JPH04205735A - Surface-modified optical disk substrate - Google Patents
Surface-modified optical disk substrateInfo
- Publication number
- JPH04205735A JPH04205735A JP2331395A JP33139590A JPH04205735A JP H04205735 A JPH04205735 A JP H04205735A JP 2331395 A JP2331395 A JP 2331395A JP 33139590 A JP33139590 A JP 33139590A JP H04205735 A JPH04205735 A JP H04205735A
- Authority
- JP
- Japan
- Prior art keywords
- optical disk
- disk substrate
- film
- acrylate
- meth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 44
- 230000003287 optical effect Effects 0.000 title claims abstract description 40
- 239000000178 monomer Substances 0.000 claims abstract description 32
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 24
- -1 methacryloyl groups Chemical group 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 14
- 238000005240 physical vapour deposition Methods 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims description 37
- 150000001875 compounds Chemical class 0.000 claims description 16
- 229910010272 inorganic material Inorganic materials 0.000 claims description 14
- 239000011147 inorganic material Substances 0.000 claims description 14
- 239000000428 dust Substances 0.000 abstract description 5
- 238000000151 deposition Methods 0.000 abstract 3
- 230000008021 deposition Effects 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 26
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 14
- 125000000524 functional group Chemical group 0.000 description 11
- 238000010894 electron beam technology Methods 0.000 description 9
- 239000003999 initiator Substances 0.000 description 9
- 229920003023 plastic Polymers 0.000 description 9
- 239000004033 plastic Substances 0.000 description 9
- 239000000126 substance Substances 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 229920006163 vinyl copolymer Polymers 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 238000007259 addition reaction Methods 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 208000017983 photosensitivity disease Diseases 0.000 description 3
- 231100000434 photosensitization Toxicity 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- UZKWTJUDCOPSNM-UHFFFAOYSA-N 1-ethenoxybutane Chemical compound CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229920002601 oligoester Polymers 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 239000003504 photosensitizing agent Substances 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000193 polymethacrylate Polymers 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 150000003568 thioethers Chemical class 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- WXPWZZHELZEVPO-UHFFFAOYSA-N (4-methylphenyl)-phenylmethanone Chemical compound C1=CC(C)=CC=C1C(=O)C1=CC=CC=C1 WXPWZZHELZEVPO-UHFFFAOYSA-N 0.000 description 1
- SKYXLDSRLNRAPS-UHFFFAOYSA-N 1,2,4-trifluoro-5-methoxybenzene Chemical compound COC1=CC(F)=C(F)C=C1F SKYXLDSRLNRAPS-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- QWQFVUQPHUKAMY-UHFFFAOYSA-N 1,2-diphenyl-2-propoxyethanone Chemical compound C=1C=CC=CC=1C(OCCC)C(=O)C1=CC=CC=C1 QWQFVUQPHUKAMY-UHFFFAOYSA-N 0.000 description 1
- YAOJJEJGPZRYJF-UHFFFAOYSA-N 1-ethenoxyhexane Chemical compound CCCCCCOC=C YAOJJEJGPZRYJF-UHFFFAOYSA-N 0.000 description 1
- IOSXLUZXMXORMX-UHFFFAOYSA-N 1-ethenoxypentane Chemical compound CCCCCOC=C IOSXLUZXMXORMX-UHFFFAOYSA-N 0.000 description 1
- OVGRCEFMXPHEBL-UHFFFAOYSA-N 1-ethenoxypropane Chemical compound CCCOC=C OVGRCEFMXPHEBL-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- PGYJSURPYAAOMM-UHFFFAOYSA-N 2-ethenoxy-2-methylpropane Chemical compound CC(C)(C)OC=C PGYJSURPYAAOMM-UHFFFAOYSA-N 0.000 description 1
- GNUGVECARVKIPH-UHFFFAOYSA-N 2-ethenoxypropane Chemical compound CC(C)OC=C GNUGVECARVKIPH-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
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- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- IEVADDDOVGMCSI-UHFFFAOYSA-N 2-hydroxybutyl 2-methylprop-2-enoate Chemical compound CCC(O)COC(=O)C(C)=C IEVADDDOVGMCSI-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
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- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 1
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- 230000005856 abnormality Effects 0.000 description 1
- 231100000987 absorbed dose Toxicity 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 235000013334 alcoholic beverage Nutrition 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
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- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229910001632 barium fluoride Inorganic materials 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- NHOGGUYTANYCGQ-UHFFFAOYSA-N ethenoxybenzene Chemical compound C=COC1=CC=CC=C1 NHOGGUYTANYCGQ-UHFFFAOYSA-N 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- RMBPEFMHABBEKP-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2C3=C[CH]C=CC3=CC2=C1 RMBPEFMHABBEKP-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(IV) oxide Inorganic materials O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- DFENKTCEEGOWLB-UHFFFAOYSA-N n,n-bis(methylamino)-2-methylidenepentanamide Chemical compound CCCC(=C)C(=O)N(NC)NC DFENKTCEEGOWLB-UHFFFAOYSA-N 0.000 description 1
- UTSYWKJYFPPRAP-UHFFFAOYSA-N n-(butoxymethyl)prop-2-enamide Chemical compound CCCCOCNC(=O)C=C UTSYWKJYFPPRAP-UHFFFAOYSA-N 0.000 description 1
- DNTMQTKDNSEIFO-UHFFFAOYSA-N n-(hydroxymethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCO DNTMQTKDNSEIFO-UHFFFAOYSA-N 0.000 description 1
- ULYOZOPEFCQZHH-UHFFFAOYSA-N n-(methoxymethyl)prop-2-enamide Chemical compound COCNC(=O)C=C ULYOZOPEFCQZHH-UHFFFAOYSA-N 0.000 description 1
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical compound CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 1
- ZIWDVJPPVMGJGR-UHFFFAOYSA-N n-ethyl-2-methylprop-2-enamide Chemical compound CCNC(=O)C(C)=C ZIWDVJPPVMGJGR-UHFFFAOYSA-N 0.000 description 1
- YPHQUSNPXDGUHL-UHFFFAOYSA-N n-methylprop-2-enamide Chemical compound CNC(=O)C=C YPHQUSNPXDGUHL-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000007592 spray painting technique Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- YODZTKMDCQEPHD-UHFFFAOYSA-N thiodiglycol Chemical compound OCCSCCO YODZTKMDCQEPHD-UHFFFAOYSA-N 0.000 description 1
- GQUJEMVIKWQAEH-UHFFFAOYSA-N titanium(III) oxide Chemical compound O=[Ti]O[Ti]=O GQUJEMVIKWQAEH-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- KEROTHRUZYBWCY-UHFFFAOYSA-N tridecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)C(C)=C KEROTHRUZYBWCY-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、ピットの読み誤りの原因となる、帯電による
ゴミ、ホコリの付着や擦り傷の発生を防止できる表面改
質光ディスク基板に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a surface-modified optical disk substrate that can prevent the adhesion of dirt and dust and the occurrence of scratches due to charging, which cause pit reading errors.
（従来の技術およびその課題）
高密度記録媒体である光ディスクは再生専用だけでなく
、追記型、書換型なども実用化され多種多様になってき
ている。この光ディスク基板材料として現在、ポリメヂ
ルメタクリレート系重合体やポリカーボネート等のグラ
スチックが用いられているが、これらのプラスチックは
帯電性が高く硬度も十分てないためゴミ、ホコリの付着
や表面の擦傷が起こり、しばしば読みとり時のエラーの
原因となる。また、光ディスク使用時にアルコール飲料
をこぼすと白化するなどの問題もある。この問題を解決
するため、光ディスク基板材料上にアクリレート系の保
護被膜層を形成するこしながらこの方法においても十分
な耐擦り偏性、帯電性を得る事ができず耐忍剤性に関し
ては帯電防止剤添加によってさらに低下するという問題
があった。(Prior Art and its Problems) Optical discs, which are high-density recording media, are not only for reproduction only, but also write-once type, rewritable type, etc. have been put into practical use and are becoming more diverse. Currently, plastics such as polymethyl methacrylate polymers and polycarbonate are used as substrate materials for optical discs, but these plastics have high electrostatic properties and are not sufficiently hard, so they are susceptible to dirt and dust adhesion and surface scratches. occur and often cause reading errors. Furthermore, there are also problems such as whitening if alcoholic beverages are spilled on the optical disc when using it. In order to solve this problem, an acrylate-based protective coating layer was formed on the optical disc substrate material. However, even with this method, sufficient abrasion resistance and charging properties could not be obtained, and the antistatic properties were insufficient for antistatic properties. There was a problem that the addition of additives further decreased the performance.
（課題を解決するための手段）
そこで本発明者らは、上記問題のない、表面改質された
光ディスク基板を得るべく鋭意研究の結果、光ディスク
基板材料上に特定の多層膜を形成することによって上記
目的を達成できることを見出し本発明を完成させた。(Means for Solving the Problems) Therefore, as a result of intensive research to obtain a surface-modified optical disc substrate free from the above-mentioned problems, the present inventors found that by forming a specific multilayer film on the optical disc substrate material, The inventors have discovered that the above object can be achieved and have completed the present invention.
すなわち本発明は、光ディスク基板材料の表面に、
（ａ）アクリロイル基および／又はメタクリロイル基を
分子中に少なくとも２個有する数平均分子量２００〜２
０．０００の化合物および／又は樹脂３０〜１００重量
部および
（ｂ）上２成分（ａ）と共重合可能な重合性不飽和モノ
マー０〜７０重量部
からなり、（ａ）と（ｂ）との和が１００重量部である
組成物を被膜形成成分とする活性エネルギー線硬化性プ
ライマー組成物の硬化膜が膜厚０１〜１ｏμｍとなるよ
う形成されており、該硬化膜上に物理蒸着法によって厚
さ０．１〜１．０μｍ未満の無機物質層が形成されてな
る表面改質光ディスク基板を提供するものである。That is, the present invention provides a material having a number average molecular weight of 200 to 2, having at least two acryloyl groups and/or methacryloyl groups in the molecule, on the surface of the optical disc substrate material.
0.000 compound and/or 30 to 100 parts by weight of resin and (b) 0 to 70 parts by weight of a polymerizable unsaturated monomer copolymerizable with the above two components (a), and (a) and (b) A cured film of an active energy ray-curable primer composition containing a composition in which the sum of 100 parts by weight of The present invention provides a surface-modified optical disk substrate on which an inorganic material layer having a thickness of 0.1 to less than 1.0 μm is formed.
本発明における光ディスク基板は、ビデオディスク、オ
ーディオディスク、文書ファイル用ディスク、コンピュ
ーターメモリー用ディスクなどの光ディスク（光磁気デ
ィスクも包含する。）に使用される基板である。The optical disk substrate in the present invention is a substrate used for optical disks (including magneto-optical disks) such as video disks, audio disks, document file disks, and computer memory disks.
光ディスク基板材料は通常、プラスチック製であり、本
発明において光ディスク基板材料としては、ポリエチレ
ンなどのポリオレフィン、ポリメチルメタクリレート系
重合体、ポリスチレン、ポリカーボネート、エポキシ樹
脂等のプラスチックであることが好ましい。上記ポリメ
チルメタクリレート系重合体は、構成するモノマー成分
としてメチルメタクリレートを９０重量％以上含有する
共重合体又は単独重合体である。The optical disk substrate material is usually made of plastic, and in the present invention, the optical disk substrate material is preferably a plastic such as polyolefin such as polyethylene, polymethyl methacrylate polymer, polystyrene, polycarbonate, or epoxy resin. The polymethyl methacrylate-based polymer is a copolymer or homopolymer containing 90% by weight or more of methyl methacrylate as a constituent monomer component.
本発明においては、上記光ディスク基板材料の表面に、
（ａ）アクリロイル基および／又はメタクリロイル基Ｅ
以下、「（メタ）アクリロイル基」と略称する。コを分
子中に少なくとも２個有する化合物および／又は樹脂（
以下、「被膜形成成分（ａ）」と略称する。）と、必要
に応じて（ｂ）被膜形成成分（ａ）と共重合可能な重合
性不飽和上ツマ−（以下、「千ツマ−（ｂ）」と略称す
る。）
とを膜形成要素として含有する活性エネルギー線硬化性
プライマー組成物の硬化膜が形成されている。この硬化
膜は十分な透明性を有し、基板材料および、この硬化膜
の上に積層される無機物質層との密着性が良好であるこ
とが必要である。In the present invention, on the surface of the optical disc substrate material, (a) an acryloyl group and/or a methacryloyl group E
Hereinafter, it will be abbreviated as "(meth)acryloyl group." Compounds and/or resins having at least two of these in the molecule (
Hereinafter, it will be abbreviated as "film-forming component (a)". ) and, if necessary, (b) a polymerizable unsaturated upper layer (hereinafter abbreviated as "thousand layer (b)") that can be copolymerized with the film-forming component (a) as a film-forming element. A cured film of the active energy ray-curable primer composition contained therein is formed. This cured film needs to have sufficient transparency and good adhesion between the substrate material and the inorganic material layer laminated on the cured film.
上記被膜形成成分（ａ）は、（メタ）アクリロイル基を
１分子当り少なくとも２個有することが必要であり、硬
化性の観点から被膜形成成分（ａ）１ｋｇ当り、０．１
〜１０モルの範囲にあるのが好ましく、０．２〜５モル
の範囲にあるのがより好ましい。０．１モルより少なく
なると、樹脂の硬化が不充分となり、一方逆に１０モル
より多くなると、硬化被膜の機械的物性が低下する傾向
がある。The film-forming component (a) needs to have at least two (meth)acryloyl groups per molecule, and from the viewpoint of curability, the film-forming component (a) must contain 0.1
It is preferably in the range of ~10 moles, more preferably in the range of 0.2 to 5 moles. When the amount is less than 0.1 mol, the curing of the resin becomes insufficient, while when it is more than 10 mol, the mechanical properties of the cured film tend to deteriorate.
また上記被膜形成成分（ａ）は、数平均分子量２００〜
２０，０００であることが必要である。分子量が２００
未満では硬化時の収縮が大きく硬化膜自体に割れが生じ
たり、無機物質層を蒸着によって形成する際に無機物質
層に割れが生じたりする。一方、分子量が２０，０００
を超えると粘度が高くなり塗装作業上問題が生じる。The film-forming component (a) has a number average molecular weight of 200 to
It needs to be 20,000. Molecular weight is 200
If it is less than this, shrinkage during curing will be large and cracks will occur in the cured film itself, or cracks will occur in the inorganic material layer when it is formed by vapor deposition. On the other hand, the molecular weight is 20,000
If it exceeds the viscosity, the viscosity will increase, causing problems in painting work.
上記被膜形成成分（ａ）として使用できる樹脂としては
、例えば、ポリエステルに（メタ）アクリル酸を縮合さ
せた樹脂、（メタ）アクリロイル基含有ポリウレタン樹
脂、（メタ）アクリロイル基含有含リンエポキシ樹脂、
（メタ）アクリロイル基含有ビニル共重合体樹脂、（メ
タ）アクリロイル基含有シリコン樹脂、（メタ）アクリ
ロイル基含有メラミン樹脂などが挙げられ、これらのう
ち、特に（メタ）アクリロイル基含有ビニル共重合体樹
脂が好ましい。Examples of resins that can be used as the film-forming component (a) include resins obtained by condensing polyester with (meth)acrylic acid, (meth)acryloyl group-containing polyurethane resins, (meth)acryloyl group-containing phosphorus-containing epoxy resins,
(meth)acryloyl group-containing vinyl copolymer resins, (meth)acryloyl group-containing silicone resins, (meth)acryloyl group-containing melamine resins, etc. Among these, especially (meth)acryloyl group-containing vinyl copolymer resins is preferred.
上記被膜形成成分（ａ）における樹脂中への（メタ）ア
クリロイル基の導入は、従来公知の手段を採用すること
により行ない得る。例えば（ｉ）カルボキシル基とエポ
キシ基との付加反応、（１１）水酸基とエポキシ基との
付加反応、（ｉｉｉ ）水酸基とカルボキシル基とのエ
ステル化反応、（１ｖ）イソシアネート基と水酸基との
付加反応等の官能基同志の反応を利用し、これらの反応
における一方の官能基（以下、「第１の官能基」と略称
する。）と（メタ）アクリロイル基とを有する化合物を
もう一方の官能基（以下、「第２の官能基」と略称する
。）を有する樹脂と反応させることによって（メタ）ア
クリロイル基を有する樹脂を得ることができる。これら
のうち、特に（１）又は（１ｖ）の反応を用いたものが
好ましい。The (meth)acryloyl group in the film-forming component (a) can be introduced into the resin by employing conventionally known means. For example, (i) addition reaction between carboxyl group and epoxy group, (11) addition reaction between hydroxyl group and epoxy group, (iii) esterification reaction between hydroxyl group and carboxyl group, (1v) addition reaction between isocyanate group and hydroxyl group. Utilizing reactions between functional groups such as (hereinafter abbreviated as "second functional group"), a resin having a (meth)acryloyl group can be obtained. Among these, those using reaction (1) or (1v) are particularly preferred.
上記第１の官能基と（メタ）アクリロイル基とを有する
化合物としては、例えば、アクリル酸、メタクリル酸な
どのカルボキシル基含有化合物；グリシジルアクリレー
ト、グリシジルメタクリレート、３．４−エポキシシク
ロヘキシルメチルアクリレート、３．４−エポキシシク
ロヘキシルメチルメタクリレートなどのエポキシ基含有
化合物；２−ヒドロキシエチルアクリレート、２−ヒド
ロキシエチルメタクリレート、ヒドロキシプロピルアク
リレート、ヒドロキシプロピルメタクリレート、ヒドロ
キシブチルメタクリレート、Ｎ−メチロールアクリルア
ミド、Ｎ−メチロールメタクリルアミド、および２−ヒ
ドロキシエチルアクリレート又はメタクリレートとε−
カプロラクトンとの付加物などの水酸基含有化合物、イ
ンシアナトエチルアクリレート、インシアナトエチルメ
タクリレートなどのイソシアネート基含有化合物などが
挙げられる。Examples of the compound having the first functional group and a (meth)acryloyl group include carboxyl group-containing compounds such as acrylic acid and methacrylic acid; glycidyl acrylate, glycidyl methacrylate, 3.4-epoxycyclohexylmethyl acrylate; Epoxy group-containing compounds such as 4-epoxycyclohexylmethyl methacrylate; 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate, hydroxybutyl methacrylate, N-methylol acrylamide, N-methylol methacrylamide, and -Hydroxyethyl acrylate or methacrylate and ε-
Examples include hydroxyl group-containing compounds such as adducts with caprolactone, and isocyanate group-containing compounds such as incyanatoethyl acrylate and incyanatoethyl methacrylate.
上記、第１の官能基と（メタ）アクリロイル基とを有す
る化合物と反応せしめる、第２の官能基を有する樹脂は
、被膜形成成分（ａ）が例えば（メタ）アクリロイル基
含有ビニル共重合体樹脂の場合には、第２の官能基を保
有する重合性不飽和モノマーおよび該重合性不飽和モノ
マーと共重合可能な重合性不飽和モノマーとの共重合体
などが挙げられる。The above-mentioned resin having a second functional group to be reacted with the compound having the first functional group and a (meth)acryloyl group is such that the film-forming component (a) is, for example, a (meth)acryloyl group-containing vinyl copolymer resin. Examples include copolymers of a polymerizable unsaturated monomer having a second functional group and a polymerizable unsaturated monomer copolymerizable with the polymerizable unsaturated monomer.
上記第２の官能基を保有する重合性不飽和モノマーとし
ては、上記第１の官能基と（メタ）アクリロイル基を有
する化合物として例示したものの中から適宜選ぶことが
でき、それ以外にカルボキシル基含有モノマーとしては
、クロトン酸、イタコン酸、マレイン酸、フマル酸など
；エポキシ基含有モノマーとしては、アリルグリシジル
エーテルなど；水酸基含有モノマーとしては、アリルア
ルコールなど；イソシアネート基含有モノマーとしては
、ｍ−インプロペニル−α、α−ジメチルベンジルイソ
シアネートなども使用できる。The polymerizable unsaturated monomer having the second functional group can be appropriately selected from among the compounds exemplified as the compounds having the first functional group and a (meth)acryloyl group, and in addition to the compounds having a carboxyl group. Monomers include crotonic acid, itaconic acid, maleic acid, fumaric acid, etc.; epoxy group-containing monomers include allyl glycidyl ether; hydroxyl group-containing monomers include allyl alcohol; and isocyanate group-containing monomers include m-impropenyl. -α,α-dimethylbenzyl isocyanate and the like can also be used.
上記第２の官能基を有する重合性不飽和モノマーと共重
合可能な重合性不飽和モノマーとしては、前記第２の官
能基を保有する重合性不飽和モノマーおよび以下に記載
する、その他の重合性不飽和モノマーの中から適宜選択
して使用することができる。Examples of the polymerizable unsaturated monomer copolymerizable with the polymerizable unsaturated monomer having the second functional group include the polymerizable unsaturated monomer having the second functional group and other polymerizable monomers described below. It can be used by appropriately selecting from unsaturated monomers.
上記その他の重合性不飽和モノマーとしては、アクリル
酸メチル、アクリル酸エチル、アクリル酸プロピル、ア
クリル酸イソプロピル、アクリル酸ブチル（ｎ−、ｉ
−、ｔ−） 、アクリル酸ヘキシル、アクリル酸２−エ
チルヘキシル、アクリル酸ｎ−オクチル、アクリル酸デ
シル、アクリル酸ステアリル、アクリル酸ラウリル、ア
クリル酸シクロヘキシル、メタクリル酸メチル、メタク
リル酸エチル、メタクリル酸プロピル、メタクリル酸イ
ソプロピル、メタクリル酸ブチル（ｎ−２ｉ −、ｔ
−） 、メタクリル酸ヘキシル、メタクリル酸シクロヘ
キシル、メタクリル酸２−エチルヘキシル、メタクリル
酸トリデシル、メタクリル酸ラウリル、メタクリル酸ス
テアリル等のアクリル酸又はメタクリル酸の炭素数１〜
１８のアルキルエステル又はシクロアルキルエステル；
アクリル酸メトキシブヂル、メタクリル酸メトキシブチ
ル、アクリル酸メトキシエチル、メタクリル酸メトキシ
エチル、アクリル酸エトキシブチル、メタクリル酸エト
キシブチル等のアクリル酸又はメタクリル酸の炭素数２
〜１８のアルコキシアルキルエステル；アクリル酸アミ
ド、メタクリル酸アミド、Ｎ−メチルアクリルアミド、
Ｎ−エチルメタクリルアミド、Ｎ−メトキシメチルアク
リルアミド、Ｎ−ブトキシメチルアクリルアミド、Ｎ、
Ｎ−ジメチルアクリル酸アミド、Ｎ、Ｎ−ジメチル
アミノプロピルアクリル酸アミド等の重合性アミド、Ｎ
、Ｎ−ジメチルアミノエチル（メタ）アクリレート、Ｎ
、Ｎ−ジエチルアミノエチル（メタ）アクリレート、Ｎ
−ｔ−ブチルアミノエチル（メタ）アクリレートなどの
含窒素アルキル（メタ）アクリレート；アクリロニトリ
ル、メタクリロニトリル笠の重合性ニトリル、エチルビ
ニルエーテル、プロピルビニルエーテル、イソプロピル
ビニルエーテル、ブチルビニルエーテル、ｔｅｒｔ−ブ
チルビニルエーテル、ペンチルビニルエーテル、ヘキシ
ルビニルエーテル、シクロヘキシルビニルエーテル、フ
ェニルビニルエーテル等のビニルエーテル類；酢酸ビニ
ル、プロピオン酸ビニル、ベオバモノマ−（シェル化学
社製）等のビニルエステル類；スチレン、α−メチルス
チレン、ビニルトルエン、ａ−クロルスチレン等のビニ
ル芳香族化合物；エチレン、プロピレン、ブチレン等の
オレフィン系化合物；ブタジェン、イソプレン、クロロ
ブレン等のジエン化合物等が挙げられる。Examples of the other polymerizable unsaturated monomers include methyl acrylate, ethyl acrylate, propyl acrylate, isopropyl acrylate, butyl acrylate (n-, i
-, t-), hexyl acrylate, 2-ethylhexyl acrylate, n-octyl acrylate, decyl acrylate, stearyl acrylate, lauryl acrylate, cyclohexyl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate, Isopropyl methacrylate, butyl methacrylate (n-2i-, t
-) Acrylic acid or methacrylic acid having 1 or more carbon atoms, such as hexyl methacrylate, cyclohexyl methacrylate, 2-ethylhexyl methacrylate, tridecyl methacrylate, lauryl methacrylate, stearyl methacrylate, etc.
18 alkyl ester or cycloalkyl ester;
Acrylic acid or methacrylic acid with 2 carbon atoms, such as methoxybutyl acrylate, methoxybutyl methacrylate, methoxyethyl acrylate, methoxyethyl methacrylate, ethoxybutyl acrylate, and ethoxybutyl methacrylate.
~18 alkoxyalkyl ester; acrylamide, methacrylic acid amide, N-methylacrylamide,
N-ethylmethacrylamide, N-methoxymethylacrylamide, N-butoxymethylacrylamide, N,
Polymerizable amides such as N-dimethylacrylamide, N,N-dimethylaminopropylacrylamide, N
, N-dimethylaminoethyl (meth)acrylate, N
, N-diethylaminoethyl (meth)acrylate, N
Nitrogen-containing alkyl (meth)acrylates such as -t-butylaminoethyl (meth)acrylate; acrylonitrile, polymerizable nitriles of methacrylonitrile caps, ethyl vinyl ether, propyl vinyl ether, isopropyl vinyl ether, butyl vinyl ether, tert-butyl vinyl ether, pentyl vinyl ether , hexyl vinyl ether, cyclohexyl vinyl ether, phenyl vinyl ether, and other vinyl ethers; vinyl acetate, vinyl propionate, beoba monomer (Shell Chemical Co., Ltd.), and other vinyl esters; styrene, α-methylstyrene, vinyltoluene, a-chlorostyrene, etc. Examples include vinyl aromatic compounds; olefin compounds such as ethylene, propylene, and butylene; diene compounds such as butadiene, isoprene, and chlorobrene;
本発明において、被膜形成成分（ａ）として使用できる
化合物としては、例えばポリオキシエチレングリコール
のジ（メタ）アクリレート、ポリオキシプロピレングリ
コールのジ（メタ）アクリレートなどのポリエーテルポ
リオールのポリ（メタ）アクリレート；式
リメチロール化合物のトリ（メタ）クリレート（式中、
ｎはＯ〜１０の整数、Ｒ１はＣＨ３又は水素原子、Ｘは
炭素数１〜５アルキル基又はヒドロキシアルキル基を表
わす。）、ペンタエリスリトールテトラ（メタ）アクリ
レート、１．６−ヘキサンシオールジ（メタ）アクリレ
ート、ジペンタエリスリトールヘキサ（メタ）アクリレ
ートなどのポリオール化合物のポリ（メタ）アクリレ−
ト；
式 ０
て、Ｒ１は前記と同じであり、ｍはＯ又は１を表わす。In the present invention, compounds that can be used as the film-forming component (a) include poly(meth)acrylates of polyether polyols such as di(meth)acrylates of polyoxyethylene glycol and di(meth)acrylates of polyoxypropylene glycol. ; tri(meth)acrylate of the formula limethylol compound (wherein,
n represents an integer of O to 10, R1 represents CH3 or a hydrogen atom, and X represents an alkyl group or a hydroxyalkyl group having 1 to 5 carbon atoms. ), poly(meth)acrylate of polyol compounds such as pentaerythritol tetra(meth)acrylate, 1,6-hexanethiol di(meth)acrylate, and dipentaerythritol hexa(meth)acrylate.
G; Formula 0 where R1 is the same as above, and m represents O or 1.
）：１モルのトリメチロールプロパンと３モルのイソシ
アナトエチル（メタ）アクリレートとの付加物、１モル
のペンタエリスリトールと４モルのイソシアナトエチル
（メタ）アクリレートとの付加物などのポリオールと（
メタ）アクリロイル基を有するモノイソシアネート化合
物との付加物；式
％式％
Ｒ２０Ｎ Ｎ ０１１２で表わされるフォスフアゼ
ン＼１１１／
Ｐ
／＼／＼
０Ｒ２Ｎ ＯＲ２
系化合物１式中、Ｒ２ハＣＨ２・Ｃ−Ｃ−０（ＣＨ２ｈ
ＴあってＲ１は前記と同してあり、ρは１〜４の整数
を表わす。）等が挙げられる。これらのうち特ＣＨ。): an adduct of 1 mol of trimethylolpropane and 3 mol of isocyanatoethyl (meth)acrylate, an adduct of 1 mol of pentaerythritol and 4 mol of isocyanatoethyl (meth)acrylate, and (
Adduct with a monoisocyanate compound having a meth)acryloyl group; Formula % Formula % Phosphazene\111/ P /\/\0R2N OR2 represented by formula % R20N N 0112 In formula 1, R2 ha CH2.C-C-0 (CH2h
T and R1 are the same as above, and ρ represents an integer from 1 to 4. ) etc. Among these, special CH.
「
に、Ｒ２がＣＩ□＝に−ＣＯ（にＨ２ｈ であるフォ
スフアゼン化合物が硬化時の収縮による歪が小さいこと
および高硬度の膜形成できる点で好ましい。A phosphazene compound in which R2 is CI□=--CO(-H2h) is preferable because it causes less distortion due to shrinkage during curing and can form a highly hard film.
上記（メタ）アクリロイル基を分子中に少なくとも２個
有する化合物および前記（メタ）アクリロイル基を分子
中に少なくとも２個有するｔｈ１脂はそれぞれ単独で、
又は両者を併用して成分（ａ、）とすることができる。The compound having at least two (meth)acryloyl groups in the molecule and the th1 fat having at least two (meth)acryloyl groups in the molecule are each independently,
Alternatively, both can be used together to form the component (a).
本発明において、活性エネルギー線硬化性プライマー組
成物は、膜形成要素として被膜形成成分（ａ）以外に必
要に応じて千ツマ−（ｂ）を含有していてもよい。モノ
マー（ｂ）は、上記被膜形成成分（ａ）と共重合可能な
重合性不飽和モノマーであって、モノマー（ｂ）として
は、前記（メタ）アクリロイル基含有ビニル共重合体樹
脂において、第２の官能基を有する重合性不飽和モノマ
ーと共重合可能な重合性不飽和モノマーとして使用でき
るモノマーおよびエチレングリコールジ（メタ）アクリ
レート、プロピレングリコールジアクリレート、ジビニ
ルベンゼンなどの重合可能な不飽和基を２個以上有する
、被膜形成成分（ａ）以外の多ビニルモノマーなどを挙
げることができる。In the present invention, the active energy ray-curable primer composition may contain, in addition to the film-forming component (a), a fluoride (b) as a film-forming element, if necessary. Monomer (b) is a polymerizable unsaturated monomer copolymerizable with the film-forming component (a), and monomer (b) is the second monomer in the (meth)acryloyl group-containing vinyl copolymer resin. A monomer that can be used as a polymerizable unsaturated monomer that can be copolymerized with a polymerizable unsaturated monomer having a functional group of Examples include multi-vinyl monomers other than the film-forming component (a), which have at least one vinyl monomer.
本発明におけるプライマー組成物における被膜形成成分
（ａ）とモノマー（ｂ）との配合比率は、両者の和を１
００重量部とすると、被膜形成成分（ａ） ３０〜
１００重量部、好ましくは ６０〜１００
重量部、モノマー（ｂ） ０〜７０重量部、好
ましくは Ｏ〜 ４０重量部の範囲であ
る。The blending ratio of the film-forming component (a) and the monomer (b) in the primer composition of the present invention is such that the sum of both is 1.
00 parts by weight, film forming component (a) 30~
100 parts by weight, preferably 60-100
The monomer (b) ranges from 0 to 70 parts by weight, preferably from 0 to 40 parts by weight.
上記プライマー組成物は、被膜形成成分（ａ）、モノマ
ー（ｂ）以外に、塗装性向上などのため、これらの膜形
成要素を溶解可能な有機溶剤、レベリング剤などを含有
していてもよい。上記有機溶剤としては、エタノール、
インプロパツール、ｎ−ブクノール、インブタノール、
エチレングリコールモノエチルエーテルなどのアルコー
ル系溶剤；アセトン、メチルエチルケン、メチルイソブ
ヂルケトンなどのケトン系溶剤；酢酸エチル、酢酸ブチ
ル、エチレングリコールモノエチルエーテルアセテート
などのエステル系溶剤；ヘキサン、ヘプタンなどの脂肪
族炭化水素系溶剤；トルエン、キシレンなどの芳香族炭
化水素系溶剤などを挙げることができる。上記レベリン
グ剤としては塗料用に使用されるアクリル系、シリコン
系、フッ素系のレベリング剤を使用できる。In addition to the film-forming component (a) and the monomer (b), the primer composition may contain an organic solvent capable of dissolving these film-forming elements, a leveling agent, etc. in order to improve coating properties. Examples of the organic solvent include ethanol,
Impropatool, n-buknol, imbutanol,
Alcohol solvents such as ethylene glycol monoethyl ether; Ketone solvents such as acetone, methyl ethylkene, and methyl isobutyl ketone; Ester solvents such as ethyl acetate, butyl acetate, and ethylene glycol monoethyl ether acetate; hexane, heptane, etc. Examples include aliphatic hydrocarbon solvents; aromatic hydrocarbon solvents such as toluene and xylene. As the leveling agent, acrylic, silicone, or fluorine leveling agents used for paints can be used.
本発明において、上記プライマー組成物は電子線、紫外
線などの活性エネルギー線を照射することによって硬化
せしめられ、光ディスク基板材料の表面に硬化膜が形成
される。紫外線照射によって硬化させる場合には、該組
成物中に光重合開始剤をあらかじめ添加しておく必要が
ある。光重合開始剤としては、紫外線の照射により励起
されてラジカルを発生させるタイプの通常の光重合開始
剤が用いられ、例えば、ベンゾイン、ベンゾインメチル
エーテル、ベンゾインエチルエーテル、ベンゾインｎ−
プロピルエーテル、ベンゾインイソプロピルエーテル、
ベンゾインｎ−ブチルエーテル、α−ヒドロキシイソブ
チルフェノン、ベンゾフェノン、ｐ−メチルベンゾフェ
ノン、ミヒラーケトン、アセトフェノン、１−ヒドロキ
シ−１−シクロヘキシルアセトフェノン、２−クロロチ
オキサントン、アントラキノン、２−メチルアントラキ
ノン、フエニルジスルフィド、２−ニトロフルオレン等
があげられる。これらの光重合開始剤は単独でもしくは
２種以上を混合して使用でき、その配合量は、プライマ
ー組成物中の被膜形成成分（ａ）とモノマー（ｂ）との
和１００重置部に対して０．１〜ｌ・重量部の範囲が好
ましい。In the present invention, the primer composition is cured by irradiation with active energy rays such as electron beams and ultraviolet rays, and a cured film is formed on the surface of the optical disc substrate material. When curing by ultraviolet irradiation, it is necessary to add a photopolymerization initiator to the composition in advance. As the photopolymerization initiator, a conventional photopolymerization initiator that generates radicals when excited by ultraviolet irradiation is used, such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin n-
Propyl ether, benzoin isopropyl ether,
Benzoin n-butyl ether, α-hydroxyisobutylphenone, benzophenone, p-methylbenzophenone, Michler's ketone, acetophenone, 1-hydroxy-1-cyclohexylacetophenone, 2-chlorothioxanthone, anthraquinone, 2-methylanthraquinone, phenyl disulfide, 2-nitro Examples include fluorene. These photopolymerization initiators can be used alone or in combination of two or more, and the amount of the photopolymerization initiator is determined based on the sum of 100 parts of the film-forming component (a) and monomer (b) in the primer composition. The range of 0.1 to 1 parts by weight is preferable.
また、これらの光重合開始剤による光重合反応を促進さ
せるために、光増感促進剤を光重合開始剤と併用しても
よい。併用しつる光増感促進剤として、例えば、トリエ
チルアミン、トリエタノールアミン、２−ジメヂルアミ
ンエタノール等の３級アミン系；トリフェニルホスフィ
ン等のアルキルホスフィン系；β−チオジグリコール等
のチオエーテル系の光増感促進剤があげられる。これら
光増感促進剤はそれぞれ単独でもしくは２種以上を混合
して使用でき、その配合量は、被膜形成成分（ａ）とモ
ノマー（ｂ）との和１ｏｏ重置部に対してＯ６１〜１・
重量部の範囲が好ましい。Furthermore, in order to promote the photopolymerization reaction by these photopolymerization initiators, a photosensitization accelerator may be used in combination with the photopolymerization initiator. Examples of photosensitization accelerators that can be used in combination include tertiary amines such as triethylamine, triethanolamine, and 2-dimedylamine ethanol; alkylphosphine such as triphenylphosphine; and thioethers such as β-thiodiglycol. Examples include photosensitizers. These photosensitizers can be used alone or in combination of two or more.・
Parts by weight ranges are preferred.
一方、プライマー組成物を電子線照射によって硬化させ
る場合には、上記の如き光重合開始剤や光増感促進剤を
配合する必要はない。On the other hand, when the primer composition is cured by electron beam irradiation, it is not necessary to incorporate the photopolymerization initiator and photosensitization accelerator as described above.
本発明において、プライマー組成物の硬化膜を基材上に
形成するには、基材であるプラスチック板の表面に、粘
度調整した上記プライマー組成物を浸漬塗装法、スプレ
ー塗装法、スピンコーティング法、スプレー塗装法、バ
ーコード塗装法などによって硬化膜厚が０．１〜１０戸
、好ましくは０．５〜５μｍとなるよう塗装し、有機溶
剤を含有する場合には、有機溶剤を揮散させた後、紫外
線、電子線などの活性エネルギー線を照射することによ
って硬化させればよい。In the present invention, in order to form a cured film of the primer composition on the substrate, the primer composition whose viscosity has been adjusted is applied to the surface of the plastic plate as the substrate by dip coating, spray coating, spin coating, etc. Paint by spray painting method, barcode painting method, etc. so that the cured film thickness is 0.1 to 10 μm, preferably 0.5 to 5 μm, and if it contains an organic solvent, after volatilizing the organic solvent. It may be cured by irradiation with active energy rays such as , ultraviolet rays, and electron beams.
塗装時の粘度は塗装方法、目的とする膜厚に応じて適宜
設定すればよいが、ブルックフィールド粘度計（６０ｒ
μｍ）で通常、２〜５００センチボイスの範囲であるこ
とが好ましい。The viscosity during coating can be set appropriately depending on the coating method and the desired film thickness, but it can be determined using a Brookfield viscometer (60r
Generally, it is preferably in the range of 2 to 500 centivoices (μm).
電子線の照射によりプライマー組成物を硬化させる場合
の電子線発生源としては、コツククロフト型、コックク
ロフトワルトン型、パン・デ・グラーフ型、共振変圧器
型、変圧器型、絶縁コア変圧器型、ダイナミドロン型、
リニアフィラメント型および高周波型などの電子線発生
装置を用いることができる。その際の電子線の照射条件
は本発明の組成物の厚さ等により異なるが、一般には１
〜２０メガラツドの範囲内の線量が適している。When curing the primer composition by electron beam irradiation, electron beam sources include Cockcroft type, Cockcroft-Walton type, Pan de Graaf type, resonant transformer type, transformer type, insulated core transformer type, and dynamic type. Delon type,
Electron beam generators such as linear filament type and high frequency type can be used. The electron beam irradiation conditions at that time vary depending on the thickness of the composition of the present invention, etc., but generally 1
Doses in the range of ~20 megarads are suitable.
また、紫外線照射源としては、水銀ランプ、キセノンラ
ンプ、カーボンアーク、メタルハライドランプ、太陽光
などを用いることができる。紫外線の照射条件は特に制
限されないが１５０〜４５０ｎｍの範囲内の紫外線を含
む光線を空気中もしくは不活性ガス雰囲気下で、照射す
ることが好ましい。Further, as the ultraviolet irradiation source, a mercury lamp, a xenon lamp, a carbon arc, a metal halide lamp, sunlight, etc. can be used. The conditions for irradiating ultraviolet rays are not particularly limited, but it is preferable to irradiate with ultraviolet rays containing ultraviolet rays within the range of 150 to 450 nm in air or in an inert gas atmosphere.
上記のようにして、光ディスク基板材料の表面に十分な
透明性を有し、基板材料および、この上に積層される無
機物質層との密着性が良好なプライマー組成物の硬化膜
が形成される。As described above, a cured film of the primer composition is formed on the surface of the optical disc substrate material, which has sufficient transparency and has good adhesion to the substrate material and the inorganic material layer laminated thereon. .
本発明における表面改質光ディスク基板は光ディスク基
板材料の表面に形成されたプライマー組成物の硬化膜上
に物理蒸着法によって形成された厚さ０．１〜１．０μ
ｍ未満、好ましくは０．５〜０．８戸の無機物質層が積
層されてなるものである。The surface-modified optical disc substrate in the present invention is formed by physical vapor deposition on a cured film of a primer composition formed on the surface of the optical disc substrate material, and has a thickness of 0.1 to 1.0 μm.
It is formed by laminating inorganic material layers of less than m, preferably 0.5 to 0.8 m.
本発明において積層される無機物質層は十分な透明性を
有し、十分な硬度、耐薬品性、耐摩耗性、帯電防止性を
有し、かつ耐水性、耐候性においても優れた性能を有し
ていることが必要であり、無機物質層の形成に使用され
る無機物質としては、Ｓｉｎ、ＳｉＯ２、Ｚｒ０ｚ 、
ＡＡｗ Ｏ３、ＴｉＯ２，Ｔｉ２Ｏ３、Ｙ２０ｓ 、Ｙ
ｂ２Ｏ３、Ｍｇｏ、Ｔａ２０５ 、ＣｅＯ２，ＨｆＯ２
などの酸化物；Ｓ１３ Ｎ４．７ＩＮなどの窒化物；Ｍ
ｇＦ２．ＡｆｌＦ３．ＢａＦ２．Ｎａ５ＡｎＦ６、Ｃａ
Ｆ２．Ｎａ２ＡＡＦＩ＋などのフッ化物；ＴａＳｉ２な
どの珪化物；ＺｒＣ，ＴｉＣなどの炭化物； ＺｎＳな
どの硫化物などが挙げられる。これらのうち酸化物が好
ましく、なかでもＳ ｉ ０２ 、ＡＡ２０３が特に好
ましい。The inorganic material layer laminated in the present invention has sufficient transparency, sufficient hardness, chemical resistance, abrasion resistance, and antistatic properties, and also has excellent performance in water resistance and weather resistance. Inorganic materials used for forming the inorganic material layer include Sin, SiO2, Zr0z,
AAw O3, TiO2, Ti2O3, Y20s, Y
b2O3, Mgo, Ta205, CeO2, HfO2
oxides such as; nitrides such as S13 N4.7IN; M
gF2. AflF3. BaF2. Na5AnF6, Ca
F2. Examples include fluorides such as Na2AAFI+; silicides such as TaSi2; carbides such as ZrC and TiC; and sulfides such as ZnS. Among these, oxides are preferred, and S i 02 and AA203 are particularly preferred.
上記無機物質は、真空蒸着、スパッタリングなどの物理
蒸着法によって形成されるが、無機物質層の形成速度は
０．０５〜０．７ｎｍ／秒、さらには０．１〜０．６ｎ
ｍ／秒の範囲内にあることが好つ１
ましく、形成速度が０．７ｎｍ／秒より速くなると積層
される無機物質層に歪が多く残留しやすくなり、ひび割
れが発生したり剥離しやす（なる傾向があり、一方、０
．Ｏ５ｎｍ７秒より遅いと層形成に時間がかかり過ぎる
。無機物質層の膜厚は０．２５〜１．０ｐ＋＋＋未満で
あることが必要であり、０．２５Ｐ未満では十分な硬度
が得られず耐薬品性も不十分となる。一方１．０μｍ以
上では層形成による残留応力により無機物質層がひび割
れや剥離を生じやすくなる。The above-mentioned inorganic substance is formed by a physical vapor deposition method such as vacuum evaporation or sputtering, and the formation rate of the inorganic substance layer is 0.05 to 0.7 nm/sec, and more preferably 0.1 to 0.6 nm.
It is preferable that the formation speed be within the range of 0.7 nm/s, and if the formation speed is faster than 0.7 nm/s, a large amount of strain tends to remain in the laminated inorganic material layer, which may cause cracks or peeling. (There is a tendency to
．． If the time is slower than 05nm and 7 seconds, it will take too much time to form the layer. The thickness of the inorganic material layer must be from 0.25 to less than 1.0 p+++, and if it is less than 0.25 p, sufficient hardness will not be obtained and chemical resistance will be insufficient. On the other hand, if the thickness is 1.0 μm or more, the inorganic material layer is likely to crack or peel due to residual stress caused by layer formation.
（作用および効果）
本発明による光ディスク基板材料の表面に特定のプライ
マー硬化膜を介して無機物質層を積層してなる表面改質
光ディスク基板は、表面が無機物質層であって、帯電し
にくいためゴミ、ホコリが付着しにくく、耐擦り偏性、
耐溶剤性に優れ、硬度が高い。また最表面の無機物質層
形成によって生じた内部応力がプライマー硬化膜層によ
って応力緩和され、かつプライマー硬化膜自体の、光デ
ィスク基板材料表面および無機物質層への密着性が良好
であり、硬度も十分であることから本発明の表面改質光
ディスク基板は、密着性の良好な多層膜が形成された、
硬度の高い表面改質ディスク基板である。(Operations and Effects) The surface-modified optical disc substrate formed by laminating an inorganic material layer on the surface of the optical disc substrate material according to the present invention via a specific primer cured film has an inorganic material layer on the surface and is not easily charged. Dirt and dust do not easily adhere to it, and it has uneven abrasion resistance.
Excellent solvent resistance and high hardness. In addition, the internal stress generated by the formation of the outermost inorganic substance layer is relaxed by the primer cured film layer, and the primer cured film itself has good adhesion to the optical disc substrate material surface and the inorganic substance layer, and has sufficient hardness. Therefore, the surface-modified optical disk substrate of the present invention has a multilayer film with good adhesion formed thereon.
This is a surface-modified disk substrate with high hardness.
以下、実施例により本発明をより具体的に説明する。Hereinafter, the present invention will be explained in more detail with reference to Examples.
なお、実施例における「部」は重量基準とする。Note that "parts" in the examples are based on weight.
実施例１
３．５インチのポリカーボネート製光ディスク基板材料
上に下記のプライマー組成物Ａをスピンコーティング法
によって塗布した後、水銀ランプで５００ ｍＪ／ ｃ
ｍ２の線量となるよう照射し、厚さ約２μｍのプライマ
ー硬化膜を形成した。Example 1 Primer composition A below was applied onto a 3.5-inch polycarbonate optical disc substrate material by spin coating, and then 500 mJ/c was applied using a mercury lamp.
It was irradiated to a dose of m2 to form a cured primer film with a thickness of about 2 μm.
次いでＥＥ３（電子線照射）真空蒸着装置を用いて上記
プライマー硬化膜上に厚さｏ、ｓμｍのＳｉ Ｏ２層を
蒸着によって０．５層ｍ／秒の速度で積層し表面改質光
ディスク基板を得た。Next, using an EE3 (electron beam irradiation) vacuum evaporation device, a SiO2 layer with a thickness of 0, s μm was deposited on the cured primer film at a rate of 0.5 m/sec to obtain a surface-modified optical disk substrate. Ta.
プライマー、 勿Ａ
アロニックスＭ−８０３０（注１） ２０部（注１）
二東亜合成化学工業■製、１分子中にアクリロイル基を
３個以上有するオリゴエステルアクリレート、数平均分
子量約４００゜上記配合組成からなる混合物を均一に混
合してプライマー組成物Ａとした。Primer, Aronix M-8030 (Note 1) 20 copies (Note 1)
Primer composition A was obtained by uniformly mixing a mixture consisting of the above composition, an oligoester acrylate having three or more acryloyl groups in one molecule, manufactured by Nitoa Gosei Kagaku Kogyo (■), and having a number average molecular weight of about 400°.
実施例２
プライマー組成物Ａのかわりに下記プライマー組成物Ｂ
を用い、かつ水銀ランプによる照射のかわりに電子線照
射を１０メガラドの吸収線量となるよう行なう以外は実
施例１と同様に行ない表面改質光ディスク基板を得た。Example 2 The following primer composition B was used instead of primer composition A.
A surface-modified optical disk substrate was obtained in the same manner as in Example 1, except that instead of irradiation with a mercury lamp, electron beam irradiation was performed to give an absorbed dose of 10 megarads.
プライマー且 Ｂ
アロニックスＭ−９０５０（注２） １０部トリアク
リレート ７０部（注２）：東亜
合成化学工業■製、１分子中にアクリロイル基を３個以
上有するオリゴエステルアクリレート、数平均分子量約
５００゜上記配合組成からなる混合物を均一に混合して
プライマー組成物Ｂとした。Primer B Aronix M-9050 (Note 2) 10 parts Triacrylate 70 parts (Note 2): Manufactured by Toagosei Chemical Industry ■, oligoester acrylate having 3 or more acryloyl groups in one molecule, number average molecular weight approximately 500° Primer composition B was prepared by uniformly mixing the mixture having the above composition.
実施例３
実施例１において、プライマー硬化膜上にＳｉＯ□の層
を蒸着するかわりにＡ４２０Ｓの層を蒸着する以外は実
施例１と同様に行ない、表面改質光ディスク基板を得た
。Example 3 A surface-modified optical disk substrate was obtained in the same manner as in Example 1 except that a layer of A420S was deposited instead of a layer of SiO□ on the cured primer film.
実施例４
プライマー組成物Ａのがわりに下記プライマー組成物Ｃ
を用いる以外は実施例１と同様に行ない、表面改質光デ
ィスク基板を得た。Example 4 The following primer composition C was used instead of primer composition A.
A surface-modified optical disk substrate was obtained in the same manner as in Example 1, except for using .
ＲＯＮ ＯＲ
下記式で表わされる光重合開始剤 ７部上記配合
組成からなる混合物を均一に混合してプライマー組成物
Ｃとした。RON OR 7 parts of a photopolymerization initiator represented by the following formula A mixture consisting of the above composition was uniformly mixed to prepare a primer composition C.
実施例５
プライマー組成物Ａのかわりに下記プライマー組成物り
を用いる以外は実施例１と同様に行ない、表面改質光デ
ィスク基板を得た。Example 5 A surface-modified optical disk substrate was obtained in the same manner as in Example 1, except that the following primer composition was used instead of primer composition A.
（注３）：サンノプコ■製、ポリエステルアクリレート
オリゴマー、数平均分子量綿１，５００〜２．０００゜
上記配合組成からなる混合物を均一に混合してプライマ
ー組成物りとした。(Note 3): Polyester acrylate oligomer, manufactured by San Nopco ■, number average molecular weight cotton, 1,500-2.000° A mixture consisting of the above composition was mixed uniformly to prepare a primer composition.
比較例１
実施例１において、プライマー硬化膜を形成することな
く光ディスク基板材料上に直接５１０２層を蒸着によっ
て積層する以外は実施例１と同様に行ない、光ディスク
基板を得た。Comparative Example 1 An optical disc substrate was obtained in the same manner as in Example 1, except that 5102 layers were laminated directly on the optical disc substrate material by vapor deposition without forming a primer cured film.
比較例２
実施例１において、形成するＳ ｉ ０２層の厚さを２
μｍとする以外は実施例１と同様に行ない光ディスク
基板を得た。Comparative Example 2 In Example 1, the thickness of the S i 02 layer to be formed was changed to 2
An optical disk substrate was obtained in the same manner as in Example 1 except that the thickness was μm.
上記実施例１〜４および比較例１．２で得た表面改質プ
ラスチック板に第１表に示す試験を行なった。試験結果
を第１表に示す。The tests shown in Table 1 were conducted on the surface-modified plastic plates obtained in Examples 1 to 4 and Comparative Example 1.2. The test results are shown in Table 1.
なお、第１表における試験は下記の試験方法に従って行
なった。The tests in Table 1 were conducted according to the test method below.
成鋏方恭
外観：表面改質光ディスク基板表面を目視観察した。異
常のないものを○とした。Appearance: The surface of the surface-modified optical disk substrate was visually observed. Those with no abnormality were marked as ○.
密着性：ＪＩＳ Ｋ５４００ ８．５．２に規定する
基盤目テープ法によって行なった。但し、切り傷のすき
ま間隔を１ｍｍとした。１００個のます目のうち、剥離
せずに残ったます目の数で評価した。Adhesion: Performed by the base tape method specified in JIS K5400 8.5.2. However, the gap between the cuts was 1 mm. Evaluation was made based on the number of squares that remained without peeling out of 100 squares.
耐摩耗性：表面改質光ディスク基板を２０’Ｃの恒温室
に静置し、この板の表面をスチールウール＃○○○番で
、荷重１ ｋｇ／ ｃ＋ｎ２をかけて長さ約８ｃｍの距
離を１０往復させてこすった後、表面を目視にて評価し
た。表面に傷がつかない場合、○と表記する。Abrasion resistance: A surface-modified optical disk substrate was placed in a constant temperature room at 20'C, and the surface of this board was covered with ##○○○ steel wool over a distance of approximately 8 cm under a load of 1 kg/c+n2. After rubbing 10 times, the surface was visually evaluated. If there is no scratch on the surface, mark it as ○.
帯電性：表面改質プラスチック板の表面をガーゼでｌＯ
往復こすった後、日立製作断裂、イオニック インジケ
ーター（ＩＯＮＩＣＩＮＤＩ（：ＡＴＯＲ）にて表面の
電圧を測定した。Chargeability: Cover the surface of the surface-modified plastic plate with gauze.
After rubbing back and forth, the surface voltage was measured using an Ionic Indicator manufactured by Hitachi (IONICINDI (:ATOR)).
耐薬品性：ｌＮ−ＮａＯＨ水溶液、７５％硫酸水溶液、
トルエン、メチルイソブヂルケトンおよびエタノールの
４種類の試験液にてそれぞれ試験を行なった。表面改質
プラスチック板に内径的２０ｍｍのガラスリングをパラ
フィンにて密着させ、ガラスリング中に試験液を約２−
人れた後、上部にガラス板をかぶせて空気との接触を遮
断し、２０’Ｃの室内で２４時間スポット試験を行なっ
た後の塗板表面を評価した。変化の認められないものを
○と表記する。Chemical resistance: 1N-NaOH aqueous solution, 75% sulfuric acid aqueous solution,
Tests were conducted using four types of test liquids: toluene, methyl isobutyl ketone, and ethanol. A glass ring with an inner diameter of 20 mm is adhered to a surface-modified plastic plate with paraffin, and the test liquid is poured into the glass ring for about 2-20 minutes.
After being left unattended, a glass plate was placed over the top to block contact with the air, and a spot test was conducted in a room at 20'C for 24 hours, after which the surface of the coated plate was evaluated. If no change is observed, mark it as ○.
鉛筆硬度・ＪＩＳ Ｋ５４００ ８．４．２に規定す
る鉛筆引っかき試験を行ない、すり傷による評価を行な
った。Pencil hardness: A pencil scratch test specified in JIS K5400 8.4.2 was conducted to evaluate scratches.
耐水性：試験板として表面改質プラスチック板を使用す
る以外、ＪＩＳ Ｋ５４００ ８．１９に準じて、水
中にて２０℃で１８時間浸漬を行なった。ついで浸漬後
の試験板表面にＪＩＳ Ｋ５４００ ８．５．２に規
定する基盤目テープ法による付着性試験を行なった。但
し切り傷のすきま間隔を１ｍｍとし、１００個のます目
のうち、剥 ｑ
離せずに残ったます目の数で評価した。Water resistance: The test plate was immersed in water at 20°C for 18 hours in accordance with JIS K5400 8.19 except that a surface-modified plastic plate was used. Then, an adhesion test was conducted on the surface of the test plate after immersion using the base tape method specified in JIS K5400 8.5.2. However, the gap between the cuts was 1 mm, and the evaluation was based on the number of squares that remained without peeling out of 100 squares.
耐候性：ＪＩＳ Ｋ５４００ ９．８．１に規定する
サンシャインカーボンアーク灯式による促進耐候試験を
照射時間が２，０００時間となるまで行なった試験板表
面にＪＩＳ Ｋ５４００８．５．２に規定する基盤目
テープ法による付着性試験を行なった。但し、切り傷の
すきま間隔を１ｍｍとし、１００個のます目のうち、剥
離せずに残ったまず目の数で評価した。Weather resistance: Accelerated weather resistance test using sunshine carbon arc lamp specified in JIS K5400 9.8.1 was conducted until the irradiation time reached 2,000 hours. An adhesion test was conducted using the tape method. However, the gap between the cuts was set to 1 mm, and the evaluation was made based on the number of squares that remained without peeling out of 100 squares.
手続補正書（師） 平成３年１１月１９日Procedural amendment (master) November 19, 1991
Claims (1)
分子中に少なくとも２個有する数平均分子量２００〜２
０，０００の化合物および／又は樹脂３０〜１００重量
部および （ｂ）上記成分（ａ）と共重合可能な重合性不飽和モノ
マー０〜７０重量部 からなり、（ａ）と（ｂ）との和が１００重量部である
組成物を膜形成要素とする活性エネルギー線硬化性プラ
イマー組成物の硬化膜が膜厚０．１〜１０μｍ形成され
ており、該硬化膜上に物理蒸着法によって厚さ０．１〜
１．０μｍ未満の無機物質層が形成されてなる表面改質
光ディスク基板。[Scope of Claims] On the surface of the optical disc substrate material, (a) having at least two acryloyl groups and/or methacryloyl groups in the molecule and having a number average molecular weight of 200 to 2;
0,000 parts by weight of a compound and/or resin and (b) 0 to 70 parts by weight of a polymerizable unsaturated monomer copolymerizable with component (a), A cured film of an active energy ray-curable primer composition whose film-forming element is a composition having a total weight of 100 parts by weight is formed to a thickness of 0.1 to 10 μm, and a thickness of 0.1 to 10 μm is formed on the cured film by physical vapor deposition. 0.1～
A surface-modified optical disk substrate on which an inorganic material layer of less than 1.0 μm is formed.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2331395A JPH04205735A (en) | 1990-11-29 | 1990-11-29 | Surface-modified optical disk substrate |
| US08/279,066 US5445871A (en) | 1990-10-30 | 1994-07-22 | Surface-modified plastic plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2331395A JPH04205735A (en) | 1990-11-29 | 1990-11-29 | Surface-modified optical disk substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04205735A true JPH04205735A (en) | 1992-07-27 |
Family
ID=18243220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2331395A Pending JPH04205735A (en) | 1990-10-30 | 1990-11-29 | Surface-modified optical disk substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04205735A (en) |
-
1990
- 1990-11-29 JP JP2331395A patent/JPH04205735A/en active Pending
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