JPH04259283A - Electronic parts bonding apparatus - Google Patents
Electronic parts bonding apparatusInfo
- Publication number
- JPH04259283A JPH04259283A JP2075891A JP2075891A JPH04259283A JP H04259283 A JPH04259283 A JP H04259283A JP 2075891 A JP2075891 A JP 2075891A JP 2075891 A JP2075891 A JP 2075891A JP H04259283 A JPH04259283 A JP H04259283A
- Authority
- JP
- Japan
- Prior art keywords
- presser
- pressing
- bonding
- lead
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 7
- 239000011521 glass Substances 0.000 abstract description 2
- 239000010979 ruby Substances 0.000 abstract description 2
- 229910001750 ruby Inorganic materials 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、電子部品のボンディン
グ装置に係り、押圧子によりリードを電極に押し付けて
ボンディングする際に、押圧子の下端押圧面からレーザ
光を漏光させて、リードを加熱するようにしたものであ
る。[Industrial Field of Application] The present invention relates to a bonding device for electronic components, and when bonding is performed by pressing a lead against an electrode using a presser, a laser beam is leaked from the lower end pressing surface of the presser to heat the lead. It was designed to do so.
【０００２】0002
【従来の技術】図４は、電子部品ＰのリードＬを基板１
０１の電極１０２にボンディングするための従来手段を
示している。図中、１０３はホーン、１０４はホーン１
０３に保持された押圧子である。このものは、ホーン１
０３をＵＳ発振させて、押圧子１０４をホーン１０３の
長さ方向（矢印方向）に振動させながら、押圧子１０４
によりリードＬを電極１０２に押し付けてボンディング
するようになっており、良好にボンディングできるよう
に基板１０１はヒートブロック（図示せず）上に載置さ
れて加熱されている。[Prior Art] FIG. 4 shows how leads L of an electronic component P are connected to a board 1.
A conventional means for bonding to electrode 102 of 01 is shown. In the figure, 103 is a horn, 104 is a horn 1
This is a presser held at 03. This one is horn 1
03 and vibrating the presser 104 in the length direction (arrow direction) of the horn 103.
The lead L is pressed against the electrode 102 for bonding, and the substrate 101 is placed on a heat block (not shown) and heated to ensure good bonding.
【０００３】0003
【発明が解決しようとする課題】ところが上記従来手段
では、図５（ａ）、（ｂ）に示すように、押圧子１０４
の振動方向と、リードＬの延出方向の相違により、ボン
ディング効果に差異があり、殊に同図（ｂ）に示すよう
に、振動方向とリードＬの延出方向が直交する場合には
、良好にボンディングしにくい問題点があった。However, in the above conventional means, as shown in FIGS. 5(a) and 5(b), the presser 104
There is a difference in the bonding effect due to the difference in the direction of vibration of the lead L and the direction of extension of the lead L, especially when the direction of vibration and the direction of extension of the lead L are perpendicular to each other, as shown in FIG. There was a problem that it was difficult to bond well.
【０００４】また上記従来手段は、基板１０１全体をヒ
ートブロックにより加熱することから、電極１０２など
の金属物が酸化されやすく、また電子部品が熱ダメージ
を受けやすく、更には場合によっては、ボンディング後
に基板１０１を冷却手段により冷却せねばならない問題
点があった。[0004] Furthermore, in the above conventional means, since the entire substrate 101 is heated by a heat block, metal objects such as the electrode 102 are easily oxidized, electronic components are easily damaged by heat, and in some cases, after bonding, There is a problem in that the substrate 101 must be cooled by a cooling means.
【０００５】そこで本発明は、上記従来手段の問題点を
解消した電子部品のボンディングツールを提供すること
を目的とする。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a bonding tool for electronic components that solves the problems of the conventional means described above.
【０００６】[0006]
【課題を解決するための手段】本発明は、光透過体から
成り、その下端押圧面に漏光部を有する押圧子と、この
押圧子を保持する保持手段と、この押圧子の内部にレー
ザ光を照射するレーザ装置とからボンディングツールを
構成している。[Means for Solving the Problems] The present invention provides a presser made of a light transmitting body and having a light leakage portion on its lower end pressing surface, a holding means for holding the presser, and a laser beam inside the presser. The bonding tool consists of a laser device that irradiates the
【０００７】[0007]
【作用】上記構成において、押圧子をリードに押し付け
、その状態で押圧面からレーザ光を漏光させることによ
り、押圧点を集中的に加熱し、リードを電極にボンディ
ングする。[Operation] In the above structure, the presser is pressed against the lead, and in this state, laser light is leaked from the pressing surface, thereby intensively heating the pressing point and bonding the lead to the electrode.
【０００８】[0008]
【実施例】（実施例１）以下、図面を参照しながら本発
明の実施例を説明する。Embodiments (Embodiment 1) Hereinafter, embodiments of the present invention will be described with reference to the drawings.
【０００９】図１はボンディング装置の斜視図であって
、１は保持手段としてのホーンであり、その先端部には
棒状の押圧子２が保持されている。この押圧子２は、ガ
ラス、ルビーなどの硬質の光透過体から成っている。
３はレーザ装置であって、ファイバ４を通して、押圧子
２の上面からこの押圧子２の内部にレーザ光を入射させ
る。Ｐは電子部品であり、そのリードＬを基板１０の電
極１１にボンディングする。ボンディングの対象となる
電子部品としては、ＱＦＰ、ＳＯＰ、ＴＡＢ法により製
造されたもの等があり、また電極としては、ランド状の
電極やバンプがある。FIG. 1 is a perspective view of the bonding apparatus, in which reference numeral 1 denotes a horn as a holding means, and a rod-shaped presser 2 is held at the tip of the horn. This presser 2 is made of a hard light-transmitting material such as glass or ruby. Reference numeral 3 denotes a laser device, which makes a laser beam enter the inside of the presser 2 from the upper surface of the presser 2 through a fiber 4 . P is an electronic component, and its lead L is bonded to the electrode 11 of the substrate 10. Electronic components to be bonded include those manufactured by QFP, SOP, and TAB methods, and electrodes include land-shaped electrodes and bumps.
【００１０】図２は、リードＬを基板１０の電極１１に
ボンディングしている様子を示している。図中、１２は
電極１１の上面に形成された半田部である。このものは
、押圧子２をリードＬに押し付けてボンディングするが
、レーザ装置３から照射されたレーザ光は、押圧子２の
内部を屈折しながら透過し、下端押圧面の漏光部ａから
集中的に漏光することにより、押圧点を集中的に加熱し
て、リードＬを電極１１に良好にボンディングできる。
この場合、上記従来手段と同様に押圧子２を振動させる
ことを禁止するものではないが、振動を付与せずとも良
好にボンディングできる。FIG. 2 shows how the leads L are bonded to the electrodes 11 of the substrate 10. In the figure, 12 is a solder portion formed on the upper surface of the electrode 11. In this device, the presser 2 is pressed against the lead L for bonding, but the laser light irradiated from the laser device 3 is transmitted through the inside of the presser 2 while being refracted, and concentrated from the light leakage part a of the lower end pressing surface. By leaking light, the pressing point can be heated intensively and the lead L can be bonded to the electrode 11 well. In this case, although it is not prohibited to vibrate the presser 2 as in the conventional means, good bonding can be achieved without applying vibration.
【００１１】（実施例２）図３において、５は押圧子で
ある。この押圧子５は中空パイプ状であり、その内面６
は光反射面となっており、またその下端押圧面は漏光部
ａとなっている。(Embodiment 2) In FIG. 3, 5 is a presser. This presser 5 has a hollow pipe shape, and its inner surface 6
is a light reflecting surface, and its lower end pressing surface is a light leaking portion a.
【００１２】したがってこのものも、レーザ装置３から
照射されたレーザ光は、押圧子２の内部を屈折しながら
透過し、下端押圧面の漏光部ａから集中的に漏光するこ
とにより、押圧点を集中的に加熱して、リードＬを電極
１１に良好にボンディングできる。Therefore, in this case as well, the laser beam irradiated from the laser device 3 passes through the inside of the presser 2 while being refracted, and intensively leaks out from the light leakage part a of the lower end pressing surface, so that the pressing point is not affected. The lead L can be bonded to the electrode 11 well by intensive heating.
【００１３】[0013]
【発明の効果】以上説明したように本発明は、光透過体
から成り、その下端押圧面に漏光部を有する押圧子と、
この押圧子を保持する保持手段と、この押圧子の内部に
レーザ光を照射するレーザ装置とから電子部品のボンデ
ィングツールを構成しているので、リードの押圧点を集
中的に加熱しながら、リードを電極に良好にボンディン
グできる。Effects of the Invention As explained above, the present invention includes a presser made of a light transmitting body and having a light leakage portion on its lower end pressing surface;
A bonding tool for electronic components is made up of a holding means for holding this presser and a laser device that irradiates the inside of the presser with laser light. can be bonded well to the electrode.
【図１】ボンディングツールの斜視図[Figure 1] Perspective view of bonding tool
【図２】ボンディング中の側面図[Figure 2] Side view during bonding
【図３】他の実施例の側面図[Figure 3] Side view of another embodiment
【図４】従来手段の斜視図[Fig. 4] Perspective view of conventional means
【図５】（ａ）は従来手段の平面図 （ｂ）は従来手段の平面図[Fig. 5] (a) is a plan view of the conventional means. (b) is a plan view of the conventional means.
１ 保持手段 ２、５ 押圧子 ３ レーザ装置 ａ 漏光部 1 Holding means 2, 5 Presser 3 Laser device a Light leakage part
Claims (1)
漏光部を有する押圧子と、この押圧子を保持する保持手
段と、この押圧子の内部にレーザ光を照射するレーザ装
置とから成ることを特徴とする電子部品のボンディング
装置。Claim 1: A presser made of a light transmitting body and having a light leakage portion on its lower end pressing surface, a holding means for holding the presser, and a laser device for irradiating the inside of the presser with laser light. An electronic component bonding device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2075891A JPH04259283A (en) | 1991-02-14 | 1991-02-14 | Electronic parts bonding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2075891A JPH04259283A (en) | 1991-02-14 | 1991-02-14 | Electronic parts bonding apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04259283A true JPH04259283A (en) | 1992-09-14 |
Family
ID=12036094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2075891A Pending JPH04259283A (en) | 1991-02-14 | 1991-02-14 | Electronic parts bonding apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04259283A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07193366A (en) * | 1993-12-27 | 1995-07-28 | Nec Corp | Tcp mounter |
| JP2007220958A (en) * | 2006-02-17 | 2007-08-30 | Toshiba Corp | Solder bonding method |
| KR100764572B1 (en) * | 2004-11-09 | 2007-10-08 | 주식회사 나래나노텍 | Bonding structure of pattern electrodes formed by using laser and method for bonding the same |
-
1991
- 1991-02-14 JP JP2075891A patent/JPH04259283A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07193366A (en) * | 1993-12-27 | 1995-07-28 | Nec Corp | Tcp mounter |
| KR100764572B1 (en) * | 2004-11-09 | 2007-10-08 | 주식회사 나래나노텍 | Bonding structure of pattern electrodes formed by using laser and method for bonding the same |
| JP2007220958A (en) * | 2006-02-17 | 2007-08-30 | Toshiba Corp | Solder bonding method |
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