JPH04200893A - Reflow apparatus - Google Patents
Reflow apparatusInfo
- Publication number
- JPH04200893A JPH04200893A JP33393690A JP33393690A JPH04200893A JP H04200893 A JPH04200893 A JP H04200893A JP 33393690 A JP33393690 A JP 33393690A JP 33393690 A JP33393690 A JP 33393690A JP H04200893 A JPH04200893 A JP H04200893A
- Authority
- JP
- Japan
- Prior art keywords
- heating chamber
- nitrogen gas
- nitrogen
- oxygen concentration
- concn
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 70
- 238000010438 heat treatment Methods 0.000 claims abstract description 64
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000001301 oxygen Substances 0.000 claims abstract description 34
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 34
- 229910001873 dinitrogen Inorganic materials 0.000 claims abstract description 32
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 19
- 230000003247 decreasing effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 206010021143 Hypoxia Diseases 0.000 description 2
- 208000024891 symptom Diseases 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000005802 health problem Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はリフロー装置に係り、酸素濃度計やチッソ濃度
計により加熱室の内外の酸素濃度やチッソ濃度を計測し
て、加熱室に供給するチッソガス量を制御し、また加熱
室外の酸素濃度の低下を報知するようにしたものである
。Detailed Description of the Invention (Industrial Application Field) The present invention relates to a reflow apparatus, which measures the oxygen concentration and nitrogen concentration inside and outside a heating chamber using an oxygen concentration meter and a nitrogen concentration meter, and supplies the measured oxygen and nitrogen concentrations to the heating chamber. This system controls the amount of nitrogen gas and notifies you of a decrease in oxygen concentration outside the heating chamber.
（従来の技術）
電子部品が実装された基板は、リフロー装置の加熱室へ
送られ、電子部品の電極を基板に接着する半田の加熱処
理が行われる。この場合、半田、基板の回路パターン、
電子部品の電極などの金属部分が加熱されて酸化するの
を防止するために、加熱室にチッソガスを供給し、チ・
７ソガス雰囲気中において半田の加熱処理を行うことが
知られている。(Prior Art) A board on which electronic components are mounted is sent to a heating chamber of a reflow apparatus, and heat treatment is performed on the solder that bonds the electrodes of the electronic component to the board. In this case, the solder, the circuit pattern on the board,
In order to prevent metal parts such as electrodes of electronic components from being heated and oxidized, nitrogen gas is supplied to the heating chamber.
It is known that heat treatment of solder is performed in a 7-gas atmosphere.
（発明が解決しようとする課題）
ところが加熱室は、基板を搬入搬出するだめの入口と出
口が開口されているので、この入口と出口からチッソガ
スが加熱室外へ流出し、またここから外部空気が加熱室
内に流入して、加熱室のチッソガス濃度が次第に低下し
やすい問題点があった。また入口や出口からチッソガス
が流出する結果、リフロー装置が設置された作業室内の
酸素濃度が次第に低下し、作業者が酸欠症状を起すなど
、作業者の健康上の問題点があった。(Problem to be Solved by the Invention) However, since the heating chamber has an open inlet and outlet for loading and unloading the substrate, nitrogen gas flows out of the heating chamber from the inlet and outlet, and external air leaks from here. There is a problem in that nitrogen gas flows into the heating chamber and the concentration of nitrogen gas in the heating chamber tends to gradually decrease. Furthermore, as a result of nitrogen gas flowing out from the inlet and outlet, the oxygen concentration in the work chamber where the reflow equipment is installed gradually decreases, causing health problems for workers, such as symptoms of oxygen deficiency.
（課題を解決するための手段）
本発明は、加熱室と、この加熱室に配設されたヒータと
、電子部品が実装された基板をこの加熱室内を搬送する
コンベヤと、この加熱室にチッソガスを供給するチッソ
ガス発生手段と、この加熱室の内部及び外部の酸素濃度
又はチ。(Means for Solving the Problems) The present invention includes a heating chamber, a heater disposed in the heating chamber, a conveyor for conveying a board on which electronic components are mounted inside the heating chamber, and a nitrogen gas and the oxygen concentration inside and outside this heating chamber.
ソ温度を計測する酸素濃度計又はチッソ濃度計と、加熱
室内の酸素濃度又はチッソ濃度に応じて上記チッソガス
発生手段から加熱室に供給するチッソガス量を制御する
制御装置と、加熱室外の酸素濃度が低下したことを報知
する警報素子とからリフロー装置を構成している。an oxygen concentration meter or a nitrogen concentration meter that measures the nitrogen temperature; a control device that controls the amount of nitrogen gas supplied from the nitrogen gas generation means to the heating chamber according to the oxygen concentration or nitrogen concentration inside the heating chamber; The reflow apparatus is composed of an alarm element that notifies that the temperature has decreased.
（作用）
上記構成において、基板はコンベヤにより搬送されなが
ら、チッソガス雰囲気中において、半田の加熱処理が行
われるが、加熱室内の酸素濃度が高くなると、チッソガ
ス発生手段からのチッソガス供給量は増加される。また
加熱室外の酸素濃度が低下したならば、ブザーやモニタ
ー−テレビなどの警報素子によりその旨報知する。(Function) In the above configuration, solder heat treatment is performed in a nitrogen gas atmosphere while the substrate is being transported by a conveyor, but as the oxygen concentration in the heating chamber increases, the amount of nitrogen gas supplied from the nitrogen gas generating means increases. . Furthermore, if the oxygen concentration outside the heating chamber decreases, an alarm device such as a buzzer or a monitor/TV will notify you of this fact.
（実施例） 次に、図面を参照しながら本発明の詳細な説明する。(Example) Next, the present invention will be described in detail with reference to the drawings.
第１図はリフロー装置の側面図である。１は加熱室であ
り、その内部にはヒータ２とファン３が配設されており
、また電子部品Ｐが実装された基板Ｓを搬送するコンベ
ヤ４が設けられて、 いる。５は基板搬入用コン−、ヤ
、６は基板搬出用コンベヤ、７．８は入口と出口である
。FIG. 1 is a side view of the reflow apparatus. Reference numeral 1 denotes a heating chamber, in which a heater 2 and a fan 3 are disposed, and a conveyor 4 for conveying a board S on which an electronic component P is mounted is provided. 5 is a conveyor for carrying in substrates, 6 is a conveyor for carrying out substrates, and 7.8 is an inlet and an outlet.
１０はチッソ・ガス発生手段であって、管路１１を通し
て、上記加熱室１にチッソガスを供給する。１２は酸素
濃度計であって、加熱室１の内部と加熱室１の外部に酸
素取入部１３．１４．１５を有している。１６は酸素濃
度計１２に接続されたコンピュータのような制御装置で
あって、上記チッソガス発生手段１０や、ブザー、モニ
ターテレビ、ランプのような警報素子１７−３＝
を制御する。Reference numeral 10 denotes nitrogen gas generating means, which supplies nitrogen gas to the heating chamber 1 through a conduit 11. Reference numeral 12 denotes an oxygen concentration meter, which has oxygen intake sections 13, 14, and 15 inside the heating chamber 1 and outside the heating chamber 1. 16 is a control device such as a computer connected to the oxygen concentration meter 12, and controls the nitrogen gas generating means 10 and alarm elements 17-3 such as a buzzer, a monitor television, and a lamp.
上記構成において、電子部品Ｐが実装された基板Ｓはコ
ンベヤ４により搬送されながら、チッソガス雰囲気中に
おいて、半田の加熱処理が行われる。加熱室１は、入ロ
アや出口８により内外と連通しているので、加熱室１内
のチッソガスは加熱室１外に流出し、また加熱室１外の
空気は加熱室１内に流入し、加熱室１内の酸素濃度は次
第に高くなる。そこで酸素濃度計１２により加熱室１内
の酸素濃度を計測し、酸素濃度が高くなったならば、チ
・７ソガス発生手段１０から加熱室０へのチッソガス供
給■を増大する。In the above configuration, while the board S on which the electronic component P is mounted is conveyed by the conveyor 4, the solder heat treatment is performed in a nitrogen gas atmosphere. Since the heating chamber 1 communicates with the inside and outside through the inlet lower and the outlet 8, the nitrogen gas in the heating chamber 1 flows out of the heating chamber 1, and the air outside the heating chamber 1 flows into the heating chamber 1. The oxygen concentration within the heating chamber 1 gradually increases. Therefore, the oxygen concentration in the heating chamber 1 is measured by the oxygen concentration meter 12, and if the oxygen concentration becomes high, the supply of nitrogen gas from the nitrogen gas generating means 10 to the heating chamber 0 is increased.
また加熱室１内のチッソガスか加熱室１外へ流出するこ
とから、このリフロー装置が設置された作業室内の酸素
濃度は次第に低下する。このように作業室内の□蔽素儂
度が低下すると、作業者は酸欠症状を起すの妃その場合
は警報素Ｔ−１７によりその旨報知し、あるいは装置の
運転を停止する。Further, since the nitrogen gas in the heating chamber 1 flows out of the heating chamber 1, the oxygen concentration in the working chamber in which this reflow apparatus is installed gradually decreases. When the degree of shielding in the work room is reduced in this way, the worker may experience oxygen deficiency symptoms.In that case, the alarm T-17 is used to notify the operator of this problem, or the operation of the apparatus is stopped.
−４＝
上記実施例では、酸素濃度計１２により加熱室１内外の
酸素濃度を計測しているが、酸素濃度計１２に替えてチ
ッソ濃度計を設置し、チッソ濃度計により加熱室１内の
内部や外部のチッソ濃度を計測してもよいものである。-4= In the above embodiment, the oxygen concentration inside and outside the heating chamber 1 is measured by the oxygen concentration meter 12, but a nitrogen concentration meter is installed in place of the oxygen concentration meter 12, and the oxygen concentration inside the heating chamber 1 is measured by the nitrogen concentration meter. It is also possible to measure the nitrogen concentration inside or outside.
（発明の効果）
以上説明したように本発明は、加熱室と、この加熱室に
配設されたヒータと、電子部品が実装された基板をこの
加熱室内を搬送するコンベヤと、この加熱室にチッソガ
スを供給するチッソガス発生手段と、この加熱室の内部
及び外部内の酸素？；度又はチッソ濃度を計測する酸素
濃度計又はチッソ濃度計と、加熱室内の酸素濃度又はチ
ッソ濃度に応じて上記チッソガス発生手段から加熱室に
供給するチッソガス量を制御する制御装置と、加熱室外
の酸素濃度が低下したことを報知する警報素子とからリ
フロー装置を構成しているので、加熱室１内のチッソ濃
度を自動調整して、半田の加熱処理を良好に行うことか
でき、また作業者の安全を図ることができる。(Effects of the Invention) As explained above, the present invention includes a heating chamber, a heater disposed in the heating chamber, a conveyor for conveying a board on which electronic components are mounted inside the heating chamber, and a heater disposed in the heating chamber. A nitrogen gas generation means that supplies nitrogen gas, and oxygen inside and outside this heating chamber? an oxygen concentration meter or a nitrogen concentration meter that measures degrees or nitrogen concentration; a control device that controls the amount of nitrogen gas supplied from the nitrogen gas generation means to the heating chamber according to the oxygen concentration or nitrogen concentration in the heating chamber; Since the reflow device is composed of an alarm element that notifies that the oxygen concentration has decreased, the nitrogen concentration in the heating chamber 1 can be automatically adjusted to perform the solder heat treatment well, and the operator can Safety can be ensured.
図は本発明の実施例を示すものであって、第１図はリフ
ロー装置の側面図である。
１・・・加熱室
２・・・ヒータ
４・・ ・コンベヤ
１０・・・チッソガス発生手段
１２・・・酸素濃度計
１６・・・制御装置
１７・・・警報素子The drawings show an embodiment of the present invention, and FIG. 1 is a side view of a reflow apparatus. 1...Heating chamber 2...Heater 4...Conveyor 10...Nitrogen gas generating means 12...Oxygen concentration meter 16...Control device 17...Alarm element
Claims (1)
品が実装された基板をこの加熱室内を搬送するコンベヤ
と、この加熱室にチッソガスを供給するチッソガス発生
手段と、この加熱室の内部及び外部の酸素濃度又はチッ
ソ濃度を計測する酸素濃度計又はチッソ濃度計と、加熱
室内の酸素濃度又はチッソ濃度に応じて上記チッソガス
発生手段から加熱室に供給するチッソガス量を制御する
制御装置と、加熱室外の酸素濃度が低下したことを報知
する警報素子とを備えて成ることを特徴とするリフロー
装置。A heating chamber, a heater disposed in the heating chamber, a conveyor for transporting a board on which electronic components are mounted inside the heating chamber, a nitrogen gas generating means for supplying nitrogen gas to the heating chamber, and an interior of the heating chamber. and an oxygen concentration meter or a nitrogen concentration meter that measures the external oxygen concentration or nitrogen concentration, and a control device that controls the amount of nitrogen gas supplied from the nitrogen gas generation means to the heating chamber according to the oxygen concentration or nitrogen concentration in the heating chamber. A reflow apparatus comprising: an alarm element that notifies that the oxygen concentration outside the heating chamber has decreased.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33393690A JPH04200893A (en) | 1990-11-29 | 1990-11-29 | Reflow apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33393690A JPH04200893A (en) | 1990-11-29 | 1990-11-29 | Reflow apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04200893A true JPH04200893A (en) | 1992-07-21 |
Family
ID=18271632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33393690A Pending JPH04200893A (en) | 1990-11-29 | 1990-11-29 | Reflow apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04200893A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06120655A (en) * | 1992-09-30 | 1994-04-28 | A Tec Tekutoron Kk | Automatic soldering machine |
| JPH06277826A (en) * | 1993-03-31 | 1994-10-04 | Honda Motor Co Ltd | Method and device for high frequency heating |
| JP2001501008A (en) * | 1996-12-20 | 2001-01-23 | レール・リキード・ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード | Process for supplying gas to a chamber and method for adjusting the content of certain components of the atmosphere in such a chamber |
| TWI700144B (en) * | 2019-04-11 | 2020-08-01 | 鴻齡科技股份有限公司 | A reflow oven central monitoring method and monitoring system thereof |
-
1990
- 1990-11-29 JP JP33393690A patent/JPH04200893A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06120655A (en) * | 1992-09-30 | 1994-04-28 | A Tec Tekutoron Kk | Automatic soldering machine |
| JPH06277826A (en) * | 1993-03-31 | 1994-10-04 | Honda Motor Co Ltd | Method and device for high frequency heating |
| JP2001501008A (en) * | 1996-12-20 | 2001-01-23 | レール・リキード・ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード | Process for supplying gas to a chamber and method for adjusting the content of certain components of the atmosphere in such a chamber |
| TWI700144B (en) * | 2019-04-11 | 2020-08-01 | 鴻齡科技股份有限公司 | A reflow oven central monitoring method and monitoring system thereof |
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