JPH04206599A - Mounting structure of electronic device - Google Patents
Mounting structure of electronic deviceInfo
- Publication number
- JPH04206599A JPH04206599A JP32891090A JP32891090A JPH04206599A JP H04206599 A JPH04206599 A JP H04206599A JP 32891090 A JP32891090 A JP 32891090A JP 32891090 A JP32891090 A JP 32891090A JP H04206599 A JPH04206599 A JP H04206599A
- Authority
- JP
- Japan
- Prior art keywords
- guide frame
- wiring board
- mounting structure
- honeycomb
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 11
- 230000000694 effects Effects 0.000 claims description 6
- 238000009423 ventilation Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 6
- 230000008901 benefit Effects 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 13
- 238000003780 insertion Methods 0.000 description 9
- 230000037431 insertion Effects 0.000 description 9
- 239000000758 substrate Substances 0.000 description 8
- 238000012423 maintenance Methods 0.000 description 7
- 230000007257 malfunction Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電話加入者系電子装置等の高密度実装構造に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a high-density packaging structure for telephone subscriber electronic equipment and the like.
電子部品を搭載した配線基板の実装構造の従来技術とし
ては、実公昭５７−４２２３１号公報に提案がされてい
る。A conventional technique for mounting a wiring board mounting structure on which electronic components are mounted is proposed in Japanese Utility Model Publication No. 57-42231.
また、配線基板からの効率的な放熱構造としては特開昭
５９−２１３１９２号公報、特開昭６３−２６６８９８
号公報、特開昭６３−１８４３９７号公報、特開昭６３
−１０９１９号公報に提案がされている。Further, as an efficient heat dissipation structure from a wiring board, Japanese Patent Application Laid-Open Nos. 59-213192 and 63-266898 disclose
No. 63-184397, JP-A-63-184397
A proposal has been made in Publication No.-10919.
以上に述べた従来技術においては、配線基板の実装方法
においでは実装間隔か不均一となり汎用性に劣っていた
。また、放熱構造においては発熱部品の熱は放熱できる
か、放熱部材から発熱部品を取り外す作業か複雑であり
、保守操作性に問題があった。In the conventional technology described above, the mounting distance is uneven in the wiring board mounting method, resulting in poor versatility. In addition, in the heat dissipation structure, it is difficult to determine whether the heat from the heat generating component can be dissipated, and the process of removing the heat generating component from the heat dissipation member is complicated, resulting in problems in maintainability.
従来、ガイド枠構造の電子装置では、カイト枠に搭載さ
れる配線ガイド基板をガイド枠のガイトレールに沿って
収容しており、配線基板の識別及び保守の容易性を持っ
ていた。しかし、最近の半導体技術の急激な進展に伴い
、配線基板光りに収容される電子回路数は増大の一途に
ある。このように高密度化が進められる中での問題点は
、ガイド枠内のに空間の有効活用がされていないことと
、基板内に収容された電子回路の単位ごとに分離する機
能が失われていることである。Conventionally, in electronic devices having a guide frame structure, a wiring guide board mounted on a kite frame is accommodated along guide rails of the guide frame, making it easy to identify and maintain the wiring board. However, with recent rapid progress in semiconductor technology, the number of electronic circuits accommodated in wiring boards continues to increase. The problem with this progress in increasing density is that the space within the guide frame is not being used effectively, and the ability to separate each unit of electronic circuits housed within the board is lost. That is what we are doing.
電話加入者回路等のように回路−単位ごとに分離保守さ
れる機能については、１枚の配線基板内に多数の回路単
位が搭載されると、保守時に不具合が出る。Regarding functions such as telephone subscriber circuits, which are maintained separately for each circuit unit, if a large number of circuit units are mounted on one wiring board, problems may occur during maintenance.
つまり、例として電話加入者１人に対する１回路単位を
集約して、１枚の配線基板に８電話加入者を搭載したと
仮定すると、その中の１加入者の回路に故障もしくは機
能変更があった場合、保守交換単位は配線基板が１枚な
ので、正常動作をしている他の７回路の加入者の回線が
切断されてしまい、サービスの低下となる。In other words, as an example, if one circuit unit for one telephone subscriber is aggregated and eight telephone subscribers are mounted on one wiring board, there is a failure or a change in the function of one of the subscriber's circuits. In this case, since the unit of maintenance and replacement is one wiring board, the lines of subscribers of the other seven circuits that are operating normally will be disconnected, resulting in a decline in service.
保守サービス向上のために１加入者を１枚の配線基板に
収容すると従来の実装方法では、ガイド枠内の空間の有
効活用が図れず装置の容積が大きくなり、高密度化の要
求に反する結果となる。When accommodating one subscriber on one wiring board to improve maintenance services, the conventional mounting method does not make effective use of the space within the guide frame and increases the volume of the equipment, which goes against the demand for higher density. becomes.
本発明の第１の目的は゛、ガイド枠内への電子部品及び
電子回路の高密度実装及び保守、交換が容易に実現出来
る配線基板の実装構造を提供することにある。A first object of the present invention is to provide a wiring board mounting structure that can easily realize high-density mounting, maintenance, and replacement of electronic components and circuits within a guide frame.
本発明の第２の目的はガイド枠内の空間を有効活用した
配線基板の実装構造を提供することにある。A second object of the present invention is to provide a wiring board mounting structure that effectively utilizes the space within the guide frame.
本発明の第３の目的は配線基板上からの発熱を効率良く
ガイド枠を経由して周囲に伝熱出来る実装構造を提供す
ることにある。−
本発明の第４の目的は配線基板から放射される電磁妨害
波を個々にシールドする実装構造を提供することにある
。A third object of the present invention is to provide a mounting structure that can efficiently transfer heat generated from a wiring board to the surrounding area via a guide frame. - A fourth object of the present invention is to provide a mounting structure that individually shields electromagnetic interference waves radiated from wiring boards.
本発明の第５の目的は配線基板を電気的に接続する際に
、わずかの力で嵌合が出来る機能を持たせることにある
。A fifth object of the present invention is to provide a function that allows wiring boards to be fitted together with a small amount of force when electrically connecting them.
上記課題を達成するため、本発明は、前記の目的を達成
するための構成として、配線基板を収容するガイド枠を
六角柱が多数集まってできた蜂の巣のような構造体とし
、ユニットフレームを構成した。In order to achieve the above object, the present invention has a structure in which a guide frame for accommodating a wiring board is formed into a honeycomb-like structure made up of a large number of hexagonal columns, and a unit frame is constructed. did.
さらに、上記六角柱のカイト枠の対角を利用して配線基
板のガイドレールとした。Further, the diagonals of the hexagonal columnar kite frame were used to form guide rails for the wiring board.
さらに、ガイド枠の殻壁に通気口をあけて対流熱放散性
の効果のある構造体とした。Furthermore, vents were opened in the shell wall of the guide frame to create a structure with convection heat dissipation properties.
さらに、配線基板にガイド枠の六角柱に沿って、熱伝導
性を向上させるために熱伝導コネクタを取付けた構造と
した。Furthermore, a heat conductive connector was attached to the wiring board along the hexagonal pillar of the guide frame to improve thermal conductivity.
さらに、上記熱・伝導コネクタ内に柔軟な密閉容器に液
体を詰めた、弾力性のあるリキッドヒートシンクを挾ん
で、配線基板とガイド枠間の接触熱抵抗を低減させた構
造とした。Furthermore, a resilient liquid heat sink, which is a flexible sealed container filled with liquid, is sandwiched within the heat/conduction connector to reduce the contact thermal resistance between the wiring board and the guide frame.
さらに、ガイド枠を中空にしてその中に冷媒を流し、液
冷機能を有する構造とした。Furthermore, the guide frame was made hollow and a refrigerant was flowed into it, creating a structure with liquid cooling function.
さらに、配線基板を収容し電気的接続する際に、保守、
取扱いを容易ならしめるため、擬似ゼロフォースインサ
ージョンコネクタを設けた。Furthermore, when accommodating wiring boards and making electrical connections, maintenance,
A pseudo-zero force insertion connector is provided for ease of handling.
本発明によれば、自動的に多数のガイドレールが構成出
来ると共に、このガイドレールに実装される配線基板は
両面を部品占有空間として略同程度に部品実装すること
が出来るために、電子部品の高密度実装が可能となる。According to the present invention, a large number of guide rails can be automatically configured, and both sides of the wiring board mounted on the guide rails can be occupied by components and components can be mounted to the same extent. High-density packaging becomes possible.
また配線基板を実装することによりガイド枠内の仕切板
が増えた形となり結果的にガイド枠全体の強度も向上さ
れる。Furthermore, by mounting the wiring board, the number of partition plates within the guide frame is increased, and as a result, the strength of the entire guide frame is improved.
更に各配線基板がガイド枠により囲まれた形となるため
シールド効果もえられる。Furthermore, since each wiring board is surrounded by a guide frame, a shielding effect can also be obtained.
さらに本発明によれば、配線基板からの発熱をガイド枠
への熱伝導放熱に加えて対流による対流熱伝達放熱の効
果が期待でき、結果として冷却性能が向上できる。Further, according to the present invention, in addition to heat conduction and heat dissipation of heat generated from the wiring board to the guide frame, the effect of convection heat transfer and heat dissipation by convection can be expected, and as a result, cooling performance can be improved.
さらに、本発明によれば、配線基板からの発熱をガイド
枠への熱伝導放熱する際の接触熱抵抗を低減することが
出来、効率の良い冷却構造が得られる。Further, according to the present invention, it is possible to reduce the contact thermal resistance when heat generated from the wiring board is conducted and radiated to the guide frame, and an efficient cooling structure can be obtained.
さらに、本発明によれば、ガイド枠を中空にしてその中
に冷媒を流した液冷却が可能で、配線基板が高密度実装
化され高発熱となった場合の冷却も可能となる。Furthermore, according to the present invention, it is possible to perform liquid cooling by making the guide frame hollow and flowing a refrigerant therein, and it is also possible to cool the wiring board when it is mounted in a high density and generates a high amount of heat.
さらに、本発明によれば、配線基板をガイド枠に実装し
、電気的接続する際に、接点バネのバネ性を利用しわず
かの力で操作が完了する機構となっているため、保守、
取扱いを容易ならしめる構造が得られる。Furthermore, according to the present invention, when the wiring board is mounted on the guide frame and electrically connected, the spring properties of the contact springs are used to complete the operation with a small amount of force.
A structure that facilitates handling is obtained.
以下、本発明による電子装置の実装構造の一実施例を第
１図、第２図により説明する。Hereinafter, one embodiment of the mounting structure of an electronic device according to the present invention will be described with reference to FIGS. 1 and 2.
１はガイド枠で同じ大きさの六角柱が多数集って出来た
、ちょうど蜂の巣のような構造体で、その殻壁は薄板を
使用している。ガイド枠１はその周囲を囲むようにユニ
ットフレーム３を取付け、上下左右をリベツ］・９等に
より接合することにより、ユニットフレーム３とガイド
枠１が一体化される。ガイド枠の製造方法の一例として
は第１９図に示すような工程が従来技術としである。1 is the guide frame, which is a honeycomb-like structure made up of many hexagonal pillars of the same size, and its shell walls are made of thin plates. The unit frame 3 is attached to the guide frame 1 so as to surround it, and the unit frame 3 and the guide frame 1 are integrated by joining the upper, lower, left, and right sides with rivets. As an example of a method for manufacturing a guide frame, a process as shown in FIG. 19 is a conventional technique.
ガイド枠１の六角柱の対角を利用することにより、自動
的に多数のガイドレール１０が構成出来、配線基板２が
収容される。By utilizing the diagonals of the hexagonal pillars of the guide frame 1, a large number of guide rails 10 can be automatically constructed and the wiring boards 2 can be accommodated.
ガイド枠１はその後部をコネクタガイド溝１１を有する
中間板８と接合したのち、ユニットカバ４と全面側で嵌
合させられることにより、前後をそれぞれ板によりサン
ドイッチされた形となり、ハニカム板としての特性をも
たせることが出来、軽量で高強度を有する構造体となる
。After the guide frame 1 has its rear part joined to the intermediate plate 8 having the connector guide groove 11, the entire surface side of the guide frame 1 is fitted with the unit cover 4, so that the front and rear parts are sandwiched between the plates, and the guide frame 1 is formed into a honeycomb plate. The structure can be made lightweight and has high strength.
６はマザーボードで各配線基板と電気的に接続されるコ
ネクタ７を実装し、これをユニットフレーム３に組込む
ことによりユニットが構成される。A motherboard 6 mounts a connector 7 electrically connected to each wiring board, and is assembled into the unit frame 3 to form a unit.
以下、本実施例についてさらに詳細に説明する。This example will be described in more detail below.
ハニカム構造を用いたユニットは、従来の基板並列搭載
に比べて、部品の占有空間を有効に活用できる利点があ
る。Units using a honeycomb structure have the advantage of making more effective use of the space occupied by components compared to conventional board mounting in parallel.
第３図は、従来の基板並列型ユニット３０１内に、部品
を搭載した基板３０２が実装されている一部断面斜視図
を示すが、この方式では、隣接する基板との隙間の空間
が、部品の占有できる空間となるため、たとえば基板の
右側に背の高い部品をのせると、対面する基板の左側に
は背の低い部品しか搭載できない等が発生する。このた
め、隙間の空間をその両側の基板に割りふり、部品の高
さ条件を付与して使用する場合が多かった。あるいは、
対面している基板に部品が搭載されているにもかかわら
ず、どうしても背の高い部品を搭載したい場合には、１
枚分の余分な空間を設けて実装せざるを得なくなり、実
装密度低下をまぬがれない場合も多かった。FIG. 3 shows a partially sectional perspective view of a board 302 with components mounted inside a conventional board parallel type unit 301. In this system, the space between adjacent boards is For example, if a tall component is mounted on the right side of the board, only short components can be mounted on the left side of the facing board. For this reason, the space in the gap is often allocated to the substrates on both sides of the gap, and the height conditions for the parts are set. or,
If you really want to mount a tall component even though the component is mounted on the facing board, use 1.
In many cases, it was necessary to provide an extra space for the number of chips to be mounted, resulting in a reduction in packaging density.
これに対し、第４図はハニカム構造のガイド枠１内に部
品を搭載した基板２を実装している状態の一部断面斜視
図を示す。ハニカム構造とすれば、基板中央付近の領域
においては、部品が占有できる空間は、ハニカムの仕切
り壁までとなり、この高さは従来並列型の隣接基板間の
高さになるため、基板の両面共に部品占有空間として最
大限に利用することができる。したがって背の高い部品
を基板中央部に配置することにより、部品の最高制限高
さは、基板の両面共にハニカム仕切り壁までの高さを確
保することができ、従来のように基板表裏での部品高さ
の割りふりや高さ制限等を気にすることなく、部品の選
定や搭載面選択を行うことができるようになる。On the other hand, FIG. 4 shows a partially sectional perspective view of a state in which a board 2 with components mounted thereon is mounted within a guide frame 1 having a honeycomb structure. With a honeycomb structure, in the area near the center of the board, the space that can be occupied by components is up to the partition wall of the honeycomb, and this height is the same as the height between adjacent boards in a conventional parallel type, so both sides of the board The space occupied by the parts can be maximized. Therefore, by placing tall components in the center of the board, the maximum height limit of the components can be secured to the honeycomb partition wall on both sides of the board, and components on the front and back sides of the board can be You will be able to select parts and mounting surfaces without worrying about height allocation or height restrictions.
また、ハニカム構造ユニットを用いた他の効果としては
、基板上の配線領域を大きく取れることが上げられ、図
を用いて説明する。第５図は、従来の基板並列型ユニッ
トに搭載した基板３０２の下端部及び基板ガイド用レー
ル３１０の一部を示した断面図である。従来構造では、
この図に示すように基板上端部両側には、基板を位置決
めするためのレール壁３１２が備えられており、このた
め基板の下端部の両面は、基板の出し入れ時にレールと
接触してこすれるため、このレール壁の高さ範囲内にパ
ターン配線があるとショートや断線の発生が考えられた
。そのため、従来は、基板端面から数ｍｍは、パターン
配線禁止領域を設けなければならず、配線密度向上の阻
害となっていた。Another advantage of using the honeycomb structure unit is that the wiring area on the board can be enlarged, which will be explained with reference to the drawings. FIG. 5 is a cross-sectional view showing the lower end of the board 302 and part of the board guide rail 310 mounted on a conventional board parallel type unit. In the conventional structure,
As shown in this figure, rail walls 312 for positioning the board are provided on both sides of the top end of the board, so both sides of the bottom end of the board come into contact with the rails and rub when the board is inserted or removed. It was thought that short circuits and disconnections would occur if the pattern wiring was within the height range of the rail wall. Therefore, conventionally, it was necessary to provide a pattern wiring prohibited area several mm from the end surface of the substrate, which hindered improvement in wiring density.
これに対して第６図はハニカム構造ユニットに搭載した
基板２の下端面及びハニカム構造ユニットの一部を示し
た断面図である。ハニカム構造ユニットでは、六角形の
角部１０を利用して基板の位置決めができるので、従来
のようにレールを設ける必要はない。そのため、基板両
面側をレール壁でこするようなことがなくなるので、基
板端面のぎりぎりまでパターン配線領域を確保でき、配
線密度の向上に効果がある。なお、基板上端部について
も同様にパターン配線領域を拡大できることは言うまで
もない。On the other hand, FIG. 6 is a sectional view showing the lower end surface of the substrate 2 mounted on the honeycomb structure unit and a part of the honeycomb structure unit. In the honeycomb structure unit, the hexagonal corners 10 can be used to position the substrate, so there is no need to provide rails as in the conventional case. Therefore, since the rail walls do not rub the both sides of the board, the pattern wiring area can be secured to the very edge of the board end face, which is effective in improving the wiring density. It goes without saying that the pattern wiring area can be similarly expanded for the upper end of the substrate.
第７図は基板の放熱構成の一実施例である。基板２に熱
伝導コネクタ１３を設け、ガイド枠］との接触面接を大
きくすることにより、基板２とガイド枠１の間の熱伝導
率を良好にしたものであり、基板２に搭載された回路部
品１４からの熱を基板２、熱伝導コネクタ１３、ガイド
枠ｌを介して効率よく伝導放熱させることができる。こ
の熱伝導コネクタ１３は、熱伝導率の高い銅および、ア
ルミニウム等で山形に作られており、その角度はガイド
枠１の六角形の内角より大きく、また挿入部にはテーバ
が設けてあり、弱い力で挿入できる。基板２の挿入後は
、熱伝導コネクタ１３による弾性力でガイド枠１と熱伝
導コネクタ１３は密着する構造となっている。基板２と
熱伝導コネクタ１３の接続は、第８図に示す様に接着剤
等で固定されている。また、この熱伝導コネクタ１３は
、基板の位置決め精度を向上させることは言うまでもな
い。FIG. 7 shows an example of the heat dissipation structure of the substrate. By providing a heat conductive connector 13 on the board 2 and increasing the contact area with the guide frame, the thermal conductivity between the board 2 and the guide frame 1 is improved, and the circuit mounted on the board 2 Heat from the component 14 can be efficiently conducted and radiated via the substrate 2, the heat conductive connector 13, and the guide frame l. This heat conductive connector 13 is made of copper, aluminum, etc. with high thermal conductivity in a chevron shape, and its angle is larger than the hexagonal inner angle of the guide frame 1, and the insertion part is provided with a taper. Can be inserted with weak force. After the board 2 is inserted, the guide frame 1 and the heat conductive connector 13 are in close contact with each other due to the elastic force of the heat conductive connector 13. The connection between the board 2 and the heat conductive connector 13 is fixed with an adhesive or the like as shown in FIG. Moreover, it goes without saying that this heat conductive connector 13 improves the positioning accuracy of the board.
第９図は複数枚の熱伝導コネクタ１３設けてさらに伝導
放熱を良好にした一実施例である。FIG. 9 shows an embodiment in which a plurality of heat conductive connectors 13 are provided to further improve conductive heat radiation.
第１０図は、基板２に搭載された回路部品１４の放熱構
成の一実施例である。基板２に搭載された部品１４は、
基板２を介して伝導放熱されるが、その他に部品１４と
ガイド枠１との間に絶縁性のある、柔軟な密ぺい容器に
液体をつめたリキッドヒートシンクＩ５を設置し、その
リキッドヒートシンク１５を介して基板２に搭載された
部品１４の熱をガイド枠［に伝導放熱することができる
。このリキッドヒートシンク１５は、基板２をガイド枠
１に挿入する前にリキッドヒートシンクＬ５を熱伝導コ
ネクタ１３にはさみ込み、基板２のガイド枠１への挿入
により、熱伝導コネクタ１３がガイド枠］に押えられ、
その熱伝導コネクタ１３に押えられたりキットヒートシ
ンク１５が部品１４、熱伝導コネクタ１３およびガイド
枠１に密着する構造となっている。FIG. 10 shows an example of a heat dissipation configuration of the circuit component 14 mounted on the board 2. The components 14 mounted on the board 2 are
Heat is radiated by conduction through the substrate 2, but in addition, a liquid heat sink I5 filled with liquid in an insulating, flexible, airtight container is installed between the component 14 and the guide frame 1, and the liquid heat sink 15 is The heat of the component 14 mounted on the board 2 can be conducted and radiated to the guide frame through the guide frame. This liquid heat sink 15 is constructed by inserting the liquid heat sink L5 into the heat conductive connector 13 before inserting the board 2 into the guide frame 1, and by inserting the board 2 into the guide frame 1, the heat conductive connector 13 is pressed against the guide frame. is,
The kit heat sink 15 is pressed by the heat conductive connector 13 and is in close contact with the component 14, the heat conductive connector 13, and the guide frame 1.
第１図はガイド枠１の放熱構成の一実施例である。ユニ
ット３の全面に放熱フィン５を設けたユニットカバ４を
ガイド枠１がユニットカバ４に直接接触する様に取付け
られる構造とすることでガイド枠１からの熱をユニット
カバ４、放熱フィン５を介して外部に放熱することがで
きる。このガイド枠１とユニットカバ４の接続はユニッ
トカバ４のガイド枠１の接触する側にガイド枠１のフレ
ームの形に合わせた六角形の集合体の溝を形成しガイド
枠１をはめ込むことで行うことができる。FIG. 1 shows an example of the heat dissipation structure of the guide frame 1. As shown in FIG. The unit cover 4, which has heat dissipation fins 5 provided on the entire surface of the unit 3, is installed so that the guide frame 1 is in direct contact with the unit cover 4, so that the heat from the guide frame 1 is transferred to the unit cover 4 and the heat dissipation fins 5. Heat can be radiated to the outside through the The connection between the guide frame 1 and the unit cover 4 is achieved by forming a hexagonal aggregate groove that matches the frame shape of the guide frame 1 on the side of the unit cover 4 that contacts the guide frame 1, and fitting the guide frame 1 into the groove. It can be carried out.
またユニットカバ４のガイド枠１の接触する側に弾性が
大きくかつ熱伝導の良好な樹脂等をはりつけておき、密
着することもできる。さらに第１２図に示す様にカイト
枠１中に管路を設はユニットカバ４に接触する様にし、
管路１６を伝熱管とすることでガイド枠１の熱伝導率を
良好にすることができる。Alternatively, a resin or the like having high elasticity and good thermal conductivity may be pasted on the side of the unit cover 4 that is in contact with the guide frame 1 to achieve close contact. Furthermore, as shown in FIG. 12, a conduit is installed in the kite frame 1 so as to contact the unit cover 4,
By using the conduit 16 as a heat transfer tube, the thermal conductivity of the guide frame 1 can be improved.
また本発明は、伝導放熱だけでなく、液冷方式において
も適している構造であり、その一実施例を第１４図に示
す。ガイド枠１を中空とし、もしくは、第１３図に示す
様にガイド枠１中に管路１６を設け、それをポンプおよ
び冷液機等からなる液冷ユニット１７と管路１８で接続
する。これによりガイド枠１内にフレオン等の絶縁性の
高い冷却した液体を循環させて、ユニット全体を片より
なく冷却することができる。Furthermore, the present invention has a structure suitable not only for conduction heat radiation but also for a liquid cooling system, and one embodiment thereof is shown in FIG. 14. The guide frame 1 is made hollow, or as shown in FIG. 13, a conduit 16 is provided in the guide frame 1, and the conduit 16 is connected to a liquid cooling unit 17 consisting of a pump, a chiller, etc. by a conduit 18. As a result, a highly insulating cooled liquid such as Freon is circulated within the guide frame 1, and the entire unit can be uniformly cooled.
また、第９図に示す様にガイド枠１に穴をあけた構造と
することで空冷方式にも適することは言うまでもない。Further, it goes without saying that the structure in which the guide frame 1 has holes as shown in FIG. 9 is suitable for an air cooling system.
従来技術のフックシェルフ形実装では、隣接する電子回
路搭載プリント基板間や、シェルフはシールド構造を取
っていない為、電子回路搭載プリント基板から放射され
る電磁妨害波は、シェルフ上側、下側にある通気口及び
前面を通り他のシェルフに実装される電子回路搭載プリ
ント基板を誤動作させたり、隣接する電子回路搭載プリ
ント基板を誤動作させる恐れがあった。又、シェルフ外
に放射される電磁妨害波は筐体外に放出され他の電子装
置を誤動作させる恐れが有った。In the hook-shelf type mounting of the conventional technology, electromagnetic interference emitted from adjacent printed circuit boards with electronic circuits and the shelf does not have a shielding structure, so the electromagnetic interference waves emitted from the printed circuit boards with electronic circuits are on the upper and lower sides of the shelf. There was a risk that printed circuit boards mounted with electronic circuits mounted on other shelves through the vents and the front surface would malfunction, or that adjacent printed circuit boards mounted with electronic circuits would malfunction. Furthermore, electromagnetic interference waves radiated outside the shelf may be radiated outside the housing and cause other electronic devices to malfunction.
本発明は、上記従来技術では不完全であった電磁妨害波
のシールディング構造に関するもので有る。電子回路搭
載プリント基板は、六角柱状の電子回路搭載プリント基
板実装ガイド枠に実装され、又、ガイド枠前面は放熱用
熱伝導界にて閉かれる為、電子回路搭載プリント基板か
ら放射される電磁妨害波は六角柱状電子回路搭載プリン
ト基板実装ガイド枠内でシールドされ隣接する電子回路
搭載プリント基板や他の電子装置を誤動作させる事が無
くなる。The present invention relates to a shielding structure for electromagnetic interference, which was incomplete in the prior art. The electronic circuit mounted printed circuit board is mounted on a hexagonal prism-shaped electronic circuit mounted printed circuit board mounting guide frame, and the front of the guide frame is closed with a thermal conduction field for heat dissipation, so that electromagnetic interference radiated from the electronic circuit mounted printed circuit board is prevented. The waves are shielded within the hexagonal prism-shaped electronic circuit-mounted printed circuit board mounting guide frame, thereby preventing malfunctions of adjacent electronic circuit-mounted printed circuit boards and other electronic devices.
第１４図は従来のブックシェルフ形実装の斜視図、第１
５図はその正面図である。電子回路搭載プリント基板４
０２より放射される電磁妨害波５は、シェルフ４０３の
上面、下面の通気口４１９及び正面を通り、他のユニッ
トに実装されている電子回路搭載プリント基板や、隣接
する電子回路搭載基板４０２を誤動作させる恐れがあっ
た。又、シェルフ外に漏洩した電磁妨害波は筐体外に放
出され他の電子装置を誤動作させる恐れがあった。第１
図は本発明の斜視図であり、電子回路搭載プリント基板
２は六角柱状電子回路プリント基板実装ガイド枠１に実
装され前面は放熱用熱伝導界４でシールドされる為、電
子回路搭載プリント基板２から放射される電子妨害波は
隣接する電子回路搭載プリント基板２ｂに影響をあたえ
ない。又、電磁妨害波が電子回路搭載プリント基板実装
ガイド枠外へ漏洩しない為、他の電子装置に影響をあた
える事がない。Figure 14 is a perspective view of a conventional bookshelf type mounting;
Figure 5 is its front view. Printed circuit board with electronic circuit 4
The electromagnetic interference waves 5 emitted from the shelf 403 pass through the vents 419 and the front of the upper and lower surfaces of the shelf 403, causing electronic circuit-mounted printed circuit boards mounted in other units and adjacent electronic circuit-mounted boards 402 to malfunction. There was a fear that it would. Furthermore, electromagnetic interference waves leaked outside the shelf may be emitted outside the housing and cause other electronic devices to malfunction. 1st
The figure is a perspective view of the present invention. The electronic circuit mounted printed circuit board 2 is mounted on the hexagonal columnar electronic circuit printed circuit board mounting guide frame 1, and the front surface is shielded by a heat conductive field 4 for heat dissipation. The electronic interference waves radiated from the electronic circuit board 2b do not affect the adjacent printed circuit board 2b. Furthermore, since electromagnetic interference waves do not leak outside the electronic circuit mounted printed circuit board mounting guide frame, they do not affect other electronic devices.
第１７図は、本発明に係るコネクタ接続構成の一実施例
を示す全体構成の斜視図である。蜂の巣のような構造体
に回路基板を多数取り付ける場合、保守、取扱いが問題
となるので、いかに回路基板の取扱い性を容易にできる
かが課題となる。以下に単純な構成でかつ取扱い性を大
幅に向上できる疑似ゼロフォースインサージョンの構成
を第１８により詳細に説明する。FIG. 17 is a perspective view of the overall configuration showing one embodiment of the connector connection configuration according to the present invention. When a large number of circuit boards are attached to a honeycomb-like structure, maintenance and handling become a problem, so the issue is how to make the circuit boards easier to handle. Below, the structure of the pseudo-zero force insertion which has a simple structure and can greatly improve the ease of handling will be explained in more detail in the 18th section.
回路基板２にはＬＳＩ等の電子部品【４が搭載され、端
面の接栓１９でマザーボード６に接続される。Electronic components such as LSIs [4] are mounted on the circuit board 2, and are connected to the motherboard 6 through connectors 19 on the end surface.
一方、先述のマザーボード６には、ハウジング５゜５′
が取り付けられており、ハウジング５，５′には接点ば
ね６が組付けられている。またハウジング５．５′は、
マザーボード側のみがマザーボード６に係止されており
他端はフリーである。先述のハウジング７．７′に組付
けられた接点ばね２０は、プレスフィツト接続によりマ
ザーボード６のスルーホールに機械的、電気的に接続さ
れており、ハウジング７．７′は接点ばね２０によりブ
リテンションが作用している。また前記ブリテンション
は、ばね２１にて支え、ハウジング７が所定の間隙２２
を有する構成である。On the other hand, the motherboard 6 mentioned above has a housing 5°5'.
are attached, and a contact spring 6 is assembled to the housings 5, 5'. Also, the housing 5.5' is
Only the motherboard side is locked to the motherboard 6, and the other end is free. The contact spring 20 assembled in the aforementioned housing 7.7' is mechanically and electrically connected to the through-hole of the motherboard 6 by press-fit connection, and the housing 7.7' is held in tension by the contact spring 20. is working. Further, the britension is supported by a spring 21, and the housing 7 is supported by a predetermined gap 22.
The configuration has the following.
次に第１７図と合せて、疑似ゼロインサーションコネク
タの動作を詳細に説明する。Next, the operation of the pseudo zero insertion connector will be explained in detail with reference to FIG.
回路基板１の突起２３を合せた厚さは間隙２２より多少
厚めに設定してあり、また回路基板の高さ寸法２４は、
ばね２１の高さ方向の間隙２５より同様に多少大きく設
定しである６今回路基板２をハウシング７の間隙に挿入
するとすると、ハウジング７゜７′は突起２３で支えら
れ、同時にばね２１は回路基板の高さ寸法２５で支えら
れた状態となる。ここで回路基板の突起２３がハウシン
グの切欠き２６まで進むと、ハウジングは接点ばね２０
のブリテンションで閉じ、第１７図に示す接点が接触し
た状態となり、所定の接触力でゼロインサーションフォ
ースの挿′入動作が実現する。次に回路基板を抜去する
場合は、回路基板の突起２３がハウジング７を押し広げ
、接点接触面の摺動なしで、抜去作業が行なえる構造で
ある。この場合、突起２３及び切欠き２６には、Ｒ付は
又は面取りを付与し、容易に押し広げる形状とすること
は言うまでもない。また突起２３はハウジング７の所定
の間隙２２より厚いため、ばね２１が自己の回復力によ
りハウジング７と係合し、回路基板が完全に抜去された
後も所定の間隙２２を維持することができる。The combined thickness of the protrusions 23 of the circuit board 1 is set to be slightly thicker than the gap 22, and the height dimension 24 of the circuit board is:
If the circuit board 2 is inserted into the gap in the housing 7, which is set to be slightly larger than the gap 25 in the height direction of the spring 21, the housing 7°7' will be supported by the protrusion 23, and at the same time the spring 21 will be inserted into the circuit. It will be in a state where it is supported by the height dimension 25 of the board. When the protrusion 23 on the circuit board advances to the notch 26 in the housing, the housing will close to the contact spring 20.
The contact points shown in FIG. 17 are in contact with each other, and an insertion operation of zero insertion force is realized with a predetermined contact force. Next, when the circuit board is to be removed, the protrusions 23 of the circuit board push the housing 7 apart, and the structure allows the removal operation to be performed without sliding the contact contact surfaces. In this case, it goes without saying that the protrusion 23 and the notch 26 are rounded or chamfered so that they can be easily expanded. Further, since the protrusion 23 is thicker than the predetermined gap 22 of the housing 7, the spring 21 engages with the housing 7 by its own recovery force, and the predetermined gap 22 can be maintained even after the circuit board is completely removed. .
以上説明した如く、接触面の摺動がなく接点摩耗が生し
ない、かつ挿入時のロック機構を兼ねた突起と切欠きを
有することより、簡易な取扱い性が良好な疑似ゼロイン
サーションコネクタを提供できる。またここでは、カー
ドエツジタイプのコネクタの一実施例を示したが、間接
形のコネクタにおいても同様の疑似ゼロインサーション
コネクタを実現できることは言うまでもない。As explained above, we provide a quasi-zero insertion connector that does not cause contact wear due to no sliding on the contact surface, and has protrusions and notches that also serve as a locking mechanism during insertion, making it easy to handle. can. Although an embodiment of a card edge type connector has been shown here, it goes without saying that a similar pseudo-zero insertion connector can also be realized with an indirect type connector.
〔発明の効果〕
以上説明したように、本発明に係る電子装置の実装構造
によれば、軽量でかつ強度上すぐれた、配線基板を収容
するユニットフレームを構成することが出来る。また配
線基板の実装密度を向上させることが出来ると共に配線
基板から発生する熱を効率良く冷却することが出来る。[Effects of the Invention] As described above, according to the mounting structure for an electronic device according to the present invention, it is possible to construct a unit frame that is lightweight and has excellent strength and accommodates a wiring board. Moreover, the mounting density of the wiring board can be improved, and the heat generated from the wiring board can be efficiently cooled.
さらに保守操作時に配線基板の取扱い性にすぐれた構造
を提供できる。Furthermore, it is possible to provide a structure with excellent handling of the wiring board during maintenance operations.
第１図は本発明の一実施例の外観を示す斜視図、第２図
はガイド枠の構成図、第３図は従来のガイド枠への配線
基板の実装斜視図、第４図は本発明の実装斜視図、第５
囚及び第６図はガイドレール部詳細図、第７図及び第８
図は配線基板への熱伝導コネクタ取付図、第９図はガイ
ド枠に通気口を設けた部分斜視図、第［０図及び第１１
図は接触熱抵抗低減のためにリキッドヒートシンクを実
装した状態の斜視図、第１２図及び第１３図は冷却能方
向上のための実施例を示す斜視図、第１４図及び第１５
図は従来技術のブックシェル形実装の斜視図、及び正面
図、第１６図は本発明により電磁波がシールドされてい
ることを示す正面図、第１７図及び第１８図は配線基板
を電気的に接続させるための接続機構の斜視図である。
１・・・ガイド枠 ２・・・回路基板３・・・
ユニットフレーム ４・・・ユニットカバー５・・・放
熱フィン ６・・・マザーボード７・・・ハウジ
ング ８・・・中間板９・・・リベット
１ｏ・・・ガイドレール１１・・・コネクタガイド溝
１２・・・レール壁１３・・・熱伝導コネクタ １
４・・・回路部品１５・・・リキッドヒートシンク
１６・・・管路 １７・・・液冷ユニット
１８・・・液路 Ｉ９・・・通気口２０・
・・接点ばね ２Ｉ・・・押さえばね２３、＝
突起 ２４・・・回路基板高さ寸法２５・
・・ハウジング高さ寸法２６・・・切欠き見１胃
駆］Ｏ以
第１１０
７； 之
員１２１辺
１８−一一史各
！１’３１招
第１７Ｍ
ん−一一切Ｆｐ！粗
１１８旨
７−−− へウジしつ゛
４−−− ［ｉＷ名１ｎ品
カニーＳ岳、冒り）
η −−一 押乙′ＬＪめ
〃−−−品疎
為−−一 七り吸１
接着御埋荀 引１
洗身・表記処理
力１１月二・猪肩
＋Ｊ３ＩｆＴ
↓
手続補正書は劃
発明の名称
電子装置の実装構造
補正をする者
事件との関係 特 許 出願人
名 称 Ｌ５１０１株式会社 日 立 製
作 所代 理 人
補正の対象
明細書の図面の簡単な説明の欄
補正の内容FIG. 1 is a perspective view showing the appearance of an embodiment of the present invention, FIG. 2 is a configuration diagram of a guide frame, FIG. 3 is a perspective view of mounting a wiring board on a conventional guide frame, and FIG. 4 is a perspective view of the present invention. Implementation perspective view, fifth
Figures 6 and 6 are detailed views of the guide rail, Figures 7 and 8.
The figure is a diagram of installing a heat conduction connector on a wiring board, Figure 9 is a partial perspective view of a guide frame with a ventilation hole, and Figures [0 and 11]
The figure is a perspective view of a state in which a liquid heat sink is mounted to reduce contact thermal resistance, Figures 12 and 13 are perspective views showing an embodiment for increasing the cooling capacity, and Figures 14 and 15 are
The figures are a perspective view and a front view of a bookshell type mounting according to the prior art, Fig. 16 is a front view showing that electromagnetic waves are shielded by the present invention, and Figs. 17 and 18 are It is a perspective view of the connection mechanism for making a connection. 1... Guide frame 2... Circuit board 3...
Unit frame 4...Unit cover 5...Radiation fin 6...Motherboard 7...Housing 8...Intermediate plate 9...Rivet
1o...Guide rail 11...Connector guide groove 12...Rail wall 13...Heat conduction connector 1
4...Circuit component 15...Liquid heat sink 16...Pipe line 17...Liquid cooling unit 18...Liquid line I9...Vent hole 20.
...Contact spring 2I...Press spring 23, =
Protrusion 24...Circuit board height dimension 25.
...Housing height dimension 26...Notch view 1 stomach drive] O to 110 7; Members 121 sides 18-11 history each! 1'31 Invitation No. 17M N-1 Fp! Coarse 118 effect 7 --- Heujishitsu ゛ 4 --- [iW name 1n product Kanny S mountain, blasphemy) η --- 1 Oshiot' LJ me〃 --- Quality behavior --- 1 7-lisu 1 Adhesion Gobui pull 1 Body wash/notation processing ability November 2 Inokata + J3 IfT ↓ The procedural amendment is the name of the invention Name of the invention Relationship to the case of a person who amends the mounting structure of an electronic device Patent Applicant name Name L5101 Hitachi Co., Ltd. Made
Contents of the amendment in the brief description of the drawings in the specification subject to the amendment
Claims (9)
な構造体（ハニカム構造）のガイド枠から構成されたユ
ニットフレームに配線基板を収容したことを特徴とする
電子装置の実装構造。1. A mounting structure for an electronic device, characterized in that a wiring board is housed in a unit frame composed of a guide frame having a honeycomb structure in which a large number of hexagonal columns of the same size are gathered together.
して配線基板の挿入、引出及び保持のガイドレール機能
を持たせたことを特徴とする請求項１記載の電子装置の
実装構造。2. 2. The electronic device mounting structure according to claim 1, wherein diagonals of the hexagonal pillars of the honeycomb-structured guide frame are used to provide a guide rail function for inserting, pulling out, and holding a wiring board.
度に部品実装することが出来ることを特徴とする請求項
１記載の電子装置の実装構造。3. 2. The mounting structure for an electronic device according to claim 1, wherein components can be mounted to substantially the same extent on both sides of the wiring board as component-occupied spaces.
、配線基板から発生した熱を伝導により放熱させるとと
もに、殻壁に通気口を設けることで対流熱放散させるこ
とを特徴とする請求項１記載の電子装置の実装構造。4. 2. The honeycomb-structured guide frame is made of a highly thermally conductive material, and dissipates heat generated from the wiring board by conduction, and also dissipates heat by convection by providing ventilation holes in the shell wall. Mounting structure of electronic devices.
めた、リキッドヒートシンクを挾み、配線基板と山形形
状の熱伝導コネクタ間の熱伝導性を向上させると共に、
その弾力性を利用して山形形状の熱伝導コネクタをガイ
ド枠に密着させ接触熱抵抗を低減させることを特徴とす
る請求項１記載の電子装置の実装構造。5. A liquid heat sink, which is a flexible airtight container filled with liquid, is placed in the heat conduction connector to improve thermal conductivity between the wiring board and the chevron-shaped heat conduction connector, and
2. The electronic device mounting structure according to claim 1, wherein the chevron-shaped heat conductive connector is brought into close contact with the guide frame by utilizing its elasticity to reduce contact thermal resistance.
ることにより液冷ユニットとすることも出来る請求項１
記載の電子装置の実装構造。6. Claim 1: A liquid cooling unit can be formed by constructing a guide frame having a honeycomb structure with a hollow shell wall.
Mounting structure of the electronic device described.
ガイド枠内に実装することにより、シールド効果を有す
ることを特徴とする請求項１記載の電子装置の実装構造
。7. 2. The mounting structure for an electronic device according to claim 1, wherein a shielding effect is achieved by mounting the wiring boards within partitioned honeycomb structure guide frames.
ム構造のガイド枠の終端に取り付けられたパネル内の接
栓にそれぞれ電気的に接続する際に、接点バネのバネ性
を利用してわずかな力で嵌合が出来る機能を有する電子
装置の実装構造。8. An electrical connector terminal is provided at one end of the wiring board, and when electrically connecting to each connector in the panel attached to the end of the guide frame with a honeycomb structure, the springiness of the contact spring is used to make a slight A mounting structure for electronic devices that can be mated by force.
ように沿う形状の熱伝導コネクタを取付け、配線基板と
ガイド枠との熱伝導性を向上させ、熱伝導にて配線基板
から発生する熱を冷却することを特徴とする電子装置の
実装構造。9. A heat-conducting connector shaped to closely fit the guide frame that houses the wiring board is attached to the wiring board, improving thermal conductivity between the wiring board and the guide frame, and cooling the heat generated from the wiring board through thermal conduction. A mounting structure for an electronic device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2328910A JP2776981B2 (en) | 1990-11-30 | 1990-11-30 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2328910A JP2776981B2 (en) | 1990-11-30 | 1990-11-30 | Electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04206599A true JPH04206599A (en) | 1992-07-28 |
| JP2776981B2 JP2776981B2 (en) | 1998-07-16 |
Family
ID=18215458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2328910A Expired - Lifetime JP2776981B2 (en) | 1990-11-30 | 1990-11-30 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2776981B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090321045A1 (en) * | 2008-06-30 | 2009-12-31 | Alcatel-Lucent Technologies Inc. | Monolithic structurally complex heat sink designs |
| US7933125B2 (en) | 2008-03-24 | 2011-04-26 | Fujitsu Limited | Board unit and electronic apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62194402A (en) * | 1986-02-21 | 1987-08-26 | Citizen Watch Co Ltd | Measurement of minute dimension |
-
1990
- 1990-11-30 JP JP2328910A patent/JP2776981B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62194402A (en) * | 1986-02-21 | 1987-08-26 | Citizen Watch Co Ltd | Measurement of minute dimension |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7933125B2 (en) | 2008-03-24 | 2011-04-26 | Fujitsu Limited | Board unit and electronic apparatus |
| US20090321045A1 (en) * | 2008-06-30 | 2009-12-31 | Alcatel-Lucent Technologies Inc. | Monolithic structurally complex heat sink designs |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2776981B2 (en) | 1998-07-16 |
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