JPH04199593A - Bonder of outer lead of semiconductor device - Google Patents
Bonder of outer lead of semiconductor deviceInfo
- Publication number
- JPH04199593A JPH04199593A JP33541090A JP33541090A JPH04199593A JP H04199593 A JPH04199593 A JP H04199593A JP 33541090 A JP33541090 A JP 33541090A JP 33541090 A JP33541090 A JP 33541090A JP H04199593 A JPH04199593 A JP H04199593A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- heat source
- lead holder
- holder
- olb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- 239000003292 glue Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 241000270281 Coluber constrictor Species 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 2
- OQZCSNDVOWYALR-UHFFFAOYSA-N flurochloridone Chemical compound FC(F)(F)C1=CC=CC(N2C(C(Cl)C(CCl)C2)=O)=C1 OQZCSNDVOWYALR-UHFFFAOYSA-N 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野〕
この発明は、半導体装置の外部リードボンディング装置
に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to an external lead bonding apparatus for semiconductor devices.
第６図（ａ）は従来の非接触熱源を用いた半導体外部リ
ードポンディング装置（以下、ＯＬＢ装置と略称する）
のリード押さえをかめず断面図てあり、図において、（
１）はＯＬＢ装置のリード押さえ、（２）は半導体装置
、（３）は半導体外部リード、（４）は基板、（５）は
基板上ラント、（６）はレーザ光線なとの熱源で、ＯＬ
Ｂ装置のリード押さえ（１１は透光性の物質である。ま
た、第６図（ｂ）は、第６図（ａ）におけるＯＬＢ装置
のリード押さえ（１）の底面図である。Figure 6(a) shows a conventional semiconductor external lead bonding device (hereinafter abbreviated as OLB device) using a non-contact heat source.
The cross-sectional view is shown without the reed holder in place, and in the figure (
1) is the lead holder of the OLB device, (2) is the semiconductor device, (3) is the semiconductor external lead, (4) is the substrate, (5) is the runt on the substrate, and (6) is the heat source such as a laser beam. OL
The lead holder (11) of the B device is a transparent material. FIG. 6(b) is a bottom view of the lead holder (1) of the OLB device in FIG. 6(a).
次に動作について説明する。ＯＬＢ装置のり一ド押さえ
（１）により半導体装置（２）の外部リード（３）を押
さえた状態で半導体外部リード（３）のホンディング部
をレーザ光線やキセノンランプなとの非接触の熱源（６
）で加熱し、ホンディング（例えばＳｎとはんた、はん
たとはんたとを熱で溶融して接合する方法）を行う。こ
の時、熱源（６）となるレーザー光線やキセノンランプ
なとはＯＬＢ装置のリード押さえ（１１の中を通過する
。Next, the operation will be explained. While holding down the external lead (3) of the semiconductor device (2) with the OLB device glue press (1), apply a non-contact heat source (such as a laser beam or a xenon lamp) to the bonding part of the semiconductor external lead (3). 6
) to perform honding (for example, a method of bonding Sn and solder, or solder to solder by melting them with heat). At this time, the heat source (6), such as a laser beam or a xenon lamp, passes through the lead presser (11) of the OLB device.
従来のＯＬＢ装置は以上のように構成されている゛のて
、リード押さえの材質は透光性であることか必要で、ま
た、ボンディング時にリード表面にある溶融したＳｎや
はんだやそれらの酸化物等の異物がリード押さえに付着
し、レーザー光線などの熱エネルギーか、この異物にさ
えぎられ半導体外部リードとラントとの接合に十分なエ
ネルギーか伝わらなくなるため、頻繁にクリーニングし
なければならないなとの問題点かあった。Conventional OLB devices are constructed as described above, so the material of the lead holder must be translucent, and molten Sn, solder, and their oxides on the lead surface during bonding must be The problem is that foreign matter such as these adheres to the lead holder, and the thermal energy from laser beams or other sources is blocked by this foreign matter, preventing the transmission of sufficient energy to bond the semiconductor external lead and the runt, which requires frequent cleaning. There was a point.
この発明は上記のような問題点を解消するためになされ
たものて、ＯＬＢ装置のリード押さえの熱源照射部分に
異物か付着することを防止することかできるＯＬＢ装置
を得ることを目的とする。The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide an OLB device that can prevent foreign matter from adhering to the heat source irradiated portion of the lead presser of the OLB device.
この発明に係る非接触熱源を用いたＯＬＢ装置はリード
押さえに、レーサー光線なとの熱源か通過する部分に貫
通穴もしくは凹部なとを設けたもの、すなわち、リード
押さえか外部リードを押さえ熱源か当る部分にリード押
さえか外部リードとの間に所定の空隙を構成するように
したものである。The OLB device using a non-contact heat source according to the present invention is one in which the lead holder is provided with a through hole or a recess in the part through which a heat source such as a racer beam passes, that is, the lead holder or the external lead is held down and the heat source is A predetermined gap is formed between the lead presser and the external lead at the contact portion.
この発明における非接触熱源を用いたＯＬＢ装置のリー
ド押さえの貫通穴もしくは凹部なとは、ＯＬＢ装置のレ
ーザー光線なとの照射部分において、リード押さえとリ
ードとの間か密着しないようにすることて接合部分の溶
融したはんだなとかり−ト押さえの熱源照射部に付着し
ないようにする。ＯＬＢ装置のリード押さえに貫通穴を
設けた場合には、その貫通穴はレーサー光線なとの非接
触熱源かＯＬＢ装置のリード押さえの材質中を透過せず
、開孔部を通過することにより○ＬＢ装置のリード押さ
えの材質を透光性のものに限定する必要をなくする。In this invention, the through holes or recesses of the lead holder of the OLB device using a non-contact heat source are bonded by making sure that the lead holder and the leads do not come into close contact in the part of the OLB device that is irradiated with a laser beam. Make sure that the molten solder does not adhere to the heat source irradiated part of the holder. When a through hole is provided in the lead holder of an OLB device, the through hole allows a non-contact heat source such as a laser beam to pass through the opening without passing through the material of the lead holder of the OLB device. To eliminate the need to limit the material of a lead presser of an LB device to a translucent material.
以下、この発明の一実施例を図について説明する。第１
図（ａ）において、（１）はリード押さえ、（２）は半
導体装置、（３）は半導体外部リード、（４）は基板、
（５）はランド、（６）は熱源、（７）はＯＬＢ装置の
り−ト押さえで１）に設けられた開孔部である。An embodiment of the present invention will be described below with reference to the drawings. 1st
In figure (a), (1) is a lead holder, (2) is a semiconductor device, (3) is a semiconductor external lead, (4) is a substrate,
(5) is a land, (6) is a heat source, and (7) is an opening provided in 1) by the OLB device glue presser.
また第１図（ｂ）と第１図ＦＣ）は、第１図（ａ）にお
けるＯＬＢ装置のリード押さえ（１）の底面図である。Moreover, FIG. 1(b) and FIG. 1 FC) are bottom views of the lead holder (1) of the OLB device in FIG. 1(a).
次に動作について説明する。第１図（ａ）において、非
接触熱源（６）を用いたＯＬＢ装置のリード押さえ（１
）に開孔部（７）か設けてあり、リード押さえ（１）は
半導体装置（２）の外部リード（３）の先端部を押さえ
る形状、寸法になっている。また、レーザー光線なとの
非接触熱源（６）は（７）の開孔部の中を通過し、ＯＬ
Ｂ装置のり−ト押さえ（１）と半導体外部リード（３）
の接触点に当たらないので、ボンディング時に半導体外
部リード（３）の表面にあるＳｎやはんたやそれらの酸
化物なとか、ＯＬＢ装置のリード押さえ（１）に付着付
して、熱源（６）かさえぎられボンディング部に十分な
エネルギーか伝わらなくなることを防止できる。さらに
、レーザー光線なとの非接触熱源（６）かＯＬＢ装置の
リード押さえ（１）の材質中を通らないので、ＯＬＢ装
置のリード押さえ（１）を透光性のものにする必要がな
くなる。Next, the operation will be explained. In FIG. 1(a), a lead presser (1) of an OLB device using a non-contact heat source (6) is shown.
) is provided with an opening (7), and the lead presser (1) is shaped and dimensioned to press the tip of the external lead (3) of the semiconductor device (2). In addition, a non-contact heat source (6) such as a laser beam passes through the opening of (7), and the OL
B device glue holder (1) and semiconductor external lead (3)
During bonding, Sn, solder, or their oxides on the surface of the semiconductor external lead (3) or the lead presser (1) of the OLB device may adhere to the heat source (6). ) It is possible to prevent sufficient energy from being obstructed and not being transmitted to the bonding part. Furthermore, since the non-contact heat source (6) such as a laser beam does not pass through the material of the lead holder (1) of the OLB device, there is no need to make the lead holder (1) of the OLB device transparent.
なお、上記実施例ではＯＬＢ装置のり一ト押さえ（］）
に貫通した開孔部（４）を設けたものを示したか、ボン
ディング部の非接触熱源が当たる所か空洞になっていれ
ばとのような形でもよい。例えば、第２図（ａ）（第２
図（ｂ）は第２図（ａ）におけるリード押さえの底面図
）の様な形状でもよく、また、ＯＬＢ装置のリード押さ
えを透光性のものにすれば第３図、第４図あるいは第５
図なとのようにしてもよい。In addition, in the above embodiment, the OLB device glue press (])
Although shown as having an opening (4) passing through the bonding part, it may also have a hollow shape where the non-contact heat source hits the bonding part. For example, Fig. 2(a) (second
Figure (b) may have a shape similar to the bottom view of the lead holder in Figure 2(a).Also, if the lead holder of the OLB device is translucent, it may be as shown in Figures 3, 4 or 4. 5
It may be done as shown in the figure.
以上のように、この発明によれば、非接触熱源を用いた
○ＬＢ装首のリード押さえに開孔部などを設け、ＯＬＢ
装置のレーザー等を照射するボンディング部分のり一ト
押さえ部において、リード押さえ下面とり−トとの間に
空間番設けたので、ＯＬＢ装置のリード押さえにはんだ
やＳｎ等かボンディングにより付着し、レーザー光線な
との熱源かさえぎられることを防止する効果かある。ま
た、ＯＬＥ装置のリード押さえに貫通した開孔部を設け
た場合には、ＯＬＢ装置のリード押さえに透光性の物質
を用いる必要をなくす効果がある。As described above, according to the present invention, an opening or the like is provided in the reed holder of an OLB neck using a non-contact heat source, and an OLB
In the glue holding part of the bonding part that is irradiated with the laser etc. of the device, a space is provided between it and the lower surface of the lead holder, so that solder, Sn, etc. may adhere to the lead holder of the OLB device by bonding, and the laser beam will not irradiate it. It has the effect of preventing the heat source from being blocked. Further, when a penetrating hole is provided in the lead presser of the OLE device, there is an effect that it is not necessary to use a translucent material for the lead presser of the OLB device.
第１図（ａ）はこの発明の一実施例による非接触熱源を
用いたＯＬＢ装置のリード押さえを示す断面図、第１図
（ｂ）および第１図ｆｃｌは第１図（ａ）におけるＯＬ
Ｂ装置のリード押さえの底面図、第２図（ａ）はこの発
明の他の実施例による非接触熱源を用いたＯＬＢ装置の
リード押さえを示す断面図、第２図ら）は第２図ｆａ）
におけるＯＬＢ装置のリード押さえの底面図、第３図、
第４図、第５図はこの発明の他の実施例による非接触熱
源を用いたＯＬＢ装置のリード押さえを示す断面図、第
６図（ａ＋は従来の非接触熱源を用いた○ＬＢ装置のリ
ード押さえを示す断面図、第６図（ｂ）は第６図（ａ）
におけるＯＬＢ装置のリード押さえの底面図である。図
において、（］）は非接触熱源を用いたＯＬＢ装置のリ
ード押さえ、（２）は半導体装置、（３）は半導体外部
リード、（４）は基板、（５）は基板上ランド、（６）
はレーサー光線なとの非接触熱源、（７）はＯＬＢ装置
のリード押さえに設けた開孔部。
なお、図中、同一符号は同一、または相当部分を示す。FIG. 1(a) is a sectional view showing a lead presser of an OLB device using a non-contact heat source according to an embodiment of the present invention, and FIG. 1(b) and FIG. 1fcl are OL in FIG. 1(a).
FIG. 2(a) is a sectional view showing the lead holder of an OLB device using a non-contact heat source according to another embodiment of the present invention; FIG. 2(a) is a bottom view of the lead holder of device B;
A bottom view of the lead holder of the OLB device in Figure 3.
4 and 5 are cross-sectional views showing the lead press of an OLB device using a non-contact heat source according to another embodiment of the present invention, and FIG. A sectional view showing the lead presser, Fig. 6(b) is similar to Fig. 6(a).
It is a bottom view of the lead holder of the OLB device in FIG. In the figure, (]) indicates a lead holder for an OLB device using a non-contact heat source, (2) indicates a semiconductor device, (3) indicates a semiconductor external lead, (4) indicates a substrate, (5) indicates a land on the substrate, and (6) indicates a semiconductor external lead. )
(7) is a non-contact heat source such as a racer beam, and (7) is an opening provided in the lead holder of the OLB device. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
非接触熱源を上記外部リードに照射するものにおいて、
上記リード押えが上記外部リードを押え上記熱源が当る
部分にリード押えが上記外部リードとの間に所定の空隙
を構成することを特徴とする半導体装置の外部リードボ
ンディング装置。In a device that irradiates a non-contact heat source to the external leads of a semiconductor device by penetrating a lead holder that holds down the external leads,
An external lead bonding apparatus for a semiconductor device, wherein the lead presser presses the external lead and forms a predetermined gap between the lead presser and the external lead at a portion where the heat source hits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33541090A JPH04199593A (en) | 1990-11-28 | 1990-11-28 | Bonder of outer lead of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33541090A JPH04199593A (en) | 1990-11-28 | 1990-11-28 | Bonder of outer lead of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04199593A true JPH04199593A (en) | 1992-07-20 |
Family
ID=18288237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33541090A Pending JPH04199593A (en) | 1990-11-28 | 1990-11-28 | Bonder of outer lead of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04199593A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04219990A (en) * | 1990-12-20 | 1992-08-11 | Matsushita Electric Ind Co Ltd | Joining method for lead of ic component |
| JPH06252545A (en) * | 1993-03-01 | 1994-09-09 | Nec Corp | Apparatus and method for mounting lead part |
| JPH07193366A (en) * | 1993-12-27 | 1995-07-28 | Nec Corp | Tcp mounter |
-
1990
- 1990-11-28 JP JP33541090A patent/JPH04199593A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04219990A (en) * | 1990-12-20 | 1992-08-11 | Matsushita Electric Ind Co Ltd | Joining method for lead of ic component |
| JPH06252545A (en) * | 1993-03-01 | 1994-09-09 | Nec Corp | Apparatus and method for mounting lead part |
| JPH07193366A (en) * | 1993-12-27 | 1995-07-28 | Nec Corp | Tcp mounter |
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