その保管場所が必要になる
。Conventional methods and devices for testing electrical properties, forming electrodes, and taping have had the following problems. 1. Work efficiency is poor because each work is done separately. 2.74-Since electronic components that have been minced are stored and then transferred to the taping process again, there may be cases where electronic components fall, the orientation of the 10th electrode and 1st electrode of the electronic component is reversed, or different types of electronic components occur. There were cases where electronic parts were mixed in. Moreover, if you tape an electronic component with its polarity reversed, the direction (polarity) of the electrodes of the electronic component will be reversed when the electronic component is mounted on a printed circuit board, etc. This develops into a serious problem where the entire product becomes defective. 3474 - Minked electronic components are stored and then transferred to the taping process, so a storage space is required.
本発明の目的は電子部品の電気特性の検査、フォーミン
グ、テーピングの作業を一貫して連続的に行なうことが
できるようにして作業の合理化を図り、作業時間の短縮
、作業能率の向」二、製造コストの低減を実現し、しか
も作業中に電子部品が落下したり、極性が反転したりし
ないようにした電子部品の電気特性の検査、フォーミン
グ、テーピング方法を提供することにある。The purpose of the present invention is to streamline the work by making it possible to consistently and continuously perform the work of inspecting the electrical characteristics of electronic parts, forming, and taping, thereby shortening work time and improving work efficiency. To provide a method for inspecting electrical characteristics, forming, and taping electronic components, which reduces manufacturing costs and prevents electronic components from falling or reversing polarity during work.
本発明のうち請求項１の電子部品の電気特性の検査、フ
ォーミング、テーピング方法は、第２図のように適宜間
隔で一列に多数連接されている電子部品ｌの各モールド
部２を、第３図のように受凹部４がモールド部２の間隔
と同じ間隔で一列に多数形成されている細長の支持具３
の各受凹部４にのせて、同支持具３を間欠的に移動させ
て各電子部品１の電気特性を検査し、同受凹部４にのせ
てある電子部品１の十電極５と一電極６のいずれか一方
を第７図のように（同図では十電極５）を所定寸法に切
断してから、第６図〜第１０図のように折曲げ、次に他
方の電極（この場合は一電極６）を所定寸法に切断して
から所定形状に折曲げてフォーミングし２次に、受凹部
４にのせてある電子部品１の電気特性を検査して良品と
不良品を判別し、良品を第６図のように一個づつ同受凹
部４から押出し具７により押出してエンボステープ８の
収容部９内に収容し、同収容部９を第６図のようにシー
ル用テープ１０によりシールしてテーピングするもので
ある。
本発明のうち請求項２の電子部品の電気特性の検査、フ
ォーミング、テーピング方法は、第５図のように支持具
３の受凹部４にのせた電子部品１を、第７図に示す押え
具１５により支持具３に押しつけるようにしたものであ
る。
本発明のうち請求項３の電子部品の電気特性の検査、フ
ォーミング、テーピング方法は、支持具３の受凹部４の
幅を第６図、第１４図に示すように電子部品１のモール
ド部２の幅より狭くして、同モールド部２の幅方向両端
部１６、］７を受凹部４より側方に突出させ、その突出
する両端部１６．１７を第６図、第１４図に示すように
押出し具７により押して、同電子部品１をエンボステー
プ８の収容部９に一個づつ収容するようにしたものであ
る。
本発明のうち請求項４の電子部品の電気特性の検査、フ
ォーミング、テーピング方法は、電子部品ｌの電気特性
の検査、同電子部品１の十電極５及び−電極６のフォー
ミング、エンボステープ８の収容部９への電子部品１の
収容及びテーピングの各作業を、第１図のように二列以
上の作業ラインΔ、Ｂ、Ｃに分けて行ない、支持具３の
受凹部４にのせてある電子部品１を他のラインに移し替
えるときに、第１図の筒体１８に第１１図のように支持
具３ごと挿入し、その筒体１８を移動するようにしたも
のである。The method of inspecting, forming, and taping the electrical characteristics of electronic components according to claim 1 of the present invention is such that each mold portion 2 of an electronic component 1, which is connected in a row at appropriate intervals as shown in FIG. As shown in the figure, an elongated support 3 in which a large number of receiving recesses 4 are formed in a row at the same intervals as the mold parts 2.
The electrical characteristics of each electronic component 1 are inspected by placing the electronic component 1 on each receiving recess 4 by intermittently moving the support 3. Cut one of the electrodes (10 electrodes 5 in this figure) to a predetermined size as shown in Figure 7, bend it as shown in Figures 6 to 10, and then cut the other electrode (in this case, One electrode 6) is cut to a predetermined size, then bent into a predetermined shape and formed.Secondly, the electrical characteristics of the electronic component 1 placed in the receiving recess 4 are inspected to distinguish between good and defective products. As shown in FIG. 6, the embossed tape is extruded one by one from the receiving recess 4 by the extruder 7 and stored in the housing part 9 of the embossed tape 8, and the housing part 9 is sealed with the sealing tape 10 as shown in FIG. This is done by taping. The method of inspecting, forming, and taping the electrical characteristics of an electronic component according to claim 2 of the present invention is to use a holding device shown in FIG. 15 to press against the support 3. In the method of inspecting, forming and taping the electrical characteristics of an electronic component according to claim 3 of the present invention, the width of the receiving recess 4 of the support 3 is adjusted to the width of the molded portion 2 of the electronic component 1 as shown in FIGS. 6 and 14. The width of both ends 16, 7 of the molded part 2 in the width direction is made to protrude laterally from the receiving recess 4, and the protruding ends 16, 17 are made narrower than the width of the mold part 2, as shown in FIGS. 6 and 14. The electronic components 1 are pushed by a pusher 7 to be accommodated one by one in the accommodating portion 9 of the embossed tape 8. The method of inspecting, forming and taping the electrical characteristics of an electronic component according to claim 4 of the present invention includes inspecting the electrical characteristics of the electronic component 1, forming the 10th electrode 5 and the 6th electrode of the electronic component 1, and forming the embossed tape 8. The work of accommodating and taping the electronic components 1 in the accommodating portion 9 is performed in two or more work lines Δ, B, and C as shown in FIG. When transferring the electronic component 1 to another line, the support 3 is inserted into the cylindrical body 18 of FIG. 1 as shown in FIG. 11, and the cylindrical body 18 is moved.
本件出願のうち請求項１の発明では、電子部品の電気特
性の検査、フォーミング、テーピングの各作業が一貫し
て自動且つ連続的に行なわれるので、それらの作業が合
理化され、作業能率が向−トする。
また、電子部品１が電気特性の検査から最終工程のテー
ピングまで、細長の支持具３の受凹部４にのせたまま行
なわれ、その間に一度も同受凹部４から他に移し替えな
いので、移し替えによる電子部品１の裏返し、−電極５
と十電極６の向きの反転、異種類型子部品の混入等が生
じない。
本件出願のうち請求項２の発明では、支持具３の受凹部
４にのせた電子部品ｌを押え具１５により支持具３に押
しつけるので、電子部品１を支持具３にのせたまま移動
しても支持具３の」二で電子部品Ｉの極性が反転したり
、電子部品１が支持具３から落下したりすることがない
。
本件出願のうち請求項３の発明では、受凹部４の幅を電
子部品ｌのモールド部２の幅より狭くして、モールド部
２の幅方向両端部１６．１７が受凹部４より側方に突出
するようにしであるので、その突出する幅方向両端部１
６．１７を押出し具７により押してエンボステープ８の
収容部９に一個づつ収容することができる。
本件出願のうち請求項４の発明では、電子部品１の電気
特性の検査、同電子部品１の一電極５及び十電極６のフ
ォーミング、テーピングの各作業をニガ以−にのライン
（例えば第１図のＡ、Ｂ、Ｃ）に分けて行なう場合、電
子部品Ｉを支持具３の受凹部４にのぜたまま筒体１８に
入れて他の作業ラインに移し替えるので、その移動時に
支持具３の上で電子部品１の極性が反転したり、振動で
支持具３から落下したりすることがない。In the invention of claim 1 of the present application, each operation of inspecting the electrical characteristics of electronic components, forming, and taping is performed automatically and continuously, so these operations are streamlined and work efficiency is improved. to Furthermore, the electronic component 1 is carried out while being placed in the receiving recess 4 of the elongated support 3 from the inspection of electrical characteristics to the final taping process, and the electronic component 1 is never transferred from the receiving recess 4 to another during the process. Turning over the electronic component 1 due to replacement, -electrode 5
Therefore, reversal of the direction of the electrode 6, mixing of different types of mold parts, etc. do not occur. In the invention of claim 2 of the present application, since the electronic component 1 placed on the receiving recess 4 of the support 3 is pressed against the support 3 by the presser 15, the electronic component 1 can be moved while being placed on the support 3. Also, the polarity of the electronic component I will not be reversed or the electronic component 1 will not fall from the support 3. In the invention of claim 3 of the present application, the width of the receiving recess 4 is made narrower than the width of the molded part 2 of the electronic component l, so that both ends 16 and 17 in the width direction of the molded part 2 are located laterally than the receiving recessed part 4. Since it is made to protrude, both ends in the width direction that protrude 1
6.17 can be pushed by the pusher 7 and accommodated one by one in the accommodation section 9 of the embossed tape 8. In the invention of claim 4 of the present application, each operation of inspecting the electrical characteristics of the electronic component 1, forming and taping the one electrode 5 and ten electrodes 6 of the electronic component 1 is carried out on a later line (for example, the first When performing the work separately in A, B, and C in the figure, the electronic component I is placed in the receiving recess 4 of the support 3 and transferred to another work line, so the support The polarity of the electronic component 1 will not be reversed on the support 3 or the electronic component 1 will not fall off the support 3 due to vibration.
第２図に示ず１は本発明で電気特性の検査、フォーミン
グ、テーピングされる電子部品であり、これは例えばタ
ンタル個体電解コンデンザ、モールドヂップコンデンザ
等である。この電子部品１はモールド部２から十電極５
と一電極６とが互いに逆方向に突設され、しかも−電極
６が連接片２１にＪ：り一列に連接されて、各電子部品
１のモールド部２が均一間隔で配列されている。
第３図に示す３は本発明で使用される支持具てあり、そ
れには前記モールド部２の間隔と同一間隔で多数の受凹
部４が一列に形成されている。この受凹部４は前記モー
ルド部２を第５＠のようにのせることができる広さにし
、また深さをモールド部２の厚さよりやや浅くしである
。
第４図の８は本発明で使用されるエンボステープであり
、これには電子部品１を第４図のように一個づつ収容で
きる大きさの収容部９が均一間隔で多数連接されている
。
本発明において前記電子部品１の電気特性、例えば短絡
試験、容量、損失等を検査するには次のようにする。
第２図のように電子部品１が多数連接されている電子部
品群２５を、第１図の送りローラ２２により同図の矢印
ａ方向に送り出して作業ラインＡにのせる。
この送り出された電子部品１の前に、第１図の支持具搬
送ラインＤを右側から左側に順次送られてくる支持具３
のうちか端の支持具３を送り出す（第１図の矢印す方向
に）。この状態で、前記電子部品１を第１図の矢印Ｃ方
向に押し倒して、第５図のように前記支持具３の受凹部
４の上にのせる。
この支持具３を第１図の右側に移動させて同図の一次特
性検査部２６の位置で停止させる。この−次特性検査部
２６において電子部品ｌの生電極５と一電極６に測定プ
ローブ（図示されていない）を押し当てて、電子部品１
の短絡試験、容量等の各種検査のうち必要とする検査を
行なう。
検査が終了しだら受凹部４に電子部品をのせたまま支持
具３を第１図の右側に移動して左側フォーミング部２７
の位置で停止させる。この左側フォーミング部２７にお
いて最初に、モールド部２の側方に突出している生電極
５を所定寸法に切断する。この切断は例えば第７図のよ
うに、固定刃２８の上にのせた生電極５の上に可動刃２
９を降下させて行なう。
その後、電子部品１の生電極５を第８図〜第９図の各位
置に移動させて３段階に分けて折曲げる。
最初の折曲げは第８図のように第一受台３１０〕側方に
突出している生電極５の」二から第一回転輪３２と押し
台３３を降下させて、生電極５を第一受台３１の上面及
び側面形状に合わせて折曲げる。
次に支持具３を第１図の右側に移動させて第９図の位置
で停止させ、支持具３にのせてある電子部品ｌの生電極
５を第９図のように第二受台３４の上にのせ、同受台３
８の側方に突出している＋電極５の上から第二回転輪３
７を降下させて、＋電極５を第９図の形状に折曲げる。
更に、支持具３を第１図の右側に移動させて第１０図の
位置で停止させ、同支持具３にのせてある電子部品１の
生電極５を第１０図のように第三受台３８の」二にのせ
、その生電極５を同図のようにプレス機３９の押゛圧部
４０により側方より押して折り曲げる。この場合、抑圧
部４ｏにはウレタンゴム等の軟質材を使用して、生電極
５及びモールド部２に加わる衝撃を緩和する。
このようにして左側フィーミンクが終了したら、電子部
品１を受凹部４にのせノ：−まま支持具３を更に第１図
の右側に移動して右側フォーミング部４Ｉの位置で停止
させる。この右側７４−ミンク部４１では、連接片２１
により連接されている電子部品の一電極６を同連接片２
１から所定寸法に切断する。この切断は図示されていな
い固定刃の上にのせたー電極６の上に図示されていない
可動刃を降下させて行なう。
その後、生電極５の左側フォーミング時と同様に、電子
部品１をのせた支持具３を順次所定位置まで移動して停
止させながら、−電極６を３段階に分けて折曲げる。
このようにしてフォーミングが済んだ電子部品１は、連
接片２】から分離されてばらばらになって一個づつ受凹
部４にのっている。本発明ではこの電子部品１が受凹部
４から落下しないように、第７図〜第１０図のように押
え具１５により電子部品１を一個づつ支持具３に押しつ
ける。この押え具１５はピアノ線をＬ字状に曲げて、そ
の下向き部１５ａを支持具３の上方に配置されている」
二蓋４２を貫通させて電子部品ｌを下方に押しつけるこ
とができるようにし、同ピアノ線の根元側１５ｂ（第７
図〜第１０図の左側端部）を前記」二蓋４２の」二に、
図示されていない押し板で押さえて固定して、同ピアノ
線の横向き部１５ｃに第７図の矢印Ｘ−Ｙ方向に弾性を
持たせである。
この押え具１５で電子部品ｌを支持具３に押しつけた状
態で、同支持具３を第１図の作業ラインＡの右端まで移
動し、そこで同支持具３を電子部品１をのせたまま第１
１図のように筒体１８内に押込む。この筒体１８を第１
図の矢印ｄ方向に移動して隣の作業ラインＢの横まで移
動し、その位置で筒体１８内から支持具３をラインＢに
押出し、空になった筒体１８を元の位置（作業ラインへ
の右端）に自動的に戻す。
次に、押出された支持具３を作業ラインＢの上を第１図
の左側に移動させ、同作業うインＢ上の二次特性検査部
４２の位置で停止させる。この二次特性検査部４２にお
いて電子部品ｌの電気特性、例えばＬＣチエツク、オー
ブンの有無等を検査する。この二次特性検査により前記
フォーミング時に電子部品１に与えられた衝撃（ストレ
ス）により生じた新たな不良もチエツクされる。
電気特性の検査が終了したらその電子部品１をせたまま
支持具３をラインＢの左端まで移動し、その左端にある
筒体１８内に第１１図のように支持具３を押込む。
この筒体１８を第１図の矢印ｅ方向に移動して隣の作業
ラインＣの左横に停止させ、その位置で筒体１８内から
支持具３を押出す。空になった筒体１８は元の位置（作
業ラインＢの左端）に自動的に戻す。
押出された支持具３を電子部品１をのせたまま作業ライ
ンＣ上の判別部４３まで移動して停止させる。ここでは
前記−次検査、二次検査の結果に基づいて電子部品ｌを
良品と不良品に分けるとか、更に良品を二辺上のランク
に分ける等して判別する。
判別後、更に第１図の排出部４４において不良品を支持
具３の受凹部４から排出して、支持具３に良品だけを残
す。この良品だけがのっている支持具３を第１図のテー
ピング部４５まで移動して停止させる。ここでは第６図
のように電子部品１を一個づつエンボステープ８の収容
部９内に収容する。この場合、第６図、第１３図のよう
に支持具３の受凹部４の幅を電子部品１のモールド部２
の幅より狭くして、同モールド部２の幅方向両端部１６
．１７が受凹部４より側方に突出するようにし、その突
出する両端部１６．１７を第６図、第１３図のように前
記押出し具７により下から一個づつ突き上げて、エンボ
ステープ８の収容部９内に収容できるようにしである。
また、このとき、下から押し上げて収容部９内に収容し
た電子部品ｌが収容部９から落下しないようにするため
、第６１ｑ及び第１２．１３図に示すように、押出し具
７の手前１一方に、適宜周期でエンボステープ８の走行
方向にスライドする開閉体５３を配置しである。この開
閉体５３は電子部品１を収容部９内に入れるときは第１
２図の左側にスライドして同電子部品Ｉが通過する通路
５４を開け、電子部品ｌを収容部９内に入れ終えて押し
具７を降下させると、第１２図の右側にスライドして同
通路５４を閉じて収容部９内に収容された電子部品１が
自重で落下しないようにしである。
なお、第６図イ、口及び、第１２図、第１３図の５５．
５６．５７はガイド板であり、そのうちガイド板５５を
前記開閉体５４に対向させ、他の二つのガイド板５６と
５７を互いに対向させて、前記開閉体５４及びガイド板
５５の側方に配置して、前記通路５４を形成するもので
ある。
収容部９内へ電子部品１が収容されたら、第１図のテー
ピング部４５において、第６図のように同収容部９の開
口部１０の外側にシール用テープ１１を被せ、そのテー
プ１１をヒーターにより加熱して熱シールしたり、接着
剤により接着したりして前記開口部１０を密封封止する
。
本発明では良品と判定された電子部品を全てエンボステ
ープ８の収容部９に収容してもよいが、良品を二辺上の
ランクに分けたときは、その良品のうちグレードの高い
電子部品だけを収容部９に収容して、グレードの低い良
品は支持具３にそのまま残しておくとか、その逆ｔこす
る等するとかできる。
エンボステープ８の収容部９に収容されずに支持具３に
残された電子部品ｌは、支持具３にのせたままラインＣ
の右端に送り出し、そこに待機している第１図のストッ
カー５１に送り込む。このストッカー５１は第１４図の
ように多数の細長収容部５２に仕切られて、多数本の支
持具３を収容できるようにしである。多数本の支持具３
が収容されたストッカー５１は第１図の支持具搬送ライ
ンＤの横まで移動されて、同ラインＤに送り出される。
以上の実施例は一電極５、十電極６を下方に折曲げてフ
ォーミングするものであるが、フォーミングは一電極５
、十電極６を１一方に折曲げて行なうようにしてもよい
。
また、第６図の実施例では下向きになっている収容部９
の下方からシール用テープ１１を供給するようにしであ
るが、エンボステープ１１の移送が進行して収容部９が
上向きになってから、同収容部９の」１方からシール用
テープ１１を供給するようにしてもよい。Reference numeral 1, not shown in FIG. 2, is an electronic component whose electrical characteristics are tested, formed, and taped in the present invention, such as a tantalum solid electrolytic capacitor, a mold-dip capacitor, and the like. This electronic component 1 has ten electrodes 5 from a mold part 2.
and one electrode 6 are provided protruding in mutually opposite directions, and the negative electrode 6 is connected to the connecting piece 21 in a line, so that the mold parts 2 of each electronic component 1 are arranged at uniform intervals. Reference numeral 3 in FIG. 3 designates a support used in the present invention, in which a large number of receiving recesses 4 are formed in a line at the same intervals as the intervals between the mold parts 2. This receiving recess 4 is wide enough to allow the mold part 2 to be placed thereon as shown in the fifth part, and has a depth slightly shallower than the thickness of the mold part 2. Reference numeral 8 in FIG. 4 is an embossed tape used in the present invention, in which a large number of accommodating portions 9 each having a size capable of accommodating electronic components 1 one by one are connected at uniform intervals as shown in FIG. In the present invention, the electrical characteristics of the electronic component 1, such as short circuit test, capacity, loss, etc., are tested as follows. An electronic component group 25 in which a large number of electronic components 1 are connected as shown in FIG. 2 is sent out in the direction of arrow a in FIG. 1 by the feed roller 22 in FIG. 1 and placed on a work line A. In front of this sent-out electronic component 1, a support 3 is sequentially sent from the right side to the left side on the support conveyance line D in FIG.
Send out the support 3 at one end (in the direction of the arrow in FIG. 1). In this state, the electronic component 1 is pushed down in the direction of arrow C in FIG. 1 and placed on the receiving recess 4 of the support 3 as shown in FIG. This support 3 is moved to the right side in FIG. 1 and stopped at the position of the primary characteristic testing section 26 in the same figure. In this second-order characteristic testing section 26, a measurement probe (not shown) is pressed against the raw electrode 5 and one electrode 6 of the electronic component 1, and the electronic component 1 is
Performs necessary tests such as short-circuit tests and capacity tests. When the inspection is finished, move the support 3 to the right side in FIG.
Stop at the position. In this left forming section 27, first, the raw electrode 5 protruding laterally of the mold section 2 is cut into a predetermined size. This cutting is performed, for example, as shown in FIG.
Perform this by lowering 9. Thereafter, the raw electrode 5 of the electronic component 1 is moved to each position shown in FIGS. 8 to 9 and bent in three stages. For the first bending, as shown in FIG. It is bent to match the shape of the top and side surfaces of the pedestal 31. Next, the support 3 is moved to the right side in FIG. 1 and stopped at the position shown in FIG. Place it on the same pedestal 3.
The second rotating wheel 3 is placed above the + electrode 5 protruding to the side of 8.
7 and bend the + electrode 5 into the shape shown in FIG. Furthermore, the support 3 is moved to the right side in FIG. 1 and stopped at the position shown in FIG. 10, and the raw electrode 5 of the electronic component 1 placed on the support 3 is placed on the third pedestal as shown in FIG. 38, and the raw electrode 5 is pushed from the side by the pressing part 40 of the press 39 as shown in the same figure and bent. In this case, a soft material such as urethane rubber is used for the suppressing part 4o to reduce the impact applied to the raw electrode 5 and the mold part 2. When the left forming part 4 is completed in this manner, the electronic component 1 is placed on the receiving recess 4, and the support 3 is further moved to the right side in FIG. 1 and stopped at the position of the right forming part 4I. In this right side 74-mink part 41, the connecting piece 21
One electrode 6 of the electronic component connected to the same connecting piece 2
1 to the specified size. This cutting is performed by lowering a movable blade (not shown) onto the electrode 6 placed on a fixed blade (not shown). Thereafter, as in forming the left side of the raw electrode 5, the -electrode 6 is bent in three stages while the support 3 carrying the electronic component 1 is sequentially moved to a predetermined position and stopped. The electronic component 1 that has been formed in this manner is separated from the connecting piece 2 and placed in pieces in the receiving recess 4 one by one. In the present invention, in order to prevent the electronic components 1 from falling from the receiving recess 4, the electronic components 1 are pressed one by one against the support 3 using the presser 15 as shown in FIGS. 7 to 10. This holding tool 15 is made by bending piano wire into an L-shape, and its downward portion 15a is placed above the supporting tool 3.
The second lid 42 is penetrated so that the electronic component l can be pressed downward, and the base side 15b (seventh
10) to the "2" of the "2 lid 42",
It is pressed and fixed with a push plate (not shown), so that the horizontal portion 15c of the piano wire has elasticity in the direction of the arrow X-Y in FIG. 7. With the electronic component 1 pressed against the support 3 using the holding tool 15, move the support 3 to the right end of the work line A in FIG. 1
Push it into the cylindrical body 18 as shown in Figure 1. This cylindrical body 18 is
Move in the direction of arrow d in the figure to the side of the adjacent work line B, push out the support 3 from inside the cylinder 18 to line B, and return the empty cylinder 18 to its original position (work line B). automatically return to the right end of the line). Next, the extruded support 3 is moved to the left side in FIG. 1 on the work line B and stopped at the position of the secondary characteristic inspection section 42 on the work line B. This secondary characteristic testing section 42 tests the electrical characteristics of the electronic component 1, such as an LC check and the presence or absence of an oven. Through this secondary characteristic inspection, new defects caused by impact (stress) applied to the electronic component 1 during the forming are also checked. When the electrical characteristic test is completed, the support 3 is moved to the left end of the line B with the electronic component 1 placed thereon, and the support 3 is pushed into the cylindrical body 18 at the left end as shown in FIG. The cylindrical body 18 is moved in the direction of arrow e in FIG. 1 and stopped on the left side of the adjacent work line C, and the support 3 is pushed out from within the cylindrical body 18 at that position. The empty cylinder 18 is automatically returned to its original position (left end of work line B). The extruded support 3 with the electronic component 1 placed thereon is moved to the discrimination section 43 on the work line C and stopped. Here, based on the results of the above-mentioned secondary inspection and secondary inspection, the electronic components 1 are classified into non-defective products and defective products, and the non-defective products are further classified into ranks on two sides. After the discrimination, the defective products are further discharged from the receiving recess 4 of the support 3 in the discharge section 44 shown in FIG. 1, leaving only the good products in the support 3. The support 3 on which only the non-defective products are placed is moved to the taping portion 45 in FIG. 1 and stopped. Here, as shown in FIG. 6, the electronic components 1 are housed one by one in the housing section 9 of the embossed tape 8. In this case, as shown in FIGS. 6 and 13, the width of the receiving recess 4 of the support 3 is
Both ends 16 in the width direction of the mold part 2
．． 17 protrudes laterally from the receiving recess 4, and the protruding ends 16 and 17 are pushed up one by one from below with the pusher 7 as shown in FIGS. 6 and 13, and the embossed tape 8 is accommodated. It is designed so that it can be accommodated in the section 9. At this time, in order to prevent the electronic component l pushed up from below and stored in the housing part 9 from falling from the housing part 9, the front part 1 of the pushing tool 7 is On one side, an opening/closing body 53 is arranged which slides in the running direction of the embossed tape 8 at appropriate intervals. This opening/closing body 53 is the first
Slide to the left in Figure 2 to open the passage 54 through which the electronic component I passes, and when the electronic component I is placed into the housing section 9 and the push tool 7 is lowered, it slides to the right in Figure 12 to open the passage 54 through which the electronic component I passes. The passage 54 is closed to prevent the electronic component 1 housed in the housing section 9 from falling due to its own weight. In addition, the opening in Figure 6A and 55 in Figures 12 and 13.
56 and 57 are guide plates, of which guide plate 55 faces the opening/closing body 54, and the other two guide plates 56 and 57 face each other and are arranged on the sides of the opening/closing body 54 and the guide plate 55. Thus, the passage 54 is formed. Once the electronic component 1 is housed in the housing section 9, the sealing tape 11 is placed over the outside of the opening 10 of the housing section 9 at the taping section 45 in FIG. 1 as shown in FIG. The opening 10 is hermetically sealed by heat sealing by heating with a heater or bonding with an adhesive. In the present invention, all electronic components determined to be non-defective may be accommodated in the storage section 9 of the embossed tape 8, but when the non-defective products are divided into ranks on two sides, only electronic components of high grade among the non-defective products are stored. can be stored in the storage section 9, and low-grade non-defective products can be left as they are on the support 3, or vice versa. Electronic components l left on the support 3 without being accommodated in the accommodation portion 9 of the embossed tape 8 are transferred to the line C while being placed on the support 3.
The stocker 51 in FIG. 1 waits there. As shown in FIG. 14, this stocker 51 is partitioned into a large number of elongated accommodating parts 52, so that a large number of supports 3 can be accommodated therein. Multiple supports 3
The stocker 51 in which the is housed is moved to the side of the support conveyance line D in FIG. 1 and sent out to the same line D. In the above embodiment, forming is performed by bending one electrode 5 and ten electrodes 6 downward.
, the ten electrodes 6 may be bent to one side. In addition, in the embodiment shown in FIG.
The sealing tape 11 is supplied from below, but after the transfer of the embossed tape 11 progresses and the storage section 9 faces upward, the sealing tape 11 is supplied from one side of the storage section 9. You may also do so.
本発明の電子部品の電気特性の検査、フィーミンク、テ
ーピング方法は次のような効果がある。
１、検査、フォーミング、テーピングが一貫し、′て行
なわれるので、検査からテーピングまでの作業能率が著
しく向上する。
２、これまで、検査、フォーミング、テーピングの各工
程に必要であった作業者のうち、フォーミング、テーピ
ング時稈の作業者が不要になり、］９
大幅な省力化が可能になる。
３、電子部品１を支持具３にのせてからテーピングが完
了するまで、電子部品Ｉを支持具３から一切移し替えな
いので、作業中に電子部品の向きが変わって電子部品１
の電極の向きが逆転するようなことがない。また、電子
部品を次の工程に移し替えるときに生ずる異種類の電子
部品の混入等の人為的な作業ミスも生じない。
４、検査終了とほぼ同時にテーピングが完了するので、
テーピングまでの待ち時間が大幅に短縮される。
５、検査、フォーミング、テーピングの各工程を別々に
行なう場合は、各工程間で電子部品を保管しておく必要
があったが、その必要がないので保管スペースが削減さ
れる。
６、検査、フォーミング、テーピングの作業が一貫して
連続的に行なわれるので、それらの設備を個別に設置す
る場合よりも設備設置スペースが大幅に削減できる。ま
た、作業ラインを第１図のように複数本並設すれば、作
業ラインをコンバク１・にすることができる。
７、検査からテーピングまで作業が一貫して連続的に行
なわれるので計数管理が容易になる。The method of inspecting electrical characteristics of electronic components, feaming, and taping according to the present invention has the following effects. 1. Since inspection, forming, and taping are performed consistently, work efficiency from inspection to taping is significantly improved. 2. Among the workers who were previously required for each process of inspection, forming, and taping, the workers who handle the forming and taping processes are no longer necessary, allowing for significant labor savings. 3. Since the electronic component I is not transferred from the support 3 at all after the electronic component 1 is placed on the support 3 until the taping is completed, the orientation of the electronic component may change during work and the electronic component 1 may
The direction of the electrode will not be reversed. Further, human errors such as mixing of different types of electronic components that occur when electronic components are transferred to the next process do not occur. 4. Taping is completed almost at the same time as the inspection is completed, so
The waiting time for taping is greatly reduced. 5. When the inspection, forming, and taping processes were performed separately, it was necessary to store electronic components between each process, but since this is not necessary, storage space is reduced. 6. Since inspection, forming, and taping operations are performed consistently and continuously, the equipment installation space can be significantly reduced compared to when these equipments are installed individually. Furthermore, by arranging a plurality of work lines in parallel as shown in FIG. 1, the number of work lines can be reduced to one. 7. Since the work from inspection to taping is performed consistently and continuously, counting management becomes easier.
第１図は本発明の一実施例を示す概略平面図、第２図は
電子部品の説明図、第３図は同電子部品を支持する支持
しの一例を示す斜視図、第４図はエンボステープの一例
を示す斜視図、第５図は支持具に電子部品をのせた状態
の説明図、第６図イはエンボステープへ電子部品を収容
及びシールするテーピングの説明図、同図口は同図イの
部分平面図、第７図は電極の切断′説明図、第８図〜Ｉ
Ｏ図はフィーミンクの説明図、第１１図は筒体の一例を
示す斜視図、第１２図はテーピング時の側面説明、第１
３はテーピング時の正面図、第１４図はストッカーの説
明図である。
１は電子部品
２はモールド部
３はヴ持５
４は受凹部
５は十電極
６は一電極
７は押出し具
８はエンボステープ
９は収容部
１０は収容部の開口部
１１はシール用テープ
１５は押え見
１６．１７はモールド部の両端部
Ａ、＋３、ＣはラインFIG. 1 is a schematic plan view showing one embodiment of the present invention, FIG. 2 is an explanatory diagram of an electronic component, FIG. 3 is a perspective view showing an example of a support for supporting the electronic component, and FIG. 4 is an embossed A perspective view showing an example of the tape, FIG. 5 is an explanatory diagram of electronic components placed on a support, and FIG. Figure A is a partial plan view, Figure 7 is an explanatory diagram of electrode cutting, and Figures 8 to I.
Figure O is an explanatory diagram of Feemink, Figure 11 is a perspective view showing an example of the cylindrical body, Figure 12 is an explanation of the side surface during taping, and Figure 1
3 is a front view during taping, and FIG. 14 is an explanatory diagram of the stocker. 1 is an electronic component 2 is a mold part 3 is a holder 5 4 is a receiving recess 5 is a ten electrode 6 is one electrode 7 is an extrusion tool 8 is an embossing tape 9 is a housing part 10 is a sealing tape 15 for an opening 11 of the housing part 16.17 is both ends of the mold part A, +3, C are lines
Claims (4)
ールド部２を、支持具３の、モールド部２の間隔と同じ
間隔で一列に多数形成されている受凹部４にのせて、同
支持具３を間欠的に移動させて各電子部品１の電気特性
を検査し、次に受凹部４にのせてある電子部品１のモー
ルド部２の＋電極５と−電極６のいずれか一方を所定寸
法に切断してから折曲げ、次に他方の電極を所定寸法に
切断してから折曲げてフォーミングし、次に受凹部４に
のせてある電子部品１の電気特性を検査して良品と不良
品に判別し、良品を押出し具７により一個づつ受凹部４
から押出してエンボステープ８の収容部９に収容し、同
収容部９の開口部１０をシール用テープ１１でシールし
てテーピングすることを特徴とする電子部品の電気特性
の検査、フォーミング、テーピング方法。1. Each mold part 2 of the electronic component 1, which is connected in a row at appropriate intervals, is placed in a receiving recess 4, which is formed in a number in a row at the same intervals as the intervals of the mold parts 2, of a support 3. Then, the electrical characteristics of each electronic component 1 are inspected by moving the support 3 intermittently, and then the + electrode 5 and the - electrode 6 of the mold part 2 of the electronic component 1 placed in the receiving recess 4 are inspected. One of the electrodes is cut to a predetermined size and then bent, then the other electrode is cut to a predetermined size and then bent and formed, and then the electrical characteristics of the electronic component 1 placed in the receiving recess 4 are inspected. to distinguish between good and defective products, and push out the non-defective products one by one into the receiving recess 4 using the pusher 7.
A method for inspecting electrical properties, forming, and taping electronic components, characterized by extruding the tape from the embossed tape 8, storing it in a storage part 9 of the embossed tape 8, and sealing the opening 10 of the storage part 9 with a sealing tape 11 for taping. .
５により支持具３に押しつけるようにしたことを特徴と
する請求項第１の電子部品の電気特性の検査、フォーミ
ング、テーピング方法。2. The holding tool 1 holds the electronic component 1 placed on the receiving recess 4 of the support tool 3.
5. A method for inspecting electrical characteristics of an electronic component, forming it, and taping it as claimed in claim 1, wherein the electronic component is pressed against the support member 3 by a holder.
部２の幅より狭くして、同モールド部２の幅方向両端部
１６、１７を受凹部４より側方に突出させ、その突出す
る両端部１６、１７を前記押出し具７により押して、同
電子部品１をエンボステープ８の収容部９に一個づつ収
容するようにしたことを特徴とする請求項１又は請求項
２の電子部品の電気特性の検査、フォーミング、テーピ
ング方法。3. The width of the receiving recess 4 of the support 3 is made narrower than the width of the molded part 2 of the electronic component 1, so that both ends 16 and 17 in the width direction of the molded part 2 are placed laterally than the receiving recessed part 4. The electronic parts 1 are made to protrude, and the protruding ends 16 and 17 are pushed by the pushing tool 7, so that the electronic parts 1 are accommodated one by one in the accommodation part 9 of the embossed tape 8. Inspection of electrical characteristics, forming, and taping methods for electronic components as described in Item 2.
及び−電極６のフォーミング、エンボステープ８の収容
部９への電子部品１の収容及びシールの各作業を、二列
以上の作業ラインに分けて行ない、支持具３の受凹部４
にのせてある電子部品１を他のラインに移し替えるとき
に、同支持具３ごと筒体１８内に挿入し、その筒体１８
を移動するようにしたことを特徴とする請求項１又は請
求項２の電子部品の電気特性の検査、フォーミング、テ
ーピング方法。4. Inspection of electrical characteristics of electronic component 1, positive electrode 5 of electronic component 1
and - The operations of forming the electrode 6, accommodating the electronic component 1 in the accommodating portion 9 of the embossed tape 8, and sealing are performed in two or more work lines, and
When transferring the electronic component 1 placed on the holder to another line, the support 3 is inserted into the cylindrical body 18 and the cylindrical body 18 is transferred to another line.
3. A method for inspecting electrical characteristics, forming, and taping an electronic component according to claim 1 or 2, characterized in that said electronic component is moved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2339255A JPH0727852B2 (en) | 1990-11-30 | 1990-11-30 | Electrical characteristics inspection, forming and taping method for electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2339255A JPH0727852B2 (en) | 1990-11-30 | 1990-11-30 | Electrical characteristics inspection, forming and taping method for electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04206923A true JPH04206923A (en) | 1992-07-28 |
| JPH0727852B2 JPH0727852B2 (en) | 1995-03-29 |
Family
ID=18325720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2339255A Expired - Lifetime JPH0727852B2 (en) | 1990-11-30 | 1990-11-30 | Electrical characteristics inspection, forming and taping method for electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727852B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104399850A (en) * | 2014-12-03 | 2015-03-11 | 昆山微容电子企业有限公司 | Capacitor pin cutting device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63293812A (en) * | 1987-05-27 | 1988-11-30 | Hitachi Electronics Eng Co Ltd | Inspection and taping device for electronic parts |
| JPH03119798A (en) * | 1989-09-30 | 1991-05-22 | Haimeka Koki:Kk | Automatic taping machine, forming means and taping method for electronic component |
-
1990
- 1990-11-30 JP JP2339255A patent/JPH0727852B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63293812A (en) * | 1987-05-27 | 1988-11-30 | Hitachi Electronics Eng Co Ltd | Inspection and taping device for electronic parts |
| JPH03119798A (en) * | 1989-09-30 | 1991-05-22 | Haimeka Koki:Kk | Automatic taping machine, forming means and taping method for electronic component |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104399850A (en) * | 2014-12-03 | 2015-03-11 | 昆山微容电子企业有限公司 | Capacitor pin cutting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0727852B2 (en) | 1995-03-29 |
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