JPH042064U - - Google Patents
Info
- Publication number
- JPH042064U JPH042064U JP4181290U JP4181290U JPH042064U JP H042064 U JPH042064 U JP H042064U JP 4181290 U JP4181290 U JP 4181290U JP 4181290 U JP4181290 U JP 4181290U JP H042064 U JPH042064 U JP H042064U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- damping material
- sheet
- reinforcing layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 7
- 238000013016 damping Methods 0.000 claims description 5
- 230000003014 reinforcing effect Effects 0.000 claims 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例の縦断面図である。
１０……プリント基板本体、１１……高張力絶
縁フイルム、１２……プリントパターン、２０…
…ハニカムコア、３０……アルミニウムフイルム
、４０……接着材、５０……電気部品、６０……
制振材層。
FIG. 1 is a longitudinal sectional view of an embodiment of the present invention. 10...Printed circuit board body, 11...High tensile strength insulating film, 12...Print pattern, 20...
... Honeycomb core, 30 ... Aluminum film, 40 ... Adhesive material, 50 ... Electrical parts, 60 ...
Damping material layer.
Claims (1)
の補強層で裏打ちしてなる高剛性プリント基板に
おいて、前記プリント基板本体の部品実装面と反
対側で且つ前記補強層の裏面に貼付けた制振材を
備えることを特徴とする制振材付高剛性プリント
基板。 ２ 前記制振材がシート状のゴム材料であること
を特徴とする請求項１記載の制振材付高剛性プリ
ント基板。[Claims for Utility Model Registration] 1. In a high-rigidity printed circuit board formed by lining a sheet-like printed circuit board body with a reinforcing layer having a honeycomb structure, the side opposite to the component mounting surface of the printed circuit board body and the back surface of the reinforcing layer. A high-rigidity printed circuit board with a damping material, characterized by having a damping material attached to the board. 2. The highly rigid printed circuit board with damping material according to claim 1, wherein the damping material is a sheet-like rubber material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4181290U JPH042064U (en) | 1990-04-19 | 1990-04-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4181290U JPH042064U (en) | 1990-04-19 | 1990-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH042064U true JPH042064U (en) | 1992-01-09 |
Family
ID=31552804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4181290U Pending JPH042064U (en) | 1990-04-19 | 1990-04-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH042064U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012165590A (en) * | 2011-02-08 | 2012-08-30 | Sumitomo Wiring Syst Ltd | Electric connection box |
-
1990
- 1990-04-19 JP JP4181290U patent/JPH042064U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012165590A (en) * | 2011-02-08 | 2012-08-30 | Sumitomo Wiring Syst Ltd | Electric connection box |