JPS6413759U - - Google Patents
Info
- Publication number
- JPS6413759U JPS6413759U JP10917087U JP10917087U JPS6413759U JP S6413759 U JPS6413759 U JP S6413759U JP 10917087 U JP10917087 U JP 10917087U JP 10917087 U JP10917087 U JP 10917087U JP S6413759 U JPS6413759 U JP S6413759U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- thin
- wiring board
- reinforcing plate
- thicker
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第1図は本考案の薄形プリント配線基板の一実
施例を示す斜視図、第2図は第1図のA−A断面
を示す断面図、第3図、第4図はそれぞれ第1図
の基板2、補強板7を示す斜視図である。
1……薄形プリント配線基板、2……基板、3
……部品が実装される部分、4……他の部分、5
,6,8,9……溝、7……補強板、10……接
着剤。
FIG. 1 is a perspective view showing an embodiment of the thin printed wiring board of the present invention, FIG. 2 is a sectional view taken along the line AA in FIG. 1, and FIGS. 3 and 4 are the same as in FIG. 1. FIG. 3 is a perspective view showing the substrate 2 and reinforcing plate 7 of FIG. 1... Thin printed wiring board, 2... Board, 3
... Part where parts are mounted, 4 ... Other parts, 5
, 6, 8, 9...groove, 7...reinforcement plate, 10...adhesive.
Claims (1)
たはミシン目穴が形成された薄形の基板に、該基
板より厚さの厚い補強板が前記他の部分において
貼合わされている薄形プリント配線基板。 A thin print in which a reinforcing plate that is thicker than the substrate is attached to a thin substrate with grooves or perforations formed at the boundary between the part where the component is mounted and the other part. wiring board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10917087U JPS6413759U (en) | 1987-07-15 | 1987-07-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10917087U JPS6413759U (en) | 1987-07-15 | 1987-07-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6413759U true JPS6413759U (en) | 1989-01-24 |
Family
ID=31345170
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10917087U Pending JPS6413759U (en) | 1987-07-15 | 1987-07-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6413759U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03126286A (en) * | 1989-10-11 | 1991-05-29 | Matsushita Electric Ind Co Ltd | Flexible printed circuit board and manufacture thereof |
JPH0552197U (en) * | 1991-12-24 | 1993-07-09 | 松下電工株式会社 | Gate fixing device |
US7763974B2 (en) | 2003-02-14 | 2010-07-27 | Hitachi, Ltd. | Integrated circuit for driving semiconductor device and power converter |
-
1987
- 1987-07-15 JP JP10917087U patent/JPS6413759U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03126286A (en) * | 1989-10-11 | 1991-05-29 | Matsushita Electric Ind Co Ltd | Flexible printed circuit board and manufacture thereof |
JPH0552197U (en) * | 1991-12-24 | 1993-07-09 | 松下電工株式会社 | Gate fixing device |
US7763974B2 (en) | 2003-02-14 | 2010-07-27 | Hitachi, Ltd. | Integrated circuit for driving semiconductor device and power converter |
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