JPS6413759U - - Google Patents

Info

Publication number
JPS6413759U
JPS6413759U JP10917087U JP10917087U JPS6413759U JP S6413759 U JPS6413759 U JP S6413759U JP 10917087 U JP10917087 U JP 10917087U JP 10917087 U JP10917087 U JP 10917087U JP S6413759 U JPS6413759 U JP S6413759U
Authority
JP
Japan
Prior art keywords
substrate
thin
wiring board
reinforcing plate
thicker
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10917087U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10917087U priority Critical patent/JPS6413759U/ja
Publication of JPS6413759U publication Critical patent/JPS6413759U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の薄形プリント配線基板の一実
施例を示す斜視図、第2図は第1図のA−A断面
を示す断面図、第3図、第4図はそれぞれ第1図
の基板2、補強板7を示す斜視図である。 1……薄形プリント配線基板、2……基板、3
……部品が実装される部分、4……他の部分、5
,6,8,9……溝、7……補強板、10……接
着剤。
FIG. 1 is a perspective view showing an embodiment of the thin printed wiring board of the present invention, FIG. 2 is a sectional view taken along the line AA in FIG. 1, and FIGS. 3 and 4 are the same as in FIG. 1. FIG. 3 is a perspective view showing the substrate 2 and reinforcing plate 7 of FIG. 1... Thin printed wiring board, 2... Board, 3
... Part where parts are mounted, 4 ... Other parts, 5
, 6, 8, 9...groove, 7...reinforcement plate, 10...adhesive.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 部品が実装される部分と他の部分の境界に溝ま
たはミシン目穴が形成された薄形の基板に、該基
板より厚さの厚い補強板が前記他の部分において
貼合わされている薄形プリント配線基板。
A thin print in which a reinforcing plate that is thicker than the substrate is attached to a thin substrate with grooves or perforations formed at the boundary between the part where the component is mounted and the other part. wiring board.
JP10917087U 1987-07-15 1987-07-15 Pending JPS6413759U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10917087U JPS6413759U (en) 1987-07-15 1987-07-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10917087U JPS6413759U (en) 1987-07-15 1987-07-15

Publications (1)

Publication Number Publication Date
JPS6413759U true JPS6413759U (en) 1989-01-24

Family

ID=31345170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10917087U Pending JPS6413759U (en) 1987-07-15 1987-07-15

Country Status (1)

Country Link
JP (1) JPS6413759U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03126286A (en) * 1989-10-11 1991-05-29 Matsushita Electric Ind Co Ltd Flexible printed circuit board and manufacture thereof
JPH0552197U (en) * 1991-12-24 1993-07-09 松下電工株式会社 Gate fixing device
US7763974B2 (en) 2003-02-14 2010-07-27 Hitachi, Ltd. Integrated circuit for driving semiconductor device and power converter

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03126286A (en) * 1989-10-11 1991-05-29 Matsushita Electric Ind Co Ltd Flexible printed circuit board and manufacture thereof
JPH0552197U (en) * 1991-12-24 1993-07-09 松下電工株式会社 Gate fixing device
US7763974B2 (en) 2003-02-14 2010-07-27 Hitachi, Ltd. Integrated circuit for driving semiconductor device and power converter

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